Charging module assembly structure and vehicle-mounted power supply

Abstract

The application provides a charging module assembly structure and a vehicle-mounted power supply, and belongs to the technical field of vehicle-mounted power supplies, and comprises a circuit board, a ceramic gasket and a water-cooled plate, and further comprises a positioning plate; the positioning plate is located between the circuit board and the water-cooled plate, and a positioning hole for mounting the ceramic gasket is formed in the positioning plate. The charging module assembly structure provided by the application sets the positioning plate between the circuit board and the water-cooled plate, the positioning hole is formed in the positioning plate, the outer contour of the positioning hole matches the outer contour of the ceramic gasket, and the thickness dimension of the positioning plate is the same as the thickness dimension of the ceramic gasket. When assembling, the ceramic gasket is placed in the positioning hole, so that the ceramic gasket is effectively prevented from rotating with the screw, and the assembly efficiency and assembly quality are improved.

Description

Technical Field

[0001] This application belongs to the field of vehicle power supply technology, and more specifically, relates to a charging module assembly structure and a vehicle power supply using the charging module assembly structure. Background Technology

[0002] The vehicle's battery can be charged via the vehicle's onboard power supply. The charging module converts AC power from the grid into DC power, directly providing input energy to the onboard power supply; its power directly affects the charging speed. Existing charging modules consist of a circuit board, ceramic pads, and a water-cooling plate arranged sequentially from top to bottom. The circuit board and ceramic pads are fixed to the water-cooling plate with screws. To reduce the number of components, each ceramic pad is fixed with only one screw. Therefore, the ceramic pads rotate during screw tightening, affecting assembly efficiency and quality. Utility Model Content

[0003] The purpose of this application is to provide a charging module assembly structure that aims to solve the problem that in the assembly process of existing charging modules, the ceramic gasket rotates with the screw, affecting assembly efficiency and quality.

[0004] To achieve the above objectives, the technical solution adopted in this application is: to provide a charging module assembly structure, including: a circuit board, a ceramic pad and a water-cooled plate, characterized in that it further includes a positioning plate; the positioning plate is located between the circuit board and the water-cooled plate, and the positioning plate has positioning holes for installing the ceramic pad.

[0005] In one possible implementation, a charging module assembly structure further includes a heat-conducting plate located between the positioning plate and the water-cooling plate.

[0006] In one possible implementation, a charging module assembly structure further includes a silicone pad located between the heat-conducting plate and the water-cooling plate.

[0007] In one possible implementation, the circuit board has a first mounting hole for mounting screws, the ceramic gasket has a second mounting hole corresponding to the first mounting hole, and the heat-conducting plate has a third mounting hole corresponding to the second mounting hole.

[0008] In one possible implementation, the positioning plate is provided with a protrusion that penetrates the heat-conducting plate, and the protrusion has a fourth mounting hole for mounting screws.

[0009] In one possible implementation, the heat-conducting plate has a socket adapted to the protrusion.

[0010] In one possible implementation, the silicone pad is bonded to the water-cooling plate with adhesive.

[0011] In one possible implementation, the positioning plate is made of plastic.

[0012] In one possible implementation, a stop is provided on the side wall of the positioning hole.

[0013] Compared with the prior art, the solution shown in this application's embodiment provides a charging module assembly structure in which a positioning plate is provided between the circuit board and the water-cooling plate. The positioning plate has positioning holes whose outer contours match the outer contours of the ceramic gaskets, and the thickness of the positioning plate is the same as the thickness of the ceramic gaskets. During assembly, the ceramic gaskets are placed inside the positioning holes, effectively preventing them from rotating with the screws, thus improving assembly efficiency and quality.

[0014] Another objective of this application is to provide an on-board power supply, which includes any of the charging module assembly structures described above.

[0015] Compared with the prior art, the charging module assembly structure of the vehicle power supply in this application has a positioning plate between the circuit board and the water-cooling plate. The positioning plate has positioning holes whose outer contours match the outer contours of the ceramic gaskets. The thickness of the positioning plate is the same as the thickness of the ceramic gaskets. During assembly, the ceramic gaskets are placed inside the positioning holes, effectively preventing them from rotating with the screws, thus improving assembly efficiency and quality. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 An exploded view of a charging module assembly structure provided in an embodiment of this application;

[0018] Figure 2 The three-dimensional positioning plate provided in the embodiments of this application Figure 1 ;

[0019] Figure 3 The three-dimensional positioning plate provided in the embodiments of this application Figure 2 .

