Flexible circuit board, display module and display device

Abstract

The application discloses a flexible circuit board, a display module and a display device, and relates to the technical field of display. The flexible circuit board comprises a main circuit board and a movable circuit board connected with each other. The movable circuit board is flexibly arranged, and the movable circuit board moves towards or away from the main circuit board around the connecting position of the movable circuit board and the main circuit board. The movable circuit board comprises a substrate and a first conductive layer and a second conductive layer arranged on two sides of the substrate. The first conductive layer and the second conductive layer each comprise a plurality of grounding parts and a plurality of signal lines, and the plurality of grounding parts are arranged on two sides of the plurality of signal lines. The grounding parts on at least one side of the plurality of signal lines are target grounding parts, the target grounding parts are provided with slots, and the slots extend to one end of the movable circuit board connected with the main circuit board along the extension direction of the signal lines. The application solves the problem that the product yield of an AMOLED module is reduced due to the increase of the tearing proportion of the connecting area of the movable circuit board and the flexible circuit board.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a flexible circuit board, a display module, and a display device. Background Technology

[0002] Due to space constraints, the design space for traces in the flexible circuit boards of AMOLED modules is becoming increasingly smaller, and the active circuit boards (the part of the flexible circuit board used for external connections) are being designed to be shorter and shorter. This results in more and more pulling and tightening of the connection area between the active circuit board and the flexible circuit board during assembly, leading to an increase in the tearing rate of the connection area between the active circuit board and the flexible circuit board, which seriously affects the product yield of AMOLED modules. Utility Model Content

[0003] This application provides a flexible circuit board, a display module, and a display device, aiming to reduce the tear ratio in the connection area between the active circuit board and the flexible circuit board, and improve the product yield of the display module.

[0004] In a first aspect, this application provides a flexible circuit board, including a main circuit board and a movable circuit board, the movable circuit board being connected to the main circuit board. The movable circuit board is flexibly configured, and around the connection point between the movable circuit board and the main circuit board, the movable circuit board and the main circuit board can move towards each other or away from each other.

[0005] The movable circuit board includes a substrate, a first conductive layer, and a second conductive layer. The first and second conductive layers are disposed on opposite sides of the substrate. Both the first and second conductive layers include multiple grounding portions and multiple signal lines. Along a direction perpendicular to the extension of the signal lines, the multiple grounding portions are located on both sides of the multiple signal lines. The extension direction of the signal lines is from one end of the movable circuit board connected to the main circuit board to the opposite end.

[0006] In the first conductive layer and / or the second conductive layer, the grounding portion located on at least one side of the multiple signal lines is the target grounding portion. The target grounding portion has a slot that penetrates the target grounding portion and extends along the extension direction of the signal lines to the end of the active circuit board that is connected to the main circuit board.

[0007] This application embodiment provides a slot along the extension direction of the signal line at the target ground portion on the active circuit board. The slot is provided on at least one conductive layer of the active circuit board to prevent cracks from spreading from the boundary of the active circuit board to the middle portion of the active circuit board. When the crack extends to the slot position, the continuity of the material at the slot is disrupted, making it difficult for the crack to continue to propagate to the middle portion of the active circuit board along the original direction and path.

[0008] The middle section of the active circuit board typically houses a high density of signal lines. If a crack propagates to this area, it can cause the signal lines to break or short-circuit. Grooving, through physical isolation, confines the crack to the boundary area, effectively preventing its spread and reducing the probability of signal lines breaking in the middle section of the active circuit board, thereby improving the yield rate of AMOLED modules.

[0009] In some embodiments, the main circuit board has an opening. The movable circuit board is located within the opening and is connected to the main circuit board through a sidewall of the opening.

[0010] In some embodiments, the dimension of the target ground portion in the second direction is larger than the dimension of the ground portion without slots in the second direction, and larger than the dimension of the signal line in the second direction, wherein the second direction is perpendicular to the extension direction of the signal line.

[0011] In some embodiments, the slotting divides the target ground portion into a first sub-part and a second sub-part, wherein the second sub-part is closer to the multiple signal lines in a second direction than the first sub-part.

