A battery pack

Abstract

The application discloses a battery pack, which comprises a battery module, a support body, a liquid cooling plate, a current row and a heat-conducting adhesive layer, the support body is arranged on the top of the battery module, the support body is provided with a mounting groove, the liquid cooling plate is arranged on the side of the support body away from the battery module, the current row is arranged in the mounting groove, the current row is provided with an arch bridge structure, the arch bridge structure is arched away from the liquid cooling plate, and the heat-conducting adhesive layer is filled between the support body and the liquid cooling plate, and aims to solve the technical problem of how to reduce the amount of heat-conducting adhesive between the current row and the cooling plate in the battery structure.

Description

Technical Field

[0001] This application relates to the field of battery heat dissipation technology, and more particularly to a battery pack. Background Technology

[0002] In existing battery pack structures, an aluminum busbar is typically located at the top of the battery to collect the current from the cell tabs and connect to the external circuitry. The aluminum busbar structure often adopts an arched bridge design, creating a certain height gap between the top of the battery and the cooling plate.

[0003] The arched structure occupies space vertically, increasing the distance between the aluminum busbar and the top cold plate. To achieve effective thermal conductivity between the busbar and the cold plate, a large amount of thermally conductive adhesive is required to fill the structural gaps and create heat conduction channels. Excessive use of this adhesive not only increases material costs but also places higher demands on the assembly process. Furthermore, the adhesive itself is of relatively high quality, and excessive use will increase the overall weight of the package, which is detrimental to the system's lightweight design goals.

[0004] Therefore, how to reduce the amount of thermally conductive adhesive used between the aluminum busbar and the cooling plate while ensuring the reliability of electrical connections has become an urgent technical problem to be solved in current battery structure design. Utility Model Content

[0005] One objective of this application is to provide a battery pack that addresses the technical problem of how to reduce the amount of thermally conductive adhesive used between the current busbar and the cooling plate in the battery structure.

[0006] To achieve the above objectives, this application provides a solution as follows: a battery pack, comprising a battery module; a support body disposed on top of the battery module, the support body having an installation groove; a liquid cooling plate disposed on the side of the support body away from the battery module; a current bus disposed in the installation groove, the current bus having an arch bridge structure, the arch bridge structure arching away from the liquid cooling plate; and a thermally conductive adhesive layer filling the space between the support body and the liquid cooling plate.

[0007] Optionally, the arch bridge structure is used to be embedded between adjacent cell terminals in the battery module, and the arch height of the arch bridge structure is less than the height of the cell terminals in the battery module.

[0008] Optionally, the arch height of the arch bridge structure is h, which satisfies the relationship with the height H of the battery cell electrode: 0.3H≤h≤0.8H.

[0009] Optionally, the thickness of the thermally conductive adhesive layer ranges from 1.0 to 2.5 mm.

[0010] Optionally, the bracket body includes multiple positioning protrusions, each mounting slot corresponds to at least two positioning protrusions, and the current outlet is provided with positioning through holes, with the positioning protrusions passing through the positioning through holes.

[0011] Optionally, the height of the positioning convex hull is n, and its relationship with the thickness N of the current busbar is: 0.7N≤n≤N.

[0012] Optionally, the support body also includes partitions disposed between adjacent current bars.

[0013] Optionally, the upper surface of the partition is coplanar with the upper surface of the current busbar.

[0014] Optionally, the support body is a vacuum-formed structure, and the thickness of the support body ranges from 0.4 to 0.8 mm.

[0015] Optionally, the main body of the support has a flow groove, which together with the liquid cooling plate forms a discharge channel, and the distance from the bottom surface of the flow groove to the bottom surface of the liquid cooling plate is greater than 5 mm.

