Power circuit board, power module, electronic device, and vehicle

Abstract

The utility model discloses a kind of power circuit board, power module, electronic equipment and vehicle, including control panel, substrate, interlayer and power chip, the interlayer is connected between the control panel and the substrate;The power chip is located in the interlayer, the power chip is electrically connected with the control panel, and the power chip is directly or indirectly connected with the substrate to realize heat conduction.The power circuit board of the utility model realizes the pre-embedded integration of control panel and power chip, avoids the need to separately set power module, improves the overall degree of integration, reduces the overall volume and weight, also improves the power density of motor controller limited problem of promotion.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, specifically to a power circuit board, a power module, an electronic device, and a vehicle. Background Technology

[0002] Currently, most new energy vehicles are driven by electric motors. As the control device that controls the operation of the motor, the performance of the motor controller directly determines the overall driving experience. However, existing motor controllers suffer from problems such as large size, heavy weight, and limited power density. Utility Model Content

[0003] This utility model aims to at least partially solve one of the technical problems in the related art.

[0004] To address this, this utility model proposes a power circuit board that integrates the control board and power chip, avoiding the need for a separate power module, improving the overall integration level, reducing the overall size and weight, and also improving the problem of limited power density improvement of the motor controller.

[0005] This utility model embodiment also proposes a power module including the above-described power circuit board.

[0006] This utility model embodiment also proposes an electronic device including the above-described power circuit board or power module.

[0007] This utility model embodiment also proposes an electronic device including the above-described power module.

[0008] The power circuit board of this utility model embodiment includes:

[0009] Control board and base plate;

[0010] An interlayer connecting the control board and the substrate;

[0011] A power chip is disposed within the interlayer, the power chip is electrically connected to the control board, and the power chip is directly or indirectly connected to the substrate to achieve heat conduction.

[0012] In some embodiments, a thermal conductive element is included, which is disposed within the interlayer and connected between the power chip and the substrate, and is used to conduct the heat generated by the power chip to the substrate.

[0013] In some embodiments, the substrate is provided with a first connecting portion, which extends into the interlayer and is connected to the heat-conducting element.

[0014] In some embodiments, there are multiple first connecting portions, and adjacent first connecting portions are arranged at intervals.

[0015] And / or, the material of the heat-conducting component is copper.

[0016] In some embodiments, the control board is provided with a second connection portion, which extends into the interlayer and is electrically connected to the power chip.

[0017] In some embodiments, the thickness of the interlayer in the relative direction between the control board and the substrate is 0.2 mm to 1 mm;

[0018] And / or, the interlayer is made of resin.

[0019] In some embodiments, the control panel includes:

[0020] N first insulating layers;

[0021] N+1 first metal layers, N first insulating layers respectively disposed between two adjacent first metal layers, and at least one first metal layer electrically connected to the power chip.

[0022] In some embodiments, the control panel includes:

[0023] Electronic device, wherein the electronic device is disposed on the side of the control board opposite to the substrate;

[0024] And / or, an electrical connector, the electrical connector being disposed on the side of the control board opposite to the substrate, the electrical connector being electrically connected to the control board, and the electrical connector being used to realize signal interaction between the power chip and the external circuit board.

[0025] In some embodiments, the substrate includes:

[0026] M second insulating layers;

[0027] M+1 second metal layers, M second insulating layers respectively disposed between two adjacent second metal layers, and at least one second metal layer directly or indirectly connected to the power chip.

[0028] In some embodiments, a heat sink is included, which is connected to the substrate and located on the side of the substrate opposite to the power chip, and the heat sink is used to quickly dissipate the heat generated by the chip.

[0029] In some embodiments, a connecting layer is provided between the substrate and the heat sink, and the heat sink is connected to the substrate through the connecting layer.

[0030] The power module of this utility model embodiment includes a housing and a power circuit board as described in any of the above embodiments. The housing is used for the flow of a temperature regulating medium. The power circuit board is mounted in the housing, and the heat sink extends into the housing and is used to contact the temperature regulating medium.