[0020] In the diagram: 101, circuit board; 102, ceramic gasket; 103, water-cooled plate; 104, positioning plate; 105, positioning hole; 106, heat-conducting plate; 107, silicone pad; 108, first mounting hole; 109, second mounting hole; 110, third mounting hole; 111, protrusion; 112, fourth mounting hole; 113, insertion hole; 114, stop block. Detailed Implementation

[0021] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0022] Please refer to the following: Figures 1 to 3 The present application provides a charging module assembly structure. The charging module assembly structure includes: a circuit board 101, a ceramic pad 102, and a water-cooled plate 103, and also includes a positioning plate 104; the positioning plate 104 is located between the circuit board 101 and the water-cooled plate 103, and the positioning plate 104 has positioning holes 105 for mounting the ceramic pad 102.

[0023] This embodiment provides a charging module assembly structure. Compared with the prior art, a positioning plate 104 is provided between the circuit board 101 and the water-cooling plate 103. The positioning plate 104 has a positioning hole 105, the outer contour of which matches the outer contour of the ceramic pad 102. The thickness of the positioning plate 104 is the same as the thickness of the ceramic pad 102. During assembly, the ceramic pad 102 is placed in the positioning hole 105, thereby effectively preventing the ceramic pad 102 from rotating with the screw, improving assembly efficiency and assembly quality.

[0024] In this embodiment, there are two positioning holes 105, arranged side by side at both ends of the positioning plate 104 along its length. To further improve the fixing effect of the positioning plate 104 on the ceramic pad 102, the inner wall of the positioning hole 105 is provided with anti-slip texture. These anti-slip textures can increase the friction between the ceramic pad 102 and the positioning hole 105, ensuring that the ceramic pad 102 is firmly placed in the positioning hole 105 even under certain external vibration, preventing it from shifting.

[0025] Meanwhile, considering the need for heat dissipation, the positioning plate 104 is made of a material with high thermal conductivity. This material not only ensures that the positioning plate 104 itself has good structural strength, but also can quickly transfer the heat generated by the circuit board 101 to the water-cooled plate 103, thereby improving the heat dissipation efficiency of the entire charging module.

[0026] Furthermore, the positioning plate 104 is provided with several weight-reduction holes. These weight-reduction holes effectively reduce the weight of the positioning plate 104 without affecting its structural strength and main functions, thereby reducing the weight of the entire charging module assembly structure and improving the portability and installation flexibility of the charging module in practical applications.

[0027] In some embodiments, please refer to Figure 1 A charging module assembly structure also includes a heat-conducting plate 106, which is located between the positioning plate 104 and the water-cooling plate 103. In this embodiment, the heat-conducting plate 106 is made of metal and is installed between the positioning plate 104 and the water-cooling plate 103. The outer contour of the heat-conducting plate 106 matches the outer contour of the positioning plate 104. The heat-conducting plate 106 can quickly conduct heat from the circuit board 101 to the water-cooling plate 103, thereby improving the heat dissipation effect of the circuit board 101.

[0028] To further enhance the thermal conductivity of the heat-conducting plate 106, a layer of high thermal conductivity silicone grease is applied to the contact surfaces between the heat-conducting plate 106 and the positioning plate 104. This silicone grease fills the tiny gaps between the contact surfaces, reducing thermal resistance and allowing heat to be transferred more smoothly from the circuit board 101 through the positioning plate 104 to the heat-conducting plate 106, and then from the heat-conducting plate 106 to the water-cooling plate 103. Furthermore, to improve the heat dissipation efficiency of the water-cooling plate 103, dense coolant channels are provided inside the water-cooling plate 103. The coolant circulates within these channels, continuously carrying away the heat transferred from the heat-conducting plate 106. The coolant circulation is achieved by a small water pump, which draws coolant from one end of the water-cooling plate 103, allows it to absorb heat through the channels, and then discharges it from the other end into an external heat dissipation device for cooling. The cooled coolant then flows back into the water-cooling plate 103, creating a highly efficient heat dissipation system. Furthermore, numerous tiny protrusions and grooves are provided on the inner wall of the coolant channel. These structures increase the contact area between the coolant and the inner wall of the water-cooled plate 103, further improving heat exchange efficiency and thus better ensuring the heat dissipation effect of the circuit board 101 and extending the service life of the circuit board 101.

