Electronic speed controller with laminated circuit board structure
By using a stacked circuit board structure and a design with multiple capacitors arranged in parallel, the high cost problem of electronic speed controllers under high current loads was solved, and the stability and reliability were improved, while the manufacturing difficulty was reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JIUTIAN ZHANYI TECHNOLOGY CO LTD
- Filing Date
- 2025-07-17
- Publication Date
- 2026-07-21
AI Technical Summary
Existing electronic speed controllers require increased copper thickness when subjected to high current loads, resulting in high manufacturing costs and difficulties, as thick copper PCBs are difficult to process.
The circuit board adopts a stacked circuit board structure, including a top layer, an internal power layer, an internal ground layer, an internal signal layer, and a bottom layer. Electrical connections are achieved through metallized vias, and multiple capacitors and MOSFETs are arranged in parallel to rationally allocate the functions of each layer to handle large currents.
It reduces manufacturing costs, improves the stability and reliability of electronic speed controllers, achieves high current load capacity, and enhances power supply stability and precise current control.
Smart Images
Figure CN224538401U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic speed controllers for unmanned aerial vehicles (UAVs), and in particular to an electronic speed controller with a stacked circuit board structure. Background Technology
[0002] An electronic speed controller (ESC), also known as an electronic speed governor, is an electronic control device primarily used to control the speed and direction of an electric motor. It is now widely used in controlling drones. Drones use ESCs to drive their motors to complete various commands, mimicking their real-world operation to achieve a similar effect to real-world conditions.
[0003] To power a drone, the motor needs to consume a considerable amount of power. With a relatively fixed battery voltage, the only way to obtain high power is to increase the current. High current is a necessary condition for providing high power output. Currently, to handle high current, the copper thickness is increased during the fabrication of the electronic speed controller circuit board. However, thick copper foil itself is expensive, and the processing of thick copper PCB boards is also difficult, making the manufacturing cost too high. Utility Model Content
[0004] To address the aforementioned issues, this application provides an electronic speed controller with a stacked circuit board structure.
[0005] This application provides a technical solution using the following approach:
[0006] An electronic speed controller with a stacked circuit board structure includes a stacked circuit board structure, which, from top to bottom, comprises a top layer, a first internal power layer, an internal ground layer, a second internal power layer, an internal signal layer, and a bottom layer. Each layer in the stacked circuit board structure is electrically connected to the others via metallized vias. These vias are created by drilling holes at corresponding locations on each layer and then plating the via walls with metal to allow current conduction and signal transmission between the layers. The top and bottom layers are responsible for transmitting power signals and current acquisition. The first and second internal power layers provide a stable power supply to the circuit board. The internal ground layer serves as shielding and grounding. The internal signal layer is used to transmit control signals and data signals.
[0007] By adopting the above technical solution, when a large current passes through, the stacked circuit board structure diverts the current and rationally allocates the functions of each layer, thus realizing the function of carrying a large current without increasing the copper thickness of the circuit board.
[0008] Preferably, the top layer is provided with multiple capacitors, which are arranged in parallel.
[0009] By adopting the above technical solution and arranging multiple capacitors in parallel, the total capacitance can be increased, improving power supply stability and filtering effect. When there are instantaneous current changes in the circuit, the capacitors can charge and discharge quickly, acting as a buffer and reducing the impact of power fluctuations on other components. This combination of multiple capacitors in parallel enables the electronic speed controller to operate more stably when facing large currents, enhancing its reliability.
[0010] Preferably, the edge of the stacked circuit board structure is provided with twelve pads, and a drive motor is connected to every three pads. The top layer is provided with twenty-four MOSFETs, and every two MOSFETs are connected to one pad.
[0011] By adopting the above technical solution, a drive motor is connected to every three pads via soldered wires. This layout facilitates the connection between the electronic speed controller and the drive motor, allowing current to be smoothly transmitted from the electronic speed controller to the drive motor to provide power. Each pair of MOSFETs is connected to one pad, and they work together to precisely control the current. When the drive motor requires different current levels, the MOSFETs can adjust their conduction state to change the current magnitude, thereby achieving precise drive of the motor.