[0012] The sidewall closest to the slot of the multiple signal lines in the conductive layer stacked with the target ground portion is recessed in the second direction relative to the sidewall closest to the slot of the second sub-part.

[0013] In some embodiments, the sidewall of the multiple signal lines in the conductive layer stacked with the target ground portion that is closest to the slot, and the sidewall of the second sub-part that is closest to the slot, have a dimension a in the second direction that is greater than or equal to 0.15 mm.

[0014] In some embodiments, the size of the slot in the second direction is 0.05 mm to (a-0.1) mm.

[0015] In some embodiments, the first sub-part includes a plurality of spacers arranged at intervals along a second direction, and along the extension direction of the signal line, the gap between any two adjacent spacers extends to the end of the active circuit board connected to the main circuit board.

[0016] In some embodiments, the dimension of each spacer in the second direction is 0.05 mm to 0.2 mm.

[0017] In some embodiments, the multiple signal lines include multiple first signal lines and multiple second signal lines, wherein the dimensions of the first signal lines in the second direction are greater than the dimensions of the second signal lines in the second direction.

[0018] Among them, multiple first signal lines are arranged along the second direction on at least one side of multiple second signal lines.

[0019] In some embodiments, the multiple signal lines in the first conductive layer include multiple display traces, and the multiple signal lines in the second conductive layer include multiple touch traces.

[0020] The orthographic projections of multiple display traces on the substrate are staggered from the orthographic projections of multiple touch traces on the substrate.

[0021] Secondly, this application provides a display module, including a flexible circuit board and a display panel as described in any of the above embodiments, wherein the display panel and the flexible circuit board are bonded together.

[0022] Thirdly, this application provides a display device, including a display module and a middle frame as described in the above embodiments, wherein the middle frame is disposed on the non-display side of the display panel in the display module.

[0023] The technical effects of the display module in the second aspect and the display device in the third aspect can be seen in the technical effects of the flexible circuit board design in the first aspect, and will not be repeated here.

[0024] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0025] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0026] Figure 1 This is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of this application;

[0029] Figure 4 Provided for the embodiments of this application Figure 3 A partially enlarged structural diagram;

[0030] Figure 5 A cross-sectional schematic diagram of a movable circuit board provided in an embodiment of this application;

[0031] Figure 6 A cross-sectional schematic diagram of a movable circuit board provided in an embodiment of this application;

[0032] Figure 7 A cross-sectional schematic diagram of a movable circuit board provided in an embodiment of this application;

[0033] Figure 8 This is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of this application;

[0034] Figure 9 This is a schematic diagram of a display module provided in an embodiment of this application;

[0035] Figure 10 This is a schematic diagram of a display device provided in an embodiment of this application. Detailed Implementation

[0036] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0037] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0038] In the description of this application, "multiple" means two or more.

[0039] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] In describing some embodiments, the term "connection" and its derivative expressions may be used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. The term "electrical connection" indicates, for example, that two or more components have direct physical or electrical contact, but may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0041] In addition, the use of “based on” implies openness and inclusivity, because processes, steps, calculations or other actions “based on” one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0042] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0043] This document describes exemplary embodiments with reference to cross-sectional views, which are intended as idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include shape deviations caused, for example, by manufacturing processes. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0044] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0045] Due to space constraints, the design space for traces in the flexible circuit boards of AMOLED modules is becoming increasingly smaller, and the active circuit boards (the part of the flexible circuit board used for external connections) are being designed to be shorter and shorter. This results in more and more pulling and tightening of the connection area between the active circuit board and the flexible circuit board during assembly, leading to an increase in the tearing rate of the connection area between the active circuit board and the flexible circuit board, which seriously affects the product yield of AMOLED modules.

[0046] To address the aforementioned technical problems, this application provides a flexible circuit board 10, such as... Figure 1As shown, the flexible circuit board 10 includes a main circuit board 101 and a movable circuit board 102. The movable circuit board 102 is connected to the main circuit board 101 and is flexibly configured. Around the connection point between the movable circuit board 102 and the main circuit board 101, the movable circuit board 102 and the main circuit board 101 can move towards each other or away from each other. The movable circuit board 102 is used to realize external connections of the flexible circuit board 10, such as connecting the flexible circuit board 10 to the main board located on the non-display surface of the display panel.