[0016] The beneficial effects of this application are as follows: To address the issue of increased thermal conductive adhesive layer thickness due to the long distance between the current busbar and liquid cooling plate in existing battery structures, this application modifies the arched structure by making it arched towards the battery module side. This eliminates the vertical space occupied by the arched structure, thereby shortening the vertical distance from the current busbar to the liquid cooling plate, reducing the amount of thermal conductive adhesive used, lowering adhesive costs and overall package weight, and significantly improving heat conduction efficiency. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a battery pack provided in an embodiment of this application; Figure 2 This is a cross-sectional schematic diagram of a battery pack provided in an embodiment of this application; Figure 3 This is provided by the embodiments of this application. Figure 2 A magnified view of a portion of region A in the middle; Figure 4 This is an exploded view of the support body and the current bus provided in the embodiment of this application; Figure 5 This is a schematic diagram of the current bus structure provided in an embodiment of this application; Figure 6 This is a partial structural schematic diagram of the support body provided in the embodiments of this application.

[0019] Explanation of icon numbers: 10. Bracket body; 11. Mounting groove; 12. Positioning protrusion; 13. Partition; 14. Flow groove; 20. Liquid cooling plate; 30. Current busbar; 31. Arch bridge structure; 32. Positioning through hole; 40. Thermally conductive adhesive layer; 50. Discharge channel; 60. Battery module; 61. Cell terminal. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0021] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0022] It should also be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or may be connected to an intermediary component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component through an intermediary component.

[0023] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the structure of a battery pack provided in an embodiment of this application. Figure 2 This is a cross-sectional schematic diagram of a battery pack provided in an embodiment of this application. Figure 3 This is provided by the embodiments of this application. Figure 2 A magnified view of a portion of region A in the middle.

[0024] This embodiment provides a battery pack for optimizing the heat conduction path of the current bus 30 at the top of the battery and reducing the amount of thermally conductive adhesive used. The battery pack includes a support body 10, a liquid cooling plate 20, a current bus 30, and a thermally conductive adhesive layer 40.

[0025] The support body 10 is mounted on top of the battery module 60 and can be flat or frame-shaped. A mounting groove 11 is machined on the support body 10. The mounting groove 11 is used to embed and fix the current busbar 30, ensuring a stable position during operation. A liquid cooling plate 20 is located on the side of the support body 10 away from the battery module 60. The liquid cooling plate 20 has internal coolant channels where coolant circulates, absorbing and carrying away heat from the current busbar 30 and the battery module 60.

[0026] Please see Figure 4 , Figure 4 This is an exploded view of the bracket body 10 and the current busbar 30 provided in this embodiment. The current busbar 30 is embedded in the mounting groove 11 and has an arch bridge structure 31. The highest point of the arch bridge bends towards the battery module 60, that is, the side of the arch bridge facing the liquid cooling plate 20 is concave. Unlike the structure of the arch bridge in the prior art, which usually protrudes towards the liquid cooling plate 20, this reverse arch makes the base surface of the current busbar 30 closer to the surface of the liquid cooling plate 20 in most areas, thereby significantly reducing the vertical distance between the two. A thermally conductive adhesive layer 40 is filled between the bracket body 10 and the liquid cooling plate 20. The thickness of the thermally conductive adhesive is jointly defined by the shape of the mounting groove 11, the bracket body 10, and the current busbar 30. Because the arch bridge arches towards the battery side, the distance between the planar area of ​​the current busbar 30 and the liquid cooling plate 20 is shortened, the required thickness of the thermally conductive adhesive is reduced, and the amount of adhesive applied is correspondingly reduced. The cured thermally conductive adhesive forms a stable heat conduction channel, which quickly conducts the heat generated by the current busbar 30 during operation to the liquid cooling plate 20, where it is carried away by the coolant inside the liquid cooling plate 20.

