Remote monitoring of communication power supply

Abstract

The utility model discloses a kind of remote monitoring communication power supply, belong to communication power supply technical field, solve the problem that communication power supply uses, switch device is due to the stress of high-speed switch and power grid surge, although there is protection still difficult to eliminate influence, leading to breakdown failure, cause the whole machine to stop and be associated with damage. Including communication power supply body and the power device stress monitoring and protection circuit being arranged in communication power supply body, the power device stress monitoring and protection circuit are connected with power device in communication power supply body. The utility model compares by sampling the voltage and current of power MOSFET and threshold value, triggers hardware shutdown after detecting abnormality, records stress event, uploads data to monitoring end, realizes all-round protection, solves the stress and breakdown risk of traditional circuit.

Description

Technical Field

[0001] This utility model relates to the field of communication power supply technology, and in particular to a remote monitoring communication power supply. Background Technology

[0002] Communication power supplies are core devices that provide stable power to communication equipment. They convert AC power from mains electricity, batteries, etc., into DC or AC power suitable for the equipment, and have voltage stabilization and anti-interference functions. Some even include redundant designs to prevent power outages. They ensure the continuous operation of communication equipment and prevent voltage fluctuations and power outages from affecting communication. They are a critical infrastructure supporting the stable operation of communication systems such as base stations and data centers.

[0003] During the operation of communication power supplies, power MOSFETs and diodes are subjected to extremely high voltage and current stresses (voltage spikes and current spikes) generated by parasitic inductance and capacitance in the circuit during high-speed switching on and off. Furthermore, surges generated by lightning strikes or the start-up and shutdown of large equipment on the power grid side may introduce instantaneous high voltages far exceeding the device's rated values ​​through conduction or coupling. Even with buffer and absorption circuits, these stresses and interferences cannot be completely eliminated, leading to avalanche breakdown of the devices or thermal breakdown caused by a sharp increase in junction temperature due to instantaneous current and switching losses.

[0004] Therefore, a remote monitoring communication power supply is proposed to solve or alleviate the above problems. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a remote monitoring and communication power supply.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A remote monitoring communication power supply includes a communication power supply body and a power device stress monitoring and protection circuit installed in the communication power supply body. The power device stress monitoring and protection circuit is connected to the power device in the communication power supply body. The power device stress monitoring and protection circuit monitors the voltage and current stress of the power device in real time, and after judgment and cumulative evaluation, directly outputs a shutdown signal for instantaneous protection, and then simultaneously uploads the stress data and fault status to the remote monitoring terminal through an isolated interface.

[0008] Preferably, the power device stress monitoring and protection circuit includes a power stage and drive module, a stress monitoring module, a logic processing and counting module, and an interface and isolation module;

[0009] The drive signal input terminal of the power stage and drive module is used to receive external pulse width modulation signals. The power-off control signal input terminal of the power stage and drive module is connected to the power-off signal output terminal of the logic processing and counting module. The high-voltage sampling input terminal and current sampling input terminal of the stress monitoring module are respectively connected to the high-voltage monitoring point and current monitoring point of the power stage and drive module. The voltage sampling signal output terminal and current sampling signal output terminal of the stress monitoring module are respectively connected to the voltage signal input terminal and current signal input terminal of the logic processing and counting module. The voltage threshold reference input terminal and current threshold reference input terminal of the logic processing and counting module are respectively connected to an external reference voltage source. The digital status output terminal of the logic processing and counting module is connected to the local data input terminal of the interface and isolation module. The power-off signal output terminal of the logic processing and counting module is simultaneously connected to the power-off control signal input terminal of the power stage and drive module and the local fault signal input terminal of the interface and isolation module. The remote communication terminal of the interface and isolation module is used for remote isolated data exchange with the outside. The remote fault signal output terminal of the interface and isolation module outputs the isolated fault status signal.

[0010] Preferably, the power stage and drive module includes an IR2110 driver chip, a first MOSFET, a sampling resistor, a clamping Zener diode, and a clamping PNP transistor. The high-side gate drive output terminal of the IR2110 driver chip is connected to the gate of the first MOSFET through a current-limiting resistor. The enable terminal of the IR2110 driver chip is set as the power-off control signal input terminal of the power stage and drive module. The enable terminal of the IR2110 driver chip is connected to the power-off signal output terminal of the logic processing and counting module. The drain of the first MOSFET is set as the power stage and drive module's... At the high-voltage monitoring point, the drain of the first MOSFET is connected to the cathode of the clamping Zener diode, the source of the first MOSFET is connected to one end of a sampling resistor, and the other end of the sampling resistor is grounded. The two ends of the sampling resistor are set as current monitoring points for the power stage and the drive module. The anode of the clamping Zener diode is connected to the emitter of the clamping PNP transistor, the base of the clamping PNP transistor is connected to the source of the first MOSFET through a bias resistor, and the collector of the clamping PNP transistor is connected to a clamping capacitor. The other end of the clamping capacitor is connected to the source of the first MOSFET.

