A long service life soft wiring board for new energy vehicles
By setting multiple protective layers on the outside of flexible circuit boards used in new energy vehicles, including heat dissipation, shielding, insulation and protective layers, the reliability and safety issues of circuit boards in complex environments are solved, and the service life is significantly extended.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN HUANGJIANG DASHUN ELECTRONICS
- Filing Date
- 2025-07-25
- Publication Date
- 2026-07-21
Smart Images
Figure CN224538403U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of automotive flexible circuit board equipment, specifically a flexible circuit board for new energy vehicles with a long service life. Background Technology
[0002] Flexible printed circuit boards (FPCs) play a crucial role in new energy vehicles. Due to their flexibility, bendability, thinness, and other characteristics, they are widely used in battery management systems, motor controllers, and vehicle electronic devices to realize signal transmission and power connection. Their long life, high temperature resistance, and vibration resistance directly affect the reliability and safety of new energy vehicles, making them an indispensable component of the electronic systems of new energy vehicles.
[0003] A search revealed Chinese patent application CN202011179033.9, which discloses a thin and light flexible circuit board. The board comprises, from top to bottom, an upper PET layer, an upper circuit layer, an upper insulating UV layer, an upper jumper, an upper waterproof adhesive layer, a middle partition layer, a lower waterproof adhesive layer, a lower jumper, a lower insulating UV layer, a lower circuit layer, and a lower PET layer. The upper PET layer has a thickness of 0.05-0.06 mm, the lower PET layer has a thickness of 0.05-0.06 mm, the middle partition layer has a thickness of 0.025-0.038 mm, and the total thickness of the flexible circuit board is 0.15-0.22 mm. The upper waterproof adhesive layer completely covers the upper circuit layer, the upper insulating UV layer, and the upper jumper. The lower waterproof adhesive layer completely covers the lower circuit layer, the lower insulating UV layer, and the lower jumper. An air venting groove is printed on either the upper or lower waterproof adhesive layer.
[0004] The above-mentioned technical solutions and traditional flexible circuit boards still have shortcomings when applied to new energy vehicles. The working environment of new energy vehicles is relatively complex, with various adverse factors such as high temperature and electromagnetic interference. These factors will seriously affect the performance and service life of flexible circuit boards. Circuit boards are prone to problems such as wire breakage, insulation layer damage, and unstable signal transmission, which can lead to failure of automotive electronic systems, affecting driving safety and normal vehicle use.
[0005] Therefore, developing a flexible circuit board for new energy vehicles with a long service life is of great practical significance. Summary of the Invention
[0006] The purpose of this utility model is to provide a flexible circuit board for new energy vehicles with a long service life. By setting a protective sleeve on the outside of the main body, the protective sleeve includes a heat dissipation layer, a shielding layer, an insulation layer and a protective layer from the inside out. Each layer of material has good performance and can effectively resist the adverse effects of high temperature, high humidity, electromagnetic interference and other adverse factors, which greatly extends the service life of the flexible circuit board and solves the problems mentioned in the background art.
[0007] To achieve the above objectives, this utility model provides the following technical solution:
[0008] A long-life flexible circuit board for new energy vehicles, comprising:
[0009] The body of the flexible circuit board has connectors at both ends, and gold fingers are provided at the ends of the connectors;
[0010] A protective structure is disposed outside the main body. The protective structure includes a protective sleeve that surrounds the main body. The protective sleeve includes, from the inside out, a heat dissipation layer, a shielding layer, an insulation layer, and a protective layer.
[0011] Preferably, the body includes a substrate layer and a copper foil layer for conductive circuits. The substrate layer uses a high-strength, high-temperature resistant polyimide film as the base material, and the thickness of the substrate layer is 25-50 μm.
[0012] Preferably, the surface of the substrate layer is formed with conductive lines by chemical copper plating and electroplating. The copper foil layer of the conductive lines has a thickness of 12-35 μm. In order to improve the corrosion resistance and conductivity of the conductive line layer, a nickel-gold alloy layer with a thickness of 0.5-2 μm is also plated on the surface of the copper foil layer.
[0013] Preferably, an adhesive layer is provided between the main body and the protective sleeve, as well as between the heat dissipation layer, shielding layer, insulating layer and protective layer of the protective sleeve. The adhesive layer is an organosilicon potting compound.
[0014] Preferably, the heat dissipation layer is a graphene heat dissipation film with a thickness of 5-10 μm, and micropores are distributed on the heat dissipation layer to assist heat dissipation.
[0015] Preferably, the shielding layer is made of copper foil with a thickness of 18 μm and the surface is electroplated with nickel-gold.
