Microwave ferrite ultra-wideband low-loss miniaturized surface mount isolator

Abstract

The utility model provides a kind of microwave ferrite ultra-wideband low-loss miniaturization surface mount isolator, it is related to surface mount isolator field, the microwave ferrite ultra-wideband low-loss miniaturization surface mount isolator, including first bolt, the side of first bolt is provided with second bolt, the outside between first bolt and second bolt is provided with lower magnetic circuit, the top of lower magnetic circuit is bonded with gyromagnetic substrate, the outside of gyromagnetic substrate is connected with dielectric substrate by co-firing, the top of dielectric substrate is penetrated by the top of first bolt and second bolt, and extends to the top of dielectric substrate, this microwave ferrite ultra-wideband low-loss miniaturization surface mount isolator radio frequency connector joint transmission, greatly reduce module, equipment occupied space, while supporting automatic welding, improve assembly efficiency, build stable connection platform, provide key support for product to realize surface mount installation, adapt to modern modularization circuit layout demand.

Description

Technical Field

[0001] This utility model relates to a miniaturized surface-mount isolator with ultra-wideband microwave ferrite and low loss, specifically a miniaturized surface-mount isolator with ultra-wideband microwave ferrite and low loss, belonging to the technical field of surface-mount isolators. Background Technology

[0002] Isolators are an important and fundamental type of device in microwave engineering. They consist of a gyromagnet made of gyromagnetic material. Due to the combined action of an external microwave magnetic field and a constant DC magnetic field, the gyromagnetic material produces gyromagnetic properties, causing the electromagnetic waves propagating in the gyromagnet to rotate in polarization, thereby realizing the unidirectional transmission of high-frequency signals. They are widely used in various equipment such as microwave measurement, radar, communication, electronic countermeasures, and aerospace.

[0003] With the development of communication technology, the requirements for isolators are becoming increasingly stringent, such as ultra-wideband, small size, light weight, and high reliability. Compared with existing SC band frequency doubling isolators, which are mostly connected to systems, components, and modules via wires or coaxial cables, a microwave ferrite ultra-wideband low-loss miniaturized surface-mount isolator is provided to solve the miniaturization problem. Utility Model Content

[0004] The purpose of this invention is to provide a miniaturized surface-mount microwave ferrite ultrawideband low-loss isolator to solve the above-mentioned problems, thereby addressing the issue that existing SC band frequency doubling isolators are mostly connected to systems, components, and modules via wires, coaxial cables, etc., which occupy a large amount of space.

[0005] This utility model is achieved through the following technical solution: a microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator.

[0006] The device includes a first pin, a second pin on one side of the first pin, a lower magnetic circuit between the outer sides of the first and second pins, a gyromagnetic substrate bonded to the top of the lower magnetic circuit, and a dielectric substrate co-fired to the outer side of the gyromagnetic substrate. The top ends of the first and second pins penetrate the dielectric substrate and extend to the top of the dielectric substrate. A sputtered pattern is provided on the top of the dielectric substrate to absorb the load. The gyromagnetic substrate and the dielectric substrate are co-fired together, and a circuit is sputtered on the coplanar surface of the gyromagnetic substrate and the dielectric substrate using thin-film lithography. The sputtered thin-film circuit adopts a double-Y circuit structure. The large Y is a disk junction with a square groove in the middle. The impedance matching of the second, third, and other stages is trapezoidal. The large Y is a multi-stage impedance matching LC circuit with a C-shaped impedance matching distribution, which is a segment of arc line.

[0007] Preferably, a first positioning connection port is provided on the outer side of the sputtered pattern, and a second positioning connection port is provided on the outer side of the sputtered pattern.

[0008] Preferably, the first positioning connection port is penetrated by the first pin, and the second positioning connection port is penetrated by the second pin. The first pin and the second pin are connected in two stages. The bottom end face is set as the first stage, which is connected to the input or output signal, and the top connection face is set as the second stage, which is connected to the first positioning connection port and the second positioning connection port.

