A high-density hybrid PCB circuit board

Abstract

The utility model provides a kind of high-density combined PCB circuit board, including mainboard, component, positioning hole, the point of the mainboard is equipped with component, the positioning hole is set in the corner of the mainboard, the edge of the mainboard top surface is equipped with connector, the edge of the mainboard is detachably connected with subboard, the upper and lower of the mainboard connection place of subboard are all equipped with V groove.The utility model has the advantages of: in the case of equipment space limitation, through the V groove of mainboard, subboard connection place preset, force at V groove, directly break off subboard, cross section neat, subboard and mainboard separate, without complex dismounting tool or step, and simultaneously pull out flexible gold finger, use flexible board, flexible gold finger of flexible board is inserted into connector, so that mainboard, flexible board is used in combination, use more flexible, so that the circuit board can adapt to smaller installation space, improve the miniaturization and integration of equipment.

Description

Technical Field

[0001] This utility model relates to the field of PCB circuit board technology, and in particular to a high-density composite PCB circuit board. Background Technology

[0002] A PCB, or Printed Circuit Board, is an indispensable component in modern electronic devices. A PCB is a board formed by patterning conductive copper foil onto the surface of an insulating material (such as fiberglass or epoxy resin) to create electrical connections between electronic components. Its main function is to achieve electrical connections between electronic components through these copper foil traces and to support and fix the components on the board.

[0003] Common PCB circuit boards are generally rigid boards, and their installation requires sufficient space. When space or installation area is insufficient, PCB circuit boards cannot be installed. Therefore, a high-density modular PCB circuit board is proposed, which has multiple usage modes, can adapt to smaller installation spaces, and improves the miniaturization and integration of equipment. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a high-density modular PCB circuit board to solve the problems mentioned in the background art and overcome the shortcomings of the existing technology.

[0006] To achieve the above objectives, one embodiment of the present invention provides a high-density combined PCB circuit board, including a motherboard, components, and positioning holes. Components are installed at several points on the motherboard, and positioning holes are provided at the four corners of the motherboard.

[0007] A connector is installed at one edge of the top surface of the motherboard, and a sub-board is detachably connected to one edge of the motherboard;

[0008] V-grooves are provided above and below the connection between the sub-board and the main board, and a flexible gold finger is fixed on the top of the sub-board.

[0009] The flexible gold finger end is inserted into the connector;

[0010] The end of the flexible gold finger can also be connected to a flexible plate, on which circuits are etched.

[0011] Preferably, in any of the above embodiments, the motherboard is divided into two layers: the lower layer is glass fiber, and the upper layer is an epoxy resin layer laminated or coated on the surface of the glass fiber layer.

[0012] Using the above technical solution: In this circuit board, the components are connected to the corresponding solder points on the motherboard by means of pin soldering. The components on the motherboard are densely distributed, thus it is a high-density PCB circuit board.

[0013] The motherboard is installed in a predetermined position using positioning holes and screws. Both the motherboard and the sub-board are conventional rigid boards.

[0014] Preferably, in any of the above solutions, the connector is compatible with the model of the flexible gold finger, and the sub-board is divided into two layers: the lower layer is glass fiber, and the upper layer is an epoxy resin layer laminated or coated on the surface of the glass fiber layer.

[0015] Using the above technical solution: This circuit board has two usage modes. The first mode is the use of a main board and a sub-board together. The components on the main board and the sub-board are connected by connectors and flexible gold fingers. The main board and the sub-board can be easily separated.

[0016] The second mode is the use of a combination of a motherboard and a flexible board. The circuits on the flexible board and the components on the motherboard are connected by connectors and flexible gold fingers. The flexible board can be bent, which can reduce the overall area and space occupied by the circuit board.

[0017] Preferably, in any of the above solutions, the length of the sub-board is less than the length of the main board.

[0018] Preferably, in any of the above solutions, the sub-board is integrally cut and formed with the main board, and the sub-board, like the main board, is a rigid board.

