An integrated circuit board having an anti-interference module

Abstract

The utility model discloses an integrated circuit board with anti -interference module relates to the field of circuit board, including the substrate, the outer wall of substrate all electric connection has the connecting terminal. The utility model discloses when setting up metal shielding case and the conductive bubble cotton cooperation cover are established in the outside of control chip, on one hand, metal shielding case can reflect the electromagnetic radiation in the external environment, prevents these interference signals from entering the shielding space inside and influences the normal work of control chip, on the other hand, the existence of conductive bubble cotton fills the gap between metal shielding case and control chip and peripheral element, avoids electromagnetic wave through the gap leakage or invasion, and the good conductivity of conductive bubble cotton can connect metal shielding case with the ground pin of control chip or the ground plane of integrated circuit board, forms a complete ground loop, and the interference current on the shield cover is guided into the earth, guarantees the stable operation of entire circuit system.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, specifically to an integrated circuit board with an anti-interference module. Background Technology

[0002] In the field of modern electronics, integrated circuit boards have become the core components of various electronic devices and are widely used in many key fields such as computers, communications, automobiles, medical equipment and aerospace. With the trend of miniaturization, high performance and functional diversification of electronic devices, the number of electronic components integrated on IC boards is constantly increasing, the circuit layout is becoming more compact, and the operating frequency is continuously increasing. This makes them significantly more sensitive to electromagnetic interference, so an integrated circuit board with an anti-interference module is needed.

[0003] When existing integrated circuit boards are in operation, electromagnetic radiation from the surrounding environment, low-frequency interference from motors and welding machines in the workshop, and high-frequency radiation from wireless signal base stations can directly affect sensitive components that are not properly protected. Using mechanical structures such as screws and clips to fix anti-interference parts is a complex and time-consuming process. Therefore, there is an urgent need for an integrated circuit board with an anti-interference module. Utility Model Content

[0004] Based on this, the purpose of this utility model is to provide an integrated circuit board with an anti-interference module to solve the problem that when existing integrated circuit boards with anti-interference modules are in use, electromagnetic radiation from the surrounding environment, low-frequency interference from motors and welding machines in the workshop, and high-frequency radiation from wireless signal base stations will directly affect sensitive components that have not been properly protected. The operation process of fixing anti-interference parts with mechanical structures such as screws and clips is complicated and time-consuming.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an integrated circuit board with an anti-interference module, comprising a substrate, wherein the outer wall of the substrate is electrically connected to a connection terminal, the inner wall of the connection terminal is electrically connected to a control chip, a magnetic plate is adhered to the inner wall of the substrate, and a magnetic frame is attached to the outer wall of the magnetic plate.

[0006] A metal shield is bonded to the outer wall of the magnetic frame, and conductive foam is installed on the inner wall of the metal shield.

[0007] Preferably, the connecting terminals are arranged at equal intervals on the outer wall of the substrate, and the inner wall of the substrate has a slotted design.

[0008] Preferably, the magnetic plate is engaged with the base plate, and the magnetic plate is arranged in a grid-like structure.

[0009] Preferably, the outer wall of the magnetic plate is in close contact with the outer wall of the magnetic frame, and the inner wall length of the magnetic plate is the same as the inner wall length of the magnetic frame.

[0010] Preferably, the outer wall of the magnetic frame is in close contact with the outer wall of the metal shield, and the length of the outer wall of the magnetic frame is the same as the length of the outer wall of the metal shield.

[0011] Preferably, the metal shielding cover is engaged with the conductive foam, and the metal shielding cover is engaged with the substrate.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. This utility model uses a substrate to bond and adhere the magnetic plate. The substrate, as the basic support component of the integrated circuit board, is made of FR-4 epoxy resin insulating material. It not only provides a mounting carrier for circuit components but also ensures the stability of circuit connections through surface treatment and immersion gold plating. Specific areas of the substrate are designated as mounting positions for the magnetic plate. The magnetic plate is made of ferrite magnetic material, and one side is tightly bonded to the substrate with conductive adhesive. The selection of conductive adhesive balances adhesion strength and conductivity, ensuring a good electrical connection between the magnetic plate and the substrate's grounding network, and preventing the introduction of new interference due to the magnetic plate becoming an electromagnetic reflector. The magnetic pole distribution of the magnetic plate is optimized, using a multi-pole magnetization method to ensure a uniform distribution of the surface magnetic field strength, guaranteeing force balance during magnetic attraction. The magnetic frame, as the intermediate component connecting the magnetic plate and the metal shielding cover, uses permalloy... Made of high-permeability magnetic material, its shape perfectly matches the bottom contour of the metal shield. The inner side has a stepped structure that engages with the metal shield. The bottom of the magnetic frame has a magnetic attraction area corresponding to the magnetic plate. This area is demagnetized and then locally magnetized to ensure a directional attraction between it and the magnetic plate. The metal shield, as the core anti-interference component, is made of copper alloy metal shielding material. Its inner wall is covered with conductive foam to eliminate gap interference with the components. The bottom edge fits precisely with the stepped structure of the magnetic frame. When the metal shield approaches the magnetic plate, it generates an instant magnetic attraction force to achieve initial positioning. The installation process of the metal shield does not require tools. The operator only needs to hold the metal shield and align it with the approximate position of the magnetic plate. The magnetic attraction force will automatically guide the metal shield to complete the precise alignment, which is more efficient than the traditional screw fixing method.