[0047] Among them, such as Figure 2 As shown, the active circuit board 102 includes a substrate 1021, a first conductive layer 1022, and a second conductive layer 1023. The first conductive layer 1022 and the second conductive layer 1023 are respectively disposed on both sides of the substrate 1021. The first conductive layer is as follows: Figure 2 As shown, the second conductive layer is as follows Figure 3 As shown.

[0048] The substrate 1021 serves as the basic support structure for the movable circuit board 102, providing a platform for the attachment and layout of the first conductive layer 1022 and the second conductive layer 1023, thus ensuring the stability and reliability of the overall structure of the movable circuit board 102.

[0049] For example, the material of substrate 1021 may be polyimide (PI).

[0050] like Figure 2 , Figure 3 and Figure 4 As shown, both the first conductive layer 1022 and the second conductive layer 1023 include multiple grounding portions 103 and multiple signal lines 104. Along the extension direction perpendicular to the signal lines 104, the multiple grounding portions 103 are respectively disposed on both sides of the multiple signal lines 104.

[0051] The signal line 104 extends from one end D1 of the active circuit board 102 connected to the main circuit board 101 to the other end D2 opposite to one end D1.

[0052] Signal line 104 plays an important role in transmitting electrical signals in the active circuit board 102. It is responsible for transmitting signals from the main circuit board 101 to other components that need to be connected, or transmitting signals from other components back to the main circuit board 101.

[0053] The main function of the grounding part 103 is to provide a good grounding environment for the signal line 104, reduce interference during signal transmission, and ensure signal stability and accuracy. By distributing the grounding parts 103 on both sides of the signal line 104, external electromagnetic interference can be effectively shielded, crosstalk between the signal lines 104 can be reduced, and signal transmission quality can be improved.

[0054] Among them, such as Figure 5As shown, in the first conductive layer 1022 and / or the second conductive layer 1023, the ground portion 103 located on at least one side of the multiple signal lines 104 is the target ground portion 105. The target ground portion 105 has a slot T1 that penetrates the target ground portion 105 and extends along the extension direction of the signal lines 104 to the end D1 of the movable circuit board 102 that is connected to the main circuit board 101.

[0055] Since there are four possible scenarios for the target grounding part 105, there are also four different positions to choose from for setting the slot T1 for the target grounding part 105, and these four positions can be arbitrarily combined according to actual needs.

[0056] The following details these four exemplary location scenarios:

[0057] For example, in the first conductive layer 1022, located on multiple signal lines 104 Figure 2 The grounding part 103 on the right side serves as the target grounding part 105, and a slot T1 is provided that penetrates the target grounding part 105 and extends along the extension direction of the signal line 104 to the end D1 where the active circuit board 102 is connected to the main circuit board 101.

[0058] For example, in the first conductive layer 1022, located on multiple signal lines 104 Figure 2 The grounding part 103 on the left side serves as the target grounding part 105, and a slot T1 is provided that penetrates the target grounding part 105 and extends along the extension direction of the signal line 104 to the end D1 where the active circuit board 102 is connected to the main circuit board 101.

[0059] For example, in the second conductive layer 1023, located on multiple signal lines 104 Figure 2 The grounding part 103 on the right side serves as the target grounding part 105, and a slot T1 is provided that penetrates the target grounding part 105 and extends along the extension direction of the signal line 104 to the end D1 where the active circuit board 102 is connected to the main circuit board 101.

[0060] For example, in the second conductive layer 1023, located on multiple signal lines 104 Figure 2 The grounding part 103 on the left side serves as the target grounding part 105, and a slot T1 is provided that penetrates the target grounding part 105 and extends along the extension direction of the signal line 104 to the end D1 where the active circuit board 102 is connected to the main circuit board 101.

[0061] By setting slots T1 on the target grounding parts 105 at these four different locations, and allowing for arbitrary combinations, the circuit structure can be flexibly optimized according to different circuit design requirements and signal transmission requirements to achieve better circuit performance.