[0012] Preferably, the underlying layer is provided with four motor drive chips for controlling four drive motors, and each motor drive chip is provided with a corresponding microcontroller control chip.
[0013] By adopting the above technical solution, the motor drive chip is installed in a reserved position on the bottom layer and connected to the bottom layer circuitry via pins. Each motor drive chip is equipped with a corresponding microcontroller control chip. The microcontroller control chip is connected to the motor drive chip via signal lines, sending control commands to the motor drive chip. The motor drive chip then precisely controls the motor according to these commands, achieving adjustment of the motor's speed and direction.
[0014] Preferably, the underlying layer includes a first converter chip and a second converter chip, wherein the first converter chip is connected to the motor drive chip and the second converter chip is connected to the microcontroller control chip.
[0015] By adopting the above technical solution, the voltage converter chip can efficiently convert the input power into a suitable voltage output. The voltage converter chip is installed at the bottom layer near the motor drive chip and the microcontroller control chip, and is connected to them through lines to provide them with a stable operating voltage.
[0016] Preferably, the electronic speed controller includes a motor drive module, a microcontroller control module, and a power management module. The power management module is connected to the motor drive module, the power management module is connected to the microcontroller control module, the motor drive module is connected to the microcontroller module, and the electronic speed controller control module is connected to the microcontroller control module. The microcontroller control module issues commands to the motor drive module, and the motor drive module drives the motor.
[0017] By adopting the above technical solution, the motor drive module is responsible for driving the motor, the microcontroller control module is responsible for issuing control commands, and the power management module is responsible for power supply, monitoring and processing. Together, they constitute the core control system of the electronic speed controller, which improves the performance and stability of the electronic speed controller.
[0018] Preferably, the power management module includes a power conversion circuit, a power acquisition circuit, and a filtering circuit.
[0019] By employing the above technical solution, the power supply conversion circuit converts the input power into a suitable voltage for use by other modules. The power acquisition circuit monitors the power supply's charge level in real time to understand its status. The filtering circuit filters the power supply, removing noise and interference signals to ensure its purity.
[0020] Preferably, the stacked circuit board structure has mounting holes at its four corners, and the mounting holes are oblong holes.
[0021] By adopting the above technical solution, the design of the oblong hole allows for some adjustment space during circuit board installation. The oblong hole allows for the use of screws or other fasteners to install the circuit board in a designated position, facilitating the installation and maintenance of the electronic speed controller.
[0022] In summary, this application includes at least one of the following beneficial technical effects:
[0023] 1. By setting up a stacked circuit board structure, when a large current passes through, the stacked circuit board structure diverts the current. The stacked circuit board structure rationally allocates the functions of each layer, which greatly reduces the manufacturing cost and effectively solves the problem of large current load in electronic speed controllers.
[0024] 2. Each module and component has a clear division of labor and works closely together. For example, the motor drive module, the microcontroller control module, and the power management module work together to optimize the overall performance of the electronic speed controller. Components such as capacitors, MOSFETs, and motor drive chips precisely control current and signal transmission, further improving the stability and reliability of the electronic speed controller. Attached Figure Description
[0025] Figure 1 This is a schematic diagram illustrating the structure of the electronic speed controller's multilayer circuit board in the embodiments of this application.
[0026] Figure 2 This is a schematic diagram illustrating the top-level structure in the embodiments of this application.
[0027] Figure 3 This is a schematic diagram illustrating the underlying structure in the embodiments of this application.
[0028] Figure 4 This is a schematic diagram illustrating the working principle of the electronic speed controller in the embodiments of this application.
[0029] Explanation of reference numerals in the attached diagram: 1. Stacked circuit board structure; 11. Top layer; 111. Capacitor; 112. MOSFET; 12. First internal power layer; 121. Motor driver chip; 122. Microcontroller control chip; 123. First transformer chip; 124. Second transformer chip; 125. Current sensing amplifier; 13. Internal ground layer; 14. Second internal power layer; 15. Internal signal layer; 16. Bottom layer; 2. Pad; 3. Mounting hole. Detailed Implementation
[0030] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.
