Heat-conducting plastic heat-dissipating component, lighting device and electronic equipment
By using an insert injection molding process that integrates thermally conductive plastic with a PCB, the problems of poor thermal conductivity and low production efficiency have been solved, achieving efficient heat dissipation, low cost, and high-efficiency production, thus adapting to the miniaturization trend of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BENSONG ENG PLASTICS HANGZHOU
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-21
AI Technical Summary
In the existing technology, thermally conductive adhesives or thermally conductive pads have poor thermal conductivity and high cost, low production efficiency, and require holes to be drilled on the PCB for fixation, which affects production efficiency and cost.
Thermally conductive plastic with a thermal conductivity of 3~50W/(m•K) is integrally molded with the PCB through an insert injection molding process. The heat dissipation area and the heat transfer area are directly attached to each other, avoiding the thermal resistance of thermally conductive adhesive or thermally conductive pads. The bonding is ensured by limiting and fixing mechanisms.
It improves heat dissipation, reduces overall costs, increases production efficiency, meets miniaturization requirements, avoids the adverse effects of conductive materials on circuits, and simplifies the fixing process.
Smart Images
Figure CN224538398U_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of heat dissipation technology, specifically relating to thermally conductive plastic heat dissipation components, lighting devices, and electronic equipment. Background Technology
[0002] With the rapid development of electronic equipment technology, PCBs (Printed Circuit Boards), as the support structure for electronic components, are also known as circuit boards, integrated circuit boards, control boards, etc., and their integration and miniaturization trends are becoming increasingly apparent. Electronic components on PCBs, such as CPUs, GPUs, and LED components, which are heat sources, need to dissipate the heat they generate in a timely manner to extend the PCB's lifespan.
[0003] For heat sources with high heat dissipation requirements, additional heat sink structures are often used to achieve heat dissipation. Heat sinks are made of metal, thermally conductive plastic, or a combination of thermally conductive plastic and metal sheets to increase contact with the heat source, further improving the heat dissipation effect of the thermally conductive plastic heat sink. However, due to the shrinkage of the heat sink during the injection molding cooling process, the heat dissipation area becomes microscopically uneven (which may also be apparent macroscopically). Insufficient microscopic flatness means that if it is directly attached to the PCB heat source, gaps will remain at the adjacent uneven areas. These gaps are often filled with media such as air, which significantly reduces the heat conduction effect. Therefore, existing technologies use thermally conductive adhesive or thermally conductive pads between the heat source and the heat sink to fill in the "uneven" microstructure of the heat dissipation area as much as possible, creating a heat dissipation path connecting the PCB and the heat sink. However, thermally conductive adhesive or thermally conductive pads have the following technical problems: 1. Low cost and poor thermal conductivity limit the heat dissipation effect between the heat source and the radiator; 2. High thermal conductivity and high cost of heat dissipation solutions make large-scale promotion difficult. 3. The installation of thermal conductive adhesive or thermal conductive pads is required in the later stages, and most of these are done manually, resulting in low production efficiency and high overall cost. 4. The PCB cannot be fixed by thermal adhesive or thermal pad alone. Screw holes need to be made in the PCB and screws are used to lock it to the heat sink. This solution requires drilling holes in the PCB and the fixing between the PCB and the heat sink must be done manually, which results in low production efficiency. Summary of the Invention
[0004] In order to overcome the aforementioned technical problems in the prior art, the present invention aims to provide a thermally conductive plastic heat dissipation component, lighting device, and electronic device with good heat dissipation effect, low overall cost, and high production efficiency, which is achieved through the following technical solution: A thermally conductive plastic heat dissipation assembly includes a heat sink and a PCB. The heat sink has a heat dissipation area, and the back of the PCB has a heat transfer area. The area of the heat transfer area covers part or all of the back of the PCB. The circuits and / or electronic components on the PCB are arranged to avoid the heat transfer area. The heat sink is made of thermally conductive plastic with a thermal conductivity of 3~50W / (m•K). The heat sink and the PCB are integrally formed by insert injection molding process, and the heat dissipation area and the heat transfer area are attached together.
