An integrated device for sintering power amplifier connectors

Abstract

The utility model relates to an integrated device for power amplifier connector sintering, including, sintering cavity, the sintering cavity top is provided with the placement groove, and the sintering cavity both ends face is provided with the elastic big thimble and small thimble, and the big thimble and small thimble are fixed by the big baffle setting in the sintering cavity both ends outside, the both sides of sintering cavity is provided with the big thimble through the small baffle fixed, and the sintering cavity top is provided with the pressing plate, the connector on the sintering cavity 5 faces can be fixed, positioning simultaneously, and it is convenient to obtain the proper stable sintering temperature, guarantees the sintering quality.

Description

Technical Field

[0001] This utility model belongs to the field of sintering technology, specifically an integrated device for sintering power amplifier connectors. Background Technology

[0002] In micro-assembly, sintering is a process that reduces porosity in the molded body, increases bonding between particles, and improves mechanical strength. It is commonly used to connect semiconductor chips and substrates, and also for the connection and sealing of connectors. The purpose of sintering power amplifier connectors is to protect the internal bare chips from atmospheric contamination and corrosion, thus providing a sealing and shielding function.

[0003] In sintering applications, a suitable and stable sintering temperature is crucial for the reliability of power amplifier devices. For high-performance, highly integrated power amplifiers, due to the numerous external connectors and the fact that the connectors are not on the same mounting surface, it is difficult to maintain a stable temperature during sintering. This can lead to unstable quality and high void ratios, easily causing rework or scrap of the sintered products. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] Given the following technical problems in the existing technology: For high-performance, highly integrated power amplifiers, due to the large number of external connectors and the fact that the connectors are not on the same mounting surface, it is difficult to ensure a stable temperature during sintering, which can lead to problems such as unstable quality and high void ratio.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an integrated device for sintering power amplifier connectors, comprising,

[0007] A sintering cavity, wherein a placement groove is provided at the top of the sintering cavity, and elastic large and small ejector pins are provided at both ends of the sintering cavity, and the large and small ejector pins are fixed by large baffles provided on the outer sides of both ends of the sintering cavity;

[0008] The two sides of the sintering cavity are provided with large pins fixed by small baffles, and the top of the sintering cavity is provided with a pressure plate.

[0009] As a preferred technical solution for an integrated device for sintering power amplifier connectors, the sintering cavity has a first countersunk hole on its side, the large ejector pin has a limiting plate at its end, and the large ejector pin is disposed in the first countersunk hole.

[0010] As a preferred technical solution for an integrated device for sintering power amplifier connectors, the end of the large ejector pin is provided with a first spring-pressed contact baffle.

[0011] As a preferred technical solution for an integrated device for sintering power amplifier connectors, the side of the sintering cavity is further provided with a second countersunk hole, the end of the small ejector pin is provided with a limiting plate, and the small ejector pin is disposed in the second countersunk hole.

[0012] As a preferred technical solution for an integrated device for sintering power amplifier connectors, the end of the small ejector pin is provided with a second spring pressing against a large baffle.

[0013] As a preferred technical solution for an integrated device for sintering power amplifier connectors, the pressure plate is also provided with an observation hole.

[0014] The beneficial effects of this utility model are that the connectors on the five sides of the sintering cavity can be fixed and positioned simultaneously, which facilitates obtaining a suitable and stable sintering temperature and ensures the sintering quality. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a top view of the structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the large and small thimbles in this utility model.

[0019] Reference numerals: 1. Sintering cavity; 11. Placement groove; 2. Large baffle; 3. Small baffle; 4. Pressure plate; 5. Large ejector pin; 6. Small ejector pin; 61. Second spring; 51. First spring; 12. First countersunk hole; 13. Second countersunk hole; 41. Observation hole. Detailed Implementation

[0020] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0022] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0023] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0024] Example 1

[0025] Reference Figures 1-3 This embodiment provides an integrated device for sintering power amplifier connectors, including a sintering cavity 1, a placement groove 11 provided on the top of the sintering cavity 1, and elastic large pins 5 and small pins 6 provided on both ends of the sintering cavity 1, which are fixed by large baffles 2 provided on the outer sides of both ends of the sintering cavity 1.

[0026] Large ejector pins 5, which are fixed by small baffles 3, are provided on both sides of the sintering chamber 1, and pressure plates 4 are provided on the top of the sintering chamber 1.

[0027] The sintering cavity 1 has a first countersunk hole 12 on its side, and a limiting plate is provided at the end of the large ejector pin 5. The large ejector pin 5 is disposed in the first countersunk hole 12.

[0028] The end of the large ejector pin 5 is equipped with a first spring 51 that presses against the large baffle 2.

[0029] The sintering cavity 1 is also provided with a second countersunk hole 13 on its side, and a limiting plate is provided at the end of the small ejector pin 6. The small ejector pin 6 is set in the second countersunk hole 13.

[0030] The end of the small pin 6 is equipped with a second spring 61 that presses against the large baffle 2.

[0031] An observation hole 41 is also provided on the pressure plate 4.