[0031] In some embodiments, a pressure block is included, wherein the power circuit board has a fixing area, and the pressure block is connected to the housing and pressed against the fixing area to fix the power circuit board to the housing.

[0032] In some embodiments, the power circuit board is provided in multiple ways, the housing is provided in multiple openings, the power circuit board is respectively provided at the multiple openings, the heat sink of each power circuit board extends into the housing from the opening, and two adjacent power circuit boards are pressed and fixed by the same pressure block.

[0033] The electronic device of this utility model embodiment includes a power circuit board as described in any of the above embodiments, or includes a power module as described in any of the above embodiments.

[0034] The vehicle of this utility model embodiment includes electronic equipment as described in any of the above embodiments.

[0035] Beneficial effects: The power circuit board, power module, electronic device and vehicle of this utility model embodiment realize the pre-embedded integration of control board and power chip, avoid the need to set up power module separately, improve the overall integration level, reduce the overall size and weight, and also improve the problem of limited power density improvement of motor controller. Attached Figure Description

[0036] Figure 1 This is a cross-sectional view of the overall structure of the power circuit board according to an embodiment of the present invention.

[0037] Figure 2 This is a three-dimensional schematic diagram of the power circuit board according to an embodiment of the present invention.

[0038] Figure 3 This is an exploded view of the power circuit board according to an embodiment of the present invention.

[0039] Figure 4 This is an exploded view of the power module according to an embodiment of the present invention.

[0040] Figure 5 This is a schematic diagram of the fixing area on the power circuit board of this utility model embodiment.

[0041] Figure 6 This is a schematic diagram showing the arrangement of multiple openings on the box body according to an embodiment of the present invention.

[0042] Figure 7 This is a three-dimensional schematic diagram of the power module according to an embodiment of the present invention. Figure 1 .

[0043] Figure 8 This is a three-dimensional schematic diagram of the power module according to an embodiment of the present invention. Figure 2 .

[0044] Figure label:

[0045] 100 - Power circuit board; 101 - Fixing area;

[0046] 1-Control board; 11-First metal layer; 12-First insulating layer; 13-Second connecting part; 14-Electronic components; 15-Electrical connectors;

[0047] 2-Substrate; 21-Second metal layer; 22-Second insulating layer; 23-First connecting portion;

[0048] 3-Mezzanine; 4-Power chip; 5-Heat conductor; 6-Heat sink; 7-Connection layer;

[0049] 200 - Box body; 201 - Opening; 202 - Liquid inlet; 203 - Liquid outlet;

[0050] 300-block. Detailed Implementation

[0051] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0052] like Figure 1 As shown, the power circuit board 100 of this utility model embodiment includes a control board 1, a substrate 2, a sandwich layer 3, and a power chip 4.

[0053] Control board 1 can be a circuit board with some control functions. Control board 1 can be a flat plate and can be disposed above substrate 2. Substrate 2 can be an AMB substrate 2, or substrate 2 can be flat. Control board 1 and substrate 2 can be arranged at intervals in the vertical direction.

[0054] The interlayer 3 connects the control board 1 and the substrate 2. The interlayer 3 can be made of resin or other insulating materials; in some embodiments, it can also be made of other insulating materials. The interlayer 3 can be fixed between the control board 1 and the substrate 2, with its top side connected and fixed to the control board 1 and its bottom side connected and fixed to the substrate 2. The interlayer 3 enables the integrated arrangement of the control board 1 and the substrate 2.

[0055] The power chip 4 is disposed within the interlayer 3. The power chip 4 is electrically connected to the control board 1, and the power chip 4 is directly or indirectly connected to the substrate 2 to achieve heat conduction. The power chip 4 is a semiconductor element used for power conversion and management.

[0056] like Figure 1 As shown, the power chip 4 can be pre-embedded in the aforementioned interlayer 3 and can be arranged horizontally. The top side of the power chip 4 can be directly connected to the control board 1, so that the power chip 4 can realize electrical functions such as turning on and off through the control board 1.