[0011] Preferably, the stress monitoring module includes an INA181 current amplifier chip and an AD8207 differential amplifier. The non-inverting input of the AD8207 differential amplifier is connected to the power stage and the high-voltage monitoring point of the drive module through a first resistor. The inverting input of the AD8207 differential amplifier is connected to the source side of the first MOSFET in the current monitoring point of the drive module through a second resistor. The output of the AD8207 differential amplifier is set as the voltage sampling signal output of the stress monitoring module to output a drain-source voltage sampling signal. The non-inverting input of the INA181 current amplifier chip is connected to the end of the sampling resistor in the current monitoring point of the drive module near the first MOSFET. The inverting input of the INA181 current amplifier chip is connected to the end of the sampling resistor in the current monitoring point near ground. The output of the INA181 current amplifier chip is set as the current sampling signal output of the stress monitoring module to output a drain current sampling signal.

[0012] Preferably, the logic processing and counting module includes an LM393 comparator, a first CD4071 OR gate, a second CD4071 OR gate, a CD4060 counter, and a CD4042 latch. The inverting input of the first voltage comparator in the LM393 comparator receives a voltage threshold, and the non-inverting input of the first voltage comparator in the LM393 comparator is connected to the voltage sampling signal output of the stress monitoring module to receive a voltage sampling signal. The output of the first voltage comparator in the LM393 comparator outputs an overvoltage flag signal. The inverting input of the second voltage comparator in the LM393 comparator receives a current threshold, and the non-inverting input of the second voltage comparator in the LM393 comparator is connected to the current sampling signal output of the stress monitoring module to receive a current sampling signal. The output of the second voltage comparator in the LM393 comparator outputs an overcurrent flag signal. The first C... The two inputs of the D4071 OR gate are connected to the outputs of the first voltage comparator and the second voltage comparator in the LM393 comparator, respectively. The output of the first CD4071 OR gate is connected to the clock input of the CD4060 counter. The multiple outputs of the CD4060 counter are connected to the corresponding data inputs of the CD4042 latch. The data output of the CD4042 latch is set as the digital status output of the logic processing and counting module to output the cumulative stress level signal. The three inputs of the second CD4071 OR gate are connected to the outputs of the first voltage comparator, the second voltage comparator, and the most significant bit output of the CD4060 counter, respectively. The output of the second CD4071 OR gate is set as the power-off signal output of the logic processing and counting module to output the power-off control signal.

[0013] Preferably, the interface and isolation module includes a CD4051 multiplexer analog switch, an ADC0804 analog-to-digital converter, an SPI interface chip ADAU1401A, and an optocoupler isolation array. The positive analog input terminal of the ADC0804 is connected to the voltage sampling signal output terminal and the current sampling signal output terminal of the stress monitoring module through the CD4051 multiplexer analog switch. The digital output terminal of the ADC0804 is connected to the parallel data input terminal of the SPI interface chip ADAU1401A. The master output slave input terminal, master input slave output terminal, and serial clock terminal of the SPI interface chip ADAU1401A are respectively connected to the first optocoupler, the second optocoupler, and the third optocoupler in the optocoupler isolation array. The input-side anode of the optocoupler is connected to the optical coupler. The input-side cathodes of the first, second, and third optocouplers in the optocoupler isolation array are grounded. The output-side collectors of the first, second, and third optocouplers in the optocoupler isolation array are respectively used as the isolated remote master output slave signal terminal, remote master input slave signal terminal, and remote serial clock signal terminal to form the remote communication terminal between the interface and the isolation module. The power-off signal output terminal of the logic processing and counting module is connected to the input-side anode of the fourth optocoupler in the optocoupler isolation array. The input-side cathode of the fourth optocoupler in the optocoupler isolation array is grounded. The output-side collector of the fourth optocoupler in the optocoupler isolation array is set as the remote fault signal output terminal between the interface and the isolation module to output the isolated remote fault signal.