[0031] This application discloses an electronic speed controller with a stacked circuit board structure, referring to... Figure 1The circuit board includes a stacked circuit board structure 1, which, from top to bottom, comprises a top layer 11, a first internal power layer 12, an internal ground layer 13, a second internal power layer 14, an internal signal layer 15, and a bottom layer 16. Each layer in the stacked circuit board structure 1 is electrically connected. The top layer 11 and the bottom layer 16 are responsible for transmitting power signals and acquiring current. The top layer 11 is the uppermost layer of the circuit board, typically made of copper-clad fiberglass substrate, although a ceramic substrate can also be used. The surface of the top layer 11 is smooth and flat, used to house key components and make some circuit connections. It plays a crucial role in transmitting power signals and acquiring current, accurately delivering power signals to the required locations and precisely acquiring current data. The first internal power layer 12 primarily provides a stable power supply to the entire circuit board. Its copper layer is evenly distributed and has a specific circuit layout to ensure stable power transmission. It can be made of pure copper or a copper alloy. The internal ground layer 13 serves as shielding and grounding, effectively reducing electromagnetic interference and ensuring the stability of the circuit board. It is generally composed of a thick copper layer, but conductive plastic can also be used as a substitute, as long as the grounding and shielding requirements are met. The second internal power layer 14, similar to the first internal power layer 12, also provides power support for the circuit board. The two work together to ensure the reliability of the power supply. The internal signal layer 15 is mainly used to transmit various signals, such as control signals and data signals. Its circuit layout is relatively complex and requires careful planning based on the specific circuit design. The bottom layer 16 is the lowest layer of the circuit board, also using copper-clad glass fiber substrate or copper-clad ceramic substrate. Like the top layer 11, it participates in power signal transmission and current acquisition, and also houses some important control chips. Electrical connections between layers are achieved through metallized vias. Metallized vias are created by drilling holes at corresponding positions on each layer and then plating metal on the hole walls, enabling current conduction and signal transmission between layers. The combination logic of this stacked structure is as follows: the top layer 11 is responsible for the introduction of power signals and the initial current acquisition at the front end; the first internal power layer 12 and the second internal power layer 14 ensure the power supply; the internal ground layer 13 shields interference; the internal signal layer 15 transmits signals; and the bottom layer 16 is responsible for the output of power signals and current acquisition at the back end as well as chip control. They work together and the multiple layers split the current, which improves the circuit board's ability to handle large currents and its overall performance.
[0032] Reference Figure 2 The top layer 11 is equipped with capacitors 111, pads 2 and MOSFETs 112. The capacitors 111 are arranged in parallel on the top layer 11. Twelve pads 2 are arranged on the edge of the stacked circuit board structure 1. A drive motor is connected to every three pads 2. Twenty-four MOSFETs 112 are arranged on the top layer 11. Every two MOSFETs 112 are connected to one pad 2.
[0033] Specifically, capacitor 111 comprises multiple capacitors connected in parallel. Capacitor 111 is typically a multilayer ceramic capacitor, which has advantages such as small size, large capacitance, and good high-frequency characteristics. Capacitor 111 is installed in a designated position on the top layer 11 and connected to the top layer 11 circuitry by soldering. The parallel arrangement of multiple capacitors 111 increases the total capacitance, improving power supply stability and filtering effect. When there are instantaneous current changes in the circuit, capacitor 111 can charge and discharge rapidly, acting as a buffer and reducing the impact of power fluctuations on other components. This parallel combination of multiple capacitors 111 enables the electronic speed controller to operate more stably under high current conditions, enhancing its reliability.
[0034] Specifically, pads 2 include twelve pads positioned along the edge of the multilayer circuit board structure 1. The pads 2 are made of copper and gold-plated to improve conductivity and oxidation resistance. Silver pads 2 can also be used, but their cost is relatively high. The pads 2 are etched onto the edge of the circuit board and are either circular or square. Every three pads 2 are connected to a drive motor via soldered wires. This layout facilitates the connection between the electronic speed controller and the drive motor, allowing current to flow smoothly from the electronic speed controller to the drive motor, providing power to the motor.