[0057] The bottom side of the power chip 4 can be connected to the substrate 2. It should be noted that part or all of the substrate 2 has good thermal conductivity. The heat generated by the power chip 4 during operation can be directly conducted to the substrate 2, which facilitates the rapid dissipation of heat generated by the power chip 4 and avoids the situation where the operating temperature of the power chip 4 is too high.

[0058] The power circuit board 100 of this utility model embodiment realizes the integrated arrangement of control board 1, substrate 2 and power chip 4. The power chip 4 is arranged in the sandwich layer 3 between control board 1 and substrate 2 by pre-embedding integration, which avoids the situation in the prior art where control board 1 and power module are arranged independently, improves the overall integration level, reduces the overall volume and weight, and also improves the problem of limited power density improvement of motor controller.

[0059] In some embodiments, the power circuit board 100 includes a heat-conducting element 5 disposed within the interlayer 3, the heat-conducting element 5 being connected between the power chip 4 and the substrate 2, and the heat-conducting element 5 being used to conduct the heat generated by the power chip 4 to the substrate 2.

[0060] For example, such as Figure 1 As shown, the heat-conducting component 5 can be a block structure. The heat-conducting component 5 has good thermal conductivity. For example, the heat-conducting component 5 can be made of metal materials with good thermal conductivity, such as copper or aluminum. The heat-conducting component 5 can also be embedded in the aforementioned interlayer 3 and can be located below the aforementioned power chip 4. The top side of the heat-conducting component 5 can be directly connected to the power chip 4, and the bottom side of the heat-conducting component 5 can be directly connected to the substrate 2.

[0061] In use, the heat generated by the power chip 4 can be directly conducted to the substrate 2 via the heat conductor 5, thus achieving indirect heat conduction between the power chip 4 and the substrate 2. The heat conductor 5 solves the problem of connection limitations between the power chip 4 and the substrate 2 due to positional deviations, etc. That is, the top side of the heat conductor 5 can be connected to the corresponding heat dissipation point of the power chip 4, and the bottom side of the heat conductor 5 can be connected to the corresponding heat dissipation point of the substrate 2, ensuring the overall heat dissipation effect.

[0062] In some embodiments, the substrate 2 is provided with a first connecting portion 23, which extends into the interlayer 3 and is connected to the heat-conducting element 5. For example, as Figure 1 As shown, the first connecting part 23 can be integrally formed on the top side of the substrate 2. The first connecting part 23 can be a protrusion, bump, etc., provided on the top side of the substrate 2. During processing, the first connecting part 23 can extend into the interlayer 3 and be directly connected to the bottom side of the heat-conducting component 5. This facilitates the connection between the substrate 2 and the heat-conducting component 5.

[0063] In some embodiments, there are multiple first connecting portions 23, and adjacent first connecting portions 23 are arranged at intervals. For example, as Figure 1 As shown, there can be four first connecting parts 23, which can be arranged at intervals in the front-back direction. Each first connecting part 23 can be directly connected to the heat-conducting component 5, thereby enhancing heat dissipation.

[0064] In some embodiments, the control board 1 is provided with a second connecting portion 13, which extends into the interlayer 3 and is electrically connected to the power chip 4. For example, as Figure 1 As shown, the second connecting part 13 can be integrally formed on the bottom side of the control board 1. The second connecting part 13 can be a protrusion, bump, etc. provided on the bottom side of the control board 1. During processing, the second connecting part 13 can extend into the interlayer 3 and be directly connected to the top side of the power chip 4, thereby facilitating the connection between the power chip 4 and the control board 1.

[0065] In some embodiments, the thickness of the interlayer 3 in the relative direction between the control plate 1 and the substrate 2 is 0.2 mm to 1 mm. For example, as... Figure 1 As shown, the thickness of the interlayer 3 can be dimension H, which can specifically be 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, 0.55mm, 0.6mm, 0.65mm, 0.7mm, 0.75mm, 0.8mm, 0.85mm, 0.9mm, 0.95mm, 1mm, etc.

[0066] Within the above-mentioned numerical range, on the one hand, it meets the needs of pre-embedded power chip 4 and heat-conducting component 5, and on the other hand, it avoids the situation that the overall size of the interlayer 3 is too thick, thus playing the role of controlling the overall thickness of the power circuit board 100.

