A solder resist coating device for a charger circuit board

Abstract

The utility model relates to a solder resist coating device for charger circuit board printing, which can isolate harmful gas and take out and put circuit board outside the isolation cabin to avoid injury of operator caused by unexpected failure of coating machine.

Description

Technical Field

[0001] This utility model relates to the field of solder resist coating technology for charger circuit boards, and in particular to a solder resist coating device for printed charger circuit boards. Background Technology

[0002] In the electronics manufacturing industry, the printing quality of charger circuit boards directly affects the safety, stability, and lifespan of the product. Solder resist coating, as a crucial step in circuit board production, has always been a core concern for the industry due to its process reliability and operational safety. During the solder resist coating process, solder resist inks containing volatile organic compounds (VOCs) are typically used. These substances release harmful gases during coating and subsequent curing. Long-term exposure not only harms the health of operators, but also poses a risk of injury from moving parts when handling circuit boards, as the operation often requires operators to be close to the equipment's working area. If the coating machine malfunctions unexpectedly, operators are highly susceptible to injury from being pinched by moving parts when handling circuit boards at close range.

[0003] Therefore, it is necessary to design a solder resist coating device for charger circuit boards that can isolate harmful gases and allow the circuit boards to be placed and removed outside the isolation chamber, thus preventing operator injury due to accidental malfunctions of the coating machine. Utility Model Content

[0004] To overcome the shortcomings of existing technologies that release harmful gases during coating and subsequent curing processes, which can endanger the health of operators with prolonged exposure, and the fact that the handling of circuit boards often requires operators to be close to the equipment's working area, and that operators are at high risk of being pinched by moving parts when handling circuit boards at close range in the event of an unexpected malfunction of the coating machine, this utility model provides a solder resist coating device for charger circuit boards that can isolate harmful gases and allow the handling of circuit boards outside the isolation chamber, thus avoiding injury to operators due to unexpected malfunctions of the coating machine.

[0005] A solder resist coating device for printed circuit boards of chargers includes an isolation chamber, an observation window, a door, a coating table, a coating machine, a one-way air inlet valve, an air extraction component, and a moving component. The observation window is connected to the upper front side of the isolation chamber, and the door is rotatably connected to the right side of the isolation chamber. The coating table is connected inside the isolation chamber, and the coating machine is installed on the coating table. The one-way air inlet valve is connected to the upper right side of the isolation chamber. An air extraction component capable of purifying harmful gases inside the isolation chamber is provided on the upper side of the isolation chamber. A moving component is provided at the front of the isolation chamber to prevent operator injury due to coating machine malfunction when placing circuit boards.

[0006] Furthermore, a handle is provided on the right side of the hatch.

[0007] Furthermore, the air extraction assembly includes an air pump, a first connecting pipe, a treatment chamber, an adsorption plate, and a second connecting pipe. The air pump is connected to the upper front side of the isolation chamber, the first connecting pipe is connected to the upper side of the air pump, the treatment chamber is connected to the rear side of the first connecting pipe, the treatment chamber is connected to the upper side of the isolation chamber, the adsorption plate is placed inside the treatment chamber, and the second connecting pipe is connected to the rear side of the treatment chamber.

[0008] Furthermore, the adsorption plate is made of activated carbon.

[0009] Furthermore, it also includes a moving component, which includes a placement plate, a multi-stage telescopic cylinder, and a limit rod. The multi-stage telescopic cylinder is connected to the rear of the coating table. The multi-stage telescopic cylinder and the processor are electrically connected through a control module. The placement plate is connected to the telescopic end of the multi-stage telescopic cylinder. Limit rods are connected to the rear sides of both the left and right sides of the placement plate. The limit rods are all slidably connected to the coating table.

[0010] Furthermore, the placement plate is provided with placement slots.

[0011] The beneficial effects are as follows: 1. This utility model uses a multi-stage telescopic cylinder to move the placement plate forward, then places the circuit board on the placement plate. Next, the multi-stage telescopic cylinder moves the placement plate backward, so that the placement plate is located in the isolation chamber. The isolation chamber isolates the harmful gases and allows the circuit board to be placed and removed from outside the isolation chamber, thus avoiding injury to the operator due to accidental malfunction of the coating machine.

[0012] 2. This utility model activates an air pump, allowing air to enter through a one-way air inlet valve and then through a first connecting pipe into the treatment chamber. The harmful gases in the air are purified by an adsorption plate, and the purified gas is discharged through a second connecting pipe. This achieves the effect of purifying the harmful gases inside the isolation chamber and preventing them from harming personnel. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a three-dimensional structural diagram of the coating table and placement plate of this utility model.

[0015] Figure 3 This is a three-dimensional structural diagram of the multi-stage telescopic cylinder and limit rod of this utility model.

[0016] Figure 4 This is a three-dimensional structural diagram of the placement plate and multi-stage telescopic cylinder of this utility model.

[0017] Figure 5 This is a three-dimensional structural diagram of the processing chamber and adsorption plate of this utility model.

[0018] In the attached diagram, the following are the reference numerals: 1_isolation chamber, 2_observation window, 3_chamber door, 4_air pump, 5_first connecting pipe, 6_processing chamber, 7_coating table, 8_placement plate, 9_coating machine, 10_multi-stage telescopic cylinder, 11_limiting rod, 12_adsorption plate, 13_second connecting pipe, and 14_one-way air inlet valve. Detailed Implementation

[0019] The preferred technical solution of this utility model will be described in detail below with reference to the accompanying drawings.

