Load lead-out, load lead-out and ceramic cover connection structure and relay
By designing a connection structure of deformation ring and coupling ring at the load lead end, the problem of insufficient welding strength is solved, the welding area is increased, the risk of breakage is reduced, and the connection reliability of the relay is improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN HONGFA ELECTRIC POWER CONTROLS CO LTD
- Filing Date
- 2025-06-20
- Publication Date
- 2026-07-21
AI Technical Summary
In the existing technology, the welding strength between the load lead and the ceramic cover is insufficient, which leads to cracking at the weld and subsequent relay failure.
Design a load lead-out terminal, including a terminal body and a connecting ring body. The connecting ring body is composed of a deformation ring and a joining ring. The deformation ring can absorb welding stress, and the orthogonal projection area of the joining ring is larger than that of the deformation ring. The solder is distributed in the gap between the joining ring and the ceramic cover and at its included angle, thereby increasing the effective welding area and improving the connection strength.
It significantly increases the welding area of the load lead-out end and the ceramic cover, reduces the risk of welding stress fracture, and improves connection strength and reliability.
Smart Images
Figure CN224536985U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of relay technology, and in particular to a load lead, a connection structure between the load lead and a ceramic cover, and a relay. Background Technology
[0002] A relay is an automated control device that uses a coil to generate a magnetic field, causing contacts to close and thus controlling the load. The relay's contacts are isolated within a ceramic housing and led out from the load leads that pass through the ceramic housing.
[0003] The load lead and the ceramic cover are welded together. Typically, fusible solder is placed between the load lead and the ceramic cover, and a welding device is used to heat the solder to a molten state, thus connecting the load lead and the ceramic cover together. However, insufficient weld strength between the load lead and the ceramic cover can lead to cracking and other abnormalities at the weld, resulting in air leakage and ultimately relay failure. Utility Model Content
[0004] Therefore, it is necessary to provide a load output terminal to address the above-mentioned problems.
[0005] A load lead includes:
[0006] Terminal body;
[0007] A connecting ring body is connected to a terminal body. The connecting ring body includes a deformation ring and a connecting ring. The deformation ring is connected between the terminal body and the connecting ring along a first direction. The deformation ring can be deformed under force to absorb welding stress. The connecting ring is used to weld to a ceramic cover. In the first direction, the orthogonal projection area of the connecting ring is larger than the orthogonal projection area of the deformation ring.
[0008] The solder can be placed between the bonding ring and the ceramic cover, and the molten solder can be adsorbed between the bonding ring and the ceramic cover, as well as between the included angle of the bonding ring and the ceramic cover.
[0009] The aforementioned load lead-out terminal includes a terminal body and a connecting ring body, wherein the connecting ring body is composed of a deformation ring and a joining ring. The deformation ring connects the terminal body and the joining ring along a first direction, and it can absorb welding stress through deformation; the orthographic projection area of the joining ring in the first direction is larger than the orthographic projection area of the deformation ring in the axial direction. After the solder melts, it is distributed in the gap between the joining ring and the ceramic cover and at its included angle, significantly increasing the effective welding area, improving the connection strength and suppressing the risk of stress fracture.
[0010] In one embodiment, the engagement ring extends along a second direction relative to at least one side of the deformation ring;
[0011] The second direction is set perpendicular to the first direction.
[0012] In one embodiment, the end face of the connecting ring that connects to the ceramic cover is flat.
[0013] In one embodiment, the connecting ring includes a first ring body and a second ring body, the first ring body being connected between the deformation ring and the second ring body along a first direction, and the second ring body being welded to the ceramic cover and capable of deforming under force to absorb welding stress.
[0014] In the first direction, the projected area of the first ring body is larger than the projected area of the second ring body, so that in the second direction, there are accommodating spaces on both sides of the second ring body, which are used to accommodate solder.
[0015] In one embodiment, a connecting ramp is provided between the connecting ring and the deformation ring, and the connecting ramp gradually approaches the outer ring surface of the deformation ring from the outer ring surface of the connecting ring.
[0016] In one embodiment, the load lead-out terminal is a one-piece molded part; or...
