A 3D MEMS speaker
By employing a superimposed structure of upper, middle, and lower layers in a MEMS loudspeaker, integrating the upper and lower loudspeakers, and achieving three-layer electrical signal transmission through conductive pillars, the challenges of sound pressure level enhancement and microfabrication in existing technologies have been solved, achieving high loudness, high fidelity audio output, and stable electrical connections.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUBEI JIUFENGSHAN LAB
- Filing Date
- 2025-08-27
- Publication Date
- 2026-07-21
AI Technical Summary
Existing MEMS loudspeakers can only place one MEMS chip in the vertical direction, which makes it difficult to improve sound pressure level performance. In addition, traditional planar loudspeakers are prone to nonlinear distortion, and the microfabrication process for three-dimensional structures is demanding and lacks effective vertical stacking solutions.
Design a 3D MEMS loudspeaker with a stacked structure of upper, middle and lower layers. The upper and lower loudspeakers are integrated in the cavity of the middle layer, and the electrical signals of the three layers are connected by conductive pillars to form a vertical stacked architecture. The two loudspeakers work together in the Z-axis direction.
Without increasing the space occupied in the XY plane, it significantly improves the sound pressure level performance, doubles the acoustic performance, reduces internal acoustic interference, improves the reliability of electrical connections and the efficiency of sound radiation, and meets the requirements of high loudness and high fidelity audio output.
Smart Images
Figure CN224538328U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of MEMS loudspeaker technology, specifically to a 3D MEMS loudspeaker. Background Technology
[0002] As one of the main components of mobile terminals such as mobile phones, the speaker is mainly used to convert electrical signals into sound signals.
[0003] MEMS (Micro-Electro-Mechanical System) loudspeakers offer advantages over traditional voice coil loudspeakers, including better consistency, lower power consumption, smaller size, and lower price. They primarily come in planar and stereo structures. In a planar architecture, the driver is coupled to the vibrating sound-generating component, while in a stereo architecture, the driver is decoupled from the vibrating sound-generating component through transmission components such as mass blocks, mass frames, and linkages.
[0004] However, existing MEMS loudspeakers can only accommodate one MEMS chip vertically. To improve the sound pressure level performance of the loudspeaker, the package size needs to be increased. In addition, traditional planar MEMS loudspeakers, because the driving unit and the diaphragm are directly integrated in the same plane, are simple in structure and easy to manufacture, but they are prone to nonlinear distortion under large amplitude vibration and are difficult to achieve large driving force output. While three-dimensional structures achieve decoupling between driving and vibration through mechanical transmission mechanisms, improving design freedom and output torque, their multi-layer three-dimensional structure has high requirements for microfabrication technology, making yield control difficult, and there is still a lack of effective vertical stacking solutions for multi-chip integration. Utility Model Content
[0005] Based on the above description, this utility model provides a 3D MEMS loudspeaker, which aims to improve the sound pressure level performance of the loudspeaker without changing the package size.
[0006] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:
[0007] This utility model provides a 3D MEMS loudspeaker, including a main body and a loudspeaker assembly. The main body includes an upper plate, a middle plate and a lower plate stacked from top to bottom. The middle plate has an accommodating cavity with an opening on one side. The loudspeaker assembly includes an upper loudspeaker and a lower loudspeaker. The upper loudspeaker and the lower loudspeaker are disposed in the accommodating cavity. The upper loudspeaker is mounted on the upper plate and the lower loudspeaker is mounted on the lower plate.
[0008] Furthermore, the upper plate has an upper speaker mounting hole, the lower plate has a lower speaker mounting hole, the upper speaker is mounted in the upper speaker mounting hole, and the lower speaker is mounted in the lower speaker mounting hole.
[0009] Furthermore, the upper plate also has an upper speaker pin contact and an upper pin contact that are electrically connected to each other, the lower plate also has a lower speaker pin contact and a lower pin contact that are electrically connected to each other, and the middle plate also has a plurality of middle pin contacts, each of the middle pin contacts being electrically connected to the upper pin contact and the lower pin contact respectively.
[0010] The upper speaker is electrically connected to the upper speaker pin contact, and the lower speaker is electrically connected to the lower speaker pin contact.