[0005] Optionally, the substrate of the PCB may include an aluminum plate or a ceramic plate.
[0006] Optionally, the PCB is also provided with insert fixing holes, which can fix the position of the PCB during the insert injection molding process.
[0007] Optionally, the positioning mechanism includes a limiting post disposed on the heat sink and a limiting hole disposed on the PCB that cooperates with it.
[0008] Optionally, the radiator is further provided with a fixing mechanism for assembling the radiator.
[0009] Optionally, the radiator is provided with a number of fins.
[0010] Optionally, the area of the heat transfer zone covers part or all of the back side of the PCB.
[0011] Optionally, when the area of the heat transfer zone covers part of the back of the PCB, the area of the heat dissipation zone on the heat sink can be greater than or equal to the area of the heat transfer zone.
[0012] This application also provides a lighting device, including the thermally conductive plastic heat dissipation component described in any of the above solutions, wherein the PCB is provided with an LED module, and the heat transfer area includes the heat dissipation part of the LED module.
[0013] This application also provides an electronic device, including the thermally conductive plastic heat dissipation component described in any of the above embodiments.
[0014] Compared with existing technologies, this invention offers the following advantages: By integrating a thermally conductive plastic heat sink with the PCB through an insert injection molding process, the heat transfer and heat dissipation areas are directly bonded. This differs from existing thermally conductive adhesive or pad solutions. Firstly, it avoids the thermal resistance of the adhesive or pad layers affecting heat transfer between the heat sink and the PCB. Secondly, it eliminates the need for installation steps with thermally conductive adhesive or pads, improving production efficiency, reducing overall costs, and facilitating large-scale adoption. This application eliminates the need for screw holes on the PCB for fixing the heat sink, increasing PCB integration and further reducing the overall size, saving space and better meeting the miniaturization trend. Furthermore, eliminating the need for screws between the PCB and heat sink also saves on manual assembly steps, further improving production efficiency. This application addresses thermally conductive plastics with a thermal conductivity in the range of 3~50W / (m•K), restricting the circuits and / or electronic components on the PCB from being placed away from heat dissipation areas. This avoids the adverse effects of high thermal conductivity thermally conductive plastics filled with conductive materials such as graphene on circuits or electronic components, such as creepage, short circuits, and circuit failure due to conductivity. Attached Figure Description
[0015] Figure 1 This is a perspective view of the thermally conductive plastic heat dissipation component described in Example 1.
[0016] Figure 2 This is a disassembled diagram of the thermally conductive plastic heat dissipation assembly described in Example 1.
[0017] Figure 3 This is a perspective view of the back side of the PCB of the thermally conductive plastic heat dissipation assembly described in Example 1.
[0018] Figure 4 This is a perspective view of the thermally conductive plastic heat dissipation assembly described in Example 2.
[0019] Figure 5 This is a disassembled diagram of the thermally conductive plastic heat dissipation assembly described in Example 2.
[0020] In the figure, the reference numerals are: radiator 1, heat dissipation area 11, limiting post 12, fin 13, fixing mechanism 14, PCB 2, heat transfer area 21, LED module 22, substrate 23, insert fixing hole 24, and limiting hole 25. Detailed Implementation
[0021] The specific implementation of this application is described in detail below through examples. However, the specific implementation of this application is not intended to limit the technical solution of this application. Any non-substantial changes, such as replacing common technical solutions in the field, using the technical solutions described in the embodiments of this application are within the protection scope of this application.
[0022] It should be noted that the thermally conductive plastics with a thermal conductivity in the range of 3~50 W / (m•K) in this application are prior art and can be directly purchased from commercially available materials. The thermal conductivity of the embodiments in this application was measured using the ASTM E1641 standard.