[0017] The terminal body and the connecting ring are separate components.
[0018] In one embodiment, the connecting ring is a one-piece molded part; or...
[0019] The deformation ring and the connecting ring are separate components.
[0020] In one embodiment, the deformation ring is made of a first material and the connecting ring is made of a second material, the first material and the second material having different coefficients of thermal expansion.
[0021] This application further proposes a connection structure between a load lead-out terminal and a ceramic cover. The connection structure includes a ceramic cover and a load lead-out terminal according to some of the above embodiments, wherein the ceramic cover is provided with a mounting hole, the terminal body of the load lead-out terminal passes through the mounting hole, and the connecting ring of the load lead-out terminal is connected to the ceramic cover.
[0022] This application further proposes a relay, which includes a connection structure between a load lead and a ceramic cover according to some of the above embodiments. Attached Figure Description
[0023] Figure 1 This is a perspective view of the load lead-out terminal according to the first embodiment of this application.
[0024] Figure 2 This is a schematic diagram of the connection structure between the load lead-out terminal and the ceramic cover according to the first embodiment of this application.
[0025] Figure 3 for Figure 2 Enlarged view of point A in the middle.
[0026] Figure 4 This is a partially enlarged view of the connection structure between the load lead-out terminal and the ceramic cover according to the second embodiment of this application.
[0027] Figure 5 This is a partially enlarged view of the connection structure between the load lead-out terminal and the ceramic cover according to the third embodiment of this application.
[0028] Figure 6 This is a partially enlarged view of the connection structure between the load lead-out terminal and the ceramic cover according to the fourth embodiment of this application.
[0029] Figure 7 This is a partially enlarged view of the connection structure between the load lead-out terminal and the ceramic cover according to the fifth embodiment of this application.
[0030] Figure 8 This is a partially enlarged view of the connection structure between the load lead-out terminal and the ceramic cover according to the sixth embodiment of this application.
[0031] Figure label:
[0032] 100. Load lead-out terminal; 1. Terminal body; 2. Connecting ring body; 20. Connecting bevel; 21. Deformation ring; 22. Connecting ring; 221. First ring body; 222. Second ring body; 220. Accommodation space; 2000. Ceramic cover; 200. Mounting hole. Detailed Implementation
[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0034] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0035] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0038] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0039] See Figures 1 to 8As shown, in some embodiments of this application, the load lead-out terminal 100 includes a terminal body 1 and a connecting ring 2. The connecting ring 2 is connected to the terminal body 1 and includes a deformation ring 21 and a connecting ring 22. The deformation ring 21 is connected between the terminal body 1 and the connecting ring 22 along a first direction. The deformation ring 21 can deform under force to absorb welding stress. The connecting ring 22 is used for welding to the ceramic cover 2000, and in the first direction, the orthographic projection area of the connecting ring 22 is larger than the orthographic projection area of the deformation ring 21. Solder can be disposed between the connecting ring 22 and the ceramic cover 2000, and the molten solder can be adsorbed between the connecting ring 22 and the ceramic cover 2000, and adsorbed between the included angle of the connecting ring 22 and the ceramic cover 2000. Thus, the deformation ring 21 absorbs at least part of the welding stress through its own deformation during the welding process, thereby reducing the risk of breakage at the connection between the load lead-out end 100 and the ceramic cover 2000 caused by welding stress. In addition, the design of the joint ring 22 significantly increases the effective welding area to improve the connection strength between the load lead-out end 100 and the ceramic cover 2000.
[0040] It is important to understand that, see Figure 1 As shown, in one embodiment of this application, the terminal body 1 is generally cylindrical, and the connecting ring 2 is generally annular. Of course, the terminal body 1 can also be other shapes; for example, it can be designed as a triangular prism or a quadrangular prism, and the connecting ring 2 is not limited to annular; it can also be a rectangular ring or other polygonal ring. For ease of understanding, the following description will consistently use the example of the terminal body 1 being generally cylindrical and the connecting ring 2 being generally annular. In this application, the first direction can be understood as the axial direction of the load lead-out end 100, and the second direction can be understood as the radial direction of the load lead-out end 100. See also... Figures 2 to 8 As shown, in some embodiments of this application, in the XZ plane, the first direction is the Z direction as shown in the figure, and the second direction is the X direction as shown in the figure.