[0011] Furthermore, the middle layer plate has conductive pillars that extend through the vertical direction, and the two ends of the conductive pillars form the middle layer pin contacts.
[0012] Furthermore, the middle layer pin contacts are provided in multiple ways, and the upper layer pin contacts are provided in multiple ways corresponding to the lower layer pin contacts.
[0013] Furthermore, the two ends of the conductive post abut against the upper speaker pin contact and the lower speaker pin contact, respectively.
[0014] Furthermore, the opening of the accommodating cavity forms an acoustic hole.
[0015] Compared with the prior art, the technical solution of this application has the following beneficial technical effects:
[0016] 1. In the technical solution of this utility model, by integrating the upper speaker and the lower speaker in the accommodating cavity of the middle layer plate and installing them on the upper layer plate and the lower layer plate respectively, a double-layer MEMS sound unit stack in the Z-axis direction is realized; this structure breaks through the technical limitation that traditional MEMS speakers can only accommodate a single chip, so that two independent sound units can work together in the same package.
[0017] 2. Through synchronous driving, the sound pressure generated by the two speakers can be effectively superimposed, significantly improving the overall output sound pressure level and meeting the needs of mobile terminals for high loudness and high fidelity audio output; adopting a vertical stacking architecture, without increasing the space occupied in the XY plane, it makes full use of the space resources in the Z-axis direction, achieving a doubling of acoustic performance. The accommodating cavity provides a shared acoustic space for the upper and lower speakers. By designing the cavity shape, volume and opening position, the sound wave propagation path can be optimized, internal sound interference can be reduced, and sound radiation efficiency can be improved. The lateral openings can also be used as sound wave output channels or for pressure equalization, further improving frequency response characteristics and flatness.
[0018] 3. The middle layer board is provided with middle layer pin contacts, which are electrically connected to the upper layer pin contacts and the lower layer pin contacts respectively, forming a vertical conductive path from the top layer to the bottom layer. This realizes the electrical signal transmission between the three layers, allowing external driving circuits to be uniformly accessed through any one of the pin contacts of the upper layer board, middle layer board, and lower layer board, and transmitted downward to the lower speaker and upward to the upper speaker respectively. This constructs a complete three-dimensional electrical connection network, providing an electrical foundation for the high-density integration of multilayer MEMS devices. Attached Figure Description
[0019] Figure 1 A schematic diagram of the planar structure of the 3D MEMS loudspeaker provided by this utility model;
[0020] Figure 2 A schematic diagram of the planar structure of the 3D MEMS speaker provided by this utility model in its working state;
[0021] Figure 3 A schematic diagram of the planar structure of the upper, middle and lower plates of the main body of the 3D MEMS loudspeaker provided by this utility model;
[0022] Figure 4 A schematic diagram of the planar structure of the 3D MEMS loudspeaker provided by this utility model, showing an upper plate with an upper speaker installed, a middle plate with an upper speaker installed, and a lower plate with a lower speaker installed before stacking.
[0023] The attached diagram lists the components represented by each number as follows:
[0024] 100. 3D MEMS speaker; 1. Main body; 11. Upper plate; 111. Upper pin contact; 112. Upper speaker pin contact; 113. Upper speaker mounting hole; 12. Middle plate; 121. Middle pin contact; 122. Accommodation cavity; 13. Lower plate; 131. Lower pin contact; 132. Lower speaker pin contact; 133. Lower speaker mounting hole; 2. Speaker assembly; 21. Upper speaker; 22. Lower speaker. Detailed Implementation
[0025] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0027] It is understood that spatial relation terms such as "below," "under," "below," "below," "above," "over," etc., can be used here to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as "below" or "under" or "below" of other elements or features will be oriented "over" of other elements or features. Therefore, the exemplary terms "below" and "under" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.
[0028] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. In the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have the transmission of electrical signals or data between them.
[0029] Existing MEMS loudspeakers can only accommodate one MEMS chip vertically. To improve the sound pressure level performance of the loudspeaker, the package size needs to be increased. In addition, traditional planar MEMS loudspeakers, because the driving unit and the diaphragm are directly integrated in the same plane, are simple in structure and easy to manufacture, but they are prone to nonlinear distortion under large amplitude vibration and are difficult to achieve large driving force output. While three-dimensional structures achieve decoupling between driving and vibration through mechanical transmission mechanisms, improving design freedom and output torque, their multi-layer three-dimensional structure has high requirements for microfabrication technology, making yield control difficult, and there is still a lack of effective vertical stacking solutions for multi-chip integration.
