A Bluetooth earphone based on EVA foam packaging microphone
By using EVA foam to encapsulate the microphone, the problems of high difficulty and cost of sealing with rubber rings were solved, resulting in reduced production costs and improved assembly efficiency, while enhancing the microphone's sound acquisition effect and sealing performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HANGSHI ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-21
AI Technical Summary
In existing Bluetooth headsets, the rubber ring used to seal the gap between the microphone and the voice receiver slot is difficult to manufacture, has a high scrap rate, resulting in high production costs and increased difficulty in assembling the finished product, thus affecting assembly efficiency.
The microphone is encapsulated with EVA foam, which utilizes its elastic buffering effect to seal the gap between the microphone and the voice receiving slot, reducing production costs and improving assembly efficiency.
The use of EVA foam reduces production costs and improves the assembly efficiency of Bluetooth headsets, while also enhancing the microphone's sound acquisition and sealing performance.
Smart Images
Figure CN224538308U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of Bluetooth headset technology, and more particularly to a Bluetooth headset based on an EVA foam-encapsulated microphone. Background Technology
[0002] The microphone buffer structure of Bluetooth headsets is mainly used to reduce wind noise, reduce mechanical vibration interference, and optimize voice pickup quality. Its design directly affects call clarity and noise reduction effect.
[0003] Modern Bluetooth headsets typically use a rubber ring to seal the gap between the microphone and the voice receiver. However, the small size of this rubber ring makes it difficult to manufacture, resulting in a high scrap rate and thus higher production costs. Furthermore, because the rubber ring has a small cushioning range, the microphone and voice receiver require high precision when mating. This further increases the difficulty of assembly and affects assembly efficiency.
[0004] Therefore, the aforementioned technical defects urgently need to be addressed. Utility Model Content
[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide a Bluetooth headset based on an EVA foam-encapsulated microphone, which aims to improve the assembly efficiency of the headset and reduce the production cost of the headset.
[0006] The technical solution adopted by this application to solve the technical problem is as follows: A Bluetooth headset based on an EVA foam-encapsulated microphone, comprising:
[0007] The earphone shell has a first mounting port that is interconnected with the earphone shell and a second mounting port with a voice receiving slot. The voice receiving slot has a microphone hole that leads to the outside world.
[0008] The earphone front cover is fixedly mounted on the first mounting port, forming a first mounting cavity between the two. The battery and speaker are installed in the first mounting cavity.
[0009] And an earphone cover, which is fixedly mounted on the second mounting port, forming a second mounting cavity between the two. The main control board is installed in the second mounting cavity, and a microphone is provided on the main control board.
[0010] The battery and speaker are electrically connected to the main control board. The microphone and voice receiving slot are set accordingly. EVA foam is placed between the microphone and the voice receiving slot to seal the gap between them.
[0011] In one possible implementation, the voice receiving slot is a circular slot.
[0012] In one possible implementation, the inner diameter of the circular groove is smaller than the diameter of the microphone, so that the microphone abuts against the opening of the circular groove.
[0013] In one possible implementation, the EVA foam is a ring-shaped foam, the outer diameter of which is less than or equal to the diameter of the microphone, and the outer diameter of which is greater than the inner diameter of the voice receiving slot.
[0014] In one possible implementation, at least one side of the EVA foam is provided with an adhesive ring, which extends around the circumference of the EVA foam and is used to attach a voice receiving slot or a microphone.
[0015] In one possible implementation, the microphone hole is located on the side wall of the voice receiving slot and penetrates the outer wall of the earphone shell.
[0016] In one possible implementation, the microphone opening is located on the earphone shell at one end away from the earphone front cover.
[0017] In one possible implementation, the first mounting cavity and the second mounting cavity are interconnected.
[0018] In one possible implementation, both the earphone front cover and the earphone face cover are glued to the earphone middle shell.
[0019] Compared with existing technologies, this application provides a Bluetooth headset with a microphone encapsulated in EVA foam. This invention uses lower-cost and easier-to-mold EVA foam to seal the gap between the microphone and the voice receiver slot. Due to the good elastic cushioning effect of EVA foam, the allowable positional deviation between the microphone and the voice receiver slot during alignment is greater, making installation easier. Therefore, it can effectively improve the assembly efficiency of the headset and reduce its production cost. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the overall structure of a Bluetooth headset based on an EVA foam-encapsulated microphone provided in this embodiment;
[0022] Figure 2 This is another overall structural diagram of a Bluetooth headset based on an EVA foam-encapsulated microphone provided in this embodiment;
[0023] Figure 3 This is an exploded view of the overall structure of a Bluetooth headset with an EVA foam-encapsulated microphone provided in this embodiment;
[0024] Figure 4 yes Figure 3 Enlarged view of point A in the middle;
[0025] Figure 5 This is an exploded view of the EVA foam in a Bluetooth headset with an EVA foam-encapsulated microphone, as provided in this embodiment.