[0014] This utility model has the following beneficial effects:

[0015] This invention samples the voltage and current of the power MOSFET and compares them with a threshold. Upon detecting an anomaly, it triggers hardware shutdown, records stress events, and uploads the data to the monitoring terminal, achieving comprehensive protection and solving the stress and breakdown risks of traditional circuits. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of this utility model;

[0018] Figure 2 This is a structural block diagram of the stress monitoring and protection circuit for power devices in this utility model.

[0019] In the diagram: 1. Communication power supply unit; 2. Power stage and drive module; 3. Stress monitoring module; 4. Logic processing and counting module; 5. Interface and isolation module. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] Furthermore, the terms "first," "second," and "third" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] A remote monitoring communication power supply, such as Figure 1As shown, it includes a communication power supply body 1 and a power device stress monitoring and protection circuit installed in the communication power supply body 1. The power device stress monitoring and protection circuit is connected to the power device in the communication power supply body 1. The power device stress monitoring and protection circuit monitors the voltage and current stress of the power device in real time, and after judgment and cumulative evaluation, it directly outputs a shutdown signal for instantaneous protection and then synchronously uploads the stress data and fault status to the remote monitoring terminal through the isolated interface.

[0027] like Figure 2 As shown, the power device stress monitoring and protection circuit includes a power stage and drive module 2, a stress monitoring module 3, a logic processing and counting module 4, and an interface and isolation module 5.

[0028] The drive signal input terminal of the power stage and drive module 2 is used to receive external pulse width modulation signals. The power-off control signal input terminal of the power stage and drive module 2 is connected to the power-off signal output terminal of the logic processing and counting module 4. The high-voltage sampling input terminal and the current sampling input terminal of the stress monitoring module 3 are respectively connected to the high-voltage monitoring point and the current monitoring point of the power stage and drive module 2. The voltage sampling signal output terminal and the current sampling signal output terminal of the stress monitoring module 3 are respectively connected to the voltage signal input terminal and the current signal input terminal of the logic processing and counting module 4. The voltage threshold reference input terminal and the current threshold reference input terminal of the logic processing and counting module 4 are respectively connected to an external reference voltage source. The digital status output terminal of the logic processing and counting module 4 is connected to the local data input terminal of the interface and isolation module 5. The power-off signal output terminal of the logic processing and counting module 4 is simultaneously connected to the power-off control signal input terminal of the power stage and drive module 2 and the local fault signal input terminal of the interface and isolation module 5. The remote communication terminal of the interface and isolation module 5 is used for remote isolated data exchange with the outside. The remote fault signal output terminal of the interface and isolation module 5 outputs the isolated fault status signal.

[0029] The power stage and drive module 2 includes an IR2110 driver chip, a first MOSFET, a sampling resistor, a clamping Zener diode, and a clamping PNP transistor. The high-side gate drive output of the IR2110 driver chip is connected to the gate of the first MOSFET through a current-limiting resistor. The enable terminal of the IR2110 driver chip is set as the power-off control signal input terminal of the power stage and drive module 2. The enable terminal of the IR2110 driver chip is connected to the power-off signal output terminal of the logic processing and counting module 4. The drain of the first MOSFET is set as the power stage and drive module 2. At the high-voltage monitoring point of block 2, the drain of the first MOSFET is connected to the cathode of the clamping Zener diode, the source of the first MOSFET is connected to one end of the sampling resistor, and the other end of the sampling resistor is grounded. The two ends of the sampling resistor are set as the current monitoring point between the power stage and the drive module 2. The anode of the clamping Zener diode is connected to the emitter of the clamping PNP transistor, the base of the clamping PNP transistor is connected to the source of the first MOSFET through a bias resistor, and the collector of the clamping PNP transistor is connected to a clamping capacitor. The other end of the clamping capacitor is connected to the source of the first MOSFET.

[0030] The stress monitoring module 3 includes an INA181 current amplifier chip and an AD8207 differential amplifier. The non-inverting input of the AD8207 differential amplifier is connected to the power stage and the high-voltage monitoring point of the drive module 2 through a first resistor. The inverting input of the AD8207 differential amplifier is connected to the source side of the first MOSFET in the current monitoring point of the drive module 2 through a second resistor. The output of the AD8207 differential amplifier is set as the voltage sampling signal output of the stress monitoring module 3 to output the drain-source voltage sampling signal. The non-inverting input of the INA181 current amplifier chip is connected to the end of the sampling resistor in the current monitoring point of the drive module 2 that is close to the first MOSFET. The inverting input of the INA181 current amplifier chip is connected to the end of the sampling resistor in the current monitoring point that is close to ground. The output of the INA181 current amplifier chip is set as the current sampling signal output of the stress monitoring module 3 to output the drain current sampling signal.

