Heat dissipation structure and electronic device
By placing pads and heat sinks between the pins of power devices and the ground network, and utilizing high thermal conductivity materials and external heat dissipation components, the problem of slow heat conduction in power devices is solved, achieving efficient heat dissipation and improving device performance and lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN RAYSEES TECHNOLOGY CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-07-21
AI Technical Summary
In existing technologies, thermal grease has a low thermal conductivity, which prevents the heat from power devices from being quickly conducted to the heat sink, resulting in excessively high temperatures that affect device performance and lifespan.
A first pad and a second pad are provided between the pins of the power device and the ground network, and a first heat sink is provided between the two. The first heat sink is made of alumina or aluminum nitride substrate material processed by DPC process. Heat is transferred to the ground network through the pads for heat dissipation. Combined with external heat dissipation components such as heat sinks and fans, the heat dissipation is accelerated.
It achieves efficient heat dissipation for power devices, reduces temperature, improves device performance and lifespan, and is suitable for micro PCBA structure layout.
Smart Images
Figure CN224538397U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of heat dissipation, and more specifically, to a heat dissipation structure for a PCBA and an electronic device. Background Technology
[0002] Power devices are indispensable in the structure of PCBA, and the temperature of power devices is an important factor affecting their performance.
[0003] Common PCBA heat dissipation solutions include installing heat sinks on components that generate a lot of heat, increasing the heat dissipation area and accelerating heat dissipation into the surrounding air. Heat sinks are typically made of materials with good thermal conductivity, such as aluminum and copper. However, for power devices with non-insulated surfaces and high instantaneous power, this heat dissipation solution requires the application of thermal grease between the heat sink and the power device to act as an insulator. Since thermal grease has a relatively low thermal conductivity, it cannot quickly conduct heat from the power device to the heat sink, which can lead to the risk of the power device failing due to overheating. Utility Model Content
[0004] This application provides a heat dissipation structure and electronic device. The heat dissipation structure can accelerate the reduction of the temperature of power devices during operation, thereby improving the heat dissipation efficiency of PCBA and thus improving the performance and service life of power devices.
[0005] Firstly, this application provides a heat dissipation structure, which adopts the following technical solution:
[0006] A heat dissipation structure, comprising:
[0007] A PCB board, wherein the PCB board is provided with power devices, a first pad and a second pad, the power devices are used to connect to a network via the first pad and the second pad is used to connect to a ground network;
[0008] A first heat sink is disposed between the first pad and the second pad, and the first heat sink is connected to the first pad and the second pad, for transferring the heat of the power device to the grounding network for heat dissipation.
[0009] Optionally, the two ends of the first heat sink are respectively attached to the first pad and the second pad.
[0010] Optionally, the first heat sink is processed using the DPC process.
[0011] Optionally, the substrate of the first heat sink is an alumina plate or an aluminum nitride plate, or other DPC ceramic substrate materials.
[0012] Optionally, the heat dissipation structure further includes a second heat dissipation component, which is disposed between the first pad and the power device.
[0013] Optionally, the areas of the first heat sink and the second heat sink are larger than the areas of the power device, the first pad, and the second pad.
[0014] Optionally, multiple first pads and second pads are provided, and the first pads and second pads are provided in a one-to-one correspondence.
[0015] Optionally, it may also include an external heat dissipation component for accelerating heat dissipation.
[0016] Optionally, the external heat dissipation component includes one or more of a heat sink and a fan.
[0017] Secondly, this application provides an electronic device that adopts the following technical solution:
[0018] An electronic device includes the heat dissipation structure as described above.
[0019] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:
[0020] When a power device is operating, its temperature rises instantaneously and the heat becomes concentrated. By reserving a first pad and a second pad in the pins and grounding network of the power device, and placing a first heat sink between the first pad and the second pad, the heat generated by the power device can be effectively transferred to the second pad and then to the grounding network through the first pad and the first heat sink. The large area of the grounding network is then used to dissipate the heat, accelerating the heat transfer efficiency and effectively reducing the temperature of the power device. This achieves efficient heat dissipation for the power device, and over time, the temperature can reach a stable state, ensuring stable operation of the power device. On the other hand, because the first heat sink occupies little space, it can be used in the layout of a small PCBA structure, making it more versatile. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings.