[0035] Specifically, the MOSFETs 112 comprise twenty-four MOSFETs 112 disposed on the top layer 11. The MOSFETs 112 are field-effect transistors, specifically any one of the following three models: NTMFS5C410NLT3G, JMSLO40SPG, and CSD1640603, offering advantages such as fast switching speed and low power consumption. The MOSFETs 112 are mounted in a specific area of the top layer 11 and soldered to the top layer 11 circuitry via pins. Every two MOSFETs 112 are connected to a pad 2, working together to precisely control the current. When the drive motor requires different current levels, the MOSFETs 112 can adjust their conduction state to change the current magnitude, thereby achieving precise drive of the motor.
[0036] Reference Figure 3 Four motor drive chips 121 are set on the bottom layer 16 to control the four drive motors. Each motor drive chip 121 is equipped with a microcontroller control chip 122. The first transformer chip 123 and the second transformer chip 124 are set on the bottom layer 16 to supply power to the motor drive chip 121 and the microcontroller control chip 122. The bottom layer 16 is also equipped with a current sensing amplifier 125.
[0037] Specifically, the motor driver chip 121 includes four motor driver chips 121 located on the bottom layer 16. The motor driver chip 121 can be any one of the following three: FD6288Q, EG2134, and U3315, which have advantages such as high integration and strong driving capability. Alternatively, a driver circuit built with discrete components can be used, but the discrete component circuit is larger and less stable. The motor driver chip 121 is installed in a reserved position on the bottom layer 16 and connected to the bottom layer 16 circuitry via pins. Each motor driver chip 121 is associated with a microcontroller control chip 122, which can be any one of the following three chips: EFM8BB21F16G-C-OFN20R, EFM8BB10F8, and STM32F0510. The microcontroller control chip 122 is connected to the motor driver chip 121 via signal lines. It sends control commands to the motor driver chip 121, and the motor driver chip 121 precisely controls the motor according to the commands, achieving speed and direction adjustment.
[0038] The first voltage converter chip 123 and the second voltage converter chip 124 are installed on the bottom layer 16 near the motor driver chip 121 and the microcontroller control chip 122, and are connected to them by circuitry to provide them with a stable operating voltage. The second voltage converter chip 124, model AP2210K-3.3TRG1, is connected to the microcontroller control chip 122, while the first voltage converter chip 123, model JW5026, is connected to the motor driver chip 121, precisely adjusting the output voltage to ensure the normal operation of the chips.
[0039] Reference Figure 2 and Figure 3 The electronic speed controller circuit board is equipped with a control interface for connection to the flight controller. Specifically, VIN / GND: power input positive and negative terminals, connected to power sources such as lithium batteries; control signal interface: PWM_S1-PWM_S4: 4-channel PWM signal input, which respectively control the 4 groups of MOSFETs 112 of the H-bridge to realize speed and steering control; ADC_CUR: current detection signal input, connected to the current sensing amplifier 125 for real-time current monitoring.
[0040] Reference Figure 2 and Figure 3 Mounting holes 3 are located at the four corners of the stacked circuit board structure 1 and are oblong in shape. These mounting holes 3 are created at the four corners of the circuit board using mechanical drilling or laser drilling. The oblong shape allows for some adjustment during installation, accommodating mounting holes for drones with diameters ranging from 30.5 to 35 mm. Through these oblong holes, screws or other fasteners can be used to install the circuit board in designated positions, facilitating the installation and maintenance of the electronic speed controller.
[0041] Reference Figure 4The power management module is connected to the motor drive module, the power management module is connected to the microcontroller control module, the motor drive module is connected to the microcontroller module, the electronic speed controller control module is connected to the microcontroller control module, the microcontroller control module issues commands to the motor drive module, and the motor drive module drives the motor. The power management module includes a power supply conversion circuit, a power acquisition circuit, and a filtering circuit.