[0062] In this embodiment, a slot T1 is provided on the target ground portion 105 of the active circuit board 102 along the extension direction of the signal line 104. The slot T1 is provided on at least one conductive layer of the active circuit board 102, which can prevent the crack from spreading from the boundary of the active circuit board 102 to the middle part of the active circuit board 102. When the crack extends to the position of the slot T1, the continuity of the material at the slot T1 is destroyed, and the crack is difficult to continue to propagate to the middle part of the active circuit board 102 along the original direction and path.

[0063] The middle section of the active circuit board 102 typically houses high-density signal lines 104. If a crack propagates to this area, it can cause the signal lines 104 to break or short-circuit. The slot T1, through physical isolation, confines the crack to the boundary area, effectively preventing the crack from spreading and reducing the probability of the signal lines 104 in the middle section of the active circuit board 102 breaking, thereby improving the product yield of the AMOLED module.

[0064] In some embodiments, such as Figure 1 As shown, the main circuit board 101 has an opening K1.

[0065] The movable circuit board 102 is located inside the opening K1, and the movable circuit board 102 is connected to the main circuit board 101 through a side wall C1 of the opening K1.

[0066] The opening K1 is formed by a specific processing technique on the main circuit board 101. The shape and size of the opening K1 are determined based on the shape of the movable circuit board 102 and the overall circuit design requirements.

[0067] By placing the movable circuit board 102 inside the opening K1 of the main circuit board 101, the space of the main circuit board 101 can be fully utilized, reducing the size of the entire circuit system.

[0068] Through this special design method, such as Figure 1 As shown, this allows for more flexible circuit routing, reducing trace length and intersections, thereby reducing signal interference and improving circuit performance and stability.

[0069] In some embodiments, the size of the slot T1 in the first direction Y is greater than the width of the area where a crack may occur at the connection position between the active circuit board 102 and the main circuit board 101, thereby ensuring the isolation effect of the slot T1 on the crack.

[0070] For example, the slot T1 is elongated in the first direction Y, that is, its size in the first direction Y is large (at least larger than the size of the slot T1 in the second direction X), for example, it can be larger than one-third or one-half of the size of the movable circuit board 102 in the first direction Y, thereby ensuring that the slot T1 can isolate cracks at multiple locations.

[0071] In some embodiments, the size of the target ground portion 105 in the second direction X is larger than the size of the ground portion 103 without the slot T1 in the second direction X, and larger than the size of the signal line 104 in the second direction X, wherein the second direction is perpendicular to the extension direction of the signal line 104.

[0072] From a visually intuitive geometric perspective, this means that the target ground portion 105 is relatively wide in width perpendicular to the extension direction of the signal line 104. A wider target ground portion 105 is easier to process and manufacture to form the slot T1. The wider dimension reduces processing difficulty and errors, ensuring that the slot T1 is completely within the target ground portion 105, avoiding damage to the functional area, and improving product yield. Simultaneously, a wider target ground portion 105 can more evenly distribute bending stress.

[0073] In some embodiments, such as Figure 5 As shown, the slot T1 divides the target grounding portion 105 into a first sub-part 1051 and a second sub-part 1052. Compared to the first sub-part 1051, the second sub-part 1052 is closer to the multiple signal lines 104 in the second direction X.

[0074] The sidewall C2 of the multiple signal lines 104 in the conductive layer that is closest to the slot T1 in the conductive layer that is stacked with the target ground portion 105 is recessed in the second direction relative to the sidewall C3 of the second sub-part 1052 that is closest to the slot T1.

[0075] This means that the sidewall C2 of the signal line 104 is not aligned with the sidewall C3 of the second sub-part 1052, but is recessed a certain distance away from the slot T1.

[0076] During the process of segmenting the target ground portion 105, it is essential to ensure the integrity of the shielding for the signal line 104. By rationally designing the segmentation spacing and stacking structure, the segmented target ground portion 105 can still remain within the manufacturing process tolerances. This ensures that the segmented target ground portion 105 can still cover the signal line 104 in the other conductive layer stacked with it, guaranteeing the effectiveness of shielding the signal line 104 from external interference and preventing the signal from being affected by external factors.

[0077] In some embodiments, such as Figure 5As shown, the sidewall C2 of the multiple signal lines 104 in the conductive layer that is stacked with the target ground portion 105 closest to the slot T1, and the sidewall C3 of the second sub-part 1052 that is closest to the slot T1, have a dimension a in the second direction X that is greater than or equal to 0.15 mm.