[0041] For example, see Figures 3 to 8As shown, in the load lead-out end 100, the connecting ring 2, which connects to the ceramic cover 2000, is designed so that the maximum width of the connecting ring 22 for welding is greater than the width of the deformation ring 21, giving the connecting ring 2 a larger surface area for connecting with the ceramic cover 2000. During the welding process between the load lead-out end 100 and the ceramic cover 2000, the solder (such as brazing material) needs to be placed between the connecting ring 2 and the ceramic cover 2000. Because the connecting ring 2 has a large surface area to accommodate the molten solder, excessive solder overflows from the gap between the connecting ring 2 and the ceramic cover 2000 during the diffusion of the molten solder. This allows the solder to remain in the gap between the load lead-out end 100 and the ceramic cover 2000 as much as possible to form a larger weld layer, significantly increasing the effective welding area between the connecting ring 2 and the ceramic cover 2000, thereby improving the welding strength between the connecting ring 2 and the ceramic cover 2000.
[0042] Even if a small amount of solder overflows from the gap between the connecting ring 2 and the ceramic cover 2000, the solder will accumulate at the angle formed by the inner ring surface of the connecting ring 2 and the upper surface of the ceramic cover 2000. This effectively suppresses the overflowing solder from climbing upwards along both sides of the connecting ring 2, allowing the solder to accumulate at the bottom as much as possible. This further increases the effective welding area between the connecting ring 2 and the ceramic cover 2000 and strengthens the root connection strength between the connecting ring 2 and the ceramic cover 2000, thereby improving the welding strength between the connecting ring 2 and the ceramic cover 2000. Thus, for the connecting ring 2 of this application, since the projected area of the connecting ring 22 is larger than that of the deformation ring 21, the connecting ring 22 has a larger surface area to accommodate the molten solder, significantly increasing the effective welding area between the load lead-out end 100 and the ceramic cover 2000 to improve the welding strength. In addition, since the overflowing solder will accumulate on both sides of the connecting ring body 2, it can effectively suppress the overflowing solder from climbing up along both sides of the connecting ring body 2, so it will not affect the cross-sectional area and shape of the deformation ring 21, and will not affect the deformability of the deformation ring 21.
[0043] In addition, even if welding stress is generated during welding, the deformation ring 21 absorbs at least part of the welding stress by deforming, thereby suppressing the risk of breakage at the connection between the load lead-out end 100 and the ceramic cover 2000 caused by welding stress, and improving the connection strength between the load lead-out end 100 and the ceramic cover 2000.
[0044] In summary, according to the load lead-out terminal 100 of this application, the load lead-out terminal 100 includes a terminal body 1 and a connecting ring body 2, wherein the connecting ring body 2 is composed of a deformation ring 21 and a connecting ring 22. The deformation ring 21 connects the terminal body 1 and the connecting ring 22 along the axial direction, and it can absorb welding stress through deformation; the orthographic projection surface of the connecting ring 22 in the axial direction is larger than the orthographic projection surface of the deformation ring 21 in the axial direction. After the solder melts, it is distributed in the gap between the connecting ring 22 and the ceramic cover 2000 and at its included angle, significantly increasing the effective welding area, improving the connection strength and suppressing the risk of stress fracture. Thus, the load lead-out terminal 100 according to this application can both reduce the welding stress generated by welding and improve the welding strength.
[0045] See Figures 3 to 8 As shown, in some embodiments of this application, the coupling ring 22 extends along a second direction relative to at least one side of the deformation ring 21, and the second direction is perpendicular to the first direction. Specifically, the second direction is the radial direction of the load lead-out end 100. The coupling ring 22 extends radially relative to the inner or outer side of the deformation ring 21, or simultaneously on both sides. As the coupling ring 22 extends radially, its axial projection also increases, thereby further increasing the contact area between the coupling ring 22 and the ceramic cover 2000. For example, see... Figure 3 and Figure 4 As shown, the coupling ring 22 extends radially outward relative to the deformation ring 21; see reference Figures 5 to 8 As shown, the connecting ring 22 extends radially to both sides (i.e., the inner and outer sides) relative to the deformed ring 21.
