Tr device and electronic device

Abstract

The application provides a TR device and an electronic equipment, the TR device comprises two first PCB modules electrically connected, the first PCB module comprises a soft substrate and a rigid plate, and the soft substrate and the rigid plate are weldedly connected; one first PCB module is installed on each of opposite sides of a shell; one TR chip module is installed on the rigid plate of one first PCB module, and the TR chip module comprises a bidirectional amplifier, a combining power divider, a TR chip and a receiving and transmitting amplifier which are electrically connected in sequence. The TR assembly in the prior art scheme adopts a pure rigid plate, in order to ensure heat dissipation and high integration, the price of the rigid plate of the PCB is relatively high, thereby causing the problem of high cost.

Description

Technical Field

[0001] This application relates to the field of signal processing technology, and more specifically, to a TR device and an electronic device. Background Technology

[0002] The Ka band refers to a frequency band in the microwave spectrum, typically ranging from 26.5 GHz to 40 GHz. This band is widely used in satellite communications, radar systems, and some wireless network technologies.

[0003] In the Ka-band missile, radar, and satellite applications, current TR (Transmission Control) components suffer from high cost, low integration, and insufficient heat dissipation. Cost and heat dissipation become major challenges, especially when component size needs to be reduced while maintaining high performance. Existing TR component solutions use rigid PCBs, which, to ensure heat dissipation and high integration, result in high costs due to the high price of the rigid PCBs. Utility Model Content

[0004] The main objective of this application is to provide a TR device and electronic device to solve the problem that the PCB board in the existing TR components uses a purely rigid board, which results in a high price for the rigid board in order to ensure heat dissipation and high integration, thus causing high costs.

[0005] To achieve the above objectives, according to one aspect of this application, a TR device is provided, comprising: two first PCB modules electrically connected, each first PCB module including a flexible substrate and a rigid board, the flexible substrate and the rigid board being soldered together; a housing, on which one of the first PCB modules is respectively mounted on opposite sides; and two TR chip modules, one of the TR chip modules being mounted on the rigid board of one of the first PCB modules, the TR chip module comprising: a bidirectional amplifier, a power divider, a TR chip, and a receive-transmit amplifier connected in sequence.

[0006] Optionally, two TR chip modules are provided, one of which is mounted on the rigid board of the first PCB module. Each TR chip module includes: a bidirectional amplifier, two combiner / dividers, two TR chips, and multiple receive / transmit amplifiers. The two combiner / dividers are a first combiner / divider and a second combiner / divider. The output of the bidirectional amplifier is electrically connected to one input of the first combiner / divider. The output of the first combiner / divider is electrically connected to the input of the second combiner / divider. Each output of the second combiner / divider is electrically connected to the input of one of the TR chips. Each output of the TR chips is electrically connected to the input of one of the receive / transmit amplifiers. The receive / transmit amplifiers correspond one-to-one with the outputs of the TR chips.

[0007] Optionally, a molybdenum-copper substrate is sintered between the first PCB module and the TR chip module, and the flexible substrate has a through slot for placing the TR chip module.

[0008] Optionally, the two TR chip modules are electrically connected via glass beads.

[0009] Optionally, the housing has a mounting groove for fitting with the first PCB module, the first PCB module being soldered to the inner wall of the mounting groove.

[0010] Optionally, the TR device further includes: a plurality of power supply units (PSUs) and a second PCB module, wherein the plurality of power supply units (PSUs) are respectively mounted on the second PCB module, and the second PCB module is electrically connected to each of the first PCB modules via copper busbars.

[0011] Optionally, the TR device further includes a power connection terminal, the housing having a first through slot for mounting the power connection terminal, and the power connection terminal being electrically connected to the second PCB module.

[0012] Optionally, the housing has a plurality of second through slots for accommodating the outputs of each of the receiver and transmitter amplifiers and the wiring between them and other devices.

[0013] Optionally, the TR device further includes: an input terminal electrically connected to the input of the bidirectional amplifier, and the housing having a third through slot for mounting the input terminal.

[0014] According to another aspect of this application, an electronic device is provided, comprising: any of the TR devices described above.