[0067] In some embodiments, the control board 1 includes N first insulating layers 12 and N+1 first metal layers 11, with the N first insulating layers 12 respectively disposed between two adjacent first metal layers 11, and at least one first metal layer 11 electrically connected to the power chip 4.

[0068] Specifically, N can be a natural number excluding zero, for example, such as Figure 1 As shown, the control board 1 may include only one first insulating layer 12 and two first metal layers 11, wherein the material of the first insulating layer 12 may be resin or the like, and the material of the first metal layers 11 may be copper or the like. In some other embodiments, the first insulating layer 12 may also be provided in two, three, four, or other quantities, in which case the first metal layers 11 may be provided in three, four, five, or other quantities.

[0069] It should be noted that during processing, any one of the first metal layers 11 can be directly connected to the power chip 4, or some or all of the first metal layers 11 can be connected to the power chip 4. That is, the multiple first metal layers 11 and the power chip 4 can be selectively connected and arranged according to actual needs.

[0070] In some embodiments, the control board 1 includes electronic components 14, which are disposed on the side of the control board 1 opposite to the substrate 2. For example, such as Figure 1 As shown, the electronic device 14 may include capacitors, resistors, etc. The electronic device 14 can be fixed on the top side of the control board 1 by mounting, specifically in the front half of the control board 1.

[0071] In some embodiments, the control board 1 includes an electrical connector 15, which is disposed on the side of the control board 1 away from the substrate 2. The electrical connector 15 is electrically connected to the control board 1 and is used to realize signal interaction between the power chip 4 and the external circuit board.

[0072] For example, such as Figure 1 As shown, the electrical connector 15 can be a signal pin, or it can be fixed to the top side of the control board 1 by surface mounting, specifically in the rear half of the control board 1. The electrical connector 15 enables signal interaction between the power chip 4 and other circuit boards.

[0073] In some embodiments, the substrate 2 includes M second insulating layers 22 and M+1 second metal layers 21, the M second insulating layers 22 are respectively disposed between two adjacent second metal layers 21, and at least one second metal layer 21 is directly or indirectly connected to the power chip 4.

[0074] For example, the second insulating layer 22 can be made of ceramic, resin, etc., and the second metal layer 21 can be made of copper, aluminum, or other materials with good thermal conductivity. Figure 1 As shown, the substrate 2 may include only one second insulating layer 22. In this case, there may be two second metal layers 21, and the second insulating layer 22 may be disposed between the two second metal layers 21. In some other embodiments, there may be two, three, four, or other numbers of second insulating layers 22, and there may be three, four, five, or other numbers of second metal layers 21.

[0075] During the manufacturing process, any one of the second metal layers 21 can be connected to the heat-conducting element 5. In some other embodiments, some or all of the second metal layers 21 can be connected to the heat-conducting element 5. That is, the connection between the second metal layer 21 of the substrate 2 and the heat-conducting element 5 can be selectively arranged according to actual needs.

[0076] In some embodiments, the power circuit board 100 includes a heat sink 6, which is connected to the substrate 2 and located on the side of the substrate 2 away from the power chip 4, and the heat sink 6 is used to quickly dissipate the heat generated by the chip.

[0077] For example, such as Figures 1 to 3 As shown, the heat sink 6 can be directly connected and fixed to the bottom side of the substrate 2. Specifically, the heat sink 6 can be connected and fixed to the bottommost second metal layer 21 of the substrate 2. In use, the heat generated by the power chip 4 can be conducted to the second metal layer 21 of the substrate 2 via the heat conductor 5, and then conducted to the heat sink 6 via the second metal layer 21. The heat sink 6 can achieve rapid heat dissipation, avoiding the situation where the operating temperature of the power chip 4 is too high.