[0078] For example, in a circuit structure including a target ground layer 105 and a conductive layer (containing multiple signal lines 104), the target ground layer 105 plays a crucial role in stable signal transmission and electromagnetic compatibility. The slot T1 alters the local circuit layout and electromagnetic environment.

[0079] The specified dimension a is greater than or equal to 0.15mm, which can ensure to a certain extent that the upper signal line 104 is covered by the lower grounding part 105, thereby avoiding external signal interference with the normal transmission of the signal line 104 and ensuring the signal quality transmitted on the signal line 104.

[0080] In some embodiments, such as Figure 5 As shown, the dimension b of the slot T1 in the second direction X is 0.05mm to (a-0.1)mm.

[0081] In a circuit layout that includes structures such as the target ground part 105 and the signal line 104, the size of the slot T1 needs to be coordinated with the overall layout.

[0082] For example, the dimension b of the slot T1 in the second direction X is set to be 0.05mm to (a-0.1)mm. On the one hand, the lower limit of 0.05mm takes into account the minimum processing accuracy of the manufacturing process, ensuring that the slotting operation can be reliably realized in actual production, and avoiding processing difficulties or insufficient processing accuracy due to the slot T1 being too small.

[0083] Besides manufacturing process factors, the dimensions of the slot T1 also need to ensure its effectiveness in preventing crack propagation. If the slot T1 is too narrow, the crack may continue to propagate along its edge, failing to provide effective protection. Setting the dimension b to be no less than 0.05mm can, to some extent, prevent further crack propagation. When a crack encounters a slot T1 of a certain width, its propagation path is blocked, thus protecting the circuit structures on both sides of the slot T1 and preventing damage to critical structures such as signal line 104 due to crack propagation, ensuring the normal operation of the circuit.

[0084] On the other hand, the upper limit of (a-0.1)mm is related to the distance a between the signal line 104 and the sidewall C3 of the second sub-part 1052 mentioned in the above embodiment. This related design helps to make reasonable use of circuit space while meeting the requirements of signal transmission and avoiding capacitive coupling, and avoids the slot T1 being too large and occupying too much effective layout area.

[0085] In some embodiments, such as Figure 6 As shown, the first sub-part 1051 includes a plurality of spacers 106, which are arranged at intervals along the second direction X. Along the extension direction of the signal line 104, the gap between any two adjacent spacers 106 extends to the end of the active circuit board 102 that is connected to the main circuit board 101.

[0086] For example, if there is sufficient space for the wiring, multiple slots T1 can be formed in the first sub-part 1051, that is, the first sub-part 1051 is divided into multiple intervals 106. The multiple intervals 106 form multiple crack-stopping zones, which further improves the crack isolation effect, disperses the stress at the connection between the movable circuit board 102 and the main circuit board 101, prevents cracks from spreading from the connection to the middle part of the movable circuit board 102, protects the integrity of the movable circuit board 102, and thus improves the reliability of the movable circuit board 102.

[0087] In some embodiments, such as Figure 6 As shown, the dimension e of each spacer 106 in the second direction X is 0.05 mm to 0.2 mm.

[0088] For example, if the size of the spacer 106 is too small, its own strength may be insufficient, and it may easily deform or be damaged under stress, thereby affecting the reliability of the active circuit board 102.

[0089] When the size of the spacer 106 is within the range of 0.05mm to 0.2mm, it can maintain the stability of its shape and position when subjected to certain mechanical vibrations and temperature changes, reduce the probability of crack formation, and improve the service life of the active circuit board 102.

[0090] Different manufacturing processes impose different limitations on the dimensions of the spacer 106. If the spacer 106 is too small, it may exceed the precision range of the manufacturing process, leading to processing difficulties, increased manufacturing costs, and a higher defect rate.

[0091] The size of the spacer 106 affects the layout space of the signal line 104 and other components. If the spacer 106 is too large, it will occupy too much routing space, making circuit layout difficult and even preventing the expected circuit function from being achieved. Controlling the size of the spacer within the range of 0.05mm to 0.2mm can optimize the routing space while ensuring mechanical performance.