[0015] By applying the technical solution of this application, the existing pure rigid board design is transformed into a hybrid PCB structure combining a rigid board and a flexible board. The rigid board carries the control circuitry and signal processing section for non-RF signals, while the flexible board carries the processing circuitry for RF signals. This design can fully utilize the low-cost advantage of the rigid board and the high-frequency performance of the flexible board, thereby reducing the overall cost without sacrificing RF performance. Solder is used to weld the flexible board and the rigid board to achieve electrical connection and physical fixation. This soldering technology not only ensures the stability and reliability of the electrical connection but also serves as part of the heat dissipation channel, improving the heat dissipation capacity of the entire TR device. Compared to traditional mechanical connections (such as screws), soldering reduces parasitic effects at the connection point, has less impact on high-frequency signals, and is beneficial for RF signal transmission. The design of two TR chip modules can further improve integration. To address the susceptibility of Ka-band signals to interference, precise impedance matching is performed at the output of the combiner / divider to reduce signal reflection and loss, ensuring high-quality RF signal transmission. This solves the problem that the existing TR components use purely rigid PCB boards, which are expensive due to the high cost of rigid PCB boards in order to ensure heat dissipation and high integration. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1 A schematic diagram of the structure of a first TR device provided according to an embodiment of this application is shown;

[0018] Figure 2 A schematic diagram showing the connection between a first PCB module and a molybdenum copper substrate provided according to an embodiment of this application is illustrated.

[0019] Figure 3 A structural block diagram of a TR chip module provided according to an embodiment of this application is shown;

[0020] Figure 4 A schematic diagram of the mounting structure of a second TR device according to an embodiment of this application is shown;

[0021] Figure 5 A three-dimensional structural schematic diagram of a second TR device provided according to an embodiment of this application is shown;

[0022] Figure 6 A schematic diagram of the second through slot portion in a second TR device provided according to an embodiment of this application is shown.

[0023] The above figures include the following reference numerals:

[0024] 100, First PCB module; 110, Flexible substrate; 120, Rigid board; 130, Solder; 200, Housing; 210, Glass bead mounting hole; 220, Mounting slot; 230, First through slot; 240, Second through slot; 250, Third through slot; 300, TR chip module; 310, Bidirectional amplifier; 321, First combiner / divider; 322, Second combiner / divider; 330, TR chip; 340, Receiver / transmitter amplifier; 400, Molybdenum copper substrate; 500, Power supply unit (PSU); 600, Second PCB module; 700, Power connection terminal; 800, Input terminal. Detailed Implementation

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0026] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0027] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0028] As described in the background section, current TR (Transmission Control) components in the Ka-band missile, radar, and satellite fields suffer from high cost, low integration, and insufficient heat dissipation. Cost and heat dissipation become major challenges, especially when component size needs to be reduced while maintaining high performance. Existing TR components use rigid PCBs, which are expensive due to the high cost of rigid PCBs for heat dissipation and high integration. To address this issue, embodiments of this application provide a TR device and electronic device.

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0030] This application provides a TR device, such as Figure 1 , Figure 2 and Figure 3 As shown, the TR device includes: two first PCB modules 100 electrically connected, each first PCB module including a flexible substrate 110 and a rigid board 120, which are soldered together (by solder 130); a housing 200, on which one first PCB module is mounted on each of the opposite sides; and two TR chip modules 300, each TR chip module mounted on the rigid board of one of the first PCB modules, the TR chip module including: a bidirectional amplifier, a power divider, a TR chip, and a receiver / transmitter amplifier electrically connected in sequence.

[0031] The TR chip module includes at least: a bidirectional amplifier 310, two combiner / dividers, two TR chips 330 (the TR chips can be TR chips with one input channel and four output channels) and multiple receive / transmit amplifiers 340. The two combiner / dividers are a first combiner / divider 321 and a second combiner / divider 322. The output terminal of the bidirectional amplifier is electrically connected to one input terminal of the first combiner / divider. The output terminal of the first combiner / divider is electrically connected to the input terminal of the second combiner / divider. Each output terminal of the second combiner / divider is electrically connected to the input terminal of one TR chip. Each output terminal of the TR chip is electrically connected to the input terminal of one receive / transmit amplifier. The output terminals of the receive / transmit amplifiers and the TR chips correspond one-to-one.