[0046] For example, the radially extending design of the coupling ring 22 causes its radial boundary to extend beyond the boundary of the deformation ring 21, thereby creating a larger space for accommodating solder between the coupling ring 22 and the ceramic cover 2000. When the solder melts, the molten solder not only covers the planar gap between the coupling ring 22 and the ceramic cover 2000 but also fills the additional angled area formed by the coupling ring 22 and the ceramic cover 2000. Thus, the radially extending coupling ring 22 structure further increases the effective welding area between the load lead-out end 100 and the ceramic cover 2000, improving welding reliability.
[0047] See Figures 3 to 8As shown, in some embodiments of this application, the end face connecting the coupling ring 22 to the ceramic cover 2000 is planar. Specifically, the welding end face of the coupling ring 22 (i.e., the surface connected to the ceramic cover 2000) is designed as a flat planar structure, which extends along a second direction (radial) and is adapted to be parallel to the corresponding welding surface of the ceramic cover 2000. Exemplarily, the planar design of the welding end face of the coupling ring 22 allows the solder to be evenly distributed between the coupling ring 22 and the ceramic cover 2000 after melting, avoiding localized solder accumulation or uneven gaps caused by uneven end faces. For example, when the solder is placed between the planar end face of the coupling ring 22 and the surface of the ceramic cover 2000, the molten solder can spread evenly in the planar contact area, forming a weld layer of uniform thickness. Simultaneously, the planar butt joint between the planar end face and the ceramic cover 2000 further reduces the risk of stress concentration after welding, thereby enhancing the stability of the connection structure.
[0048] See Figure 8As shown, in some embodiments of this application, the joining ring 22 includes a first ring body 221 and a second ring body 222. The first ring body 221 is connected between the deformation ring 21 and the second ring body 222 along a first direction (axial direction). The second ring body 222 is welded to the ceramic cover 2000, and the second ring body 222 can deform under force to absorb welding stress. In the first direction, the projected area of the first ring body 221 is larger than the projected area of the second ring body 222, such that the second ring body 222 forms receiving spaces 220 on both sides in the second direction (radial direction), and the receiving spaces 220 are used to receive solder. Specifically, the first ring body 221 and the second ring body 222 are stacked along the axial direction, and the width of the second ring body 222 is smaller than the width of the first ring body 221. Because the second ring body 222 is thinner and forms a stepped structure with the first ring body 221, the second ring body 222 is more likely to undergo elastic or plastic deformation during the welding process, thereby absorbing welding stress. Meanwhile, the larger projected area of the first ring 221 allows it to cover a wider radial area, thus forming recessed areas (i.e., receiving spaces 220) on both sides of the radial axis between it and the second ring 222. It should be understood that the width of the second ring 222 is less than the width of the first ring 221: in the load lead-out end 100, the distance between the outer and inner ring surfaces of the second ring 222 is less than the distance between the outer and inner ring surfaces of the first ring 221. Alternatively, it can be understood that the radial thickness of the second ring 222 is less than the radial thickness of the first ring 221. Specifically, during implementation, when solder overflows between the second ring 222 and the upper surface of the ceramic cover 2000, it can accumulate at the bottom of the receiving space 220 and on both sides of the first ring 221, thereby increasing the welding area between the second ring 222 and the ceramic cover 2000. Furthermore, since the outer dimension of the first ring 221 is larger than that of the second ring 222, the first ring 221 can effectively prevent solder from bypassing it and climbing upwards, allowing as much solder as possible to accumulate on both sides of the first ring 221. Additionally, since any overflowing solder accumulates on both sides of the first ring 221, it can also enhance the connection strength at the root of the joining ring 22. Furthermore, it should be noted that because the second ring 222 has a deformable structure, it can also absorb some stress during the welding process. In summary, Figure 8 This structure of the connecting ring 2 not only increases the welding area between the connecting ring 2 and the ceramic cover 2000, but also greatly enhances the root connection strength between the connecting ring 2 and the ceramic cover 2000, which has a very good beneficial effect.
