Intelligent communication device for offshore wind farm
By integrating the HarmonyOS motherboard, Beidou short message module, and LoRa module into offshore wind farms, the problem of limited data transmission distance and coverage in offshore wind farms has been solved, achieving stability and reliability of long-distance and short-distance data transmission, making it suitable for intelligent communication devices in offshore wind farms.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGDONG WIND POWER CO LTD
- Filing Date
- 2025-09-19
- Publication Date
- 2026-07-21
AI Technical Summary
Existing data transmission solutions for offshore wind farms suffer from limitations in transmission distance and coverage, as well as unstable signals, making it difficult to meet the real-time and reliable data transmission requirements of large-scale wind farms.
The motherboard of the HarmonyOS system integrates a Beidou short message module and a LoRa module, combined with an RS-485 communication interface, a DC-DC step-down regulated power supply circuit and a low-dropout regulator, to achieve long-distance and short-distance data transmission. The LoRa module is used for low-power networking communication, and the Beidou short message module is used for cross-sea data transmission.
It significantly improves transmission distance and coverage, enabling stable data transmission in complex marine electromagnetic environments, avoiding interference from weather conditions, and ensuring real-time and reliable transmission of critical monitoring data.
Smart Images
Figure CN224538195U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of offshore wind farm equipment technology, and in particular to an intelligent communication device for offshore wind farms. Background Technology
[0002] With the rapid development of the offshore wind power industry, wind farms are gradually expanding in scale, with towers being deployed in a dispersed manner and at great distances from the shore. During wind farm operation, a large amount of critical monitoring data is generated, such as wind speed, wind direction, tower vibration, and equipment operating status. This data needs to be transmitted in real time and reliably to ensure the safe and efficient operation of the wind farm.
[0003] Existing data transmission solutions for offshore wind farms mainly rely on Wi-Fi, ZigBee, microwave links, or buoy satellite relays, which have limitations in transmission distance and coverage.
[0004] (1) Wireless technologies such as Wi-Fi and ZigBee have a coverage range of less than 1 kilometer, making it difficult to cover wind farms that are far from the shore and scattered.
[0005] (2) Although microwave relays can transmit over longer distances, the equipment is large and consumes a lot of power. They are also susceptible to interference from marine weather conditions such as wind, waves, rain and fog, which can lead to unstable signals.
[0006] (3) Buoy satellite relay is susceptible to the influence of ocean waves, and its positioning accuracy and transmission reliability are limited, which cannot meet the long-term stable operation requirements of large-scale wind farms.
[0007] In summary, there is an urgent need for an intelligent communication device specifically designed for offshore wind farms. Utility Model Content
[0008] To address the technical challenges of balancing transmission distance, reliability, and real-time performance in existing communication solutions, this invention aims to provide an intelligent communication device for offshore wind farms. By integrating a BeiDou short message module and a LoRa module onto the HarmonyOS motherboard, this technology can balance long-distance transmission and short-distance networking: the LoRa module supports multi-node low-power networking communication, enabling data transmission and aggregation between dispersed towers; the BeiDou short message module can transmit aggregated key monitoring data to the receiving station, achieving long-distance, cross-sea data transmission.
[0009] The objective of this utility model is achieved through the following technical solution:
[0010] This utility model provides an intelligent communication device for offshore wind farms, the intelligent communication device comprising:
[0011] HarmonyOS motherboard;
[0012] A BeiDou short message module, which is connected to the HarmonyOS motherboard, and equipped with a first antenna;
[0013] The LoRa module is connected to the HarmonyOS motherboard and is equipped with a second antenna.
[0014] In a preferred embodiment, the HarmonyOS motherboard is equipped with an RS-485 communication interface circuit, and the HarmonyOS motherboard is connected to the Beidou short message module through the RS-485 communication interface circuit.
[0015] In a preferred embodiment, the RS-485 communication interface circuit uses a chip of model MAX485ESA+T, and the RS-485 communication interface circuit is used to implement differential serial communication.
[0016] In a preferred embodiment, the HarmonyOS motherboard is equipped with a TTL interface, and the HarmonyOS motherboard is connected to the LoRa module through the TTL interface.
[0017] In a preferred embodiment, the HarmonyOS motherboard is further equipped with a DC-DC buck regulator circuit, which is connected to the HarmonyOS board and is used to convert a 12V input voltage into a 5V output voltage.
[0018] In a preferred embodiment, the DC-DC buck regulator circuit uses a chip of model LM2679SX.
[0019] In a preferred embodiment, the HarmonyOS motherboard is further equipped with a low-dropout regulator circuit, which is connected to the DC-DC buck regulator circuit, and the DC-DC buck regulator circuit is connected to the HarmonyOS board.
