A high-power wireless converged data communication terminal device

Abstract

The utility model discloses a kind of high-power wireless fusion data communication terminal equipment, including shell and circuit board in shell, control module, 5G public network module, 5G private network module, star network module, power amplifier and power management module are integrated on circuit board, 5G public network module, 5G private network module, power amplifier and star network module are electrically connected with control module respectively, power management module is electrically connected with control module, 5G public network module, 5G private network module and star network module respectively.The utility model shell uses aluminium-magnesium alloy, light in weight;Equipment integrates 5G public network, 5G private network and star network, provides multi-link guarantee for data transmission, greatly improves the speed and stability of transmission;Power amplifier is integrally arranged with shell, improves heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of communication terminal equipment technology, and more specifically, to a high-power wireless converged data communication terminal equipment. Background Technology

[0002] Most low-altitude communication gateways are 4G / 5G single-mode products, and the coverage of operator base stations cannot be completely seamless, especially in remote areas. Once the drone flies beyond the coverage range of the base station, the data will be interrupted or packets will be lost. Utility Model Content

[0003] The purpose of this invention is to propose a high-power wireless converged data communication terminal device to overcome the above-mentioned shortcomings in the prior art.

[0004] To achieve the above-mentioned technical objectives, the technical solution of this utility model is implemented as follows:

[0005] A high-power wireless converged data communication terminal device includes a housing and a circuit board disposed within the housing. The circuit board integrates a control module, a 5G public network module, a 5G private network module, a star network module, a power amplifier, and a power management module. The power amplifier is integrally disposed with the housing. The 5G public network module, the 5G private network module, the power amplifier, and the star network module are electrically connected to the control module, and the power management module is electrically connected to the control module, the 5G public network module, the 5G private network module, and the star network module, respectively.

[0006] Furthermore, the control module includes the RK3568 main control chip, and the 5G public network module, 5G private network module, and star network module are all electrically connected to the RK3568 main control chip via USB and I2C interfaces.

[0007] Furthermore, the RK3568 main control chip is electrically connected to Ethernet via an RJ45 interface.

[0008] Furthermore, the housing is made of aluminum-magnesium alloy, the outer surface of the housing is coated with an oxide layer of 5-10 μm, and several transverse grooves are provided at intervals. Honeycomb ribs are provided between the interior of the housing and the high-heat device.

[0009] Furthermore, a heat sink is provided between the 5G public network module and the 5G private network module and the housing, and thermal grease is applied between the heat sink and the housing. The bottom of the 5G public network module and the 5G private network module are connected to the circuit board through thermally conductive pads.

[0010] The beneficial effects of this utility model are as follows: The housing of this utility model is made of aluminum-magnesium alloy, which is lightweight; the device integrates 5G public network, 5G private network and star network, providing multi-link protection for data transmission and greatly improving the speed and stability of transmission; the power amplifier is integrated with the housing, which improves heat dissipation efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the circuit connection structure of the high-power wireless converged data communication terminal equipment described in this embodiment of the utility model;

[0012] Figure 2 This is a schematic diagram of the structure of the high-power wireless converged data communication terminal equipment described in this embodiment of the present invention;

[0013] Figure 3 This is a schematic diagram of the internal structure of the high-power wireless converged data communication terminal device described in this embodiment of the utility model.

[0014] As shown in the figure:

[0015] 1-Housing; 2-Horizontal groove; 3-Heat sink; 4-Star network module; 5-5G private network module; 6-Power amplifier; 7-5G public network module; 8-Power management module; 9-Circuit board. Detailed Implementation

[0016] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0017] like Figure 1 As shown, a high-power wireless converged data communication terminal device includes a housing 1 and a circuit board 9 disposed within the housing 1. The circuit board 9 integrates a control module, a 5G public network module 7, a 5G private network module 5, a star network module 4, a power amplifier 6, and a power management module 8. The power amplifier 6 is integrally disposed with the housing 1. The 5G public network module 7, the 5G private network module 5, the power amplifier 6, and the star network module 4 are electrically connected to the control module, and the power management module 8 is electrically connected to the control module, the 5G public network module 7, the 5G private network module 5, and the star network module 4, respectively.

[0018] This converged communication terminal system uses the RK3568 chip as the main control chip, aiming to realize converged communication between 5G public network, 5G private network and satellite network, and provide users with stable and efficient communication services through data transmission across different networks.

[0019] The core board mainly consists of the RK3568 main control chip, 32Gb EMMC, and 2Gb DDR4. The RK3568 is a domestically produced high-performance application processor platform launched by Rockchip. The RK3568 uses a 22nm process and integrates one QuadCore ARM Cortex-A55 CPU, one Mali-G52 GPU, and one 1TOPS NPU. In addition, the RK3568 has rich peripherals, such as RGMII, PCIe 3.0, SATA 3.0, USB 3.0 Host, USB 2.0 Host, UART, I2C, SPI, and CAN interfaces, suitable for external expansion with communication interfaces for Ethernet, 4G / 5G, BD, RS485, and RS232, as well as storage interfaces for SSDs and TF cards.