[0042] Specifically, the motor drive module includes a series of circuits and components for driving the motor. The motor drive module consists of components such as MOSFET 112 and motor drive chip 121. These components work together to drive the motor according to instructions issued by the microcontroller control module. It converts the electrical energy provided by the power supply into the power required to drive the motor, enabling different operating states. The microcontroller control module consists of microcontroller control chip 122 and related circuits. It receives external control signals, processes them, and then issues corresponding instructions to the motor drive module to precisely control the motor's operation. The power management module includes a power supply conversion circuit, a power acquisition circuit, and a filtering circuit. The power supply conversion circuit converts the input power into a suitable voltage for use by other modules; it can be implemented using a switching power supply chip or a linear regulator. The power acquisition circuit monitors the power supply in real time to understand the power supply status. The filtering circuit filters the power supply, removing noise and interference signals to ensure power purity. These three modules are interconnected and work together. The motor drive module is responsible for driving the motor, the microcontroller control module is responsible for issuing control commands, and the power management module is responsible for power supply, monitoring and processing. Together, they constitute the core control system of the electronic speed controller, which improves the performance and stability of the electronic speed controller.
[0043] The implementation principle of this embodiment is as follows: This embodiment utilizes a unique stacked circuit board structure 1 to rationally allocate the functions of each layer, avoiding the high cost problem caused by increasing copper thickness in traditional methods. Each layer works together to efficiently carry high current. Simultaneously, each module and component has a clear division of labor and works closely together. For example, the motor drive module, microcontroller control module, and power management module work together to optimize the overall performance of the electronic speed controller. Components such as capacitor 111, MOSFET 112, and motor drive chip 121 precisely control current and signal transmission, further improving the stability and reliability of the electronic speed controller. Moreover, the oblong hole design facilitates the installation and maintenance of the electronic speed controller, significantly reducing manufacturing costs compared to existing technologies and effectively solving the problem of high-current loads in electronic speed controllers.
[0044] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. An electronic speed controller with a stacked circuit board structure, characterized in that: The electronic speed controller includes a stacked circuit board structure (1). The stacked circuit board structure (1) includes, from top to bottom, a top layer (11), a first internal power layer (12), an internal ground layer (13), a second internal power layer (14), an internal signal layer (15), and a bottom layer (16). Each layer in the stacked circuit board structure (1) is electrically connected to the others. The layers are electrically connected through metallized vias. The metallized vias are drilled at corresponding positions on each layer and then metal is plated on the hole walls to enable current conduction and signal transmission between the layers. The top layer (11) and the bottom layer (16) are responsible for transmitting power signals and current acquisition. The first internal power layer (12) and the second internal power layer (14) provide a stable power supply for the circuit board. The internal ground layer (13) serves as shielding and grounding. The internal signal layer (15) is used to transmit control signals and data signals.
2. An electronic speed controller according to claim 1, wherein: The top layer (11) is provided with multiple capacitors (111), which are arranged in parallel.
3. An electronic speed controller as claimed in claim 1, wherein: The edge of the stacked circuit board structure (1) is provided with twelve pads (2), and a drive motor is connected to every three pads (2). The top layer (11) is provided with twenty-four MOS transistors (112), and every two MOS transistors (112) are connected to one pad (2).
4. An electronic speed controller as claimed in claim 1, wherein: The bottom layer (16) is provided with four motor drive chips (121) for controlling four drive motors, and each motor drive chip (121) is provided with a microcontroller control chip (122).
5. An electronic speed controller according to claim 4, characterized in that: The bottom layer (16) is provided with a first voltage converter chip (123) and a second voltage converter chip (124). The first voltage converter chip (123) is connected to the motor drive chip (121), and the second voltage converter chip (124) is connected to the microcontroller control chip (122).
6. An electronic speed controller as defined in claim 1, wherein: The electronic speed controller includes a motor drive module, a microcontroller control module, and a power management module. The power management module is connected to the motor drive module, the power management module is connected to the microcontroller control module, the motor drive module is connected to the microcontroller module, and the electronic speed controller control module is connected to the microcontroller control module. The microcontroller control module issues commands to the motor drive module, and the motor drive module drives the motor.
7. An electronic speed controller according to claim 6, wherein: The power management module includes a power conversion circuit, a power acquisition circuit, and a filtering circuit.
8. An electronic speed controller as defined in claim 1, wherein: The stacked circuit board structure (1) has mounting holes (3) at its four corners, and the mounting holes (3) are oblong holes.