[0019] The above technical solution provides two usage modes for this modular PCB. When space permits, the main board and sub-board are used together, with components connected via connectors and flexible gold fingers. When space is limited, the sub-board can be easily pried off by applying force through a pre-set V-groove at the connection point, resulting in a clean break and separation from the main board without complex disassembly tools or steps. Simultaneously, the flexible gold fingers are removed, and a flexible board is replaced. The flexible gold fingers of the flexible board are then inserted into the connector, allowing for more flexible use of the main board and flexible board. This enables the PCB to adapt to smaller installation spaces, improving the miniaturization and integration of the equipment.

[0020] Preferably, in any of the above embodiments, the substrate of the flexible plate is polyimide, the flexible plate can be bent at a certain angle, and positioning holes are provided at the corners of the flexible plate.

[0021] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0022] This high-density modular PCB, through the coordinated arrangement of connectors, sub-boards, V-grooves, flexible gold fingers, and flexible boards, offers two usage modes. When space permits, the main board and sub-board are used together, with components connected via connectors and flexible gold fingers. In situations of limited space, the sub-board can be easily pried off by applying force through the pre-set V-grooves at the connection point, resulting in a clean break and separation from the main board without complex tools or steps. Simultaneously, the flexible gold fingers are removed and replaced with the flexible board, whose flexible gold fingers are inserted into the connectors. This allows for more flexible use of the main board and flexible board, enabling the PCB to adapt to smaller installation spaces and improving the miniaturization and integration of equipment.

[0023] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a first-view structural schematic diagram of the present invention;

[0026] Figure 2 This is a structural schematic diagram of the present invention from a second perspective;

[0027] Figure 3 This is a schematic diagram of the structure of the flexible plate of this utility model.

[0028] In the diagram: 1-Main board, 2-Component, 3-Positioning hole, 4-Connector, 5-Sub-board, 6-V-groove, 7-Flexible gold finger, 8-Flexible board. Detailed Implementation

[0029] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] like Figure 1-3 As shown, this high-density modular PCB circuit board includes a main board 1, components 2, and positioning holes 3. Components 2 are installed at several points on the main board 1, and positioning holes 3 are provided at the four corners of the main board 1.

[0032] A connector 4 is installed at one edge of the top surface of the motherboard 1, and a sub-board 5 is detachably connected to one edge of the motherboard 1;

[0033] V-grooves 6 are provided above and below the connection between the sub-board 5 and the main board 1, and flexible gold fingers 7 are fixed on the top of the sub-board 5.

[0034] The flexible gold finger 7 is inserted into the connector 4;

[0035] The end of the flexible gold finger 7 can also be connected to a flexible plate 8, on which circuits are etched.

[0036] Example 1: In this circuit board, component 2 is connected to the corresponding solder points on the main board 1 by lead soldering. Component 2 is densely distributed on the main board 1, thus making it a high-density PCB circuit board. The main board 1 consists of two layers: the lower layer is fiberglass, and the upper layer is an epoxy resin layer laminated or coated on the surface of the fiberglass layer. The connector 4 is compatible with the flexible gold finger 7. The sub-board 5 also consists of two layers: the lower layer is fiberglass, and the upper layer is an epoxy resin layer laminated or coated on the surface of the fiberglass layer.

[0037] Example 2: This circuit board has two usage modes. The first mode is the use of the main board 1 and the sub-board 5 together. The components on the main board 1 and the sub-board 5 are connected through the connector 4 and the flexible gold fingers 7. The main board 1 and the sub-board 5 can be easily separated.

[0038] The second configuration involves the use of a main board 1 and a flexible board 8. The circuitry on the flexible board 8 and the components on the main board 1 are connected via connectors 4 and flexible gold fingers 7. The flexible board 8 is bendable, reducing the overall circuit board's footprint and space requirements. The sub-board 5 is shorter than the main board 1. The sub-board 5 is integrally cut and formed with the main board 1, and like the main board 1, it is a rigid board. The flexible board 8 is made of polyimide and can be bent at a certain angle. Positioning holes 3 are provided at the corners of the flexible board 8.