[0020] The low-dropout regulator circuit is used to replace the 5V output voltage of the DC-DC buck regulator circuit with a 3.3V output voltage.
[0021] In a preferred embodiment, the low dropout regulator circuit uses a chip of model ME6211C33M5G-N.
[0022] In a preferred embodiment, the smart communication device further includes an insulating housing, and the HarmonyOS motherboard is disposed within the cavity of the insulating housing;
[0023] The first antenna of the Beidou short message module and the second antenna of the LoRa module are both located on the outer wall of the insulating shell.
[0024] Compared with the prior art, the present invention has at least the following beneficial effects:
[0025] This invention provides an intelligent communication device for offshore wind farms. The intelligent communication device includes a HarmonyOS motherboard, a BeiDou short message module, and a LoRa module. The BeiDou short message module is connected to the HarmonyOS motherboard and is equipped with a first antenna. The LoRa module is connected to the HarmonyOS motherboard and is equipped with a second antenna.
[0026] This utility model integrates the HarmonyOS motherboard, Beidou short message module, and LoRa module into an intelligent communication device. This technology can take into account both long-distance transmission and short-distance networking: (1) The LoRa module supports multi-node low-power networking communication, which can realize data transmission and aggregation between distributed towers. (2) The Beidou short message module can transmit the aggregated key monitoring data to the receiving station, realizing long-distance and cross-sea data transmission.
[0027] Compared to short-range wireless solutions such as Wi-Fi and ZigBee, this technology significantly improves transmission distance and coverage. BeiDou short message transmission does not rely on ground base stations, effectively avoiding the impact of weather conditions such as wind, waves, rain, and fog on traditional microwave relays, thus ensuring stable transmission of critical monitoring data. Meanwhile, the LoRa module uses spread spectrum communication, possessing strong anti-interference capabilities, enabling stable data transmission even in complex marine electromagnetic environments. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of the structure of the intelligent communication device for offshore wind farms according to this utility model;
[0029] Figure 2 This is a simplified planar diagram of the HarmonyOS motherboard of the intelligent communication device for offshore wind farms according to this utility model.
[0030] Figure 3 This is a circuit topology diagram of the RS-485 communication interface circuit of this utility model;
[0031] Figure 4 This is the circuit topology diagram of the DC-DC step-down regulated power supply circuit of this utility model;
[0032] Figure 5 This is a circuit topology diagram of the low dropout voltage regulator circuit of this utility model.
[0033] 100-HarmonyOS motherboard;
[0034] 200-BeiDou short message module;
[0035] 300-LoRa module. Detailed Implementation
[0036] To facilitate understanding of this utility model, the technical solutions and advantages of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Any mechanisms or methods not elaborated in this utility model can be referred to in the prior art. The specific structures and features of this utility model are illustrated below by way of example and should not constitute any limitation on this utility model. Furthermore, any technical feature mentioned below (including implicit or disclosed features), as well as any technical feature directly shown or implied in the figures, can be arbitrarily combined or deleted among these technical features to form more other embodiments that may not be directly or indirectly mentioned in this utility model. The accompanying drawings show preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.
[0037] like Figure 1-5 As shown, this embodiment provides a preferred implementation of an intelligent communication device for offshore wind farms.
[0038] like Figure 1 and Figure 2 As shown, the intelligent communication device includes a HarmonyOS motherboard, a BeiDou short message module, and a LoRa module. The BeiDou short message module is connected to the HarmonyOS motherboard and is equipped with a first antenna. The LoRa module is also connected to the HarmonyOS motherboard and is equipped with a second antenna.
[0039] In this application, the HarmonyOS motherboard serves as the data processing core, responsible for collecting, processing, and forwarding various sensor data and control commands. The BeiDou short message module and LoRa module serve as different wireless communication units, used to achieve remote data transmission and coverage extension.
[0040] In some specific implementations, the HarmonyOS motherboard has a built-in processor, storage unit, and various interface circuits for data interaction with the Beidou short message module and LoRa module.
[0041] In practical implementation, the LoRa module connects to the HarmonyOS motherboard and is equipped with a second antenna for low-power, long-distance wireless data transmission within the wind farm or a localized area. Its working principle is as follows: the LoRa module can receive data from other tower nodes and feed it back to the HarmonyOS motherboard, realizing a distributed inter-tower communication network.
[0042] In practical implementation, the BeiDou short message module is connected to the HarmonyOS motherboard and equipped with a first antenna for communication with BeiDou satellites. Its working principle is as follows: the HarmonyOS motherboard transmits critical monitoring data to the BeiDou module, which encapsulates the data according to the short message protocol and transmits it via satellite link, achieving long-distance, cross-sea data transmission. This module can ensure real-time data upload to the receiving station even when offshore wind farms are far from land.