[0026] In the diagram: 1. Earphone shell; 11. First mounting port; 12. Second mounting port; 13. Voice receiver slot; 131. Microphone through hole; 2. Earphone front cover; 21. First mounting cavity; 22. Battery; 23. Speaker; 3. Earphone front cover; 31. Second mounting cavity; 32. Main control board; 321. Microphone; 33. EVA foam; 331. Adhesive ring. Detailed Implementation
[0027] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0028] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0030] Furthermore, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.
[0031] This utility model provides, for example Figure 1 , Figure 3 and Figure 4 The image shows a Bluetooth headset based on an EVA foam-encapsulated microphone, a wireless audio device that connects to mobile phones, computers, tablets, and other devices via Bluetooth technology. It can be used for wireless calls, music playback, and active noise cancellation. The main structure includes: a middle shell 1, a front cover 2, and a front cover 3. In some embodiments, the middle shell 1, front cover 2, and front cover 3 are all injection-molded shells. The front cover 2 is equipped with a speaker 23 and is inserted into the user's ear to conduct sound. The middle shell 1 has a first mounting port 11 and a second mounting port 12 with a voice receiving slot 13. The voice receiving slot 13 has a microphone aperture 131 leading to the outside. It is understood that external sounds enter the voice receiving slot 13 through the microphone aperture 131 and are ultimately collected by the microphone 321 and converted into electronic signals. The earphone front cover 2 is fixedly mounted on the first mounting port 11, forming a first mounting cavity 21 between the two. The first mounting cavity 21 houses the battery 22 and the speaker 23. The earphone face cover 3 is fixedly mounted on the second mounting port 12, forming a second mounting cavity 31 between the two. The second mounting cavity 31 houses the main control board 32, which is equipped with a microphone 321. The battery 22 and the speaker 23 are electrically connected to the main control board 32. The microphone 321 is correspondingly positioned with the voice receiving slot 13. EVA foam 33 is provided between the microphone 321 and the voice receiving slot 13 to seal the gap between the microphone 321 and the voice receiving slot 13.
[0032] It should be noted that current Bluetooth headsets typically use a rubber ring to seal the gap between the microphone 321 and the voice receiving slot 13. However, the small size of the rubber ring makes it difficult to manufacture, resulting in a high scrap rate and thus high production costs. Furthermore, due to the small buffer area of the rubber ring, high precision is required when aligning the microphone 321 and the voice receiving slot 13. This further increases the difficulty of assembly and affects assembly efficiency.
[0033] This invention uses EVA foam 33, which is cheaper and easier to mold, to seal the gap between the microphone 321 and the voice receiving slot 13. Because of the good elastic cushioning effect of the EVA foam 33, the allowable positional deviation between the microphone 321 and the voice receiving slot 13 during alignment is greater, making them easier to install. Therefore, it can effectively improve the assembly efficiency of the headphones and reduce their production costs.
[0034] Specifically, EVA foam 33 (ethylene-vinyl acetate copolymer foam) is a common lightweight, flexible, and elastic polymer material. The closed-cell structure of EVA effectively absorbs mid-to-high frequency vibrations, reduces enclosure resonance and external environmental noise interference, and improves the purity of the sound signal acquired by the microphone 321. EVA also has a damping and shock-absorbing effect; its softness and elasticity can buffer mechanical vibrations between the microphone 321 element and the voice receiving slot 13, thus preventing them from affecting the sound acquisition performance of the microphone 321. The good elasticity and buffering effect of EVA can effectively seal the gaps or joints between the microphone 321 element and the voice receiving slot 13, effectively reducing airflow leakage and enhancing the sound signal acquisition performance of the microphone 321 element.
[0035] Furthermore, such as Figure 3 and Figure 4 As shown, the voice receiving slot 13 is a circular slot. It can be understood that the microphone 321 has a cylindrical structure, so configuring the voice receiving slot 13 as a circular slot allows it to match the microphone 321.
[0036] Furthermore, the inner diameter of the circular groove is smaller than the diameter of the microphone 321, so that the microphone 321 abuts against the opening of the circular groove. In this embodiment, the inner diameter of the circular groove is configured to be smaller than the diameter of the microphone 321. This allows the microphone 321 to abut against the opening of the circular groove, and EVA foam 33 is layered between the microphone 321 and the circular groove abutting part, sealing the gap between the microphone 321 and the voice receiving slot 13 and improving the sealing performance between them.
[0037] Furthermore, such as Figure 3 and Figure 5As shown, the EVA foam 33 is a ring-shaped foam 33EVA. The outer diameter of the ring-shaped foam 33EVA is less than or equal to the diameter of the microphone 321, and the outer diameter of the ring-shaped foam 33EVA is greater than the inner diameter of the voice receiving slot 13. It can be understood that by configuring the outer diameter of the ring-shaped foam 33EVA to be less than or equal to the diameter of the microphone 321, and the outer diameter of the ring-shaped foam 33EVA to be greater than the inner diameter of the voice receiving slot 13, both ends of the ring-shaped foam 33EVA can respectively abut against the microphone 321 and the voice receiving slot 13.
