A thermostat for a storage device

Abstract

The utility model provides a temperature controller for warehousing device, specifically at temperature controller field, including temperature controller, the both sides of temperature controller are equipped with fixed lug, still be equipped with the bridge structure, the bridge structure cross section is " a few " character type, the both sides of bridge structure are connected through bolt with fixed lug, the semiconductor refrigeration piece and thermal switch are embedded in the bridge structure upside, and the lead -in of semiconductor refrigeration piece is connected in series with thermal switch. The utility model can improve the heat dissipation efficiency of temperature controller, is favorable to the improvement temperature controller performance.

Description

Technical Field

[0001] The utility model belongs to the field of thermostats, and particularly relates to a thermostat for a storage device. Background Technique

[0002] The thermostat is provided with a temperature-sensitive safety device for automatic reset or manual reset; the existing thermostat for a storage device is large in volume and has a large heat generation; however, for the existing thermostat of a storage device, its heat dissipation mostly adopts heat sinks, and its heat dissipation efficiency needs to be improved; if the heat dissipation is poor, it will cause the thermostat to fail to respond to temperature changes in time and reduce its service life. Therefore, improving the heat dissipation of the thermostat is beneficial to improving the performance of the thermostat.

[0003] Among them, the patent with the publication number of CN202405174U discloses a thermostat. Although this device has the advantages of improving the safety performance of the product, reducing the product cost, and simplifying the assembly process, its heat dissipation effect still needs to be improved.

[0004] In view of the above deficiencies, there is a need for a thermostat for a storage device, which can improve the heat dissipation efficiency of the thermostat and is beneficial to improving the performance of the thermostat. Content of the Utility Model

[0005] The purpose of the utility model is to provide a thermostat for a storage device, which can improve the heat dissipation efficiency of the thermostat and is beneficial to improving the performance of the thermostat.

[0006] The utility model provides the following technical solutions:

[0007] A thermostat for a storage device includes a thermostat, and fixing ears are provided on both sides of the thermostat;

[0008] A bridge structure is further provided, and the cross-section of the bridge structure is in a "U" shape; both sides of the bridge structure are connected to the fixing ears by bolts;

[0009] A semiconductor refrigeration sheet and a thermal switch are embedded on the upper side of the bridge structure; and the leads of the semiconductor refrigeration sheet are connected in series with the thermal switch;

[0010] Preferably, an installation hole for assembling the semiconductor refrigeration sheet is provided on the upper side of the bridge structure; the edge of the semiconductor refrigeration sheet is connected to the installation hole.

[0011] Preferably, the installation hole is of a counterbore structure, and the lower side of the edge of the semiconductor refrigeration sheet is connected to the edge of the installation hole by screws or bonding.

[0012] Preferably, thermal switch holes are provided on both sides of the installation hole, and the thermal switch is embedded in the thermal switch holes.

[0013] Preferably, a lead groove is provided on the surface of the bridge structure, and the leads are arranged in the lead groove.

[0014] Preferably, the opening of the lead groove is smaller than the diameter of the lead wire, so that the lead wire can be embedded in the lead groove.

[0015] Preferably, the lead wire is led out from the bottom of the cable tray structure to the inside of the cable tray structure.

[0016] The beneficial effects of this utility model are:

[0017] This device removes heat from the area surrounding the thermostat using a semiconductor cooling chip, improving heat dissipation efficiency and thus enhancing thermostat performance. Furthermore, this device can be freely assembled and installed, making it widely applicable. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0019] Figure 1 This is a structural diagram of the present utility model;

[0020] Figure 2 This is a diagram showing the combined state of this utility model;

[0021] Figure 3 This is a structural diagram of the cable tray;

[0022] The markings in the diagram are: 1. Thermostat; 2. Mounting lug; 3. Cable tray structure; 4. Mounting hole; 5. Thermistor switch hole; 6. Lead wire groove; 7. Semiconductor cooling chip; 8. Thermistor switch; 9. Lead wire; 10. Bolt. Detailed Implementation

[0023] like Figures 1 to 3 A temperature controller for a storage device includes a temperature controller 1. The temperature controller 1 has a conventional structure, but unlike existing technologies, it has mounting ears 2 on both sides, and these mounting ears 2 are relatively wide, used to connect and fix the temperature controller 1 and a cable tray structure 3. The cable tray structure 3 has a "U"-shaped cross-section. See the attached document for details. Figure 1 and 3 The cable tray structure 3 is connected to the fixing lugs 2 on both sides by bolts 10; of course, the cable tray structure 3 can also be disassembled separately and installed on other parts, such as above other types of thermal protectors, using screw holes to achieve free assembly and installation, with a wide range of applications.

