A new type of PCB board for MCIO8x high-speed data cables

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By designing recesses and partitions on the PCB to form wire channels, surface contact between the wires and pads is achieved, solving the problems of high soldering difficulty and easy breakage of the MCIO 8x Gen6 STR/RA PCB, improving soldering strength and shielding effect, and reducing processing difficulty and cost.

CN224538407UActive Publication Date: 2026-07-21DONGGUAN ZHONGYOU ELECTRONICS

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Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: DONGGUAN ZHONGYOU ELECTRONICS
Filing Date: 2025-08-11
Publication Date: 2026-07-21

AI Technical Summary

Technical Problem

When soldering existing MCIO 8x Gen6 STR/RA PCB boards with wires, the wire processing is difficult, and the single-point connection of the GND electronic wire has weak shielding effect and is easy to break.

Method used

A novel PCB board is designed, comprising receiving grooves and partitions forming multiple wire slots. The wires are clipped into the wire slots, the data core wires are in contact with the pads, copper foil wraps the wires, copper foil covers the inside of the grooves, and the copper foil and copper foil abut against each other. The soldering method is changed to surface contact.

Benefits of technology

It improves welding strength, reduces processing difficulty and material costs, simplifies wire structure, and enhances shielding effect.

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Abstract

The utility model discloses a novel PCB board for MCIO 8x high -speed data line, including PCB board body, PCB board body is equipped with containing portion and pad portion, the front and back of containing portion all are equipped with containing recess, the front and back of pad portion all are equipped with multiple groups of pad group that distribute in parallel in turn, and multiple pad groups are located at one side of containing recess, and multiple parallel distribution baffle that are in containing recess are equipped, and containing recess is divided into multiple adjacent wire slots by baffle. The utility model discloses a plurality of wire slots are formed by setting containing recess, baffle, are used for clamping wire material, and only need to weld two data core wires of each wire material with pad, do not need to weld ground wire, and the data core wire and pad are optimized from original point contact to surface contact, and the firmness is more reliable, solves the problem of easy broken wire, simplifies wire material structure, improves 2C+ copper foil mode of now, reduces the processing difficulty of wire material, reduces material and artificial cost.

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Description

Technical Field

[0001] This utility model relates to the technical field of data transmission lines, and in particular to a novel PCB board for MCIO 8x high-speed data lines. Background Technology

[0002] When soldering existing MCIO 8x Gen6 STR / RA PCB boards to wires, the ground wire of the wire needs to be separated and soldered independently to the PCB pads. This makes the wire processing difficult, and during soldering, the GND electronic line between the PCB board and the wire is a single point connection, resulting in weak shielding. Furthermore, a single electronic line is relatively easy to break when soldered to the pad. Therefore, there is a need to develop a new PCB board for MCIO 8x high-speed data cables that improves the contact performance between the wire and the PCB board pads and avoids the problem of easy wire breakage. Utility Model Content

[0003] The purpose of this invention is to provide a new type of PCB board for MCIO 8x high-speed data lines.

[0004] According to one aspect of the present invention, a novel PCB board for MCIO 8x high-speed data cable is provided, comprising a PCB board body, the PCB board body having a receiving portion and a pad portion, the receiving portion having receiving grooves on both the front and back sides, the pad portion having multiple sets of pads arranged in parallel on both the front and back sides, the multiple sets of pads being located on one side of the receiving groove, and the receiving groove having multiple partitions arranged in parallel in sequence, dividing the receiving groove into multiple adjacent slots.

[0005] In some implementations, the positions of the multiple grooves in the front receiving groove correspond one-to-one with the positions of the multiple grooves in the back receiving groove.

[0006] In some embodiments, the present invention also includes a copper sheet disposed in the receiving groove and covering the inner side of the receiving groove, the surface of the wire groove and the partition.

[0007] In some implementations, the pad group includes two parallel pads distributed horizontally, and the position of the pad group corresponds to the position of the wire groove.

[0008] In some implementations, the wires soldered to the PCB board body are respectively mounted in multiple wire slots, the width of which matches the width of the wires.

[0009] In some implementations, the outer surface of the wire is wrapped with copper foil, and the wire is provided with a data pair consisting of two data core wires, and the two data core wires of the data pair are soldered one-to-one with the two pads in the pad group.

[0010] In some implementations, the copper foil wrapped around the top of the wire abuts against the copper sheet on the inner side of the receiving groove.

[0011] In some implementations, the copper sheet is gold-plated copper sheet, and the copper foil is gold-plated copper foil.