[0027] In this embodiment, compared to the traditional structure where the arch bridge protrudes towards the liquid cooling plate 20, increasing the distance between the current busbar 30 and the liquid cooling plate 20, this application saves space and shortens the distance between the current busbar 30 and the liquid cooling plate 20 by changing the direction of the arch bridge, significantly accelerating heat transfer and improving heat transfer efficiency. Simultaneously, due to the shorter distance, the amount of thermally conductive adhesive used is reduced, lowering material costs and reducing the overall package weight. A better balance is achieved between structural compactness and thermal management performance.

[0028] Further, please refer to Figure 3 , Figure 3 This is provided by the embodiments of this application. Figure 2 A magnified view of region A in the middle. In some optimized embodiments, the arch bridge structure 31 is designed to be embedded in the gap area between adjacent cell terminals 61 in the battery module 60. The battery module 60 is typically composed of multiple cells arranged in an array, with each cell having a terminal on top. A certain gap exists between the terminals due to structural installation and insulation spacing requirements. Placing the arch bridge structure 31 within this gap makes full use of previously unused space, allowing for a more compact layout of the current busbar 30 and avoiding additional module height requirements.

[0029] To ensure the safety and stability of the assembly process, the arch height of the arch bridge structure 31 is strictly limited to be less than the height of the terminal post in the battery module 60. Preferably, the arch height is 1 to 2 millimeters lower than the terminal post height, creating a height difference at the top of the module. Even if thermal expansion occurs due to temperature changes during operation, a safe distance is maintained between the arch bridge structure 31 and the top of the terminal post, avoiding the risk of mechanical collision or metal short circuit. A certain lateral clearance is also maintained between the arch bridge structure 31 and the terminal post to absorb assembly tolerances and prevent frictional wear caused by vibration.

[0030] In terms of manufacturing process, the arch bridge structure 31 can be processed by stamping, bending or integral molding, etc., to maintain continuity with other straight parts of the current busbar 30, avoiding increased contact resistance caused by additional welding or connection. During assembly, after the current busbar 30 is embedded in the mounting groove 11, the arch bridge part naturally falls into the gap between adjacent poles, reducing assembly difficulty.

[0031] In one implementation, the arch height of the arch bridge structure 31 is denoted as h, which refers to the vertical distance of the highest point of the arch bridge relative to the reference plane of the current busbar 30; the height of the cell electrode post 61 is denoted as H, which is the vertical distance of the top of the electrode post relative to the top surface of the cell. The two satisfy the following relationship: 0.3H≤h≤0.8H.

[0032] Within this height range, the arch bridge structure 31 can effectively embed itself into the gap between adjacent cell terminals 61 in the battery module 60 without interfering with the top of the terminals. If h is less than 0.3H, the arch bridge has insufficient deformation space, which can easily damage the current busbar 30 when the cell expands significantly; if h is greater than 0.8H, the height of the arch bridge is too large, causing the current busbar 30 to be suspended, and the arch bridge to directly contact the cell, resulting in excessive local stress and a risk of detachment and damage.

[0033] In some optimized embodiments, the thickness of the thermally conductive adhesive layer 40 is limited to between 1.0 mm and 2.5 mm. The thickness refers to the average thickness of the portion between the current busbar 30 and the liquid cooling plate 20 filled with the thermally conductive adhesive material, which can be obtained by measuring and averaging at multiple points after the thermally conductive adhesive has cured.

[0034] Within this range, the lower limit of 1.0 mm ensures that the thermally conductive adhesive layer 40 can form a complete and continuous heat conduction path, avoiding sudden changes in thermal resistance due to local gaps or uneven coating caused by excessive thickness; at the same time, the thinner adhesive layer helps to reduce thermal resistance and improve the thermal conductivity between the current busbar 30 and the liquid cooling plate 20, which is particularly suitable for application scenarios with high heat load and strong heat dissipation requirements.