[0029] In some embodiments, please refer to Figure 1 A charging module assembly structure also includes a silicone pad 107, which is located between the heat-conducting plate 106 and the water-cooling plate 103. In this embodiment, the silicone pad 107 (also known as a silicone rubber pad) is a multifunctional industrial accessory made of silicone rubber as the base material, possessing properties such as temperature resistance, insulation, and flexibility. The silicone pad 107 is used to fill the gap between the heat-conducting plate 106 and the water-cooling plate 103, while also serving as a shock absorber and insulator.

[0030] Due to the excellent temperature resistance of the silicone pad 107, it can maintain stable performance in the high-temperature environment generated during the operation of the charging module, and will not deform or be damaged due to temperature rise, ensuring the continuity of its gap filling, shock absorption, and insulation functions. Its insulation properties are also extremely critical, effectively preventing current conduction between the heat-conducting plate 106 and the water-cooling plate 103, avoiding electrical faults, and improving the safety of the charging module assembly structure.

[0031] During assembly, the flexibility of the silicone pad 107 allows it to adapt well to the unevenness of the surfaces of the heat-conducting plate 106 and the water-cooling plate 103, fitting tightly between them. Even after prolonged use, due to equipment vibration or slight displacement, the silicone pad 107 maintains good filling and will not loosen or fall off.

[0032] To further improve the performance of the charging module assembly structure, the silicone pad 107 can be optimized. For example, a special coating can be added to the surface of the silicone pad 107 to enhance its thermal conductivity. This allows the heat generated by the charging module to be transferred to the water-cooling plate 103 more efficiently through the heat-conducting plate 106, thereby improving heat dissipation efficiency.

[0033] In some embodiments, please refer to Figure 1 The circuit board 101 has a first mounting hole 108 for mounting screws, the ceramic gasket 102 has a second mounting hole 109 corresponding to the first mounting hole 108, and the heat-conducting plate 106 has a third mounting hole 110 corresponding to the second mounting hole 109. In this embodiment, the screw passes through the first mounting hole 108, the second mounting hole 109, and the third mounting hole 110 sequentially from top to bottom, thereby fixing the circuit board 101, the ceramic gasket 102, and the heat-conducting plate 106 together. The third mounting hole 110 is a threaded hole, and the first mounting hole 108 and the second mounting hole 109 can be threaded holes or threaded through holes.

[0034] When the first mounting hole 108 and the second mounting hole 109 are threaded through holes, the screw passes through them and engages with the thread of the third mounting hole 110, achieving a tight connection. During installation, it is necessary to ensure that all mounting holes are accurately aligned to avoid installation difficulties or affecting the stability of the connection due to positional deviations. If the first mounting hole 108 and the second mounting hole 109 are also threaded holes, the screw's engagement with the threads of all three will be even stronger, further enhancing the connection strength between the circuit board 101, the ceramic gasket 102, and the heat-conducting plate 106. Simultaneously, to ensure good thermal conductivity, after installation, it is necessary to check whether the ceramic gasket 102 is flat and fitted to prevent gaps from affecting heat transfer. Furthermore, for circuit boards 101, ceramic gaskets 102, and heat-conducting plates 106 of different specifications, screws of appropriate size and type should be selected to ensure the reliability and safety of the installation. For example, for larger components, thicker and longer screws are needed to ensure sufficient connection force; while for smaller components, appropriately sized screws should be selected to avoid damaging the components due to oversized screws. In actual production, the installed components will undergo strict quality testing, including checking the tightness of the screws, the connection stability of each component, and the thermal conductivity. Only when all indicators meet the requirements can the components be put into use.