[0023] It should be noted that the electronic components mentioned in this application as "circuits and / or electronic components on the PCB are arranged to avoid heat dissipation areas" do not include heat sources that need to dissipate heat themselves and electronic components that do not require insulation performance. Components such as CPUs, GPUs, processors, and LED modules that require heat dissipation and are directly attached to the heat transfer surface will not be affected by the weak electrical conductivity of thermally conductive plastics. Example 1
[0024] like Figure 1 , Figure 2 , Figure 3 The thermally conductive plastic heat dissipation assembly shown includes a heat sink 1 and a PCB 2. The heat sink 1 has a heat dissipation area 11, and the back of the PCB 2 has a heat transfer area 21. The area of the heat transfer area 21 covers part or all of the back of the PCB 2. The circuits and / or electronic components on the PCB 2 are arranged to avoid the heat transfer area 21. The heat sink 1 is made of thermally conductive plastic with a thermal conductivity of 3~50W / (m•K). The heat sink 1 and the PCB 2 are integrally formed by insert injection molding process, and the heat dissipation area 11 and the heat transfer area 21 are attached together.
[0025] In this embodiment, the substrate 23 of the PCB2 is an aluminum plate. The basic components of the PCB2 in this embodiment are the substrate 23, an insulating layer, circuitry printed on the insulating layer, and electronic components fixed on the insulating layer. On one hand, aluminum plates have a higher thermal conductivity and better heat transfer effect, enabling them to quickly disperse the heat source temperature and transfer it to the heat sink for heat dissipation. In other embodiments, a ceramic plate can be used, or the substrate 23 can be a conventional plastic circuit board. In this case, the heat transfer area 21 only needs to be positioned away from the heat dissipation area 11, with only the heat transfer area 21 adhering to the heat dissipation area 11. This avoids the adverse effects of high thermal conductivity plastics filled with conductive materials such as graphene on the circuit or electronic components, such as creepage, short circuits, and circuit failure due to conductivity.
[0026] It should be noted that, Figure 1 The form of PCB2 is shown for illustrative purposes only and is not intended to limit its application; this will be understood by those skilled in the art.
[0027] In this embodiment, the heat dissipation area 11 and the heat transfer area 21 are attached by embedding the substrate 23 of the PCB2 into the recess of the heat sink 1, which makes the overall volume of the thermally conductive plastic heat dissipation component smaller, saves space, and is conducive to the miniaturization of electronic devices. In other embodiments, the embedding is not required, and the attachment requirement between the heat dissipation area 11 and the heat transfer area 21 can be met by insert injection molding process.
[0028] In this embodiment, the positioning mechanism includes a limiting post 12 disposed on the heat sink 1 and a limiting hole 25 disposed on the PCB 2 that cooperates with it, such as Figure 2 As shown. On the one hand, it can limit the displacement of the heat sink 1 and PCB2 in the direction of their contact surfaces; on the other hand, through the friction between the side of the limiting post 12 and the thickness direction of the PCB2, it prevents the PCB2 from detaching from the heat sink 1 in the direction perpendicular to the contact surface, thereby improving the firmness of the insert. There can be one or more limiting posts 12 and limiting holes 25, which can be set according to the needs of those skilled in the art. Figure 2 As shown. In other embodiments, other positioning mechanisms can also be used, as long as they can prevent relative displacement between the heat sink 1 and PCB2.
[0029] In this embodiment, the PCB2 is also provided with insert fixing holes 24, which can fix the position of the PCB2 during the insert injection molding process.
[0030] In this embodiment, the radiator 1 is further provided with a fixing mechanism 14 for assembling the radiator 1. The fixing mechanism 14 has a hollow structure and can be used to fix it with bolts or screws. In other embodiments, those skilled in the art can choose combinations of columns, screw holes, clips, etc., according to their needs, all of which are within the scope of this application.
[0031] In this embodiment, the radiator 1 is provided with a plurality of fins 13, and the plurality of fins 13 are arranged side by side on the other side of the heat dissipation area 11.
[0032] In this embodiment, the area of the heat transfer zone 21 covers the entire back side of the PCB2, thus completely enveloping the back side of the PCB2.