[0092] In some embodiments, such as Figure 2 and Figure 7 As shown, the multiple signal lines 104 include multiple first signal lines 1041 and multiple second signal lines 1042. The size of the first signal line 1041 in the second direction X is larger than the size of the second signal line 1042 in the second direction X.

[0093] Among them, a plurality of first signal lines 1041 are arranged along a second direction on at least one side of a plurality of second signal lines 1042.

[0094] For example, the first signal line 1041 can be a power line, and the power line is wider in the second direction X, providing better mechanical strength and tensile strength. When the active circuit board 102 is subjected to external force, the power line at the edge can withstand greater stress, dispersing the stress and preventing stress concentration in one area, thereby reducing the risk of tearing at the edge of the active circuit board 102.

[0095] Furthermore, multiple thicker power lines, serving as first signal lines 1041, can be arranged along the second direction X on at least one side of multiple second signal lines 1042. When the active circuit board 102 is subjected to external force, the edge power lines act as a "stress buffer zone," preferentially bearing and dispersing stress, preventing stress from being transmitted to the internal second signal line 1042 area, and further increasing tear resistance.

[0096] In some embodiments, such as Figure 8 As shown, ( Figure 8 yes Figure 2 and Figure 3 (Diagram showing the stacked layers) The multiple signal lines 104 in the first conductive layer 1022 include multiple display traces 107, and the multiple signal lines 104 in the second conductive layer 1023 include multiple touch traces 108.

[0097] The orthographic projections of multiple display traces 107 on the substrate 1021 are staggered from the orthographic projections of multiple touch traces 108 on the substrate 1021.

[0098] By completely offsetting the orthographic projections of the display traces 107 in the first conductive layer 1022 and the touch traces 108 in the second conductive layer 1023 onto the substrate 1021, the overlap of the two traces in the vertical direction is avoided, and the formation of parasitic capacitance between the two traces is avoided, which leads to capacitive coupling between the signal lines 104. This directly reduces display abnormalities (such as horizontal lines and flickering) and accidental touches caused by electromagnetic interference, improves the quality of high-speed signal transmission, reduces display defects caused by signal distortion, improves product yield, and enhances the long-term reliability of the product.

[0099] This application also provides a display module 100, such as Figure 9 As shown, it includes the flexible circuit board 10 and the display panel 1 described in any of the above embodiments, and the display panel 1 and the flexible circuit board 10 are bonded together.

[0100] For example, the flexible circuit board 10 is bonded to the display panel 1 via anisotropic conductive film or conductive adhesive.

[0101] The flexible circuit board 10 is responsible for transmitting high-speed signals, power and control signals between the display panel 1 and the motherboard (such as a mobile phone motherboard or driver IC).

[0102] In this embodiment of the application, a slot T1 is provided on the target ground portion 105 of the movable circuit board 102 of the flexible circuit board 101 along the extension direction of the signal line 104 to prevent the crack from spreading from the boundary of the movable circuit board 102 to the middle part of the movable circuit board 102. When the crack extends to the slot T1 position, the continuity of the material at the slot T1 is disrupted, making it difficult for the crack to continue to propagate to the middle part of the movable circuit board 102 along the original direction and path. This effectively blocks the crack propagation trend and reduces the probability of the signal line 104 arranged in the middle part of the movable circuit board 102 breaking.

[0103] By using the slotted design of the movable circuit board 102 in the flexible circuit board 10 to prevent cracks and avoid the breakage of the signal line 104, the failure risk of the display module can be reduced, thereby improving the product yield of the display module 100.

[0104] This application also provides a display device 1000, such as... Figure 10 As shown, it includes a display module 100 and a middle frame 200 as described in the above embodiment, with the middle frame 200 disposed on the non-display side of the display panel 1 in the display module 100.

[0105] The flexible circuit board 10, as part of the display module 100, is led out from the non-display side (backlight side) of the display panel 1 and is positioned and fixed by the fixing groove / snap or tape of the middle frame 200 to prevent the flexible circuit board 10 from shifting during assembly or use.

[0106] One end of the flexible circuit board 10 is bound to the display panel 1, and the other end is connected to the main board of the display device 1000 via the movable circuit board 102 or directly soldered to it, so as to realize the transmission of display signals, power and control commands.