[0009] Preferably, a first matching impedance inductor is provided on the outer side of the sputtered pattern, a first matching capacitor is provided on one side of the first matching impedance inductor, a second matching capacitor is provided on one side of the first matching capacitor, the lower magnetic circuit is rectangular, and a heat dissipation support platform is provided in the positive direction of the Y-axis; at the same time, U-shaped first grounding avoidance and second grounding avoidance positions are respectively provided at the board-level signal connection.

[0010] Preferably, a second matching impedance inductor is provided on one side of the second matching capacitor, and a third matching capacitor is provided on one side of the sputtered pattern. The gyromagnetic substrate and the dielectric substrate are co-fired together, and the circuit is sputtered on the coplanar surface of the gyromagnetic substrate and the dielectric substrate using thin-film lithography.

[0011] Preferably, a multi-stage matching impedance capacitor is provided on one side of the sputtered pattern, and a fourth matching impedance capacitor is provided on one side of the multi-stage matching impedance capacitor. The sputtered pattern is used to sputter circuits on a coplanar substrate using thin-film lithography. The sputtered thin-film circuit adopts a double-Y circuit structure, where the large Y is a disk junction with a square slot in the middle. The second, third, and other multi-stage impedance matchings are arranged in a trapezoidal distribution. The large Y is a multi-stage impedance matching LC circuit with a C-shaped distribution, which is a segment of arc line. The size of the multi-stage impedance matchings decreases with each step. Circular interfaces are provided at the signal input and signal output terminals.

[0012] Preferably, a ceramic dielectric is bonded to the top of the sputtered pattern, a permanent magnet is bonded to the top of the ceramic dielectric, a magnetic shielding sheet is bonded to the top of the permanent magnet, an absorption load is provided at the top of the lower magnetic circuit, the absorption load is connected to the third matching capacitor, the lower magnetic circuit and the ground plane of the gyromagnetic substrate and the dielectric substrate are connected by welding, the lower magnetic circuit and the gyromagnetic substrate are welded on the same axis, and the first pin and the second pin are respectively connected to the circular interface of the dielectric substrate by welding.

[0013] Preferably, a first grounding clearance is provided at the bottom of the lower magnetic circuit, and a second grounding clearance is provided at the bottom of the lower magnetic circuit. Both the first grounding clearance and the second grounding clearance are U-shaped, and a heat dissipation support platform is provided on one side of the lower magnetic circuit.

[0014] This invention provides a miniaturized surface-mount isolator with ultra-wideband microwave ferrite and low loss, which has the following advantages: 1. This microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator features a miniaturized mechanism and innovative port connections: a hierarchical arrangement of circular cylindrical pins, with the bottom face used for signal input / output and the top face connected to the positioning interface. Compared to the rectangular ribbon cable leads and RF connectors used in SC-band embedded products, this significantly reduces the number of modules and the space occupied by the device, while also supporting automated soldering and improving assembly efficiency. The substrate is strengthened by welding the first and second pins to the coplanar surfaces of the gyromagnetic substrate and the dielectric substrate, respectively, reinforcing the overall substrate structure and increasing the tensile strength of the bonding surface, effectively improving the long-term reliability of the product. The surface-mount support design includes a dedicated heat dissipation platform, a first grounding avoidance, and a second grounding avoidance in the lower magnetic circuit, creating a stable connection platform that provides crucial support for surface-mount installation and adapts to the needs of modern modular circuit layouts.

[0015] 2. This microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator utilizes a low-loss mechanism and synergistic substrate material design: the gyromagnetic substrate and the dielectric substrate employ a nested design of two different materials. On one hand, the complementary material properties enable ultrawideband transmission of the isolator, reducing signal loss; on the other hand, the similar thermal expansion coefficients of the two materials significantly reduce the risk of gyromagnetic breakage under strong temperature shocks, while simultaneously forming a uniform magnetization circuit with the permanent magnet, ensuring magnetic field stability and further optimizing transmission performance. The circuit structure is innovative: a double-Y circuit structure is sputtered on a coplanar substrate using thin-film lithography, where the large Y is a disk junction with a square slot in the middle. It also integrates a multi-level impedance matching design, including both trapezoidal and C-shaped arc-shaped matching structures, with progressively smaller impedance matching dimensions. Combined with the circular interfaces at the signal input and output terminals, this further enhances ultrawideband transmission capabilities, reduces signal attenuation, and achieves low-loss performance from a circuit design perspective.