[0033] In other embodiments, the area of the heat transfer zone 21 covers a portion of the back side of the PCB2, and the area of the heat dissipation zone 11 on the heat sink 1 can be greater than or equal to the area of the heat transfer zone 21. This solution can be adopted when there are other electronic components on the back side of the PCB2 besides the heat transfer zone 21, making it inconvenient to fully attach them to the heat sink 1. Alternatively, in other cases, if there are no other electronic components on the back side of the PCB2 that need to be avoided, only the heat transfer zone 21 needs to be attached to the heat dissipation zone 11. Example 2
[0034] A thermally conductive plastic heat dissipation component, such as Figure 4 , Figure 5 As shown, the other parts are structurally the same as in the embodiment, except that in this embodiment, the heat dissipation area 11 and the heat transfer area 21 are directly bonded together, rather than the PCB 2 substrate 23 being embedded in the recess of the heat sink 1. Specifically, as shown... Figure 5 As shown.
[0035] In this embodiment, there is one limiting post 12 and one corresponding limiting hole 25. The limiting post 12 is oval, which can simultaneously limit the displacement of rotation along the limiting post 12. Multiple limiting posts can be provided in other embodiments. It can also be used in combination with the cylindrical shape of Embodiment 1. Example 3
[0036] A lighting device includes the thermally conductive plastic heat dissipation assembly described in Embodiment 1. In this embodiment, an LED module 22 is provided on the PCB2, and the heat transfer area 21 includes the heat dissipation portion of the LED module 22. For ease of understanding, in the appendix of Embodiment 1... Figure 2 As indicated, this embodiment will not be illustrated separately.
[0037] In other embodiments, the thermally conductive plastic heat dissipation assembly described in Embodiment 2 may also be included, and the LED module 22 may be as follows: Figure 5 As shown, no further details will be provided. Example 4
[0038] An electronic device includes the thermally conductive plastic heat dissipation assembly described in Embodiment 1. In this embodiment, the PCB2 is provided with heat sources requiring heat dissipation, such as a CPU and a GPU, and the heat transfer zone 21 includes heat dissipation parts for the heat sources such as the CPU and GPU.
[0039] It should be noted that the above embodiments are merely examples and not exhaustive. Those skilled in the art can set the specific positions and shapes of each component according to the ideas of this application and in combination with actual needs, without exceeding the protection scope of this application.
Claims
1. A thermally conductive plastic heat dissipation assembly, comprising a heat sink and a PCB, characterized in that, The heat sink has a heat dissipation area, and the back of the PCB has a heat transfer area. The area of the heat transfer area covers part or all of the back of the PCB. The circuits and / or electronic components on the PCB are arranged to avoid the heat transfer area. The heat sink is made of thermally conductive plastic with a thermal conductivity of 3~50W / (m·K). The heat sink and the PCB are integrally formed by insert injection molding process, and the heat dissipation area and the heat transfer area are attached together.
2. The thermally conductive plastic heat dissipation assembly according to claim 1, characterized in that, The substrate of the PCB includes an aluminum plate or a ceramic plate.
3. The thermally conductive plastic heat dissipation assembly according to claim 1, characterized in that, It also includes a positioning mechanism, which includes a limiting post on the heat sink and a limiting hole on the PCB that cooperates with it.
4. The thermally conductive plastic heat dissipation assembly according to claim 1, characterized in that, The PCB also has insert fixing holes, which can fix the position of the PCB during the insert injection molding process.
5. The thermally conductive plastic heat dissipation assembly according to claim 1, characterized in that, The radiator is also provided with a fixing mechanism for assembling the radiator.
6. The thermally conductive plastic heat dissipation assembly according to claim 1, characterized in that, The radiator has several fins.
7. The thermally conductive plastic heat dissipation assembly according to claim 1, characterized in that, The area of the heat transfer zone covers part or all of the back side of the PCB.
8. The thermally conductive plastic heat dissipation assembly according to claim 7, characterized in that, When the area of the heat transfer zone covers part of the back of the PCB, the area of the heat dissipation zone on the heat sink can be greater than or equal to the area of the heat transfer zone.
9. A lighting device, characterized in that, The invention includes the thermally conductive plastic heat dissipation assembly according to any one of claims 1 to 8, wherein the PCB is provided with an LED module, and the heat transfer area includes the heat dissipation part of the LED module.
10. An electronic device, characterized in that, Includes the thermally conductive plastic heat dissipation component as described in any one of claims 1 to 8.