[0031] The logic processing and counting module 4 includes an LM393 comparator, a first CD4071 OR gate, a second CD4071 OR gate, a CD4060 counter, and a CD4042 latch. The inverting input of the first voltage comparator in the LM393 comparator receives a voltage threshold. The non-inverting input of the first voltage comparator in the LM393 comparator is connected to the voltage sampling signal output of the stress monitoring module 3 to receive a voltage sampling signal. The output of the first voltage comparator in the LM393 comparator outputs an overvoltage flag signal. The inverting input of the second voltage comparator in the LM393 comparator receives a current threshold. The non-inverting input of the second voltage comparator in the LM393 comparator is connected to the current sampling signal output of the stress monitoring module 3 to receive a current sampling signal. The output of the second voltage comparator in the LM393 comparator outputs an overcurrent flag signal. The first CD4071... The two inputs of the OR gate are connected to the outputs of the first voltage comparator and the second voltage comparator in the LM393 comparator, respectively. The output of the first CD4071 OR gate is connected to the clock input of the CD4060 counter. The multiple outputs of the CD4060 counter are connected to the corresponding data inputs of the CD4042 latch. The data output of the CD4042 latch is set as the digital status output of the logic processing and counting module 4 to output the cumulative stress level signal. The three inputs of the second CD4071 OR gate are connected to the outputs of the first voltage comparator, the second voltage comparator, and the most significant bit output of the CD4060 counter, respectively. The output of the second CD4071 OR gate is set as the power-off signal output of the logic processing and counting module 4 to output the power-off control signal.

[0032] Interface and isolation module 5 includes a CD4051 multiplexer analog switch, an ADC0804 analog-to-digital converter, an SPI interface chip ADAU1401A, and an optocoupler isolation array. The positive analog input of the ADC0804 is connected to the voltage sampling signal output and current sampling signal output of the stress monitoring module 3 via the CD4051 multiplexer analog switch. The digital output of the ADC0804 is connected to the parallel data input of the SPI interface chip ADAU1401A. The master output slave input, master input slave output, and serial clock of the ADAU1401A are respectively connected to the first, second, and third optocouplers in the optocoupler isolation array. The input-side anode of the first, second, and third optocouplers in the optocoupler isolation array is grounded. The output-side collectors of the first, second, and third optocouplers in the optocoupler isolation array are respectively used as the isolated remote master output slave input signal terminal, remote master input slave output signal terminal, and remote serial clock signal terminal to form the remote communication terminal between the interface and the isolation module 5. The power-off signal output terminal of the logic processing and counting module 4 is connected to the input-side anode of the fourth optocoupler in the optocoupler isolation array. The input-side cathode of the fourth optocoupler in the optocoupler isolation array is grounded. The output-side collector of the fourth optocoupler in the optocoupler isolation array is set as the remote fault signal output terminal between the interface and the isolation module 5 to output the isolated remote fault signal.

[0033] When the communication power supply is working, the power device stress monitoring and protection circuit begins with real-time data acquisition of the operating status of the core power device, the first MOSFET. The AD8207 differential amplifier in the stress monitoring module 3 continuously monitors the voltage change between the drain and source of the first MOSFET. It receives the potential difference between the high voltage monitoring point and the low voltage reference point through its non-inverting input and inverting input terminals and converts it into a proportionally scaled voltage sampling signal. At the same time, the INA181 current amplifier chip accurately measures the voltage drop across the sampling resistor connected in series in the source circuit of the first MOSFET. Through its high-precision amplification, it outputs a current sampling signal that reflects the instantaneous current value. These analog signals are synchronously transmitted to the logic processing and counting module 4 for processing.

[0034] During the logic processing stage, the first voltage comparator in the LM393 comparator compares the received voltage sampling signal with the preset voltage threshold reference in real time. When the voltage stress exceeds the safety limit, its output immediately generates an overvoltage flag signal. Similarly, the second voltage comparator in the LM393 comparator compares the current sampling signal with the current threshold reference and outputs an overcurrent flag signal. These fault flag signals are sent to the first CD4071 OR gate for logic synthesis. Any fault signal will trigger the clock input of the CD4060 counter to count and accumulate, recording the frequency of stress events.