[0014] 2. This utility model uses a metal shielding cover to secure and fix the conductive foam. When the metal shielding cover and conductive foam are used together to cover the outside of the control chip, a relatively closed electromagnetic shielding space is formed. This can prevent the control chip from being interfered with in several ways. On the one hand, the metal shielding cover can reflect electromagnetic radiation from the external environment, preventing these interference signals from entering the shielding space and affecting the normal operation of the control chip. On the other hand, the presence of conductive foam fills the gaps between the metal shielding cover and the control chip and surrounding components, preventing electromagnetic waves from leaking or intruding through the gaps. The good conductivity of the conductive foam can connect the metal shielding cover to the grounding pin of the control chip or the grounding plane of the integrated circuit board, forming a complete grounding loop. This conducts the interference current induced on the shielding cover to the ground, preventing the interference current from forming secondary radiation inside the shielding cover and interfering with the control chip. The control chip itself also generates a certain amount of electromagnetic radiation during operation. The shielding structure composed of the metal shielding cover and conductive foam can effectively block the propagation of these internal radiations outward, avoiding interference with other sensitive components on the integrated circuit board and ensuring the stable operation of the entire circuit system. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present utility model;

[0016] Figure 2 This is a structural schematic diagram of the present invention viewed from a height and disassembled.

[0017] Figure 3 This is a cross-sectional structural diagram of some parts of this utility model.

[0018] In the diagram: 1. Substrate; 2. Connecting terminal; 3. Control chip; 4. Magnetic plate; 5. Magnetic frame; 6. Metal shielding cover; 7. Conductive foam. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0020] The embodiments of this utility model will be described below based on its overall structure.

[0021] Please see Figure 1-3An integrated circuit board with an anti-interference module includes a substrate 1. Connection terminals 2 are electrically connected to the outer wall of the substrate 1, and the connection terminals 2 are evenly spaced on the outer wall of the substrate 1. The inner wall of the substrate 1 has a slotted design, and a control chip 3 is electrically connected to the inner wall of the connection terminals 2. A magnetic plate 4 is adhered to the inner wall of the substrate 1, and the magnetic plate 4 is snap-fitted to the substrate 1. The magnetic plate 4 has a grid-like structure. A magnetic frame 5 is attached to the outer wall of the magnetic plate 4, and the outer wall of the magnetic plate 4 and the outer wall of the magnetic frame 5 are tightly fitted together. The inner wall length of the magnetic plate 4 is the same as the inner wall length of the magnetic frame 5. The substrate 1 serves as an adhesive bonding agent for the magnetic plate 4. As the foundational support component of the integrated circuit board, the substrate 1 is made of FR-4 epoxy resin insulating material. It not only provides a mounting carrier for circuit components but also ensures the stability of circuit connections through surface treatment and immersion gold plating. Specific areas of the substrate 1 are designated as mounting positions for the magnetic plate 4. The magnetic plate 4 is made of ferrite magnetic material, and one side of it is tightly bonded to the substrate 1 using conductive adhesive. The selection of the conductive adhesive balances adhesive strength and conductivity, ensuring a good electrical connection between the magnetic plate 4 and the grounding network of the substrate 1, and preventing damage caused by the magnetic plate 4 becoming... To prevent the introduction of new interference by electromagnetic reflectors, the magnetic pole distribution of magnetic plate 4 has been optimized. A multi-pole magnetization method is used to ensure a uniform distribution of the surface magnetic field strength, guaranteeing force balance during magnetic attraction. Magnetic frame 5, serving as the intermediate component connecting magnetic plate 4 and metal shield 6, is made of permalloy high-permeability material. Its shape perfectly matches the bottom contour of metal shield 6, and its inner side has a stepped structure that engages with metal shield 6. A magnetic attraction area is reserved at the bottom of magnetic frame 5 corresponding to the position of magnetic plate 4. This area is demagnetized and then locally magnetized to ensure a stable magnetic attraction with magnetic plate 4. The metal shield 6, as a core anti-interference component, is made of copper alloy metal shielding material. Its inner wall is covered with conductive foam 7 to eliminate gap interference with the components. The bottom edge is precisely matched with the stepped structure of the magnetic frame 5. When the metal shield 6 approaches the magnetic plate 4, it generates an instant magnetic attraction force to achieve initial positioning. The installation process of the metal shield 6 does not require the assistance of tools. The operator only needs to hold the metal shield 6 to the approximate position of the magnetic plate 4, and the magnetic attraction force will automatically guide the metal shield 6 to complete the precise alignment, which is more efficient than the traditional screw fixing method.