[0035] The 2.5 mm upper limit takes into account that the thermal conductivity of the thermally conductive adhesive itself is lower than that of metal materials. When the thickness is too large, it will significantly increase the total thermal resistance and weaken the heat dissipation capacity of the liquid cooling system. In addition, the excessive thickness of the adhesive layer will also increase the material cost and the weight of the entire pack. During the long-term operation of the battery module 60, there is a greater risk of deformation due to temperature changes or mechanical vibration, which may cause the thermally conductive adhesive to peel off or crack from the contact surface.

[0036] Thanks to the arched bridge structure 31 that arches towards the battery cell, the distance between the base surface of the current busbar 30 and the liquid cooling plate 20 is small, allowing the thermally conductive adhesive layer 40 to be stably controlled within the aforementioned range of 1.0 mm to 2.5 mm. This not only reduces the amount of thermally conductive adhesive used and lowers manufacturing costs, but also effectively ensures a balance between thermal conductivity and structural durability.

[0037] Additionally, please refer to Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of the current bus 30 provided in an embodiment of this application. Figure 6 This is a partial structural schematic diagram of the bracket body 10 provided in an embodiment of this application. In some embodiments, a plurality of positioning protrusions 12 are formed on both sides of the mounting groove 11 on the bracket body 10. Each mounting groove 11 corresponds to at least two positioning protrusions 12, and the two positioning protrusions 12 are disposed opposite to each other at different positions in the mounting groove 11 to constrain the position of the current busbar 30. A positioning through hole 32 corresponding to the position of the positioning protrusion 12 is provided on the substrate area of ​​the current busbar 30. The positioning protrusion 12 can be inserted into the positioning through hole 32 during assembly to achieve precise alignment between the current busbar 30 and the bracket body 10.

[0038] In actual assembly, simply aligning the positioning through-hole 32 of the current busbar 30 with the positioning protrusion 12 of the bracket body 10 achieves rapid and accurate positioning without relying on additional measuring tools or complex assembly fixtures, thereby improving production efficiency and reducing human error. This structure effectively prevents the current busbar 30 from shifting or tilting during transportation or operation due to factors such as vibration and thermal expansion and contraction, thus maintaining structural consistency and stability. Furthermore, through the cooperation of multiple positioning protrusions 12 and positioning through-holes 32, the current busbar 30 can obtain multiple support points within the mounting groove 11, preventing damage caused by excessive local stress.

[0039] Furthermore, in some optimized embodiments, the height of the positioning convex 12 is denoted as n, and the thickness of the current busbar 30 is denoted as N, satisfying the relationship: 0.7N≤n≤N. This height range is set to ensure that the positioning convex 12 can fix the position of the current busbar 30, while avoiding interference caused by the positioning convex 12 being too high.

[0040] When the height of the positioning protrusion 12 is less than 0.7N, the supporting force of the positioning protrusion 12 is insufficient, and the current busbar 30 is prone to shaking or displacement within the mounting groove 11, resulting in uneven distribution of the thermally conductive adhesive layer 40 thickness, which in turn affects the stability of heat conduction and heat dissipation. Simultaneously, the lack of effective support may also cause the current busbar 30 to shift during vibration or thermal expansion and contraction, increasing the risk of structural fatigue and reducing overall reliability. Conversely, if the height of the positioning protrusion 12 exceeds the thickness N of the current busbar 30, the protrusion will protrude above the surface of the current busbar 30, causing installation interference. Furthermore, an excessively high protrusion causes localized stress concentration, leading to deformation or even damage to the current busbar 30 or the support body 10, affecting structural safety and service life.

[0041] Therefore, limiting the height of the positioning convex 12 to the range of 0.7N to N ensures the firm positioning and stable support of the current busbar 30, while avoiding assembly problems and structural stress risks caused by excessive convex height, thus achieving an effective balance between assembly convenience and structural reliability.

[0042] In some embodiments, please refer to Figure 6 , Figure 6 This is a partial structural schematic diagram of the bracket body 10 provided in this application embodiment. A partition 13 is also provided on the bracket body 10, located between adjacent current bars 30. The partition 13 can be integrally formed with the mounting groove 11, or it can be fixed to the bracket body 10 by means of embedding, snap-fit, or screw connection. Its height is equal to or slightly higher than the base surface of the current bars 30, thereby forming a clear separation area in the structure.