[0035] The output data of the CD4060 counter is transmitted to the CD4042 latch for stable latching. Its multi-digit status signal directly reflects the accumulated stress level. At the same time, the second CD4071 OR gate monitors the output of the first voltage comparator in the LM393 comparator, the output of the second voltage comparator in the LM393 comparator, and the highest bit output of the CD4060 counter in real time. When a momentary fault or accumulated stress exceeding the limit is detected, a shutdown control signal is immediately issued from the shutdown signal output terminal.

[0036] The protection signal acts on two key parts simultaneously. First, it is sent directly to the enable terminal of the IR2110 driver chip to immediately shut down the high-side gate drive output, thereby forcing the power transistor to turn off and achieving hardware protection. Second, it is sent to the local fault signal input terminal of the interface and isolation module 5.

[0037] At the data interaction level, the ADC0804 analog-to-digital converter uses the CD4051 multi-channel analog switch to cyclically collect analog signals such as voltage, current and temperature and convert them into digital quantities. These data are converted into serial data format by the SPI interface chip ADAU1401A, and then electrically isolated by the first, second and third optocouplers in the optocoupler isolation array before being sent to the remote monitoring end in the form of isolated serial peripheral device interface data.

[0038] At the same time, the power-off control signal triggers the fourth optocoupler in the optocoupler isolation array to work, generating an isolated remote fault signal for remote system identification, thereby realizing remote status monitoring.

[0039] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A remote monitoring and communication power supply, characterized in that, The device includes a communication power supply body (1) and a power device stress monitoring and protection circuit installed in the communication power supply body (1). The power device stress monitoring and protection circuit is connected to the power device in the communication power supply body (1). The power device stress monitoring and protection circuit monitors the voltage and current stress of the power device in real time, and after judgment and cumulative evaluation, it directly outputs a shutdown signal for instantaneous protection and then synchronously uploads the stress data and fault status to the remote monitoring terminal through an isolated interface.

2. The remote monitoring communication power supply according to claim 1, characterized in that, The power device stress monitoring and protection circuit includes a power stage and drive module (2), a stress monitoring module (3), a logic processing and counting module (4), and an interface and isolation module (5). The drive signal input terminal of the power stage and drive module (2) is used to receive external pulse width modulation signals. The power-off control signal input terminal of the power stage and drive module (2) is connected to the power-off signal output terminal of the logic processing and counting module (4). The high-voltage sampling input terminal and the current sampling input terminal of the stress monitoring module (3) are respectively connected to the high-voltage monitoring point and the current monitoring point of the power stage and drive module (2). The voltage sampling signal output terminal and the current sampling signal output terminal of the stress monitoring module (3) are respectively connected to the voltage signal input terminal and the current signal input terminal of the logic processing and counting module (4). The voltage threshold reference input terminal and the current threshold reference input terminal are respectively connected to an external reference voltage source. The digital status output terminal of the logic processing and counting module (4) is connected to the local data input terminal of the interface and isolation module (5). The power-off signal output terminal of the logic processing and counting module (4) is simultaneously connected to the power-off control signal input terminal of the power stage and drive module (2) and the local fault signal input terminal of the interface and isolation module (5). The remote communication terminal of the interface and isolation module (5) is used for remote isolated data exchange with the outside. The remote fault signal output terminal of the interface and isolation module (5) outputs the isolated fault status signal.

3. The remote monitoring communication power supply according to claim 2, characterized in that, The power stage and drive module (2) includes an IR2110 driver chip, a first MOS transistor, a sampling resistor, a clamping Zener diode, and a clamping PNP transistor. The high-side gate drive output terminal of the IR2110 driver chip is connected to the gate of the first MOS transistor through a current-limiting resistor. The enable terminal of the IR2110 driver chip is set as the power-off control signal input terminal of the power stage and drive module (2). The enable terminal of the IR2110 driver chip is connected to the power-off signal output terminal of the logic processing and counting module (4). The drain of the first MOS transistor is set as the power stage and drive module (2). 2) The high voltage monitoring point, the drain of the first MOS transistor is connected to the cathode of the clamping Zener diode, the source of the first MOS transistor is connected to one end of the sampling resistor, the other end of the sampling resistor is grounded, the two ends of the sampling resistor are set as the current monitoring point of the power stage and the drive module (2), the anode of the clamping Zener diode is connected to the emitter of the clamping PNP transistor, the base of the clamping PNP transistor is connected to the source of the first MOS transistor through a bias resistor, the collector of the clamping PNP transistor is connected to a clamping capacitor, and the other end of the clamping capacitor is connected to the source of the first MOS transistor.