[0039] The working principle of this utility model is as follows:

[0040] This circuit board has two usage modes. The first mode is the use of the main board 1 and the sub-board 5 together. The components on the main board 1 and the sub-board 5 are connected through the connector 4 and the flexible gold fingers 7. The main board 1 and the sub-board 5 can be easily separated.

[0041] The second mode is the use of the main board 1 and the flexible board 8 together. The circuits on the flexible board 8 and the components on the main board 1 are connected through the connector 4 and the flexible gold finger 7. The flexible board 8 can be bent.

[0042] In situations where equipment space is limited, the sub-board 5 can be broken off by applying force to the pre-set V-groove 6 at the connection between the main board 1 and the sub-board 5. The cut surface is clean, and the sub-board 5 is separated from the main board 1. At the same time, the flexible gold fingers 7 are removed and replaced with a flexible board 8. The flexible gold fingers 7 of the flexible board 8 are inserted into the connector 4, so that the main board 1 and the flexible board 8 can be used together.

[0043] Compared with the prior art, the present invention has the following advantages:

[0044] This high-density modular PCB circuit board, through the coordinated arrangement of connector 4, sub-board 5, V-groove 6, flexible gold fingers 7, and flexible board 8, has two usage modes. When space permits, the main board 1 and sub-board 5 are used together, with components on the main board 1 and sub-board 5 connected via connector 4 and flexible gold fingers 7. When space is limited, the sub-board 5 can be directly pried off by applying force through the pre-set V-groove 6 at the connection point of the main board 1 and sub-board 5, resulting in a clean break and separation of the sub-board 5 from the main board 1 without complicated disassembly tools or steps. At the same time, the flexible gold fingers 7 are removed and replaced with the flexible board 8, whose flexible gold fingers 7 are inserted into connector 4, allowing the main board 1 and flexible board 8 to be used together. This makes the circuit board more flexible and adaptable to smaller installation spaces, improving the miniaturization and integration of the equipment.

Claims

1. A high-density modular PCB circuit board, characterized in that, Includes a motherboard (1), components (2), and positioning holes (3). Components (2) are installed at several points on the motherboard (1), and positioning holes (3) are provided at the four corners of the motherboard (1). A connector (4) is installed on one edge of the top surface of the motherboard (1), and a sub-board (5) is detachably connected to one edge of the motherboard (1). V-grooves (6) are provided above and below the connection between the sub-board (5) and the main board (1), and a flexible gold finger (7) is fixed on the top of the sub-board (5). The flexible gold finger (7) is inserted into the connector (4) at its end; The end of the flexible gold finger (7) can also be connected to a flexible plate (8), on which circuits are etched.

2. The high-density modular PCB circuit board as described in claim 1, characterized in that: The motherboard (1) is divided into two layers: the lower layer is glass fiber and the upper layer is an epoxy resin layer laminated or coated on the surface of the glass fiber layer.

3. A high-density modular PCB circuit board as described in claim 2, characterized in that: The connector (4) is compatible with the model of the flexible gold finger (7). The sub-board (5) is divided into two layers: the lower layer is glass fiber and the upper layer is an epoxy resin layer laminated or coated on the surface of the glass fiber layer.

4. A high-density modular PCB circuit board as described in claim 3, characterized in that: The length of the sub-board (5) is less than the length of the main board (1).

5. A high-density modular PCB circuit board as described in claim 4, characterized in that: The sub-plate (5) is integrally cut and formed with the main plate (1), and the sub-plate (5) is a rigid plate, just like the main plate (1).

6. A high-density modular PCB circuit board as described in claim 5, characterized in that: The substrate of the flexible plate (8) is polyimide, the flexible plate (8) can be bent at a certain angle, and positioning holes (3) are provided at the corners of the flexible plate (8).

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