[0016] Preferably, the insulating layer is a modified polyester insulating layer with a thickness of 15-30 μm.
[0017] Preferably, the protective layer is a polyurethane protective layer with a thickness of 5-15 μm.
[0018] Compared with the prior art, the beneficial effects of this utility model are:
[0019] This invention features a protective sleeve on the outside of the main body. The protective sleeve consists of a heat dissipation layer, a shielding layer, an insulation layer, and a protective layer from the inside out. Each layer is made of materials with excellent performance, which can effectively resist the adverse effects of high temperature, high humidity, electromagnetic interference, etc., and greatly extend the service life of the flexible circuit board. Attached Figure Description
[0020] Figure 1This is a schematic diagram of the structure of this utility model;
[0021] Figure 2 This is a schematic diagram of the structure of the main body of this utility model;
[0022] Figure 3 This is a schematic diagram of the structure of the protective sleeve of this utility model.
[0023] In the diagram: 1. Body; 101. Substrate layer; 102. Copper foil layer;
[0024] 2. Connector; 3. Gold fingers; 4. Protective sleeve; 401. Heat dissipation layer; 402. Shielding layer; 403. Insulation layer; 404. Protective layer;
[0025] 5. S-shaped structure; 6. Micropores. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] Please see Figure 1-3 This utility model provides a technical solution:
[0028] A long-life flexible circuit board for new energy vehicles, comprising:
[0029] The flexible circuit board has a body 1, with connectors 2 at both ends and gold fingers 3 at the ends of the connectors 2; the body 1 includes a substrate layer 101 and a copper foil layer 102 for conductive lines.
[0030] The protective structure is located outside the main body 1. The protective structure includes a protective sleeve 4, which surrounds the main body 1. The protective sleeve 4 includes, from the inside out, a heat dissipation layer 401, a shielding layer 402, an insulating layer 403, and a protective layer 404.
[0031] Through the above technical solution, each layer of material has good performance and can effectively resist the adverse effects of high temperature, high humidity, vibration, electromagnetic interference and other adverse factors, which greatly extends the service life of flexible circuit boards.
[0032] For a preferred embodiment, please refer to Figure 3 The substrate layer 101 uses a high-strength, high-temperature resistant polyimide film as the base material, and the thickness of the substrate layer 101 is 25-50μm.
[0033] High-strength, high-temperature resistant polyimide (PI) film is used as the base material, which has excellent mechanical properties, thermal stability and chemical stability. It can maintain good physical properties in high-temperature environments and is not easy to deform or age, providing a solid foundation for flexible circuit boards.
[0034] For a preferred embodiment, please refer to Figure 3 The substrate layer 101 has conductive circuits formed on its surface by chemical copper plating and electroplating. The copper foil layer 102 of the conductive circuit has a thickness of 12-35μm. In order to improve the corrosion resistance and conductivity of the conductive circuit layer, a nickel-gold alloy layer with a thickness of 0.5-2μm is also plated on the surface of the copper foil layer 102.
[0035] By adding a nickel-gold alloy layer, which has excellent anti-oxidation and corrosion resistance, the copper foil can be effectively prevented from being oxidized and corroded, thus extending the service life of the conductive circuit layer.
[0036] In addition, the conductive line is equipped with an S-shaped structure 5 in the bending section, which adopts S-shaped routing with a curvature radius ≥3mm. The line width is increased by 20% in the bending section to reduce mechanical stress concentration. When the FPC bends, the stress is distributed to a longer line path through a smooth curve transition, thereby reducing the maximum stress.
[0037] For a preferred embodiment, please refer to Figure 3 An adhesive layer is provided between the main body 1 and the protective sleeve 4, as well as between the heat dissipation layer 401, the shielding layer 402, the insulating layer 403 and the protective layer 404 of the protective sleeve 4. The adhesive layer is an organosilicon potting compound.
[0038] This silicone potting compound offers strong anti-aging properties, excellent weather resistance, and superior impact resistance. It is non-corrosive to electronic components and produces no byproducts during curing. It can be cured at room temperature or with heat, exhibits good self-defoaming properties, and is easy to use. It has low curing shrinkage, excellent waterproof and shock-resistant performance, and excellent resistance to thermal changes. It can be used over a wide operating temperature range, maintaining elasticity and preventing cracking within a temperature range of -60℃ to 200℃. It possesses excellent electrical properties and insulation capabilities, effectively improving the insulation between internal components and circuits after potting, thus enhancing the stability of electronic components. It also has excellent thermal conductivity and flame retardancy, effectively improving the heat dissipation capacity and safety factor of electronic components. Its low viscosity and good fluidity allow it to penetrate into tiny gaps and under components.