[0020] A solder resist coating device for printed circuit boards of chargers, such as Figures 1-3 As shown, it includes an isolation chamber 1, an observation window 2, a door 3, a coating table 7, a coating machine 9, a one-way air inlet valve 14, an air extraction assembly, and a moving assembly. The observation window 2 is connected to the upper front of the isolation chamber 1. The door 3 is rotatably connected to the right side of the isolation chamber 1. The door 3 has a handle on the right side for easy gripping. The coating table 7 is connected inside the isolation chamber 1. The coating machine 9 is installed on the coating table 7. The one-way air inlet valve 14 is connected to the upper right of the isolation chamber 1. The air extraction assembly is located on the upper side of the isolation chamber 1. The moving assembly is located at the front of the isolation chamber 1.

[0021] like Figure 1 and Figure 5 As shown, the air extraction assembly includes an air pump 4, a first connecting pipe 5, a treatment chamber 6, an adsorption plate 12, and a second connecting pipe 13. The air pump 4 is connected to the upper front side of the isolation chamber 1, the first connecting pipe 5 is connected to the upper side of the air pump 4, the treatment chamber 6 is connected to the rear side of the first connecting pipe 5, the treatment chamber 6 is connected to the upper side of the isolation chamber 1, the adsorption plate 12 is placed inside the treatment chamber 6, the adsorption plate 12 is made of activated carbon, and the second connecting pipe 13 is connected to the rear side of the treatment chamber 6.

[0022] like Figures 2-4 As shown, it also includes a moving component, which includes a placement plate 8, a multi-stage telescopic cylinder 10, and a limiting rod 11. The multi-stage telescopic cylinder 10 is connected to the rear of the coating table 7. The multi-stage telescopic cylinder 10 and the processor are electrically connected through a control module. The placement plate 8 is connected to the telescopic end of the multi-stage telescopic cylinder 10. The placement plate 8 is provided with a placement groove to facilitate the placement of the circuit board. Limiting rods 11 are connected to the rear sides of both the left and right sides of the placement plate 8. The limiting rods 11 are slidably connected to the coating table 7.

[0023] When using this device, first place the isolation chamber 1 in the solder resist coating area of ​​the charger circuit board. Then, the processor starts the multi-stage telescopic cylinder 10 through the control module, which drives the placement plate 8 and the limit rod 11 to move forward. Then, place the circuit board on the placement plate 8. Next, the multi-stage telescopic cylinder 10 drives the placement plate 8 to move backward, so that the placement plate 8 is located inside the isolation chamber 1. Then, control the coating machine 9 to perform solder resist coating on the circuit board. During the process, the isolation chamber 1 is used for isolation, which can isolate harmful gases. The circuit board can be picked up and put away outside the isolation chamber 1, avoiding accidental malfunction of the coating machine 9 that could cause injury to the operator. Then, the air pump 4 is started, allowing air to enter through the one-way air inlet valve 14, and then through the first connecting pipe 5 into the treatment chamber 6. The harmful gases in the air are purified by the adsorption plate 12, and the purified gas is discharged through the second connecting pipe 13. This process can purify the harmful gases inside the isolation chamber 1 and prevent them from harming personnel. When the coating machine 9 needs to be inspected, the door 3 can be turned and opened to inspect the coating machine 9.

[0024] It should be understood that the above description is for illustrative purposes only and is not intended to limit the present invention. Those skilled in the art will understand that variations of the present invention will be included within the scope of the claims herein.

Claims

1. A solder resist coating device for printed circuit boards of chargers, characterized in that: It includes an isolation chamber (1), an observation window (2), a door (3), a coating table (7), a coating machine (9), a one-way air inlet valve (14), an air extraction assembly, and a moving assembly. The observation window (2) is connected to the upper front of the isolation chamber (1), and the door (3) is rotatably connected to the right side of the isolation chamber (1). The coating table (7) is connected inside the isolation chamber (1), and the coating machine (9) is installed on the coating table (7). The one-way air inlet valve (14) is connected to the upper right side of the isolation chamber (1). An air extraction assembly capable of purifying harmful gases inside the isolation chamber (1) is provided on the upper side of the isolation chamber (1). A moving assembly capable of preventing operator injury due to coating machine (9) malfunction when placing circuit boards is provided at the front of the isolation chamber (1).

2. The solder resist coating apparatus for printed circuit boards of a charger according to claim 1, characterized in that: The hatch (3) has a handle on the right side.

3. The solder resist coating apparatus for printed circuit boards of a charger according to claim 1, characterized in that: The air extraction assembly includes an air pump (4), a first connecting pipe (5), a treatment chamber (6), an adsorption plate (12), and a second connecting pipe (13). The air pump (4) is connected to the upper front of the isolation chamber (1), the first connecting pipe (5) is connected to the upper side of the air pump (4), the treatment chamber (6) is connected to the rear side of the first connecting pipe (5), the treatment chamber (6) is connected to the upper side of the isolation chamber (1), the adsorption plate (12) is placed inside the treatment chamber (6), and the second connecting pipe (13) is connected to the rear side of the treatment chamber (6).

4. A solder resist coating apparatus for printed circuit boards of a charger according to claim 3, characterized in that: The adsorption plate (12) is made of activated carbon.

5. A solder resist coating apparatus for printed circuit boards of a charger according to claim 1, characterized in that: It also includes a moving component, which includes a placement plate (8), a multi-stage telescopic cylinder (10) and a limiting rod (11). The multi-stage telescopic cylinder (10) is connected to the rear of the coating table (7). The multi-stage telescopic cylinder (10) and the processor are electrically connected through a control module. The placement plate (8) is connected to the telescopic end of the multi-stage telescopic cylinder (10). The left and right rear sides of the placement plate (8) are connected to the limiting rod (11). The limiting rod (11) is slidably connected to the coating table (7).

6. A solder resist coating apparatus for printed circuit boards of a charger according to claim 5, characterized in that: The placement plate (8) is provided with a placement slot.

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