[0078] In some embodiments, a connecting layer 7 is provided between the substrate 2 and the heat sink 6, and the heat sink 6 is connected to the substrate 2 through the connecting layer 7. For example, Figure 1 and Figure 3 As shown, the connecting layer 7 can be a solder layer or a sintered layer. The top side of the connecting layer 7 can be connected and fixed to the substrate 2, and the bottom side of the connecting layer 7 can be connected and fixed to the heat sink 6.

[0079] The power module of this utility model is described below according to an embodiment.

[0080] The power module of this utility model embodiment includes a housing 200 and a power circuit board 100 as described in any of the above embodiments. The housing 200 is used for the flow of temperature regulating medium. The power circuit board 100 is installed in the housing 200, and the heat sink 6 extends into the housing 200 and is used to contact the temperature regulating medium.

[0081] For example, such as Figure 4 As shown, the housing 200 can be box-shaped, and a temperature-regulating medium such as coolant can flow inside. For example, the housing 200 can be provided with an inlet 202 and an outlet 203. In use, the temperature-regulating medium can flow into the housing 200 from the inlet 202 and then flow out from the outlet 203. The power circuit board 100 can be installed on the top side of the housing 200. The top side of the housing 200 is also provided with an opening 201, through which the heat sink 6 of the power circuit board 100 can be inserted into the housing 200. In use, the temperature-regulating medium flowing inside the housing 200 will directly contact the heat sink 6, thereby achieving rapid cooling of the heat sink 6.

[0082] In some embodiments, the power module includes a pressure block 300, and the power circuit board 100 is provided with a fixing area 101. The pressure block 300 is connected to the housing 200 and pressed against the fixing area 101 to fix the power circuit board 100 to the housing 200.

[0083] For example, such as Figure 4 As shown, the pressing block 300 can be in the shape of a long strip, such as... Figure 5 As shown, a fixing area 101 can be provided on each of the left and right sides of the power circuit board 100, and the fixing area 101 can be strip-shaped. During assembly, the power circuit board 100 can be placed on the top side of the housing 200 first, then the pressure block 300 can be pressed onto the fixing area 101 of the power circuit board 100, and finally the pressure block 300 and the housing 200 can be connected and fixed with screws or other fasteners. This facilitates the connection and fixation of the power circuit board 100 and the housing 200.

[0084] In some embodiments, a plurality of power circuit boards 100 are provided, and a plurality of openings 201 are provided in the housing 200. The plurality of power circuit boards 100 are respectively provided in the plurality of openings 201. The heat sink 6 of each power circuit board 100 extends into the housing 200 from the opening 201. Two adjacent power circuit boards 100 are pressed and fixed by the same pressure block 300.

[0085] For example, such as Figure 6 As shown, the enclosure 200 can be generally rectangular in shape and can extend along the left and right directions. The top side of the enclosure 200 can have multiple openings 201, which can be spaced apart along the left and right directions. The number of power circuit boards 100 can be the same as the number of openings 201. Figure 7 and Figure 8 As shown, multiple power circuit boards 100 can be respectively assembled at multiple openings 201 of the housing 200, and the heat sink 6 of each power circuit board 100 can extend into the housing 200 from the corresponding opening 201.

[0086] The number of pressure blocks 300 can be one more than the number of power circuit boards 100. Multiple pressure blocks 300 and multiple power circuit boards 100 can be arranged alternately in the left-right direction. The pressure block 300 located between two power circuit boards 100 can simultaneously press and fix the fixing areas 101 of the two adjacent power circuit boards 100. This can reduce the number of pressure blocks 300 and also help improve the compactness of the overall structure.

[0087] like Figure 7 As shown, a liquid inlet 202 may be provided on the left side of the housing 200, such as... Figure 8As shown, the right side of the housing 200 may be provided with a liquid outlet 203. When in use, the temperature regulating medium can flow into the housing 200 from the liquid inlet 202. After the temperature regulating medium flows through each radiator 6 in sequence and exchanges heat with the radiator 6, the temperature regulating medium can be discharged from the liquid outlet 203.

[0088] The following describes an electronic device according to an embodiment of the present invention.