[0032] Specifically, this embodiment provides an integrated device for sintering power amplifier connectors, including a sintering cavity 1, and two large baffles 2, two small baffles 3, two pressure plates 4, several large ejector pins 5, several small ejector pins 6, and several compression springs corresponding to the large ejector pins 5 and small ejector pins 6 on the sintering cavity 1. The large baffles 2 are fixed to the front and rear end faces of the sintering cavity 1 by screws, the small baffles 3 are fixed to the two sides of the sintering cavity 1 by screws, the pressure plates 4 are fixed to the top surface of the sintering cavity 1 by screws, the large ejector pins 5 are sealed in the large holes of the front and rear end faces of the sintering cavity 1 by the large baffles 2, the large ejector pins 5 are also sealed in the large holes of the two sides of the sintering cavity 1 by the small baffles 3, the small ejector pins 6 are sealed in the small holes of the sintering cavity 1 by the large baffles, and the compression springs are sealed in all the large holes (first countersunk holes 12) and small holes (second countersunk holes 13) by the large baffles and small baffles 3 respectively.

[0033] 2. The sintering cavity 1 is made of aluminum alloy, which facilitates heat conduction during sintering.

[0034] 3. The sintered integrated device has an opening at the top, a groove in the middle, and a limiting step on the inner side, which can accommodate two power amplifiers at the same time.

[0035] 4. The sintering cavity 1 has two types of holes for the two types of RF connectors of the power amplifier, and the large pin 5 and the small pin 6 are installed in the holes respectively.

[0036] 5. The large ejector pin 5 is used to position and clamp the SMP connector during sintering.

[0037] 6. The small pin 6 is used to position and press the microwave insulator during sintering. Its pin part has a round hole of a certain depth.

[0038] 7. The tail mounting posts of the large ejector pin 5 and the small ejector pin 6 are the same size and are used to fit the compression spring.

[0039] 8. The large baffle and the small baffle 3 block the compression spring, giving the large ejector pin 5 and the small ejector pin 6 a little preload.

[0040] 9. The pressure plate 4 presses down on the power amplifier. Pressure is applied to the low-frequency connector by the top surface of the sintering cavity 1, and two square holes are opened as windows to facilitate observation of the sintering effect of the connector under the pressure plate 4.

[0041] The assembly and use process of this utility model is as follows: First, place the large ejector pin 5 and the small ejector pin 6 into their respective holes around the sintering cavity 1, then insert the compression spring, and install the large baffle and small baffle 3 to block the compression spring, giving the large ejector pin 5 and the small ejector pin 6 a slight preload. The power amplifiers of the two connectors to be sintered are first placed in the power amplifier holes, then placed into the sintering cavity 1 in a tilted manner, ensuring that the RF connector components align with the large ejector pin 5 and the small ejector pin 6. By compressing the large ejector pin 5 and the small ejector pin 6, the power amplifiers of the connectors to be sintered are fixed inside the sintering cavity 1. The low-frequency connector on the top surface is fixed by the pressure plate 4. Finally, place the assembled sintering cavity 1 onto the heating stage, and all connectors can be sintered simultaneously.

[0042] The connectors on the five faces of the sintering chamber 1 can be fixed and positioned simultaneously, which facilitates obtaining a suitable and stable sintering temperature and ensures sintering quality.

[0043] 2. Simple structure. The main component is a sintering chamber 1, and other smaller components attached to the sintering chamber 1: large baffle 2, small baffle 3, pressure plate 4, large ejector pin 5, small ejector pin 6, compression spring, and the rest are general-purpose parts. All components are mainly assembled together with screws.

[0044] 3. Simple operation and easy maintenance. Simply align the amplifier to be sintered with the large ejector pin 5 and the small ejector pin 6, and insert it into the sintering shell using the retractability of the large and small ejector pins 6. The dimensions of the large ejector pin 5 and the small ejector pin 6 determine the magnitude of the preload force.

[0045] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0046] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. An integrated device for sintering power amplifier connectors, characterized in that: include, A sintering cavity (1) is provided with a placement groove (11) on the top of the sintering cavity (1), and elastic large pins (5) and small pins (6) are provided on both ends of the sintering cavity (1). The large pins (5) and small pins (6) are fixed by large baffles (2) provided on the outer sides of both ends of the sintering cavity (1). The two sides of the sintering cavity (1) are provided with large ejector pins (5) fixed by small baffles (3), and the top of the sintering cavity (1) is provided with a pressure plate (4).

2. The integrated device for sintering power amplifier connectors according to claim 1, characterized in that: The sintering cavity (1) has a first countersunk hole (12) on its side, and the end of the large ejector pin (5) is provided with a limiting plate. The large ejector pin (5) is disposed in the first countersunk hole (12).

3. The integrated device for sintering power amplifier connectors according to claim 2, characterized in that: The large pin (5) is provided with a first spring (51) at its end, which presses against the large baffle (2).

4. The integrated device for sintering power amplifier connectors according to claim 3, characterized in that: The sintering cavity (1) is also provided with a second countersunk hole (13) on its side, and a limiting plate is provided at the end of the small ejector pin (6), and the small ejector pin (6) is disposed in the second countersunk hole (13).

5. The integrated device for sintering power amplifier connectors according to claim 4, characterized in that: The small pin (6) is provided with a second spring (61) at its end, which presses against the large baffle (2).

6. The integrated device for sintering power amplifier connectors according to claim 5, characterized in that: The pressure plate (4) is also provided with an observation hole (41).

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