[0016] 3. This microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator simplifies the assembly mechanism and is easier to miniaturize than SC band frequency doubling isolators, making it suitable for compact space installations. Its surface-mount design and compatibility with automated welding allow it to be integrated into automated production lines, reducing labor costs. The combination of ultrawideband, low loss, and high reliability meets the high-precision signal transmission requirements of various fields such as communications and radar, making it suitable for a wide range of applications. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the exploded structure of this utility model; Figure 2 This is a schematic diagram of the mounting surface structure of this utility model; Figure 3This is a schematic diagram of the thin-film sputtering circuit structure of this utility model; [Explanation of Key Component Symbols] 1. First pin; 2. Second latch; 3. Lower magnetic circuit; 4. Spin magnet substrate; 5. Dielectric substrate; 6. Sputtering pattern; 6-1. First positioning connection port; 6-1. Second positioning connection port; 6-3. First matching impedance inductor; 6-4. First matching capacitor; 6-5. Second matching capacitor; 6-6. Second matching impedance inductor; 6-7. Third matching capacitor; 6-8. Multi-stage matching impedance capacitor; 6-9. Fourth matching impedance capacitor; 7. Ceramic media; 8. Permanent magnet; 9. Magnetic shielding sheet; 10. Absorbing load; 11-1 First grounding avoidance; 11-2 Second grounding avoidance; 11-3 Heat dissipation bearing platform. Detailed Implementation

[0018] This utility model provides a miniaturized surface-mount isolator with ultra-wideband microwave ferrite and low loss.

[0019] Example 1, please refer to Figure 1 , Figure 2 and Figure 3 It includes a first pin 1, a second pin 2 is provided on one side of the first pin 1, a lower magnetic circuit 3 is provided between the outer sides of the first pin 1 and the second pin 2, a gyromagnetic substrate 4 is bonded to the top of the lower magnetic circuit 3, a dielectric substrate 5 is co-fired and connected to the outer side of the gyromagnetic substrate 4, and the top ends of the first pin 1 and the second pin 2 penetrate through the dielectric substrate 5 and extend to the top of the dielectric substrate 5.

[0020] This device employs a cylindrical, two-end conductive and hierarchical structure. The overall shape is cylindrical, with both the bottom primary connection and the top secondary connection being planar structures, coaxial, and sized to fit insertion requirements. From a shape-effect perspective, compared to traditional rectangular transmission lines in the SC band, the cylindrical shape has a smoother surface and more uniform cross-sectional area, reducing edge field loss and RF signal attenuation. It also accommodates circular interfaces, avoiding the directional limitations of rectangular insertion and removal, and improving assembly convenience. The planar design of the bottom primary end face increases the contact area with the signal port, ensuring stable conduction. The top secondary connection surface, through hierarchical dimensional matching with (first positioning connection port 6-1, second positioning connection port 6-1), achieves axial positioning, preventing assembly misalignment and signal displacement, while simultaneously compressing the Z-axis space for miniaturized design. Its functional principle is "cylindrical conduction plus hierarchical positioning," achieving "low-loss signal transmission plus precise assembly plus space compression," solving the problems of large space occupation and complex RF connector assembly in traditional rectangular transmission lines.

[0021] The main body is rectangular, with a heat dissipation support platform 11-3 in the positive Y-axis direction. Two 4mm diameter U-shaped grooves are provided at the board-level signal connection (corresponding to the positions of the first grounding avoidance 11-1 and the second grounding avoidance 11-2). There is no traditional four-sided enclosed cover. In terms of shape and effect, the rectangle is adapted to the planar installation area, maximizing the use of space, providing stable support for upper components, and ensuring coaxiality and positional accuracy. The heat dissipation support platform 11-3 not only increases the heat dissipation area and improves the heat dissipation efficiency (exhausting the heat of the isolator), but also serves as an assembly reference surface to prevent uneven magnetic field caused by installation tilt. The U-shaped groove matches the size of the grounding element to achieve "avoidance-positioning", preventing structural interference and limiting the displacement of the grounding element to ensure grounding stability. The coverless design makes the signal angle coplanar with the grounding plane, meeting the "planar connection" requirements of surface mount technology and avoiding the increase of Z-axis space.

