A camera module

By using a glue injection process to mold the bracket at room temperature and low pressure, the deformation problem caused by injection molding was solved, and the optical performance stability and thin and light design of the camera module were achieved.

CN224538264UActive Publication Date: 2026-07-21GUANGZHOU LUXVISIONS INNOVATION TECH LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGZHOU LUXVISIONS INNOVATION TECH LTD
Filing Date
2025-06-23
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

In existing technologies, the injection molding process for camera modules under high temperature and high pressure can easily cause deformation of electronic components, circuit boards and connecting wires, resulting in short circuit risks and affecting optical performance.

Method used

The bracket is integrally molded at room temperature and low pressure using a glue injection process. The bracket wraps around and covers electronic components and connecting wires, forming a light-transmitting hole that is aligned with the photosensitive element, reducing the risk of deformation.

Benefits of technology

It effectively reduces the deformation of electronic components, circuit boards and connecting wires, ensures the yield of optical performance, meets mass production requirements and reduces the height and size of the camera module.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an embodiment of a kind of camera modules, camera module includes circuit board, photosensitive element, multiple electronic components and support, photosensitive element and multiple electronic components are installed on circuit board, and multiple electronic components are arranged on the outside of photosensitive element, support is integrally formed on circuit board by glue injection process, the light hole formed by support is oppositely arranged with photosensitive element, and support covers multiple electronic components. The support of the camera module is integrally formed on the circuit board using the glue injection process mode capable of filling at normal temperature and low pressure, which can reduce the deformation of electronic components, circuit boards and connecting wires between them, thereby ensuring the yield of optical performance and meeting the requirements of mass production.
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