[0043] The partition 13 provides physical isolation between adjacent current bars 30, preventing them from coming into contact due to vibration, external impact, or thermal expansion, thereby reducing safety risks such as short circuits or breakdowns. Secondly, the partition 13 acts as a limiter during the application of thermally conductive adhesive, preventing the adhesive layer from overflowing into adjacent mounting slots 11 before curing, ensuring uniform adhesive thickness and accurate coating position. Finally, the partition 13 serves as a positioning reference during assembly, improving the alignment accuracy of the current bars 30 and reducing manual adjustment steps. Furthermore, the physical separation provided by the partition 13 reduces thermal conduction interference between adjacent current bars 30, making the heat dissipation path between each current bar 30 and the liquid cooling plate 20 more independent, which helps achieve more precise thermal control.

[0044] Furthermore, in some optimized embodiments, the upper surface of the partition 13 is coplanar with the upper surface of the current busbar 30. This allows the partition 13 to not only perform the functions of separation and limitation in structure, but also to form a flat top interface together with the current busbar 30.

[0045] During assembly, this coplanar structure provides a continuous and uniform support surface when the thermally conductive adhesive layer 40 is applied, preventing the thermally conductive adhesive from accumulating or gaps in adjacent areas due to height differences, thereby ensuring the consistency of the adhesive layer thickness and the stability of the heat conduction path. Simultaneously, the coplanar design creates a more regular plane above the module, which helps the liquid cooling plate 20 to be evenly stressed during press-fitting, preventing excessive stress in localized areas from compressing the thermally conductive adhesive layer 40 and affecting heat dissipation efficiency.

[0046] Furthermore, this coplanar structure enhances the overall mechanical strength of the module. When the partition 13 is at the same height as the current busbar 30, it forms a frame-like structural support at the top, providing additional support for the liquid cooling plate 20 and reducing the risk of deformation caused by vibration, impact, or thermal cycling during operation. This not only ensures electrical safety but also extends the service life of the thermal interface between the liquid cooling plate 20 and the current busbar 30.

[0047] In one embodiment, the support body 10 is manufactured using a vacuum forming process, and its thickness is controlled within the range of 0.4 to 0.8 mm. Vacuum forming is a manufacturing method that involves heating a plastic sheet and using vacuum adsorption to form it onto the surface of a mold. This process can achieve high forming accuracy and the ability to process complex shapes while ensuring structural strength, making it very suitable for manufacturing support bodies 10 that include detailed features such as mounting grooves 11, positioning protrusions 12, and partitions 13.

[0048] Limiting the thickness of the support body 10 to the range of 0.4 to 0.8 mm achieves a balance between weight, strength, and molding efficiency. If the thickness is less than 0.4 mm, the overall rigidity of the support body 10 is insufficient, making it prone to warping or deformation when assembling the liquid cooling plate 20 or bearing the weight of the current busbar 30 for extended periods. This affects the contact stability between the current busbar 30 and the liquid cooling plate 20 and may lead to uneven distribution of the thermally conductive adhesive layer 40. If the thickness exceeds 0.8 mm, it not only increases the overall package weight and material cost but also prolongs the heating, molding, and cooling times during the thermoforming process, reducing production efficiency.

[0049] In addition, the moderate thickness also gives the support body 10 a certain degree of elastic buffering performance during operation, which can absorb some of the small deformations and vibrations caused by the module charging and discharging cycles, thereby reducing the structural stress impact on the current busbar 30 and the liquid cooling plate 20 and extending the component life.