[0032] Figure 3 The IN terminal is electrically connected to the first combiner / divider of another TR chip module via a glass bead.

[0033] Bidirectional amplifier: serving as the common terminal for the front and back of the TR device's housing, amplifying the transmitted and received signals respectively;

[0034] The first power divider (i.e., the first-stage power divider): For the transmitted signal, the power divider splits the signal into two paths, which are then transmitted to the second power divider on the back and front of the housing, respectively. For the received signal, the power divider combines the signals from the second power divider on the front and back of the housing, and then combines them again before sending them to the bidirectional amplifier.

[0035] The second combiner / divider (i.e., the second-stage combiner / divider): For transmitted signals, it performs power division, further dividing the signals split by the first combiner / divider and sending them to different multi-channel TR chips; for received signals, it combines the signals input to the common terminal of multiple multi-channel TR chips into one channel and then sends it to the first combiner / divider.

[0036] Multi-channel TR chip: For the transmit link, it has one input and multiple outputs, and also amplifies the signal to achieve multi-channel output; for the receive link, it is the opposite of the transmit link, with the received signals from multiple channels all output to the second combiner / divider through one port.

[0037] Receiver and transmitter amplifiers: These amplifiers amplify the received and transmitted signals respectively. They are the final output of the transmitted signal of the entire TR chip module and the initial input of the received signal.

[0038] The flexible substrate is used to transmit radio frequency signals, while the rigid substrate is used to transmit power supply current.

[0039] The TR chip module, short for Transmit / Receive Module, is a core component widely used in radar systems. It primarily functions to quickly switch between transmit and receive modes, enabling the radar to send radio frequency signals and receive reflected signals.

[0040] The existing rigid board design is transformed into a hybrid PCB structure combining a rigid board and a flexible board. The rigid board carries the control circuitry and signal processing components for non-RF signals, while the flexible board carries the RF signal processing circuitry. This design fully leverages the low cost of the rigid board and the high-frequency performance of the flexible board, thereby reducing overall cost without sacrificing RF performance. Solder is used to weld the flexible board and rigid board together for electrical connection and physical fixation. This soldering technique not only ensures the stability and reliability of the electrical connection but also serves as part of the heat dissipation channel, improving the overall heat dissipation capacity of the TR device. Compared to traditional mechanical connections (such as screws), soldering reduces parasitic effects at connection points, has less impact on high-frequency signals, and is beneficial for RF signal transmission. The design of two TR components further improves integration. Addressing the susceptibility of Ka-band signals to interference, precise impedance matching is performed at the output of the combiner / divider to reduce signal reflection and loss, ensuring high-quality RF signal transmission. This solves the problem of high costs caused by the high price of rigid boards in existing TR components, which are used to ensure heat dissipation and high integration.

[0041] In one embodiment of this application, a molybdenum-copper substrate is sintered between the first PCB module and the TR chip module, and the flexible substrate has a chip through slot for placing the TR chip module.

[0042] like Figure 2 As shown, the rigid plate 120 and the housing 200 are electrically connected by solder 130. Each component of the TR chip module is electrically connected to the rigid plate 120 by passing through the chip slot of the flexible substrate via the molybdenum copper carrier plate 400.

[0043] Specifically, the coefficient of thermal expansion of molybdenum copper is close to that of common semiconductor materials (such as silicon). This reduces stress caused by thermal expansion and contraction, protects the chip from damage caused by thermal cycling stress, and improves the long-term stability and lifespan of the entire component. The molybdenum copper substrate not only provides additional mechanical support but also enhances the connection strength between the chip and the PCB. This additional mechanical strength is crucial in high-temperature or vibration environments, preventing chip detachment or PCB deformation and ensuring the normal operation of the component under harsh conditions. The sintering process of the molybdenum copper substrate can be considered a secondary packaging of the chip, simplifying the assembly process between the chip and the PCB and avoiding the instability that may arise from traditional solder ball connections. Compared to soldering technology, the sintering process provides better electrical contact and a more stable connection, making it particularly suitable for high-frequency and high-power applications. In addition to improving heat dissipation, the molybdenum copper substrate can indirectly optimize chip performance. Good heat dissipation can maintain the chip's optimal operating temperature, reduce thermal distortion, and improve signal quality and overall performance. Simultaneously, the low resistance of molybdenum copper reduces energy loss during current flow, further improving component efficiency. Although the molybdenum copper substrate itself is more expensive, its improved heat dissipation and stability reduce the stringent requirements on PCB materials and design. This means that in some cases, lower-cost PCB materials can be used without sacrificing overall component performance, resulting in overall cost savings.