[0022] Please see Figure 1-3An integrated circuit board with an anti-interference module is disclosed. A metal shielding cover 6 is adhered to the outer wall of a magnetic frame 5, and the outer walls of the magnetic frame 5 and the metal shielding cover 6 are tightly fitted together. The length of the outer wall of the magnetic frame 5 is the same as the length of the outer wall of the metal shielding cover 6. Conductive foam 7 is installed on the inner wall of the metal shielding cover 6. The metal shielding cover 6 and the conductive foam 7 are engaged and connected, and the metal shielding cover 6 is also engaged and connected to the substrate 1. By setting the metal shielding cover 6, the conductive foam 7 is secured and fixed. When the metal shielding cover 6 and the conductive foam 7 are used to cover the control chip 3, a relatively closed electromagnetic shielding space is formed, which can prevent the control chip 3 from being interfered with in multiple ways. On the one hand, the metal shielding cover 6 can reflect electromagnetic radiation from the external environment, preventing these interference signals from entering the shielding space and affecting the control chip 3. On the one hand, the conductive foam 7 ensures the normal operation of the circuit. On the other hand, the presence of conductive foam 7 fills the gap between the metal shield 6 and the control chip 3 and surrounding components, preventing electromagnetic waves from leaking or intruding through the gap. The good conductivity of conductive foam 7 can connect the metal shield 6 with the grounding pin of the control chip 3 or the grounding plane of the integrated circuit board to form a complete grounding loop. This conducts the interference current induced on the shield to the ground, preventing the interference current from forming secondary radiation inside the shield and interfering with the control chip 3. The control chip 3 also generates a certain amount of electromagnetic radiation during operation. The shielding structure composed of the metal shield 6 and conductive foam 7 can effectively block the propagation of these internal radiations outward, avoiding interference with other sensitive components on the integrated circuit board and ensuring the stable operation of the entire circuit system.

[0023] Working principle: In use, take out the substrate 1 and place it in the designated position. Then, glue and fix the substrate 1 to the magnetic plate 4. Next, connect the control chip 3 to the connection terminal 2 as required. Then, snap the metal shielding cover 6 onto the conductive foam 7. Then, glue and fix the magnetic frame 5 onto the metal shielding cover 6. Finally, snap the metal shielding cover 6 onto each of the multiple control chip 3 units to shield against interference. This completes the use of the device. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0024] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated circuit board with an anti-interference module, comprising a substrate (1), characterized in that: The outer wall of the substrate (1) is electrically connected to a connection terminal (2), the inner wall of the connection terminal (2) is electrically connected to a control chip (3), the inner wall of the substrate (1) is bonded to a magnetic plate (4), and the outer wall of the magnetic plate (4) is attached to a magnetic frame (5). The outer wall of the magnetic frame (5) is bonded with a metal shield (6), and the inner wall of the metal shield (6) is fitted with conductive foam (7).

2. An integrated circuit board with an anti-interference module according to claim 1, characterized in that: The connecting terminals (2) are arranged at equal intervals on the outer wall of the substrate (1), and the inner wall of the substrate (1) is designed with a slot.

3. An integrated circuit board with an anti-interference module according to claim 1, characterized in that: The magnetic plate (4) is engaged with the base plate (1), and the magnetic plate (4) is arranged in a grid-like structure.

4. An integrated circuit board with an anti-interference module according to claim 1, characterized in that: The outer wall of the magnetic plate (4) is in close contact with the outer wall of the magnetic frame (5), and the inner wall length of the magnetic plate (4) is the same as the inner wall length of the magnetic frame (5).

5. An integrated circuit board with an anti-interference module according to claim 1, characterized in that: The outer wall of the magnetic frame (5) is closely fitted with the outer wall of the metal shield (6), and the length of the outer wall of the magnetic frame (5) is the same as the length of the outer wall of the metal shield (6).

6. An integrated circuit board with an anti-interference module according to claim 1, characterized in that: The metal shield (6) is engaged with the conductive foam (7), and the metal shield (6) is engaged with the substrate (1).

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