[0043] This utility model integrates the HarmonyOS motherboard, Beidou short message module, and LoRa module into an intelligent communication device. This technology can take into account both long-distance transmission and short-distance networking: (1) The LoRa module supports multi-node low-power networking communication, which can realize data transmission and aggregation between distributed towers. (2) The Beidou short message module can transmit the aggregated key monitoring data to the receiving station, realizing long-distance and cross-sea data transmission.
[0044] Compared to short-range wireless solutions such as Wi-Fi and ZigBee, this technology significantly improves transmission distance and coverage. BeiDou short message transmission does not rely on ground base stations, effectively avoiding the impact of weather conditions such as wind, waves, rain, and fog on traditional microwave relays, thus ensuring stable transmission of critical monitoring data. Meanwhile, the LoRa module uses spread spectrum communication, possessing strong anti-interference capabilities, enabling stable data transmission even in complex marine electromagnetic environments.
[0045] like Figure 3 As shown, the HarmonyOS motherboard is equipped with an RS-485 communication interface circuit, which connects to the Beidou short message module.
[0046] In this application, RS-485 is a differential signal communication standard, characterized by strong anti-interference capability and long transmission distance. The RS-485 communication interface circuit on the HarmonyOS motherboard is used to realize reliable data transmission between the motherboard and the Beidou short message module, which is particularly suitable for the complex electromagnetic environment of offshore wind farms. The RS-485 differential signal structure can effectively suppress common-mode interference, ensuring the accuracy of the data received by the Beidou short message module.
[0047] In some possible implementations, the RS-485 communication interface circuit uses a MAX485ESA+T chip to implement differential serial communication. The MAX485ESA+T chip supports half-duplex differential serial communication, enabling stable data transmission in complex electromagnetic environments. The differential signal design effectively suppresses common-mode interference, improves noise immunity, and is suitable for electromagnetic interference environments surrounding offshore wind farm towers and related equipment.
[0048] like Figure 3As shown, the RS-485 communication interface circuit includes an NPN transistor Q3, resistors R27, R29, and R31, a capacitor C30, a chip U10, and a connector H6. Resistor R29 is connected to the base (B) of the NPN transistor Q3, the emitter (E) of the NPN transistor Q3 is grounded, and the collector (C) of the NPN transistor Q3 is connected to the DI pin of the chip U10.
[0049] In this configuration, one end of resistor R27 is connected to a 3V3 power supply, and the other end is connected to the RO pin of chip U10. The RE# (receive enable) pin of chip U10 is directly grounded (GND). The DE (drive enable) pin of chip U10 is connected to the collector (C) of transistor Q3. The VCC pin of chip U10 is connected to a 5V power supply. The GND pin of chip U10 is grounded. One end of resistor R31 is connected to pin A of chip U10, and the other end is connected to pin B of chip U10.
[0050] Pin 1 of connector H6 is connected to pin A of chip U10. Pin 2 of connector H6 is connected to pin B of chip U10. One end of capacitor C30 is grounded, and the other end is connected to the VCC pin of chip C10.
[0051] In this application, the BEIDOU-TX signal enters the base of the NPN transistor Q3 through resistor R29, controlling the conduction and cutoff of the NPN transistor Q3. When the NPN transistor Q3 is on, the BEIDOU-TX signal is transmitted to BEIDOU-RX and the DI pin of chip U10. Resistor R27 pulls the BEIDOU-RX signal up to 3V3, ensuring that BEIDOU-RX is at a high level when the NPN transistor Q3 is off. The DE pin of chip U10 receives the signal from the collector of the NPN transistor Q3, controlling the operating mode (transmit or receive) of the MAX485. When DE is high, the MAX485 is in transmit mode, and the signal on the DI pin is transmitted to the RS-485 bus.
[0052] When DE is low, chip U10 is in receive mode, and the signal from pin RO is output to BEIDOU-RX. Pins A and B of chip U10 are connected via resistor R31 to form a differential signal pair for RS-485 communication. Capacitor C30 is connected between the 5V power supply and ground for power supply decoupling, reducing the impact of power supply noise on chip U10.
[0053] In one possible implementation, the HarmonyOS motherboard is equipped with a TTL interface, through which it connects to the LoRa module. The HarmonyOS motherboard sends control commands and data to be transmitted to the LoRa module via the TTL interface, while simultaneously receiving feedback information from the LoRa module, thus achieving bidirectional communication. The TTL (Transistor-Transistor Logic) interface is a low-voltage serial communication interface suitable for short-distance, low-power data transmission.
[0054] like Figure 4 As shown, the HarmonyOS motherboard is also equipped with a DC-DC buck regulator circuit, which is connected to the HarmonyOS board and is used to convert the 12V input voltage to a 5V output voltage.