[0035] In some embodiments, please refer to Figures 1 to 3 The positioning plate 104 has a protrusion 111 that penetrates the heat-conducting plate 106. A fourth mounting hole 112 for mounting screws is provided on the protrusion 111. In this embodiment, the protrusion 111 is cylindrical and vertically oriented. The protrusion 111 extends downwards through the entire heat-conducting plate 106. The fourth mounting hole 112 is located at the center of the protrusion 111, and the screw passes through the fourth mounting hole 112 to be fixedly connected to the water-cooling plate 103. A clearance hole corresponding to the fourth mounting hole 112 is provided on the circuit board 101 to allow the screw to pass through. Since the screw is made of metal, a protrusion 111 is provided between the screw and the heat-conducting plate 106 to prevent electrical conduction between the heat-conducting plate 106 and the water-cooling plate 103. The protrusion 111 effectively separates the screw from the heat-conducting plate 106. The protrusion 111 is made of insulating material. There are multiple protrusions 111, which are evenly arranged along the outer circumference of the positioning plate 104.

[0036] This design makes the connection between the positioning plate 104, the heat-conducting plate 106, and the water-cooling plate 103 more stable and effectively ensures the safety of the circuit. Multiple evenly distributed protrusions 111 not only evenly distribute the stress generated during screw connection, preventing excessive local stress from damaging components, but also enhance the positioning accuracy between the positioning plate 104 and the heat-conducting plate 106 to a certain extent. During installation, the operator only needs to accurately place the positioning plate 104 on the heat-conducting plate 106, ensuring that each protrusion 111 accurately penetrates the corresponding position of the heat-conducting plate 106, and then screw it into the water-cooling plate 103 through the fourth mounting hole 112. Meanwhile, the clearance holes on the circuit board 101 also facilitate the entire installation process, making the installation operation smoother. Moreover, because the protrusions 111 are made of insulating material, even in complex electrical environments, they can reliably prevent electrical conduction between the heat-conducting plate 106 and the water-cooling plate 103 through the screws, further improving the stability and reliability of the entire device.

[0037] In some embodiments, please refer to Figure 1 The heat-conducting plate 106 has insertion holes 113 that are adapted to the protrusions 111. In this embodiment, the insertion holes 113 are circular holes, and their diameter matches the outer diameter of the protrusions 111. The protrusions 111 and the insertion holes 113 are in clearance fit, which reduces the resistance of the protrusions 111 when inserted into the insertion holes 113, and at the same time achieves the installation accuracy between the positioning plate 104 and the heat-conducting plate 106. The protrusions 111 act as positioning pins, and multiple protrusions 111 are used to accurately position the heat-conducting plate 106, the positioning plate 104, and the water-cooling plate 103. The protrusions 111 pass through the pre-drilled insertion holes 113 on the heat-conducting plate 106, which not only ensures the accuracy of the installation position of the heat-conducting plate 106, but also prevents the heat-conducting plate 106 from shifting during use.

[0038] In some embodiments, the silicone pad 107 is bonded to the water-cooling plate 103 with adhesive. In this embodiment, the silicone pad 107 is bonded to the top surface of the water-cooling plate 103 using adhesive backing. The outer contour of the silicone pad 107 is larger than the outer contour of the heat-conducting plate 106. The adhesive bonding method used for the silicone pad 107 simplifies the structure, reduces the number of parts, and improves assembly efficiency. The silicone pad 107 is made of silicone.

[0039] This bonding method also provides excellent sealing, effectively preventing coolant leakage and ensuring the stable operation of the water-cooling system. Furthermore, by reducing the number of connection points between components, the risk of malfunctions due to loose connections is lowered, improving the overall reliability of the device. In addition, during subsequent maintenance, if the silicone pad 107 needs to be replaced, simply peel the old silicone pad 107 carefully from the water-cooling plate 103 and then attach the new silicone pad 107. The operation is simple and quick, greatly reducing maintenance costs and time.

[0040] In some embodiments, the positioning plate 104 is made of plastic. In this embodiment, the positioning plate 104 is made of plastic, and the protrusion 111 and the positioning plate 104 are integrally manufactured using an injection molding process. Because plastic has good insulation properties, it can ensure the insulation between the heat-conducting plate 106 and the water-cooling plate 103.