[0107] The middle frame 200 provides rigid support for the flexible circuit board 10, reducing its deformation during bending or vibration.

[0108] The technical effects brought about by the display device 1000 can be seen in the technical effects brought about by the design of the flexible circuit board 10 described above, and will not be repeated here.

[0109] By using the slotted design of the movable circuit board 102 in the flexible circuit board 10 to prevent cracks and avoid the signal line 104 from breaking, the failure risk of the display module 100 can be reduced, thereby improving the reliability of the display device 1000.

[0110] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A flexible circuit board, characterized in that, include: Main circuit board; A movable circuit board is connected to the main circuit board; the movable circuit board is flexibly configured, and around the connection position between the movable circuit board and the main circuit board, the movable circuit board and the main circuit board can move towards each other or away from each other; The active circuit board includes: substrate; A first conductive layer and a second conductive layer are respectively disposed on both sides of the substrate; each of the first conductive layer and the second conductive layer includes multiple grounding portions and multiple signal lines, and the multiple grounding portions are disposed on both sides of the multiple signal lines along a direction perpendicular to the extension of the signal lines; the extension direction of the signal lines is such that one end of the movable circuit board connected to the main circuit board points to the other end opposite to that end; In the first conductive layer and / or the second conductive layer, the grounding portion located on at least one side of the plurality of signal lines is a target grounding portion, and the target grounding portion has a slot; the slot penetrates the target grounding portion and extends along the extension direction of the signal lines to the end of the movable circuit board that is connected to the main circuit board.

2. The flexible circuit board according to claim 1, characterized in that, The main circuit board has an opening; The movable circuit board is located inside the opening, and the movable circuit board is connected to the main circuit board through one side wall of the opening.

3. The flexible circuit board according to claim 1, characterized in that, The dimension of the target grounding portion in the second direction is larger than the dimension of the grounding portion without the slot in the second direction, and larger than the dimension of the signal line in the second direction; the second direction is perpendicular to the extension direction of the signal line.

4. The flexible circuit board according to claim 3, characterized in that, The slot divides the target ground portion into a first sub-part and a second sub-part. Compared to the first sub-part, the second sub-part is closer to the plurality of signal lines in the second direction. The sidewall closest to the slot of the multiple signal lines in the conductive layer stacked with the target ground portion is recessed in the second direction relative to the sidewall closest to the slot of the second sub-part.

5. The flexible circuit board according to claim 4, characterized in that, The sidewall closest to the slot of the multiple signal lines in the conductive layer stacked with the target ground portion, and the sidewall closest to the slot of the second sub-part, have a dimension a in the second direction greater than or equal to 0.15 mm.

6. The flexible circuit board according to claim 5, characterized in that, The size of the slot in the second direction is 0.05mm to (a-0.1)mm.

7. The flexible circuit board according to claim 6, characterized in that, The first sub-section includes a plurality of spaced portions, which are spaced apart along the second direction, and along the extension direction of the signal line, the gap between any two adjacent spaced portions extends to the end of the active circuit board that is connected to the main circuit board.

8. The flexible circuit board according to claim 7, characterized in that, The dimension of each of the spacers in the second direction is 0.05 mm to 0.2 mm.

9. The flexible circuit board according to any one of claims 1 to 8, characterized in that, The plurality of signal lines include a plurality of first signal lines and a plurality of second signal lines, wherein the dimension of the first signal line in the second direction is greater than the dimension of the second signal line in the second direction; The plurality of first signal lines are arranged along the second direction on at least one side of the plurality of second signal lines.

10. The flexible circuit board according to any one of claims 1 to 8, characterized in that, The plurality of signal lines in the first conductive layer include a plurality of display traces, and the plurality of signal lines in the second conductive layer include a plurality of touch traces; The orthographic projections of the multiple display traces on the substrate are staggered from the orthographic projections of the multiple touch traces on the substrate.

11. A display module, characterized in that, include: The flexible circuit board as described in any one of claims 1 to 10; The display panel and the flexible circuit board are bonded together.

12. A display device, characterized in that, include: The display module as described in claim 11; A mid-frame is disposed on the non-display side of the display panel in the display module.

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