[0039] For a preferred embodiment, please refer to Figure 3 The heat dissipation layer 401 is a graphene heat dissipation film with a thickness of 5-10 μm. Micropores 6 are distributed on the heat dissipation layer 401 to assist in heat dissipation.
[0040] Graphene film has extremely strong thermal conductivity in the planar direction, which can quickly diffuse the heat from point heat sources (such as chips) into surface heat dissipation, effectively reducing thermal resistance; and the surface resistance of graphene film is ≤10Ω / sq, and the shielding effectiveness against high-frequency electromagnetic interference (EMI) above 1GHz can reach 40-50dB, forming a double shielding structure with the shielding layer 402.
[0041] The graphene film exhibits stable performance within a temperature range of -200℃ to 600℃, with a thermal expansion coefficient of only 1×10^-6 / ℃ (approximately 1 / 17 that of copper), thus preventing detachment from the substrate at high temperatures.
[0042] For a preferred embodiment, please refer to Figure 3 The shielding layer 402 is made of copper foil with a thickness of 18μm and is plated with nickel gold.
[0043] The above technical solutions can effectively attenuate electromagnetic interference, thereby effectively preventing signal interference and improving the stability of flexible circuit boards.
[0044] For a preferred embodiment, please refer to Figure 3 The insulating layer 403 is a modified polyester insulating layer 403 with a thickness of 15-30μm.
[0045] The modified polyester insulation layer 403 is made by adding nano-silica and flame retardant to polyester resin. The addition of nano-silica can improve the mechanical strength and wear resistance of the insulation layer 403, while the addition of flame retardant gives the insulation layer 403 good flame retardant properties, which can effectively prevent the spread of flames in high temperature or fire conditions, and ensure the safe use of flexible circuit boards.
[0046] For a preferred embodiment, please refer to Figure 3 The protective layer 404 is set as a polyurethane protective layer 404, and the thickness of the protective layer 404 is 5-15μm.
[0047] The 404 polyurethane protective layer has excellent waterproof, moisture-proof, oil-proof and chemical corrosion-resistant properties, which can effectively protect flexible circuit boards from external environmental erosion and further improve the service life of flexible circuit boards.
[0048] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. A flexible circuit board for new energy vehicles with a long service life, characterized in that, include: The body (1) of the flexible circuit board has connectors (2) at both ends and gold fingers (3) at the ends of the connectors (2). The protective structure is located outside the main body (1). The protective structure includes a protective sleeve (4), which surrounds the main body (1). The protective sleeve (4) includes a heat dissipation layer (401), a shielding layer (402), an insulation layer (403), and a protective layer (404) from the inside to the outside.
2. The flexible circuit board for new energy vehicles with a long service life according to claim 1, characterized in that: The body (1) includes a substrate layer (101) and a copper foil layer (102) for conductive lines. The substrate layer (101) uses a high-strength, high-temperature resistant polyimide film as the base material, and the thickness of the substrate layer (101) is 25-50 μm.
3. The flexible circuit board for new energy vehicles with a long service life according to claim 2, characterized in that: The substrate layer (101) has a conductive circuit formed on its surface by chemical copper plating and electroplating. The copper foil layer (102) of the conductive circuit has a thickness of 12-35μm. In order to improve the corrosion resistance and conductivity of the conductive circuit layer, a nickel-gold alloy layer with a thickness of 0.5-2μm is also plated on the surface of the copper foil layer (102).
4. The flexible circuit board for new energy vehicles with a long service life according to claim 1, characterized in that: An adhesive layer is provided between the main body (1) and the protective sleeve (4), and between the heat dissipation layer (401), shielding layer (402), insulation layer (403) and protective layer (404) of the protective sleeve (4). The adhesive layer is an organosilicon potting compound.
5. The flexible circuit board for new energy vehicles with a long service life according to claim 1, characterized in that: The heat dissipation layer (401) is a graphene heat dissipation film with a thickness of 5-10 μm. Micropores (6) are distributed on the heat dissipation layer (401) to assist in heat dissipation.
6. The flexible circuit board for new energy vehicles with a long service life according to claim 1, characterized in that: The shielding layer (402) is made of copper foil with a thickness of 18μm and is electroplated with nickel gold.
7. A flexible circuit board for new energy vehicles with a long service life according to claim 1, characterized in that: The insulating layer (403) is a modified polyester insulating layer (403) with a thickness of 15-30 μm.
8. A flexible circuit board for new energy vehicles with a long service life according to claim 1, characterized in that: The protective layer (404) is configured as a polyurethane protective layer (404) with a thickness of 5-15 μm.