[0050] In some embodiments, please refer to Figure 4 , Figure 4This is an exploded view of the support body 10 and the current busbar 30 provided in this embodiment. The support body 10 has a flow groove 14 extending along its length. After assembly, the flow groove 14 forms an enclosure structure on the side opposite to the liquid cooling plate 20, constituting a discharge channel 50 for gas or liquid flow. The discharge channel 50 can discharge thermally runaway substances in the event of thermal runaway. Compared to the prior art, where an additional channel structure is provided between the current busbar 30 and the liquid cooling plate 20, increasing the distance between them, this application avoids the space occupation problem of the channel. By adopting a structure where the support is recessed and enclosed by the liquid cooling plate 20, sufficient channel space is retained for efficient liquid drainage and ventilation, while effectively shortening the heat conduction path between the current busbar 30 and the liquid cooling plate 20, reducing the amount of thermally conductive adhesive, lowering material costs and overall package weight, and achieving better heat conduction efficiency than traditional structures.

[0051] The distance between the bottom surface of the flow channel 14 and the bottom surface of the liquid cooling plate 20 is limited to greater than 5 mm. When the distance is greater than 5 mm, the cross-sectional area of ​​the discharge channel 50 is large enough to ensure that the fluid inside the channel can be discharged smoothly, reducing the risk of localized corrosion, decreased electrical insulation, or thermal performance degradation caused by liquid retention. If the distance is less than 5 mm, the channel space is too small, which will cause blockage and prolong the liquid retention time. This not only increases electrical safety hazards but may also affect the bonding stability between the thermally conductive adhesive and the liquid cooling plate 20. At the same time, too small a space will also restrict air circulation, which is not conducive to the timely discharge of heat and moisture from the top area.

[0052] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0053] The above description is merely a preferred embodiment of this application and does not limit the patent scope of this application. Any equivalent structural transformations made based on the content of this application's specification and drawings under the concept of this application, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A battery pack, characterized in that, include: Battery module; A bracket body is disposed on the top of the battery module, and the bracket body has a mounting groove. A liquid cooling plate is disposed on the side of the bracket body away from the battery module; A current busbar is disposed in the mounting groove. The current busbar has an arch bridge structure, which arches outward from the direction away from the liquid cooling plate. A thermally conductive adhesive layer is filled between the support body and the liquid cooling plate.

2. The battery pack according to claim 1, characterized in that, The arch bridge structure is used to be embedded between adjacent cell terminals in the battery module, and the arch height of the arch bridge structure is less than the height of the cell terminals in the battery module.

3. The battery pack according to claim 2, characterized in that, The arch height of the arch bridge structure is h, and its relationship with the height H of the battery cell electrode is: 0.3H≤h≤0.8H.

4. The battery pack according to any one of claims 1 to 3, characterized in that, The thickness of the thermally conductive adhesive layer ranges from 1.0 to 2.5 mm.

5. The battery pack according to any one of claims 1 to 3, characterized in that, The bracket body includes multiple positioning protrusions, each mounting groove corresponds to at least two positioning protrusions, the current outlet is provided with positioning through holes, and the positioning protrusions pass through the positioning through holes.

6. The battery pack according to claim 5, characterized in that, The height n of the positioning convex hull and the thickness N of the current busbar satisfy the relationship: 0.7N≤n≤N.

7. The battery pack according to any one of claims 1 to 3, characterized in that, The support body also includes a partition, which is disposed between adjacent current bars.

8. The battery pack according to claim 7, characterized in that, The upper surface of the partition is coplanar with the upper surface of the current busbar.

9. The battery pack according to any one of claims 1 to 3, characterized in that, The main body of the bracket is a vacuum-formed structure, and the thickness of the main body of the bracket ranges from 0.4 to 0.8 mm.

10. The battery pack according to any one of claims 1 to 3, characterized in that, The main body of the support has a flow groove, which, together with the liquid cooling plate, forms a discharge channel. The distance from the bottom surface of the flow groove to the bottom surface of the liquid cooling plate is greater than 5 mm.

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