[0012] The beneficial effects of this utility model are as follows: This utility model improves the PCB board structure by setting up receiving grooves and partitions to form multiple wire slots for mounting wires. Only the two data cores of each wire need to be soldered to the pads, eliminating the need to solder the ground wires. The contact between the data cores and the pads is optimized from point contact to surface contact, improving the relative contact performance during soldering, making the connection more reliable, and solving the problem of easy wire breakage. The wire structure is simplified, changing the original two data cores + two ground wires (i.e., 2C + 2D) structure to the current two data cores + copper foil wrapping (2C + copper foil) structure, reducing the processing difficulty of the wires and reducing material and labor costs. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the PCB board body of a novel PCB board for MCIO 8x high-speed data lines, which is one embodiment of the present invention.

[0014] Figure 2 This is a front view of the PCB board body of a novel PCB board for an MCIO 8x high-speed data cable, which is one embodiment of the present invention.

[0015] Figure 3 This is an assembly diagram of a novel PCB board and wires for an MCIO 8x high-speed data cable, representing one embodiment of the present invention. Detailed Implementation

[0016] The present invention will be further described in detail below with reference to the embodiments.

[0017] refer to Figure 1-3 This utility model provides a novel PCB board for MCIO 8x high-speed data lines, comprising a PCB board body 1 and a copper foil 2.

[0018] The PCB board body 1 has a receiving portion and a pad portion. The receiving portion has receiving grooves 11 on both the front and back sides. Multiple parallel partitions 12 are arranged within each receiving groove 11, dividing the receiving groove 11 into multiple adjacent wire slots 13. The positions of the multiple wire slots 13 in the receiving groove 11 on the front side of the PCB board body 1 correspond one-to-one with the positions of the multiple wire slots 13 in the receiving groove 11 on the back side. Copper foil 2 is disposed within the receiving groove 11 and covers the inner surface of the receiving groove 11, the surface of the wire slots 13, and the surfaces of the partitions 12.

[0019] The pad portion has multiple sets of parallel pads 14 arranged sequentially on both the front and back sides. These sets of pads 14 are located on one side of the receiving groove 11. Each set of pads 14 includes two parallel pads 141 arranged horizontally. The positions of the pad sets 14 correspond to the positions of the wire groove 13.

[0020] The outer surface of the wires 3 soldered to the PCB board body 1 is wrapped with copper foil, and a data pair consisting of two data core wires 31 is provided. Multiple wires 3 are respectively installed in multiple wire slots 13, the width of which matches the width of the wires 3. After the wires 3 are installed in the wire slots 13, the copper foil wrapped around the top of the wire 3 abuts against the copper sheet 2 on the inner side of the receiving groove 11, and the two data core wires 31 of the data pair are soldered one-to-one to the two solder pads 141 in the pad group 14. The copper sheet 2 is gold-plated copper sheet, and the copper foil is gold-plated copper foil.

[0021] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and these all fall within the protection scope of this utility model.

Claims

1. A novel PCB board for MCIO 8x high-speed data cables, characterized in that, The PCB board includes a PCB board body, which has a receiving portion and a pad portion. The receiving portion has receiving grooves on both the front and back sides. The pad portion has multiple sets of pads arranged in parallel on both the front and back sides. The multiple sets of pads are located on one side of the receiving groove. The receiving groove has multiple partitions arranged in parallel in sequence, which divide the receiving groove into multiple adjacent slots.

2. A novel PCB board for MCIO 8x high-speed data lines according to claim 1, characterized in that, The positions of the multiple grooves in the receiving groove on the front side correspond one-to-one with the positions of the multiple grooves in the receiving groove on the back side.

3. A novel PCB board for MCIO 8x high-speed data lines according to claim 1, characterized in that, It also includes a copper sheet, which is disposed in the receiving groove and covers the inner side of the receiving groove, the surface of the wire groove and the partition.

4. A novel PCB board for MCIO 8x high-speed data lines according to claim 3, characterized in that, The pad group includes two parallel pads distributed horizontally, and the position of the pad group corresponds to the position of the wire groove.

5. A novel PCB board for MCIO 8x high-speed data lines according to claim 4, characterized in that, The wires soldered to the PCB board body are respectively installed in a plurality of wire slots, the width of the wire slots being matched with the width of the wires.

6. A novel PCB board for MCIO 8x high-speed data lines according to claim 5, characterized in that, The outer surface of the wire is wrapped with copper foil, and the wire is provided with a data pair consisting of two data core wires. The two data core wires of the data pair are soldered one-to-one with the two pads in the pad group.

7. A novel PCB board for MCIO 8x high-speed data lines according to claim 6, characterized in that, The copper foil wrapped around the top of the wire abuts against the copper sheet on the inner side of the receiving groove.

8. A novel PCB board for MCIO 8x high-speed data lines according to claim 6, characterized in that, The copper sheet is gold-plated copper sheet, and the copper foil is gold-plated copper foil.