[0041] Furthermore, the lightweight nature of plastic material reduces the overall weight of the component, offering a significant advantage in applications with stringent weight requirements. Simultaneously, plastic exhibits good corrosion resistance, allowing it to operate in acidic or alkaline environments without easily corroding, extending the service life of the positioning plate 104. Moreover, the integrated injection molding process for the protrusion 111 and positioning plate 104 ensures high production efficiency, enabling large-scale, rapid production and reducing costs. During installation, the relatively flexible plastic positioning plate 104 is less likely to scratch the heat-conducting plate 106 and water-cooling plate 103, providing better protection for other components. This integrated manufacturing method also ensures the stability of the connection between the protrusion 111 and positioning plate 104, preventing the protrusion 111 from easily detaching during long-term use, thus guaranteeing accurate and reliable positioning.

[0042] In some embodiments, please refer to Figures 1 to 3 A stop 114 is provided on the side wall of the positioning hole 105. In this embodiment, there are multiple ceramic gaskets 102, so four ceramic gaskets 102 need to be installed simultaneously in one positioning hole 105. To avoid mutual interference between adjacent ceramic gaskets 102, a stop 114 is provided on the side wall of the positioning hole 105. The positioning hole 105 is a rectangular hole, and the stop 114 is located on the two long sides of the positioning hole 105. The stop 114 limits the ceramic gaskets 102, thereby separating adjacent ceramic gaskets 102.

[0043] After installation, the four ceramic gaskets 102 are neatly and orderly arranged in the positioning holes 105 under the constraint of the stop block 114. This not only ensures the independence and stability of the ceramic gaskets 102, but also provides a reliable foundation for the normal operation of the entire device. As the usage time increases, even if the device is subjected to certain vibrations or external forces, the stop block 114 can still firmly fix the ceramic gaskets 102 in their respective positions, effectively preventing the mutual squeezing and displacement of adjacent gaskets, greatly extending the service life of the ceramic gaskets 102, and improving the reliability and stability of the entire equipment.

[0044] This application also provides an on-board power supply, including any of the charging module assembly structures described above. Compared with the prior art, the charging module assembly structure used in the on-board power supply of this application has a positioning plate 104 between the circuit board 101 and the water-cooling plate 103. The positioning plate 104 has a positioning hole 105, the outer contour of which matches the outer contour of the ceramic pad 102, and the thickness of the positioning plate 104 is the same as the thickness of the ceramic pad 102. During assembly, the ceramic pad 102 is placed in the positioning hole 105, thereby effectively preventing the ceramic pad 102 from rotating with the screw, improving assembly efficiency and assembly quality.

[0045] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A charging module assembly structure, comprising: The circuit board, ceramic gasket, and water-cooled plate are characterized in that they further include a positioning plate; the positioning plate is located between the circuit board and the water-cooled plate, and the positioning plate has positioning holes for mounting the ceramic gasket.

2. The charging module assembly structure as described in claim 1, characterized in that, It also includes a heat-conducting plate, which is located between the positioning plate and the water-cooling plate.

3. The charging module assembly structure as described in claim 2, characterized in that, It also includes a silicone pad, which is located between the heat-conducting plate and the water-cooling plate.

4. The charging module assembly structure as described in claim 2, characterized in that, The circuit board has a first mounting hole for mounting screws, the ceramic gasket has a second mounting hole corresponding to the first mounting hole, and the heat-conducting plate has a third mounting hole corresponding to the second mounting hole.

5. The charging module assembly structure as described in claim 2, characterized in that, The positioning plate is provided with a protrusion that penetrates the heat-conducting plate, and the protrusion has a fourth mounting hole for installing screws.

6. The charging module assembly structure as described in claim 5, characterized in that, The heat-conducting plate has insertion holes that are compatible with the protrusions.

7. The charging module assembly structure as described in claim 3, characterized in that, The silicone pad is bonded and fixed to the water-cooling plate with adhesive.

8. The charging module assembly structure as described in claim 1, characterized in that, The positioning plate is made of plastic.

9. The charging module assembly structure as described in claim 1, characterized in that, A stop is provided on the side wall of the positioning hole.

10. A vehicle-mounted power supply, characterized in that, It includes a charging module assembly structure as described in any one of claims 1-9.

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