[0022] Please refer to it again. Figure 1 , Figure 2 and Figure 3 A sputtered pattern 6 is provided on the top of the dielectric substrate 5. A first positioning connection port 6-1 and a second positioning connection port 6-2 are provided on the outer side of the sputtered pattern 6. The first positioning connection port 6-1 is penetrated by a first pin 1, and the second positioning connection port 6-2 is penetrated by a second pin 2. A first matching impedance inductor 6-3 is provided on the outer side of the sputtered pattern 6. A first matching capacitor 6-4 is provided on one side of the first matching impedance inductor 6-3. A second matching capacitor 6-5 is provided on one side of the first matching capacitor 6-4. A second matching impedance inductor 6-6 is provided on one side of the second matching capacitor 6-5. A third matching capacitor 6-7 is provided on one side of the sputtered pattern 6. A multi-stage matching impedance capacitor 6-8 is provided on one side of the sputtered pattern 6. A fourth matching impedance capacitor 6-9 is provided on one side of the multi-stage matching impedance capacitor 6-8.

[0023] The gyromagnetic substrate 4 is a cylinder with a height of 0.5mm, adapted to the nesting space of the dielectric substrate 5. The dielectric substrate 5 is cuboid with cylindrical through holes in both the positive and negative X-axis directions, and a "nesting groove" is formed by cutting along the Z-axis with the center as the center. After the gyromagnetic substrate 4 is embedded, it is sintered and connected as a whole. In terms of shape and effect, the cylindrical gyromagnetic substrate 4 makes the magnetic permeability uniform around the circumference, prevents the magnetic field directionality difference of the rectangular structure, and ensures uniform magnetization circuit. The 0.5mm height significantly reduces the Z-axis thickness, which helps with miniaturization. The cuboid dielectric substrate 5 is adapted to the planar mounting space, providing space for sputtering patterns 6. The wiring area is provided by matching the cylindrical through hole on the X-axis with (first pin 1 and second pin 2) to achieve precise perforation positioning and prevent signal reflection caused by gaps. The nested slot matches the size of the gyromagnetic substrate 4 and is sintered into one piece to eliminate the assembly gap of the traditional split structure, reduce interface signal loss, improve structural strength, and prevent component separation caused by temperature changes. The functional principle is "cylindrical gyromagnetic substrate 4 and cuboid dielectric substrate 5 nested into one piece", which realizes "uniform magnetic field, low signal loss conduction and Z-axis space compression", solving the problems of uneven magnetic field, high loss and large volume of traditional structures.

[0024] The dual-Y circuit structure is formed using thin-film photolithography. The large Y junction is disk-shaped (with progressively smaller square slots in the center), with multiple matching impedance capacitors 6-8 distributed at 120° intervals around the center (the size of each capacitor decreases progressively). The signal terminals have circular interfaces. The small Y junction is a multi-stage impedance matching LC circuit, including (first matching impedance inductor 6-3, first matching capacitor 6-4, second matching capacitor 6-5, second matching impedance inductor 6-6, third matching capacitor 6-7, and fourth matching impedance capacitor 6-9), forming a 120° regular S-shaped arc line structure (the size of each arc decreases progressively). In terms of shape and effect, the disk-shaped large Y junction ensures uniform signal distribution, prevents signal concentration in the rectangular Y junction, and reduces losses. The square slot, combined with 6-8 multi-stage matching impedance capacitors, achieves multi-frequency impedance matching, broadening the bandwidth. The circular interface matches (first pin 1, second pin 2) to ensure stable contact and prevent lead radiation loss. The S-shaped arc wire extends the transmission path in a limited space, reducing corner reflections and losses. The 120° distribution, together with the large Y-junction, achieves "coarse matching plus fine matching". The multi-stage size design adapts to multi-frequency signals and reduces circuit area. The functional principle is "disc large Y-junction plus S-shaped small Y-junction plus multi-stage impedance matching plus circular interface", realizing "ultra-wideband signal matching plus low-loss transmission plus circuit miniaturization", solving the problems of large space occupation, narrow bandwidth and high loss in traditional structures.