[0089] The electronic device of this utility model embodiment includes the power circuit board 100 as described in any of the above embodiments. In other embodiments, the electronic device may include the power module as described in any of the above embodiments. Specifically, the electronic device may be a vehicle motor controller. Of course, it may also be other electronic devices that require both a control circuit board and a power module.

[0090] The vehicle according to an embodiment of the present invention is described below.

[0091] The vehicle in this embodiment of the utility model includes the electronic equipment as described in any of the above embodiments. Specifically, the vehicle can be a sedan, SUV, bus, or other similar vehicle, in which case the electronic equipment can be the vehicle's motor controller.

[0092] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0093] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0094] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0095] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0096] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0097] Although the above embodiments have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Any changes, modifications, substitutions and variations made to the above embodiments by those skilled in the art are within the protection scope of the present invention.

Claims

1. A power circuit board, characterized in that, include: Control board and base plate; An interlayer connecting the control board and the substrate; A power chip is disposed within the interlayer, the power chip is electrically connected to the control board, and the power chip is directly or indirectly connected to the substrate to achieve heat conduction.

2. The power circuit board according to claim 1, characterized in that, The device includes a heat-conducting component disposed within the interlayer, which is connected between the power chip and the substrate, and is used to conduct the heat generated by the power chip to the substrate.

3. The power circuit board according to claim 2, characterized in that, The substrate is provided with a first connecting portion, which extends into the interlayer and is connected to the heat-conducting element.

4. The power circuit board according to claim 3, characterized in that, There are multiple first connecting parts, and adjacent first connecting parts are arranged at intervals; And / or, the material of the heat-conducting component is copper.

5. The power circuit board according to claim 1, characterized in that, The control board is provided with a second connection part, which extends into the interlayer and is electrically connected to the power chip.

6. The power circuit board according to claim 1, characterized in that, The thickness of the interlayer in the relative direction between the control board and the substrate is 0.2 mm to 1 mm; And / or, the interlayer is made of resin.

7. The power circuit board according to claim 1, characterized in that, The control panel includes: N first insulating layers; N+1 first metal layers, N first insulating layers respectively disposed between two adjacent first metal layers, and at least one first metal layer electrically connected to the power chip.

8. The power circuit board according to claim 1, characterized in that, The control panel includes: Electronic device, wherein the electronic device is disposed on the side of the control board opposite to the substrate; And / or, an electrical connector, the electrical connector being disposed on the side of the control board opposite to the substrate, the electrical connector being electrically connected to the control board, and the electrical connector being used to realize signal interaction between the power chip and the external circuit board.

9. The power circuit board according to claim 1, characterized in that, The substrate includes: M second insulating layers; M+1 second metal layers, M second insulating layers respectively disposed between two adjacent second metal layers, and at least one second metal layer directly or indirectly connected to the power chip.

10. The power circuit board according to any one of claims 1-9, characterized in that, The device includes a heat sink connected to the substrate and located on the side of the substrate opposite to the power chip, and the heat sink is used to quickly dissipate the heat generated by the chip.

11. The power circuit board according to claim 10, characterized in that, A connecting layer is provided between the substrate and the heat sink, and the heat sink is connected to the substrate through the connecting layer.

12. A power module, characterized in that, The device includes a housing and a power circuit board as described in claim 10 or 11, wherein the housing is used for the flow of a temperature-regulating medium, the power circuit board is mounted in the housing, and the heat sink extends into the housing and is used to contact the temperature-regulating medium.

13. The power module according to claim 12, characterized in that, The device includes a pressure block, and the power circuit board has a fixing area. The pressure block is connected to the housing and presses against the fixing area to fix the power circuit board to the housing.

14. The power module according to claim 13, characterized in that, The power circuit board is provided in multiple ways, the housing is provided in multiple ways, the power circuit board is respectively provided at the multiple openings, the heat sink of each power circuit board extends into the housing from the opening, and two adjacent power circuit boards are pressed and fixed by the same pressure block.

15. An electronic device, characterized in that, It includes a power circuit board as described in any one of claims 1-11, or a power module as described in any one of claims 12 to 14.

16. A vehicle, characterized in that, Including the electronic device as described in claim 15 above.

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