[0030] In view of this, see Figures 1 to 3This utility model provides a 3D MEMS loudspeaker, including a main body 1 and a loudspeaker assembly 2. The main body 1 includes an upper plate 11, a middle plate 12 and a lower plate 13 stacked from top to bottom. The middle plate 12 has a receiving cavity 122 with an opening on one side. The loudspeaker assembly 2 includes an upper loudspeaker 21 and a lower loudspeaker 22. The upper loudspeaker 21 and the lower loudspeaker 22 are disposed in the receiving cavity 122. The upper loudspeaker 21 is mounted on the upper plate 11 and the lower loudspeaker 22 is mounted on the lower plate 13.
[0031] In this invention, an upper speaker 21 and a lower speaker 22 are integrated within the cavity 122 of the middle plate 12 and mounted on the upper plate 11 and lower plate 13 respectively, achieving a double-layer MEMS sound unit stack in the Z-axis direction. This structure overcomes the limitation of traditional MEMS speakers that can only accommodate a single chip, allowing two independent sound units to work collaboratively within the same package. Through synchronous driving, the sound pressure generated by the two speakers can be effectively superimposed, significantly improving the overall output sound pressure level and meeting the needs of mobile terminals for high-loudness and high-fidelity audio output. The vertical stacking architecture fully utilizes the space resources in the Z-axis direction without increasing the space occupied in the XY plane, achieving a doubling of acoustic performance. The cavity 122 provides a shared acoustic space for the upper and lower speakers. By designing the cavity shape, volume, and opening position, the sound wave propagation path can be optimized, internal sound interference reduced, and sound radiation efficiency enhanced. The lateral openings can also serve as sound wave output channels or for pressure equalization, further improving frequency response characteristics and flatness.
[0032] Furthermore, the upper plate 11 has an upper speaker mounting hole 113, the lower plate 13 has a lower speaker mounting hole 133, the upper speaker 21 is mounted in the upper speaker mounting hole 113, and the lower speaker 22 is mounted in the lower speaker mounting hole 133.
[0033] In the technical solution of this utility model, by providing an upper speaker mounting hole 113 on the upper plate 11 and a lower speaker mounting hole 133 on the lower plate 13, a clear mounting position and mechanical limiting structure are provided for the upper speaker 21 and the lower speaker 22. The mounting holes match the outer contour of the speakers, ensuring that the two are precisely aligned within the accommodating cavity 122, avoiding assembly offset or loosening, improving the consistency and reliability of component assembly, and helping to improve product yield and acoustic performance stability. In addition, the upper speaker 21 and the lower speaker 22 are symmetrically mounted on the upper plate 11 and the lower plate 13 respectively through the mounting holes, making the mass distribution of the entire 3D MEMS speaker assembly 2 more balanced in the Z-axis direction, reducing structural resonance or modal coupling problems caused by vibration asymmetry, improving the working stability of the device under high frequency or large signal drive, and reducing nonlinear distortion.
[0034] It should be noted that the number of upper speaker mounting holes 113 and lower speaker mounting holes 133 is not limited; preferably, both the upper plate 11 and the lower plate 13 are provided with multiple mounting holes so that after the speaker is installed, multiple mounting holes that are not matched with the speaker form air holes. By using the mounting holes as air holes to connect with the outside, pressure fluctuations can be effectively released, air damping can be reduced, the diaphragm can move more freely, and vibration efficiency and low-frequency response can be improved.
[0035] Furthermore, in some embodiments of the present invention, the diaphragms of the upper speaker 21 and the lower speaker 22 have openings to form an open-hole diaphragm. This, together with the airflow channel formed by the mounting holes, helps to balance the static and dynamic air pressure on both sides of the diaphragm and reduce eccentric vibration or modal distortion caused by pressure accumulation.