[0049] It should be noted that, see reference Figure 8As shown, in one embodiment of this application, the second ring 222 can be an annular cylinder with a rectangular cross-section. However, this application is not limited to this; for example, the second ring 222 can also be an annular cylinder with a trapezoidal cross-section. Specifically, the surface where the second ring 222 connects to the first ring 221 is larger than the surface where the second ring 222 connects to the ceramic cover 2000. In other words, the second ring 222 is an annular cylinder with an inverted trapezoidal cross-section. Thus, due to the "smaller at the bottom and larger at the top" structural feature of the second ring 222, the second ring 222 and the first ring 221 have a larger connection area, ensuring the reliability of the connection between the second ring 222 and the first ring 221. Furthermore, this design makes the deformation of the second ring 222 positively correlated with the welding stress. It should be understood that the second ring 222 has a "small at the bottom and large at the top" structural feature. As the second ring 222 deforms from bottom to top, the deformation of the second ring 222 gradually increases as the welding stress applied to the second ring 222 increases.
[0050] For example, during welding, solder is pre-placed in the axial gap between the second ring 222 and the ceramic cover 2000. When the solder melts, some of the molten solder flows into the receiving spaces 220 on both radial sides of the second ring 222 under capillary action, filling the stepped gap between the first ring 221 and the second ring 222. For example, in... Figure 8 In the embodiment shown, the accommodating space 220 is an annular groove between the radial boundaries of the second ring 222 and the first ring 221. The molten welding liquid seeps into the groove and solidifies, forming an additional mechanical anchoring structure, thereby improving the peel strength of the welded joint.
[0051] It should be understood that the width of the second ring 222 and the dimensions of the accommodating space 220 can be adjusted according to the magnitude of the welding stress. For example, in scenarios requiring higher deformation capacity, the second ring 222 can be designed to be thinner and the accommodating space 220 deeper; while in scenarios requiring consideration of structural strength, the width of the second ring 222 can be appropriately increased and the width of the accommodating space 220 reduced. Such modifications all fall within the equivalent implementation scope of the technical solution of this application.
[0052] See Figure 3 , Figure 5 and Figure 7 As shown, in some embodiments of this application, the connecting ring 22 and the deformation ring 21 are connected by a connecting ramp 20, which is formed by the outer ring surface of the connecting ring 22 gradually approaching the outer ring surface of the deformation ring 21. Specifically, the connecting ramp 20 is a smooth arc-shaped or tapered ramp structure, forming a continuously transitioning profile on the outer surface of the load lead-out end 100, so that the geometric boundary between the connecting ring 22 and the deformation ring 21 has no sharp edges.
[0053] For example, see Figure 3 , Figure 5 and Figure 7 As shown, the connecting bevel 20 extends along the first direction (axial direction), and its radius of curvature is adjusted according to the radial dimension difference between the joining ring 22 and the deformation ring 21. During welding, the continuous transition design of the connecting bevel 20 ensures that the welding stress varies gradually between the deformation ring 21 and the joining ring 22, rather than being concentrated at a linear boundary. For example, during the welding stage, the connecting bevel 20 provides continuity for the transmission of welding stress, avoiding stress concentration at the connection between the deformation ring 21 and the joining ring 22. This reduces the risk of cracking at the connection between the deformation ring 21 and the joining ring 22. Furthermore, the specific shape of the connecting bevel 20 (such as the curvature of the arc and the bevel angle) can be adjusted according to actual needs, and such variations are all within the equivalent implementation scope of the technical solution of this application.
[0054] In some embodiments of this application, see, for example, [reference needed]. Figure 3 and Figure 7 As shown, the load lead-out terminal 100 is a one-piece molded part, meaning that the terminal body 1 and the connecting ring 2 are integrally formed from the same material through processes such as casting or machining. See, for example... Figure 3 and Figure 7 In the embodiment shown, the terminal body 1, deformation ring 21 and connecting ring 22 are integrally made of copper alloy by casting or machining process, ensuring that there are no joints between the components, resulting in high structural strength and simplified manufacturing process.