[0022] Figure 1 This is a schematic diagram of a heat dissipation structure disclosed in an embodiment of this application.
[0023] Explanation of reference numerals in the attached figures:
[0024] 1. PCB board; 2. Power device; 3. First pad; 4. Second pad; 5. First heat sink. Detailed Implementation
[0025] The present application will be further described in detail below with reference to the accompanying drawings.
[0026] This application provides a heat dissipation structure and electronic device. The heat dissipation structure can accelerate the reduction of the temperature of power devices during operation, thereby improving the heat dissipation efficiency of PCBA and thus improving the performance and service life of power devices.
[0027] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application. Furthermore, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by the present application.
[0028] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in a sequence other than that illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0029] Please see Figure 1 This is one embodiment of the heat dissipation structure in this application. The heat dissipation structure includes a PCB board 1, a first heat sink 5, and a second heat sink (not shown in the figure).
[0030] Specifically, the PCB board 1 is provided with a power device 2, a first pad 3 and a second pad 4. The power device 2 is connected to a functional electrical network through the first pad 3. The electrical network usually refers to a signal transmission path or power distribution network. The network provides stable power input and signal control for the power device 2. The second pad 4 is used to connect to a grounding network. The grounding network usually covers a large area and is not only used for stable transmission of electrical signals, but also as an additional heat dissipation channel.
[0031] The first heat sink 5 is disposed between the first pad 3 and the second pad 4, and is connected to the first pad 3 and the second pad 4, for transferring heat from the power device 2 to the grounding network for heat dissipation. The first pad 3 and the second pad 4 are designed to provide an electrical connection and a heat conduction path between the power device 2 and the grounding network. The first pad 3, the second pad 4, and the first heat sink 5 form a heat conduction path, and the first pad 3 and the second pad 4 serve as the physical connection points between the power device 2 and the grounding network, ensuring that the heat generated by the power device 2 can be efficiently transferred from the power device 2 to the grounding network.
[0032] Understandably, when power device 2 is working, its temperature rises instantly and the heat is concentrated. By reserving the first pad 3 and the second pad 4 in the pins and grounding network of the power device, and setting the first heat sink 5 between the first pad 3 and the second pad 4, the heat generated by power device 2 can be effectively transferred to the second pad 4 and then to the grounding network through the first pad 3 and the first heat sink 5. The heat is then dissipated by taking advantage of the large area of the grounding network, thereby accelerating the efficiency of heat transfer and effectively reducing the temperature of power device 2. This achieves efficient heat dissipation of the power device, and over time, the temperature can reach a stable state, ensuring the stable operation of power device 2. On the other hand, since the first heat sink 5 occupies little space, it can be used in the layout of a small PCBA structure, making it more versatile.
[0033] In this embodiment, multiple first pads 3 and second pads 4 are provided, and multiple first heat sinks 5 are provided, each corresponding to a first pad 3 and a second pad 4. Power devices 2 are soldered to the first pads 3. Multiple first pads 3 are used to connect different electrical networks, and multiple second pads 4 are all used to connect to the ground network. For high-power devices 2, multiple pads can be arranged in an array. By increasing the number of pads, the heat load on each pad is reduced. This design can significantly reduce thermal resistance, distribute heat evenly, avoid localized overheating, and further improve heat dissipation. In high-density PCB design, due to space constraints, the number of pads needs to be adjusted according to the available space.
[0034] Specifically, the two ends of the first heat sink 5 are respectively attached to the first pad 3 and the second pad 4. The substrate of the first heat sink 5 is various DPC ceramic substrate materials such as alumina plate or aluminum nitride plate, and the first heat sink 5 is processed by DPC process. The PCB board 1 uses FR4 as the substrate. The thermal conductivity of FR4 is 0.3W / (m·K), which has a relatively poor heat dissipation coefficient. Therefore, it cannot quickly conduct the heat of the power device 2 to the grounding network (the grounding network represents heat dissipation through copper). The main purpose of DPC process is to improve heat conduction efficiency and electrical performance. The thermal conductivity of aluminum nitride DPC is 170-320W / (m·K), while the thermal conductivity of air is 0.024~0.0267W / (m·K). The thermal conductivity of the first heat sink 5 is much greater than that of air, and the thermal conductivity of the first heat sink 5 is higher than that of conventional heat sinks. Therefore, it can quickly conduct the heat generated by the power device 2 to the grounding network, thereby achieving the heat dissipation effect.