[0036] Furthermore, the upper plate 11 also has an upper speaker pin contact 112 and an upper pin contact 111 that are electrically connected to each other, the lower plate 13 also has a lower speaker pin contact 132 and a lower pin contact 131 that are electrically connected to each other, and the middle plate 12 also has a plurality of middle pin contacts 121, each of the middle pin contacts 121 being electrically connected to the upper pin contact 111 and the lower pin contact 131 respectively;
[0037] The upper speaker 21 is electrically connected to the upper speaker pin contact 112, and the lower speaker 22 is electrically connected to the lower speaker pin contact 132.
[0038] In the technical solution of this utility model, by setting the upper speaker pin contact 112 and the upper layer pin contact 111 on the upper plate 11, and setting the lower speaker pin contact 132 and the lower layer pin contact 131 on the lower plate 13, independent electrical connection channels are established for the upper speaker 21 and the lower speaker 22 respectively. The upper speaker 21 is electrically connected to the upper speaker pin contact 112, and the lower speaker is electrically connected to the lower speaker pin contact 132, ensuring that the driving signal can be accurately and with low impedance transmitted to their respective sound-producing units; the middle Layer 12 is provided with multiple middle layer pin contacts 121, which are electrically connected to the upper layer pin contacts 111 and the lower layer pin contacts 131, forming a vertical conductive path from the top layer to the bottom layer. This enables the electrical signal to pass through the three layers, allowing external driving circuits to be uniformly accessed through any one of the pin contacts of the upper layer 11, middle layer 12 and lower layer 13, and transmitted downward to the lower speaker and upward to the upper speaker 21, respectively. This constructs a complete three-dimensional electrical connection network, providing an electrical foundation for the high-density integration of multilayer MEMS devices.
[0039] Specifically, in some embodiments of this utility model, an external pin contact is provided on the side of the lower plate 13 away from the middle plate 12. The external pin contact is electrically connected to the lower pin contact 131 to facilitate the transmission of electrical signals from the external pin contact to the upper speaker 21 and the lower speaker 22. The unified bottom electrical connection interface facilitates testing, repair and replacement, which is in line with the modular design trend of modern electronic products.
[0040] Furthermore, the middle layer plate 12 has conductive pillars that extend through the vertical direction, and the two ends of the conductive pillars form the middle layer pin contacts 121.
[0041] In the technical solution of this utility model, the conductive post penetrates the middle layer plate 12 in the vertical direction, and its two ends directly form middle layer pin contacts 121, which serve as conductive paths between the upper layer pin contacts 111 and the lower layer pin contacts 131. The conductive post is pre-integrated on the middle layer plate 12, eliminating the need for additional wiring or soldering operations during subsequent assembly. The upper layer pin contacts 111 and the lower layer pin contacts 131 only need to be aligned with and connected to the two ends of the conductive post to achieve electrical conduction. This greatly simplifies the packaging process of the multi-layer stacked structure, reduces the assembly accuracy requirements, and facilitates automated, high-yield mass production.
[0042] Furthermore, the middle layer pin contacts are provided in multiple ways, and the upper layer pin contacts are provided in multiple ways corresponding to the lower layer pin contacts.
[0043] In the technical solution of this utility model, by setting multiple pin contacts, an independent electrical signal channel can be provided for each electrode or functional area, realizing precise drive control, thereby optimizing vibration modes and improving sound quality performance; at the same time, the parallel distribution of multiple pin contacts can form redundant conductive paths, so even if individual contact points have poor contact due to process deviations or stress, the remaining contacts can still maintain effective conduction, which significantly improves the reliability and durability of electrical connections, and is especially suitable for harsh working environments such as long-term vibration or temperature cycling.
[0044] Specifically, in some embodiments of this utility model, there are two middle-layer pin contacts, and two upper-layer pin contacts corresponding to two lower-layer pin contacts.
[0045] Furthermore, the two ends of the conductive post abut against the upper speaker pin contact 112 and the lower speaker pin contact 132, respectively.
[0046] In the technical solution of this utility model, by directly contacting the two ends of the conductive post with the upper speaker pin contact 112 and the lower speaker pin contact 132, a metal-to-metal surface contact or point contact conductive path is formed, eliminating the traditional wire bonding or conductive adhesive transition connection links, avoiding failure modes such as easy breakage, detachment or poor soldering of bonding wires, and maintaining a stable electrical conduction state even in harsh working environments such as vibration, shock or temperature cycling, thus improving the working stability of MEMS speakers.