[0044] In one embodiment of this application, the rigid plate is welded to the housing (i.e., the rigid plate is welded to the housing by solder).

[0045] Specifically, welding between the rigid plate and the housing provides additional mechanical strength, helping to resist external shocks and vibrations, which is particularly important for TR components mounted in missile, satellite, or mobile radar systems. Compared to screws or other mechanical connections, welded connections provide more consistent and reliable rigid support, reducing structural loosening due to prolonged operation or harsh environmental conditions. As a contact method, welding provides a better thermal conduction path, allowing heat to be more efficiently conducted from heat-generating components (such as RF chips, amplifiers, etc.) on the rigid plate to the housing, which acts as a heat sink to further dissipate heat, thus improving the overall heat dissipation capacity of the component. This is especially critical for TR chip modules operating at high power and high frequency, as they generate significant amounts of heat during operation. Welding directly fixes the rigid plate to the housing, eliminating the need for additional fasteners (such as screws, brackets, etc.) and their installation steps, thus simplifying the assembly process and reducing manufacturing costs and time. Furthermore, welding may allow the use of thinner rigid plate materials because the housing provides additional support, meaning material costs can be reduced without sacrificing structural integrity. When the rigid plate is welded to the housing, the housing can act as a shield, reducing external electromagnetic interference (EMI). This is particularly useful for TR chip modules operating in sensitive frequency bands, as it can maintain signal purity, avoid signal loss or distortion, and improve overall electrical performance.

[0046] In one embodiment of this application, two TR chip modules are electrically connected via glass beads.

[0047] like Figure 4 As shown, the housing has glass bead mounting holes 210 for mounting glass beads, which pass through the first PCB module, the housing, and the TR chip module to transmit signals.

[0048] Glass bead electrical connections offer flexibility to adapt to various TR chip module designs, whether for signal transmission on both sides or for specific applications requiring additional isolation. Their high degree of customization allows designers to adjust the position and number of glass beads to optimize signal paths and system performance. In high-frequency circuits, parasitic capacitance and inductance significantly impact signal quality. Glass bead electrical connections minimize the metal contact area, significantly reducing these parasitic effects and improving signal clarity and stability. Electrical connections using glass beads, particularly in multi-channel TR chip modules, can significantly reduce signal loss, enhance signal isolation, improve mechanical stability, exhibit good environmental adaptability, and simplify design and manufacturing processes. This is an effective strategy for improving the performance and reliability of high-frequency electronic equipment. The use of glass beads extends beyond signal transmission, highlighting their ability to reduce parasitic effects.

[0049] In one embodiment of this application, such as Figure 4As shown, the housing 200 has a mounting groove 220 for fitting with the first PCB module, and the first PCB module is soldered to the inner wall of the mounting groove.

[0050] Specifically, soldering the PCB to the inner wall of the mounting slot provides a more stable physical connection compared to mechanical fixing methods such as screws. This reduces the impact of vibration and shock on the PCB, preventing loosening due to prolonged operation or harsh environmental conditions, thereby improving the stability and reliability of the entire TR chip module. The soldering process ensures good thermal contact between the PCB and the housing. The housing, acting as a heat sink, can more effectively absorb and dissipate heat from the PCB, especially at the solder joints. This helps lower the PCB temperature, keeping the chip in optimal operating condition and extending its lifespan. Soldering the PCB into the mounting slot also allows the housing to act as electromagnetic shielding, reducing the influence of external electromagnetic fields on the internal circuitry and preventing radiation generated by the internal circuitry from interfering with the external environment. This is crucial for high-frequency, multi-channel TR chip modules, ensuring signal purity and overall system performance.