[0038] Furthermore, such as Figure 5 As shown, at least one side of the EVA foam 33 has an adhesive ring 331. The adhesive ring 331 extends around the circumference of the EVA foam 33 and is used to attach the voice receiving slot 13 or the microphone 321. It can be understood that by providing the adhesive ring 331 on at least one side of the EVA foam 33, during assembly, the EVA foam 33 can be first attached to the opening of the patient voice receiving slot 13 of the microphone 321 using the adhesive ring 331, and then the microphone 321 can be assembled. This effectively improves the assembly efficiency of the microphone 321, EVA foam 33, and voice receiving slot 13.
[0039] Furthermore, such as Figure 2 and Figure 4 As shown, the microphone through-hole 131 is located on the side wall of the voice receiving slot 13 and penetrates the outer wall of the earphone shell 1.
[0040] It is understandable that external sounds enter the voice receiving slot 13 through the microphone aperture 131, and are ultimately collected by the microphone 321 and converted into electronic signals. In this embodiment, the microphone aperture 131 is located on the side wall of the voice receiving slot 13, such that the central axis of the microphone 321 and the central axis of the microphone aperture 131 form an angle greater than or equal to 90°. Preventing the microphone aperture 131 from directly facing the microphone 321 effectively avoids sound waves entering through the microphone directly impacting the microphone 321, reducing distortion in the microphone 321. At this time, the voice receiving slot 13 can form a cavity that buffers sound waves.
[0041] Furthermore, such as Figure 2 and Figure 4 As shown, the microphone hole 131 is located on the earphone shell 1 at the end opposite to the earphone front cover 2. It can be understood that this end of the earphone shell 1, opposite to the earphone front cover 2, is the closest point to the user's mouth in the Bluetooth earphone. Therefore, placing the microphone hole 131 at this location allows for better reception of the user's voice.
[0042] Furthermore, such as Figure 2As shown, the first mounting cavity 21 and the second mounting cavity 31 are interconnected. It can be understood that the interconnection of the first mounting cavity 21 and the second mounting cavity 31 allows the battery 22 and speaker 23 on the first mounting cavity 21 to be connected to the main control board 32 in the second mounting cavity 31 via a ribbon cable. Simultaneously, the interconnected first and second mounting cavities can form a unified sound resonance cavity, effectively improving the sound quality of the headphones.
[0043] Furthermore, both the earphone front cover 2 and the earphone face cover 3 are glued to the earphone middle shell 1.
[0044] In summary, this application provides a Bluetooth headset with a microphone encapsulated in EVA foam. This invention uses lower-cost and easier-to-mold EVA foam 33 to seal the gap between the microphone 321 and the voice receiving slot 13. Due to the good elastic cushioning effect of the EVA foam 33, the allowable positional deviation between the microphone 321 and the voice receiving slot 13 during alignment is greater, making them easier to install. Therefore, it can effectively improve the assembly efficiency of the headset and reduce its production cost.
[0045] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.
Claims
1. A Bluetooth headset with a microphone encapsulated in EVA foam, characterized in that, include: The earphone shell has a first mounting port and a second mounting port with a voice receiving slot, which are interconnected. The voice receiving slot has a microphone hole leading to the outside. The earphone front cavity cover is fixedly mounted on the first mounting port, forming a first mounting cavity between the two, and a battery and a speaker are installed in the first mounting cavity. The headphone cover is fixedly mounted on the second mounting port, forming a second mounting cavity between them. A main control board is installed in the second mounting cavity, and a microphone is provided on the main control board. The battery and the speaker are both electrically connected to the main control board. The microphone is correspondingly arranged with the voice receiving slot. EVA foam is provided between the microphone and the voice receiving slot to seal the gap between the microphone and the voice receiving slot.
2. A Bluetooth headset based on an EVA foam-encapsulated microphone according to claim 1, characterized in that, The voice receiving slot is a circular slot.
3. A Bluetooth headset based on an EVA foam-encapsulated microphone according to claim 2, characterized in that, The inner diameter of the circular groove is smaller than the diameter of the microphone, so that the microphone abuts against the opening of the circular groove.
4. A Bluetooth headset based on an EVA foam-encapsulated microphone according to claim 1, characterized in that, The EVA foam is a ring-shaped foam, the outer diameter of which is less than or equal to the diameter of the microphone, and the outer diameter of which is greater than the inner diameter of the voice receiving slot.
5. A Bluetooth headset based on an EVA foam-encapsulated microphone according to claim 4, characterized in that, At least one side of the EVA foam is provided with an adhesive ring, which extends around the circumference of the EVA foam and is used to attach the voice receiving slot or the microphone.
6. A Bluetooth headset based on an EVA foam-encapsulated microphone according to claim 1, characterized in that, The microphone hole is located on the side wall of the voice receiving slot and penetrates the outer wall of the earphone shell.
7. A Bluetooth headset based on an EVA foam-encapsulated microphone according to claim 1, characterized in that, The microphone hole is located on the inner shell of the earphone at one end opposite to the front cavity cover of the earphone.
8. A Bluetooth headset based on an EVA foam-encapsulated microphone according to claim 1, characterized in that, The first mounting cavity and the second mounting cavity are interconnected.
9. A Bluetooth headset based on an EVA foam-encapsulated microphone according to claim 1, characterized in that, Both the earphone front cover and the earphone face cover are glued to the earphone middle shell.