4. The remote monitoring communication power supply according to claim 2, characterized in that, The stress monitoring module (3) includes an INA181 current amplifier chip and an AD8207 differential amplifier. The non-inverting input of the AD8207 differential amplifier is connected to the power stage and the high voltage monitoring point of the drive module (2) through a first resistor. The inverting input of the AD8207 differential amplifier is connected to the source side of the first MOS transistor in the current monitoring point of the power stage and the drive module (2) through a second resistor. The output of the AD8207 differential amplifier is set as the voltage sampling signal output of the stress monitoring module (3) to output the drain-source voltage sampling signal. The non-inverting input of the INA181 current amplifier chip is connected to the sampling resistor in the current monitoring point of the power stage and the end of the sampling resistor in the current monitoring point of the drive module (2) close to the first MOS transistor. The inverting input of the INA181 current amplifier chip is connected to the sampling resistor in the current monitoring point and the end of the sampling resistor in the current monitoring point close to ground. The output of the INA181 current amplifier chip is set as the current sampling signal output of the stress monitoring module (3) to output the drain current sampling signal.

5. A remote monitoring communication power supply according to claim 2, characterized in that, The logic processing and counting module (4) includes an LM393 comparator, a first CD4071 OR gate, a second CD4071 OR gate, a CD4060 counter, and a CD4042 latch. The inverting input of the first voltage comparator in the LM393 comparator is used to receive a voltage threshold. The non-inverting input of the first voltage comparator in the LM393 comparator is connected to the voltage sampling signal output of the stress monitoring module (3) to receive a voltage sampling signal. The output of the first voltage comparator in the LM393 comparator outputs an overvoltage flag signal. The inverting input of the second voltage comparator in the LM393 comparator is used to receive a current threshold. The non-inverting input of the second voltage comparator in the LM393 comparator is connected to the current sampling signal output of the stress monitoring module (3) to receive a current sampling signal. The output of the second voltage comparator in the LM393 comparator outputs an overcurrent flag signal. The first CD4071 OR gate... The two inputs of the 4071 OR gate are respectively connected to the outputs of the first voltage comparator and the second voltage comparator in the LM393 comparator. The output of the first CD4071 OR gate is connected to the clock input of the CD4060 counter. The multiple outputs of the CD4060 counter are connected to the corresponding data inputs of the CD4042 latch. The data output of the CD4042 latch is set as the digital status output of the logic processing and counting module (4) to output the cumulative stress level signal. The three inputs of the second CD4071 OR gate are respectively connected to the outputs of the first voltage comparator, the second voltage comparator, and the highest bit output of the CD4060 counter. The output of the second CD4071 OR gate is set as the power-off signal output of the logic processing and counting module (4) to output the power-off control signal.

6. A remote monitoring communication power supply according to claim 2, characterized in that, The interface and isolation module (5) includes a CD4051 multiplexer analog switch, an ADC0804 analog-to-digital converter, an SPI interface chip ADAU1401A, and an optocoupler isolation array. The positive analog input terminal of the ADC0804 analog-to-digital converter is connected to the voltage sampling signal output terminal and the current sampling signal output terminal of the stress monitoring module (3) through the CD4051 multiplexer analog switch. The digital output terminal of the ADC0804 analog-to-digital converter is connected to the parallel data input terminal of the SPI interface chip ADAU1401A. The main output slave input terminal, the main input slave output terminal, and the serial clock terminal of the SPI interface chip ADAU1401A are respectively connected to the inputs of the first optocoupler, the second optocoupler, and the third optocoupler in the optocoupler isolation array. The input cathodes of the first, second, and third optocouplers in the optocoupler isolation array are grounded. The output collectors of the first, second, and third optocouplers in the optocoupler isolation array are respectively used as the isolated remote master output slave input signal terminal, remote master input slave output signal terminal, and remote serial clock signal terminal to form the remote communication terminal of the interface and isolation module (5). The power-off signal output terminal of the logic processing and counting module (4) is connected to the input anode of the fourth optocoupler in the optocoupler isolation array. The input cathode of the fourth optocoupler in the optocoupler isolation array is grounded. The output collector of the fourth optocoupler in the optocoupler isolation array is set as the remote fault signal output terminal of the interface and isolation module (5) to output the isolated remote fault signal.

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