[0051] In one embodiment of this application, such as Figure 4 and Figure 5 As shown, the TR device also includes: multiple power supplies PSU500 and a second PCB module 600. The multiple power supplies PSU are respectively installed on the second PCB module, and the second PCB module is electrically connected to each of the first PCB modules through copper busbars.

[0052] The second PCB module can be mounted to the housing with screws. The PSU is responsible for converting the AC power from the power socket into DC power required by the various computer components, thus powering the TR chip module.

[0053] Specifically, using multiple power supply units (PSUs) allows for more precise supply of the required voltage and current to different parts of the circuitry, which helps improve overall power efficiency and reduce unnecessary energy loss. This is particularly beneficial for multi-channel TR chip modules, where different channels may require different power supply conditions; multiple PSUs can meet these differentiated needs and optimize overall performance. A distributed power supply strategy reduces the impact of a single power supply failure on the entire system. If one PSU fails, the others can continue to supply power, increasing the reliability of the TR device. Furthermore, this distributed power design reduces the propagation of power supply noise and improves signal quality. PSUs typically generate a significant amount of heat; by mounting multiple PSUs on a second PCB module and separating them from the first PCB module, heat dissipation management can be more effective. Additionally, copper busbar connections avoid complex power lines on the PCB, saving space and facilitating a compact design that meets high integration requirements.

[0054] In one embodiment of this application, such as Figure 4 As shown, the TR device also includes: a power connection terminal 700, and a first through slot 230 on the housing for mounting the power connection terminal, wherein the power connection terminal is electrically connected to the second PCB module.

[0055] Specifically, the power connector provides a standardized interface for power delivery to the TR device, making connection to external power systems or battery packs simple and quick. The first through-slot design ensures stable installation of the power connector, facilitates maintenance and replacement, and reduces the risk of errors during assembly. Dedicated power connectors enable electrical isolation between the incoming and outgoing power, reducing the risk of electrical accidents such as short circuits or overloads. This isolation also reduces the impact of power supply noise on sensitive circuits, especially for high-frequency applications such as Ka-band multi-channel TR chip modules, where electrical isolation is crucial for maintaining signal purity. The power connectors are typically designed with a large heat dissipation surface area and good thermal conductivity to effectively dissipate heat and prevent excessive heat generation at the power inlet due to current flow. Installation via the first through-slot provides sufficient heat dissipation space without occupying valuable PCB space, while maintaining the compactness of the overall structure.

[0056] In one embodiment of this application, such as Figure 4 and Figure 6 As shown, the housing 200 has multiple second through slots 240 for accommodating the outputs of each receiver-transmitter amplifier 340 and the wiring between other devices.

[0057] By pre-installing a second through-slot in the housing, the rational planning and minimization of signal trace paths can be ensured, which is especially important for high-frequency signals. Shorter paths help reduce signal delay and insertion loss, thereby improving signal quality and overall system performance. The design of the second through-slot physically isolates traces of different signals, reducing crosstalk and electromagnetic interference (EMI) between signals. This is crucial for maintaining the purity of signals in each channel and the functional reliability of the entire TR device, especially in multi-channel high-frequency systems. The second through-slot not only simplifies the original wiring but also facilitates future maintenance and upgrades. Maintenance personnel or engineers can easily access and replace specific traces or cables through these through-slots without disassembling the entire device or disrupting the original circuit layout. The second through-slot can serve as an additional heat dissipation path, helping to dissipate heat from the receiver and transmitter amplifiers without affecting the overall package design. A well-designed through-slot can guide airflow, improve cooling efficiency, and keep components within their optimal operating temperature range.

[0058] In one embodiment of this application, such as Figure 4As shown, the TR device also includes: an input terminal 800, which is electrically connected to the input of the bidirectional amplifier, and a third through slot 250 on the housing 200 for mounting the input terminal.

[0059] The input terminals, serving as standardized interfaces for connecting to external signal sources, simplify the signal input process, allowing external signals to enter the TR device in a more stable and controllable manner. The third through-slot design ensures precise installation of the input terminals, reducing signal loss or interference caused by unstable connections. The dedicated through-slot allows for precise control of signal input wiring, reducing unnecessary bends and lengths in the signal path. This is particularly important for high-frequency signals, helping to maintain signal integrity and reduce delay, thereby improving the input signal quality of the bidirectional amplifier. The third through-slot design also provides better shielding and isolation for the input signal, reducing the impact of external electromagnetic interference (EMI) on the internal circuitry of the TR device. It also limits the radiation of internal signals, preventing interference with the external environment. Input terminals typically generate heat; the third through-slot provides an additional heat dissipation path without affecting the overall device layout, helping to maintain a suitable internal temperature.