[0024] A thermoelectric cooler 7 and a thermal switch 8 are embedded on the upper side of the bridge structure 3; and the lead 9 of the thermoelectric cooler 7 is connected in series with the thermal switch 8; the thermoelectric cooler 7 is existing technology, which is divided into a cooling surface and a heat dissipation surface. When in use, the cooling surface faces down, that is, the cooling surface is located directly above the temperature controller 1.

[0025] When the temperature of thermostat 1 rises, the thermal switch 8 senses the excessive temperature and activates, activating the thermoelectric cooler 7. The cooling surface of the cooler removes heat from the area surrounding thermostat 1. When the temperature of thermostat 1 drops, the thermal switch 8 deactivates, and the thermoelectric cooler stops working. The thermoelectric cooler 7 and thermal switch 8 significantly improve heat dissipation efficiency. To further remove heat, the device's built-in fan can be used to blow it outside the device. If space permits, a fan similar to a CPU cooler can be mounted on the heating side of the thermoelectric cooler 7 to further enhance heat dissipation efficiency.

[0026] See Figure 2 and 3 To facilitate installation and improve cooling efficiency, the upper side of the cable tray structure 3 is provided with mounting holes 4 for assembling the thermoelectric cooler 7. The mounting holes 4 are countersunk holes, and the lower edge of the thermoelectric cooler 7 is connected to the edge of the mounting hole 4 by screws or adhesive, thus securing the thermoelectric cooler 7. Simultaneously, thermal switch holes 5 are provided on both sides of the mounting holes 4, and thermal switches 8 are embedded in the thermal switch holes 5. This allows the thermal switches 8 and the thermoelectric cooler 7 to directly contact the heat source, improving sensitivity and heat dissipation efficiency. Two thermal switches 8 are symmetrically arranged to further enhance sensitivity.

[0027] See Figure 1 and Figure 3 To facilitate the fixing of the lead wire 6, a lead wire groove 6 is provided on the surface of the cable tray structure 3, and the lead wire 6 is placed in the lead wire groove 6. The opening of the lead wire groove 6 is smaller than the diameter of the lead wire 6, which allows the lead wire 6 to be embedded in the lead wire groove 6, improving the reliability of the lead wire 6 fixing. Of course, glue can also be injected into the lead wire groove 6 to improve the reliability. In order to avoid cable tangling, the lead wire 6 is led out from the bottom of the cable tray structure 3 towards the inside of the cable tray structure 3, and connects to the power supply inside the cable tray structure 3.

[0028] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A temperature controller for a storage facility, characterized in that: It includes a thermostat, with fixing ears provided on both sides of the thermostat; It also has a bridge structure, and the cross-section of the bridge structure is in a "U" shape; Both sides of the bridge structure are connected to the fixing ears by bolts; A semiconductor refrigerating sheet and a thermal switch are embedded on the upper side of the bridge structure; And the leads of the semiconductor refrigerating sheet are connected in series with the thermal switch.

2. A temperature controller for a storage device according to claim 1, characterized in that: There are mounting holes for mounting the semiconductor refrigerating sheet on the upper side of the bridge structure; the edge of the semiconductor refrigerating sheet is connected to the mounting holes.

3. A temperature controller for a storage device according to claim 2, characterized in that: The mounting holes are of a counterbore structure, and the lower side of the edge of the semiconductor refrigerating sheet is connected to the edge of the mounting holes by screws or bonding.

4. A temperature controller for a storage device according to claim 3, characterized in that: There are thermal switch holes provided on both sides of the mounting holes, and the thermal switch is embedded in the thermal switch holes.

5. A temperature controller for a storage device according to claim 4, characterized in that: There is a lead groove on the surface of the bridge structure, and the leads are arranged in the lead groove.

6. A temperature controller for a storage device according to claim 5, characterized in that: The opening of the lead groove is smaller than the diameter of the leads, so that the leads can be embedded in the lead groove.

7. A temperature controller for a storage device according to claim 6, characterized in that: The leads are led out from the bottom of the bridge structure to the inner side of the bridge structure.

Images