[0055] In other embodiments, for example, see [reference] Figure 4 , Figure 5 , Figure 6 and Figure 8 As shown, the terminal body 1 and the connecting ring 2 are separate components. Specifically, for example... Figure 4 , Figure 6 and Figure 8 As shown, a portion of the structure of the connecting ring 2 (such as the deformation ring 21) and the terminal body 1 are integrally formed from the same material through processes such as casting or machining, while another portion of the structure of the connecting ring 2 can be assembled and connected to the connecting ring 2 by means of welding or other methods. And as shown... Figure 5 As shown, the connecting ring 2 is integrally formed from the same material.
[0056] It is important to understand that, regardless of whether it is a monolithic design or a split design, the functional structure of the deformation ring 21 and the connecting ring 22 (such as the projected area of the connecting ring 22 being larger than that of the deformation ring 21, and the deformation ring 21 absorbing stress) remains consistent. For example, in a split embodiment, the interface between the connecting ring 2 and the terminal body 1 can be transitioned by an arc or reinforced with additional ribs to avoid stress concentration.
[0057] See Figure 5As shown, in some embodiments of this application, the connecting ring 2 is a one-piece molded part, that is, the deformation ring 21 and the connecting ring 22 are integrally formed from the same material by casting or machining. For example, in Figure 5 In the embodiment shown, the deformation ring 21 and the connecting ring 22 are made of copper alloy plates to form a continuous circular column structure with no seam between them, ensuring the structural integrity and stress transmission continuity of the connecting ring body 2.
[0058] See Figure 6 and Figure 8 As shown, in some embodiments, the deformation ring 21 and the connecting ring 22 are separate components. Specifically, the deformation ring 21 and the connecting ring 22 can be connected and assembled by welding or other methods. For example, in Figure 6 and Figure 8 In the embodiment shown, the deformation ring 21 is made of copper, and the connecting ring 22 is made of Kovar alloy; the two are fixed together by brazing.
[0059] The split design allows the deformation ring 21 and the connecting ring 22 to be made of different materials. For example, in one embodiment of this application, the deformation ring 21 is made of copper, and the connecting ring 22 is made of Kovar alloy, thus giving the deformation ring 21 and the connecting ring 22 different coefficients of thermal expansion. It should be noted that the coefficient of thermal expansion of Kovar alloy is close to that of ceramic materials. By selecting Kovar alloy as the material for the connecting ring 22, the welding stress between the connecting ring 22 and the ceramic cover 2000 can be effectively reduced, thus minimizing the risk of cracking.
[0060] It's important to understand that the load lead 100 is typically made of copper, while the ceramic cover 2000 is made of ceramic. The coefficients of thermal expansion of copper and ceramic differ significantly. During welding, the solder (such as brazing filler metal) needs to be heated to a molten state to connect two adjacent objects, thus releasing a large amount of heat. Furthermore, due to the significant difference in thermal expansion coefficients between copper and ceramic, substantial welding stress is generated.
[0061] However, according to this application, the deformation ring 21 and the connecting ring 22 in the connecting ring body 2 of the load lead 100 are supported by two materials with different coefficients of thermal expansion. Thus, the deformation ring 21 is made of a material with a coefficient of thermal expansion similar to or the same as that of copper, and the connecting ring 22 is made of a material with a coefficient of thermal expansion similar to or the same as that of ceramic. In this way, during the welding process, it is possible to ensure that the deformation ring 21 is welded to the terminal body 1, the deformation ring 21 is welded to the connecting ring 22, and the connecting ring 22 is welded to the ceramic cover 2000 with low welding stress. By matching the welding stress distribution through the deformation ring 21 and the connecting ring 22 made of different materials, welding strength is ensured while preventing cracking of the ceramic surface.
[0062] See Figure 2 As shown, the connection structure between the load lead and the ceramic cover according to this application may include a ceramic cover 2000 and a load lead 100 according to some of the above embodiments. When the load lead 100 is assembled with the ceramic cover 2000, the terminal body 1 is adapted to pass through the mounting hole 200 of the ceramic cover 2000, and the connecting ring 2 of the load lead 100 is connected to the ceramic cover 2000.