[0060] This application also provides an electronic device, including any type of TR device. It transforms existing purely rigid board designs into a hybrid PCB structure combining a rigid board and a flexible substrate. The rigid board carries the control circuitry and signal processing section for non-RF signals, while the flexible substrate carries the processing circuitry for RF signals. This design fully utilizes the low-cost advantage of the rigid board and the high-frequency performance of the flexible substrate, thereby reducing overall cost without sacrificing RF performance. Solder is used to weld the flexible substrate and the rigid board to achieve electrical connection and physical fixation. This soldering technique not only ensures the stability and reliability of the electrical connection but also serves as part of the heat dissipation channel, improving the heat dissipation capacity of the entire TR device. Compared to traditional mechanical connections (such as screws), soldering reduces parasitic effects at the connection points, has less impact on high-frequency signals, and is beneficial for RF signal transmission. The design of two TR chip modules further improves integration. To address the susceptibility of Ka-band signals to interference, precise impedance matching is performed at the output of the combiner / divider to reduce signal reflection and loss, ensuring high-quality RF signal transmission. This solves the problem that the existing TR components use purely rigid PCB boards, which are expensive due to the high cost of rigid PCB boards in order to ensure heat dissipation and high integration.

[0061] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0063] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A TR device, characterized by, include: Two first PCB modules are electrically connected, each first PCB module comprising a flexible substrate and a rigid board, wherein the flexible substrate and the rigid board are soldered together. A housing, wherein one of the first PCB modules is mounted on each of the opposite sides of the housing; Two TR chip modules, one of which is mounted on the rigid board of the first PCB module. The TR chip module includes: a bidirectional amplifier, a power divider, a TR chip, and a receiver / transmitter amplifier connected in sequence.

2. The TR device of claim 1, wherein, The TR chip module includes at least: a bidirectional amplifier, two combiner / dividers, two TR chips, and multiple receiver / transmitter amplifiers. The two combiner / dividers are a first combiner / divider and a second combiner / divider. The output terminal of the bidirectional amplifier is electrically connected to one input terminal of the first combiner / divider. The output terminal of the first combiner / divider is electrically connected to the input terminal of the second combiner / divider. Each output terminal of the second combiner / divider is electrically connected to the input terminal of one of the TR chips. Each output terminal of the TR chips is electrically connected to the input terminal of one of the receiver / transmitter amplifiers. The output terminals of the receiver / transmitter amplifiers and the TR chips correspond one-to-one.

3. The TR device of claim 1, wherein, A molybdenum-copper substrate is sintered between the first PCB module and the TR chip module, and the flexible substrate has a chip through slot for placing the TR chip module.

4. The TR device of claim 1, wherein, The two TR chip modules are electrically connected via glass beads.

5. The TR device of claim 1, wherein, The housing has a mounting groove for fitting with the first PCB module, and the first PCB module is soldered to the inner wall of the mounting groove.

6. The TR device of claim 1, wherein, The TR device further includes: multiple power supply units (PSUs) and a second PCB module, wherein the multiple power supply units (PSUs) are respectively mounted on the second PCB module, and the second PCB module is electrically connected to each of the first PCB modules via copper busbars.

7. The TR device of claim 6, wherein, The TR device further includes a power connection terminal, and the housing has a first through slot for mounting the power connection terminal, wherein the power connection terminal is electrically connected to the second PCB module.

8. The TR device of claim 1, wherein, The housing has multiple second through slots for accommodating the output terminals of each of the receiver and transmitter amplifiers and the wiring between them and other devices.

9. The TR device of claim 1, wherein, The TR device further includes an input terminal electrically connected to the input terminal of the bidirectional amplifier, and the housing has a third through slot for mounting the input terminal.

10. An electronic device, comprising: include: The TR device according to any one of claims 1 to 9.

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