[0055] The power supply circuit receives a 12V DC input from an external power source and converts the voltage to a stable 5V output through a DC-DC step-down converter, which is used by the HarmonyOS motherboard and its connected modules (such as the Beidou short message module and LoRa module).
[0056] In one specific implementation, the DC-DC buck regulator circuit uses a chip of model LM2679SX. This chip is a high-efficiency, adjustable output buck switching regulator. The circuit design adopts a switching buck method to ensure stable power supply even under input voltage fluctuations in the wind turbine tower environment, while reducing energy loss.
[0057] like Figure 5 As shown, the HarmonyOS motherboard is also equipped with a low-dropout regulator circuit, which is connected to a DC-DC step-down regulator circuit, and the DC-DC step-down regulator circuit is connected to the HarmonyOS board.
[0058] The low-dropout regulator circuit is used to replace the 5V output voltage of the DC-DC buck regulator circuit with a 3.3V output voltage.
[0059] In this application, a low-dropout regulator circuit is used to reduce the 5V output voltage of a DC-DC buck regulator circuit to 3.3V, providing a stable power supply for some low-voltage modules or logic circuits. The LDO circuit features low ripple, fast response, and noise suppression capabilities, making it suitable for communication modules and microcontrollers with high requirements for voltage accuracy and signal stability.
[0060] In a preferred embodiment, the low-dropout regulator circuit uses a chip of model ME6211C33M5G-N. This chip features low ripple, fast response, and high-precision output, making it suitable for microcontrollers and communication modules with high voltage accuracy requirements.
[0061] like Figure 1 As shown, the intelligent communication device also includes an insulating shell, with the HarmonyOS motherboard housed inside the cavity of the insulating shell; the first antenna of the Beidou short message module and the second antenna of the LoRa module are both located on the outer wall of the insulating shell.
[0062] In some possible implementations, the insulating housing may be made of high-strength plastic or composite material, forming an independent chamber to protect the internal electronic modules from marine environments such as moisture, salt spray and mechanical shock.
[0063] In one specific implementation, the BeiDou short message module and LoRa module are directly used as expansion chips or SoC modules, soldered or embedded on the circuit board of the HarmonyOS motherboard.
[0064] In another specific implementation, the Beidou short message module and the LoRa module are each independent hardware boards, connected to the HarmonyOS motherboard through bus interfaces such as UART, SPI or RS485.
[0065] The above embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of protection of the present utility model. For those skilled in the art, it will be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A smart communication device for offshore wind farms, characterized in that, The intelligent communication device includes: HarmonyOS motherboard; A BeiDou short message module, which is connected to the HarmonyOS motherboard, and equipped with a first antenna; The LoRa module is connected to the HarmonyOS motherboard and is equipped with a second antenna.
2. The intelligent communication device for an offshore wind farm as described in claim 1, characterized in that: The HarmonyOS motherboard is equipped with an RS-485 communication interface circuit, and the HarmonyOS motherboard is connected to the Beidou short message module through the RS-485 communication interface circuit.
3. The intelligent communication device for an offshore wind farm as described in claim 2, characterized in that: The RS-485 communication interface circuit uses a chip of model MAX485ESA+T, and the RS-485 communication interface circuit is used to realize differential serial communication.
4. The intelligent communication device for an offshore wind farm as described in claim 1, characterized in that: The HarmonyOS motherboard is equipped with a TTL interface, and the HarmonyOS motherboard is connected to the LoRa module through the TTL interface.
5. The intelligent communication device for an offshore wind farm as described in claim 1, characterized in that: The HarmonyOS motherboard is also equipped with a DC-DC buck regulator circuit, which is connected to the HarmonyOS board and is used to convert the 12V input voltage to a 5V output voltage.
6. The intelligent communication device for an offshore wind farm as described in claim 5, characterized in that: The DC-DC step-down regulated power supply circuit uses a chip of model LM2679SX.
7. The intelligent communication device for an offshore wind farm as described in claim 5, characterized in that: The HarmonyOS motherboard is also equipped with a low dropout voltage regulator circuit, which is connected to the DC-DC buck regulator circuit, and the DC-DC buck regulator circuit is connected to the HarmonyOS board. The low-dropout regulator circuit is used to replace the 5V output voltage of the DC-DC buck regulator circuit with a 3.3V output voltage.
8. The intelligent communication device for an offshore wind farm as described in claim 7, characterized in that: The low dropout regulator circuit uses a chip with the model number ME6211C33M5G-N.
9. A smart communication device for an offshore wind farm as described in any one of claims 1 to 8, characterized in that: The intelligent communication device also includes an insulating shell, and the HarmonyOS motherboard is disposed within the cavity of the insulating shell; The first antenna of the Beidou short message module and the second antenna of the LoRa module are both located on the outer wall of the insulating shell.