[0063] Since the load lead-out terminal 100 includes a terminal body 1 and a connecting ring body 2, wherein the connecting ring body 2 is composed of a deformation ring 21 and a connecting ring 22, the deformation ring 21 connects the terminal body 1 and the connecting ring 22 axially, and it can absorb welding stress through deformation; the axial projection surface of the connecting ring 22 is larger than the axial projection surface of the deformation ring 21, and the melted solder is distributed in the gap between the connecting ring 22 and the ceramic cover 2000 and at its included angle, significantly increasing the effective welding area, improving the connection strength and suppressing the risk of stress fracture. Therefore, the load lead-out terminal 100 and the ceramic cover 2000 have good connection reliability.
[0064] Furthermore, since the relay according to this application includes the connection structure between the load lead and the ceramic cover in some of the above embodiments, and since the load lead 100 and the ceramic cover 2000 have good connection reliability, the relay according to this application has high reliability in use.
[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A load lead-out terminal (100), characterized in that, include: Terminal body (1); A connecting ring body (2) is connected to the terminal body (1). The connecting ring body (2) includes a deformation ring (21) and a connecting ring (22). The deformation ring (21) is connected between the terminal body (1) and the connecting ring (22) along a first direction. The deformation ring (21) can be deformed under force to absorb welding stress. The connecting ring (22) is used to weld to the ceramic cover (2000). In the first direction, the orthographic projection area of the connecting ring (22) is greater than the orthographic projection area of the deformation ring (21). Solder can be disposed between the bonding ring (22) and the ceramic cover (2000), and the molten solder can be adsorbed between the bonding ring (22) and the ceramic cover (2000), and adsorbed between the included angle of the bonding ring (22) and the ceramic cover (2000).
2. The load lead-out terminal (100) according to claim 1, characterized in that, The joining ring (22) is provided along the second direction to extend at least one side relative to the deformation ring (21); The second direction is perpendicular to the first direction.
3. The load lead-out terminal (100) according to claim 2, characterized in that, The end face of the connecting ring (22) that connects to the ceramic cover (2000) is a plane.
4. The load lead-out terminal (100) according to claim 2, characterized in that, The joining ring (22) includes a first ring body (221) and a second ring body (222). The first ring body (221) is connected between the deformation ring (21) and the second ring body (222) along the first direction. The second ring body (222) is welded to the ceramic cover (2000), and the second ring body (222) can be deformed under force to absorb welding stress. In the first direction, the projected area of the first ring body (221) is larger than the projected area of the second ring body (222), so that in the second direction, a receiving space (220) is formed on both sides of the second ring body (222), the receiving space (220) being used to receive the solder.
5. The load lead-out terminal (100) according to claim 2, characterized in that, A connecting slope (20) is provided between the connecting ring (22) and the deformation ring (21), and the connecting slope (20) gradually approaches the outer ring surface of the deformation ring (21) from the outer ring surface of the connecting ring (22).
6. The load lead-out terminal (100) according to any one of claims 1 to 5, characterized in that, The load lead-out terminal (100) is a one-piece molded part; or, The terminal body (1) and the connecting ring (2) are separate components.
7. The load lead-out terminal (100) according to any one of claims 1 to 5, characterized in that, The connecting ring (2) is a one-piece molded part; or, The deformation ring (21) and the joining ring (22) are separate components.
8. The load lead-out terminal (100) according to claim 7, characterized in that, The deformation ring (21) is made of a first material, and the connecting ring (22) is made of a second material, wherein the coefficients of thermal expansion of the first material and the second material are different.
9. A connection structure between a load lead-out terminal and a ceramic cover, characterized in that, include: A ceramic cover (2000) is provided with mounting holes (200); According to any one of claims 1 to 8, the terminal body (1) of the load lead-out terminal (100) passes through the mounting hole (200), and the connecting ring (2) of the load lead-out terminal (100) is connected to the ceramic cover (2000).
10. A relay, characterized in that, include: The connection structure between the load lead-out terminal and the ceramic cover as described in claim 9.