[0025] Example 2, please refer to again. Figure 1 , Figure 2 and Figure 3A ceramic medium 7 is bonded to the top of the sputtered pattern 6, a permanent magnet 8 is bonded to the top of the ceramic medium 7, and a magnetic shielding sheet 9 is bonded to the top of the permanent magnet 8. An absorption load 10 is provided at the top of the lower magnetic circuit 3, and the absorption load 10 is connected to the third matching capacitor 6-7. A first grounding avoidance 11-1 and a second grounding avoidance 11-2 are provided at the bottom of the lower magnetic circuit 3. Both the first grounding avoidance 11-1 and the second grounding avoidance 11-2 are U-shaped. A heat dissipation bearing platform 11-3 is provided on one side of the lower magnetic circuit 3.

[0026] The key assembly structure involves reflow soldering of the lower magnetic circuit 3 and the rotary magnetic substrate 4 (replacing the traditional stacked installation) to ensure coaxiality; (first pin 1, second pin 2) and dielectric substrate 5 are soldered after passing through small holes; the whole structure has no external RF connectors, and the signal is directly conducted through the circuit of (first pin 1, second pin 2) - dielectric substrate 5. In terms of assembly effect, reflow soldering eliminates Z-axis gaps and compresses space, improves structural stability, and prevents vibration from causing the magnetic field circuit to break; the soldering of (first pin 1, second pin 2) realizes the integration of "mechanical positioning and electrical connection", reduces contact resistance and signal loss, and prevents loosening; the design without external connectors reduces X-axis space, reduces signal transmission links, reduces link loss, and improves transmission efficiency.

[0027] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator, comprising a first pin (1), characterized in that: A second pin (2) is provided on one side of the first pin (1), and a lower magnetic circuit (3) is provided between the outer sides of the first pin (1) and the second pin (2). A gyromagnetic substrate (4) is bonded to the top of the lower magnetic circuit (3), and a dielectric substrate (5) is co-fired to the outside of the gyromagnetic substrate (4). The top ends of the first pin (1) and the second pin (2) penetrate the dielectric substrate (5) and extend to the top of the dielectric substrate (5). A sputtered pattern (6) is provided on the top of the dielectric substrate (5).

2. The microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator according to claim 1, characterized in that: The outer side of the sputtering pattern (6) is provided with a first positioning connection port (6-1), and the outer side of the sputtering pattern (6) is provided with a second positioning connection port (6-2).

3. The microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator according to claim 2, characterized in that: The first positioning connection port (6-1) is penetrated by the first pin (1), and the second positioning connection port (6-2) is penetrated by the second pin (2).

4. A microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator according to claim 3, characterized in that: A first matching impedance inductor (6-3) is provided on the outer side of the sputtered pattern (6), a first matching capacitor (6-4) is provided on one side of the first matching impedance inductor (6-3), and a second matching capacitor (6-5) is provided on one side of the first matching capacitor (6-4).

5. A microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator according to claim 4, characterized in that: A second matching impedance inductor (6-6) is provided on one side of the second matching capacitor (6-5), and a third matching capacitor (6-7) is provided on one side of the sputtered pattern (6).

6. A microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator according to claim 5, characterized in that: A multi-stage matching impedance capacitor (6-8) is provided on one side of the sputtered pattern (6), and a fourth matching impedance capacitor (6-9) is provided on one side of the multi-stage matching impedance capacitor (6-8).

7. A microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator according to claim 6, characterized in that: A ceramic medium (7) is bonded to the top of the sputtered pattern (6), a permanent magnet (8) is bonded to the top of the ceramic medium (7), a magnetic shielding sheet (9) is bonded to the top of the permanent magnet (8), and an absorption load (10) is provided on the top of the lower magnetic circuit (3). The absorption load (10) is connected to the third matching capacitor (6-7).

8. A microwave ferrite ultrawideband low-loss miniaturized surface-mount isolator according to claim 7, characterized in that: The bottom of the lower magnetic circuit (3) is provided with a first grounding clearance (11-1) and a second grounding clearance (11-2). Both the first grounding clearance (11-1) and the second grounding clearance (11-2) are U-shaped. A heat dissipation bearing platform (11-3) is provided on one side of the lower magnetic circuit (3).

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