[0035] To further enhance the heat dissipation effect of the power device 2, the heat dissipation structure also includes a second heat sink, which is disposed between the first pad 3 and the power device 2. The second heat sink is used to transfer heat to the air to achieve heat exchange and thus dissipate heat. The second heat sink further enhances the heat dissipation effect based on the first heat sink 5.
[0036] In one possible implementation of the above embodiments, the second heat sink is identical to the first heat sink 5, and the areas of both the first and second heat sinks are larger than the areas of the power device 2, the first pad 3, and the second pad 4. In other embodiments, the areas of the first and second heat sinks can be less than or equal to the areas of the power device 2, the first pad 3, and the second pad 4. The size of the first and second heat sinks directly affects the heat dissipation effect; a larger area provides more surface area to disperse heat, thereby reducing the local temperature.
[0037] Furthermore, since both the first heat sink 5 and the second heat sink are processed using DPC technology, the larger copper layer thickness can significantly improve heat conduction. In high-density PCBA design, it is necessary to balance space constraints with heat dissipation requirements, and select the area and copper layer thickness of the first heat sink 5 and the second heat sink based on actual power consumption and thermal management requirements.
[0038] In another feasible approach, the second heat sink is different from the first heat sink 5. The second heat sink can be made of a heat sink made of a material with good thermal conductivity, such as aluminum or copper, to increase the heat dissipation area and accelerate the dissipation of heat into the surrounding air.
[0039] To further enhance the heat dissipation effect of the PCBA structure, the heat dissipation structure also includes external heat dissipation components, which are used to accelerate heat dissipation. Specifically, the external heat dissipation components include one or more of heat sinks and fans. The heat sinks dissipate heat by increasing the surface area to promote airflow, thereby improving the heat dissipation effect; the fans dissipate heat by accelerating airflow to promote the exchange of hot and cold air, thereby removing heat. The external heat dissipation components, combined with the first heat sink 5 and the second heat sink, can further enhance the heat dissipation effect of the power device 2.
[0040] This application also discloses an electronic device that includes the above-described heat dissipation structure. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.
[0041] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A heat dissipation structure, characterized in that, include: A PCB board, wherein the PCB board is provided with power devices, a first pad and a second pad, the power devices being used to connect to an electrical network via the first pad and the second pad being used to connect to a ground network; A first heat sink is disposed between the first pad and the second pad, and the first heat sink is connected to the first pad and the second pad, for transferring the heat of the power device to the grounding network for heat dissipation.
2. The heat dissipation structure according to claim 1, characterized in that, The two ends of the first heat sink are respectively attached to the first pad and the second pad.
3. The heat dissipation structure according to claim 1, characterized in that, The first heat sink is processed using the DPC process.
4. The heat dissipation structure according to claim 3, characterized in that, The substrate of the first heat sink is an alumina plate or an aluminum nitride plate, or other DPC ceramic substrate materials.
5. The heat dissipation structure according to claim 1, characterized in that, The heat dissipation structure further includes a second heat dissipation component, which is disposed between the first pad and the power device.
6. The heat dissipation structure according to claim 5, characterized in that, The areas of the first heat sink and the second heat sink are larger than the areas of the power device, the first pad, and the second pad.
7. The heat dissipation structure according to claim 1, characterized in that, Multiple first pads and multiple second pads are provided, and multiple first heat sinks are provided, with each of the multiple first heat sinks corresponding to one of the first pads and one of the second pads.
8. The heat dissipation structure according to claim 1, characterized in that, It also includes an external heat dissipation component, which is used to accelerate the dissipation of heat from the power device.
9. The heat dissipation structure according to claim 8, characterized in that, The external heat dissipation components include one or more of heat sinks and fans.
10. An electronic device, characterized in that, Includes the heat dissipation structure as described in any one of claims 1 to 9.