[0047] Furthermore, the opening of the accommodating cavity 122 forms an acoustic hole.
[0048] In the technical solution of this utility model, the side opening of the cavity 122 of the middle layer plate 12 is directly used as a sound hole, without the need to set up an additional independent acoustic sound outlet channel or opening structure, thereby reducing the number of parts and assembly processes, improving the integration of the device, and avoiding the problem of weakening the structural strength or reducing the sealing performance caused by additional openings. While ensuring acoustic performance, the limited packaging space is utilized to the maximum extent.
[0049] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
[0050] In summary, the technical solution of this application has the following beneficial technical effects:
[0051] 1. In the technical solution of this utility model, by integrating the upper speaker and the lower speaker in the accommodating cavity of the middle layer plate and installing them on the upper layer plate and the lower layer plate respectively, a double-layer MEMS sound unit stack in the Z-axis direction is realized; this structure breaks through the technical limitation that traditional MEMS speakers can only accommodate a single chip, so that two independent sound units can work together in the same package.
[0052] 2. Through synchronous driving, the sound pressure generated by the two speakers can be effectively superimposed, significantly improving the overall output sound pressure level and meeting the needs of mobile terminals for high loudness and high fidelity audio output; adopting a vertical stacking architecture, without increasing the space occupied in the XY plane, it makes full use of the space resources in the Z-axis direction, achieving a doubling of acoustic performance. The accommodating cavity provides a shared acoustic space for the upper and lower speakers. By designing the cavity shape, volume and opening position, the sound wave propagation path can be optimized, internal sound interference can be reduced, and sound radiation efficiency can be improved. The lateral openings can also be used as sound wave output channels or for pressure equalization, further improving frequency response characteristics and flatness.
[0053] 3. The middle layer board is provided with middle layer pin contacts, which are electrically connected to the upper layer pin contacts and the lower layer pin contacts respectively, forming a vertical conductive path from the top layer to the bottom layer. This realizes the electrical signal transmission between the three layers, allowing external driving circuits to be uniformly accessed through any one of the pin contacts of the upper layer board, middle layer board, and lower layer board, and transmitted downward to the lower speaker and upward to the upper speaker respectively. This constructs a complete three-dimensional electrical connection network, providing an electrical foundation for the high-density integration of multilayer MEMS devices.
Claims
1. A 3D MEMS loudspeaker, characterized in that, include: The main body includes an upper plate, a middle plate and a lower plate stacked from top to bottom, wherein the middle plate has a receiving cavity with an opening on one side; A speaker assembly includes an upper speaker and a lower speaker, the upper speaker and the lower speaker being disposed within the accommodating cavity, the upper speaker being mounted on the upper plate, and the lower speaker being mounted on the lower plate.
2. The 3D MEMS loudspeaker according to claim 1, characterized in that, The upper plate has an upper speaker mounting hole, and the lower plate has a lower speaker mounting hole. The upper speaker is mounted in the upper speaker mounting hole, and the lower speaker is mounted in the lower speaker mounting hole.
3. The 3D MEMS loudspeaker according to claim 1, characterized in that, The upper plate also has an upper speaker pin contact and an upper pin contact that are electrically connected to each other; the lower plate also has a lower speaker pin contact and a lower pin contact that are electrically connected to each other; the middle plate also has a middle pin contact; the middle pin contact is electrically connected to the upper pin contact and the lower pin contact respectively. The upper speaker is electrically connected to the upper speaker pin contact, and the lower speaker is electrically connected to the lower speaker pin contact.
4. The 3D MEMS loudspeaker according to claim 3, characterized in that, The middle layer plate has conductive pillars that extend through the vertical direction, and the two ends of the conductive pillars form the middle layer pin contacts.
5. The 3D MEMS loudspeaker according to claim 3, characterized in that, The middle layer pin contacts are provided in multiple ways, and the upper layer pin contacts are provided in multiple ways corresponding to the lower layer pin contacts.
6. The 3D MEMS loudspeaker according to claim 4, characterized in that, The two ends of the conductive post abut against the upper speaker pin contact and the lower speaker pin contact, respectively.
7. The 3D MEMS loudspeaker according to claim 1, characterized in that, The opening of the accommodating cavity forms an acoustic hole.