[0020] When the RK3568 processor is running, different modules require different power supply voltages. The processor core typically requires about 1V, DDR memory may require 1.2V or 1.1V, and I / O interfaces generally require 3.3V or 1.8V. Taking an industrial-grade RK3568 core board design as an example, a power management integrated circuit (PMIC), such as the RK809 or RK806, is used to centrally manage the multi-voltage rail outputs. These PMICs can accurately convert the external input voltage to the voltage required by each module through multiple internally integrated DC-DC converters and low-dropout linear regulators (LDOs). If a discrete component design is chosen, a combination of DC-DC chips and LDOs will be used. The input is DC24V, which needs to power the CPU minimum system, SSD, 5G module, and other peripherals. The M30 Core Board is the CPU core board, and the power supply provides DC3.3V and DC5V through two DC-DC converters respectively. The core board has a dedicated power management chip RK809, which provides the core voltage and interface voltage required by the CPU through a two-stage step-down circuit. Peripherals, including the 5G module, SSD, and Ethernet, all use independent DC-DC power supplies to avoid mutual interference.

[0021] In this embodiment, the further connection relationships of each module are as follows:

[0022] Core bus layer: The RK3568 internally uses the UART bus to enable coordination among various controllers (USB, DDR4, Ethernet, etc.) to ensure high-speed data exchange.

[0023] 5G module connection: The two modules are connected to the main controller through independent USB 2.0 and USB 3.0 channels respectively, using different endpoint addresses to distinguish data transmission, and receiving control commands through the I2C bus and synchronization pulses through GPIO.

[0024] Storage and Synchronization: DDR4 memory is used for temporary data caching, and eMMC stores configuration and status information; the synchronization pulse generator is connected to the dual modules via GPIO to achieve air interface transmission timing alignment.

[0025] Data output: The processed data stream is distributed to the terminal device via Ethernet (RGMII interface), supporting wired and wireless parallel transmission.

[0026] In order to achieve better heat dissipation efficiency in this invention, such as Figure 2-3 As shown:

[0027] The housing 1 adopts a "honeycomb internal rib" design: on the outside of the housing 1 corresponding to high heat-generating components such as the 5G module and power management module 8, 2mm thick magnesium-aluminum alloy ribs (4mm spacing) are added to increase the contact area and conduct heat from the components to the housing 1.

[0028] The surface of the housing 2 is treated with "anodization + microgrooving": the oxide layer is 5-10μm thick (to improve corrosion resistance), and the surface is machined with transverse grooves 2 0.1mm deep (2mm spacing) to increase the convective heat dissipation area with air, which improves the heat dissipation efficiency by 15%-20% compared with a smooth surface.

[0029] The top surface of the 5G module is connected to the magnesium-aluminum alloy shell 1 via a heat sink 3 and thermal grease: the heat dissipation plate is 0.8mm thick (covering the core heat-generating area of ​​the module), and thermal grease (thermal conductivity ≥5W / (m·K)) is applied between it and the shell 1 to ensure that the heat of the module is quickly conducted to the shell 1.

[0030] The bottom pads of the module are connected to the PCB motherboard via "thermal conductive pads": the corresponding area of ​​the PCB is designed with a 2oz thick copper foil (about 70μm), and is connected to the magnesium-aluminum alloy bracket on the back of the motherboard through 4 Φ3mm thermal conductive vias, forming an auxiliary heat dissipation path of "module → PCB → bracket → housing".

[0031] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-power wireless converged data communication terminal device, comprising a housing (1) and a circuit board (9) disposed within the housing (1), characterized in that, The circuit board (9) integrates a control module, a 5G public network module (7), a 5G private network module (5), a star network module (4), a power amplifier (6), and a power management module (8). The power amplifier (6) is integrated with the housing (1). The 5G public network module (7), the 5G private network module (5), the power amplifier (6), and the star network module (4) are electrically connected to the control module, and the power management module (8) is electrically connected to the control module, the 5G public network module (7), the 5G private network module (5), and the star network module (4).

2. The high-power wireless converged data communication terminal equipment according to claim 1, characterized in that, The control module includes the RK3568 main control chip. The 5G public network module (7), 5G private network module (5), and star network module (4) are all electrically connected to the RK3568 main control chip through USB and I2C interfaces.

3. The high-power wireless converged data communication terminal equipment according to claim 2, characterized in that, The RK3568 main control chip is electrically connected to Ethernet via an RJ45 interface.

4. The high-power wireless converged data communication terminal equipment according to claim 1, characterized in that, The housing (1) is made of aluminum-magnesium alloy. The outer surface of the housing (1) is coated with an oxide layer of 5-10 μm and is provided with several transverse grooves (2) at intervals. The interior of the housing (1) is provided with honeycomb ribs between it and the high-heat device.

5. The high-power wireless converged data communication terminal equipment according to claim 4, characterized in that, A heat sink (3) is provided between the 5G public network module (7) and the 5G private network module (5) and the housing (1). Thermal grease is applied between the heat sink (3) and the housing (1). The bottom of the 5G public network module (7) and the 5G private network module (5) is connected to the circuit board (9) through thermal pads.

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