Electronic speed controller capacitor mounting structure

Abstract

The utility model provides a kind of electronic speed regulator capacitor mounting structure, including main circuit board, transition circuit board and capacitor;The main circuit board is equipped with first through-hole, and forms reinforcing pad at first through-hole;Second through-hole is equipped on the transition circuit board, and transition circuit board lower end is equipped with gold finger type pad, the gold finger type pad is electrically connected with the second through-hole, the gold finger type pad of the transition circuit board passes through first through-hole and forms composite weld point by welding;The capacitor is arranged multiple along transition circuit board length direction, and the pin of capacitor is vertically inserted into the second through-hole and forms composite weld point by welding.The electronic speed regulator capacitor mounting structure of the utility model is easy to produce, and high tensile strength, and mechanical and electrical performance reliability is high.

Description

Technical Field

[0001] This utility model relates to the field of electronic speed controller technology, and more specifically, to an electronic speed controller capacitor mounting structure. Background Technology

[0002] In electronic speed controllers, the current standard implementation involves bending the electrolytic capacitor leads by 90° and then inserting them into vias on the PCB board for soldering. However, the bending process easily creates microscopic metal cracks in the capacitor leads, and mechanical vibration or thermal stress can cause fatigue, leading to a risk of lead breakage during transportation and use, thus compromising mechanical reliability. Furthermore, the standard 0.5mm diameter lead cross-sectional area is only 0.196mm². When the electronic speed controller's operating current exceeds 1.5A, the current density reaches 7.65A / mm² (exceeding the safety threshold of 5A / mm² specified in IEC 60384-4). Sustained overcurrent will cause the leads to overheat and melt, creating an electrical performance bottleneck. Additionally, the irregularly shaped bent leads are incompatible with wave soldering equipment, requiring manual soldering, which is detrimental to production. Utility Model Content

[0003] The purpose of this utility model is to solve the above-mentioned technical problems and provide an electronic speed controller capacitor mounting structure that has strong mechanical reliability, stable electrical performance, and is easy to manufacture.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] This utility model provides a capacitor mounting structure for an electronic speed controller, including: a main circuit board, a transition circuit board, and capacitors; the main circuit board has a first through hole and a reinforced pad is formed at the first through hole; the transition circuit board has a second through hole and a gold finger pad at the lower end of the transition circuit board, the gold finger pad being electrically connected to the second through hole, the gold finger pad of the transition circuit board passing through the first through hole and forming a composite solder joint through welding; multiple capacitors are arranged along the length of the transition circuit board, the leads of the capacitors being vertically inserted into the second through hole and forming a composite solder joint through welding.

[0006] In one embodiment, the transition circuit board includes a PCB substrate on which multiple layers of copper foil conductive layers are disposed and an integrated current distribution network is formed.

[0007] In one embodiment, the integrated current distribution network includes parallel current paths with multiple current paths and multiple vias, a heat-diffusing copper foil area with multiple thermally conductive vias, and a mechanically reinforcing frame surrounding the edge of the PCB substrate.

[0008] In one embodiment, the multilayer copper foil conductive layer defines a positive electrode setting area and a negative electrode setting area, the positive electrode pin of the capacitor is soldered to the positive electrode setting area, and the negative electrode pin of the capacitor is soldered to the negative electrode setting area, wherein the pin arrangement direction of at least one capacitor is perpendicular to the arrangement direction among the multiple capacitors.

[0009] In one embodiment, the transition circuit board is provided with positioning holes for positioning pins on the carrier holding the capacitor to be inserted and positioned.

[0010] In one embodiment, the capacitor pins are coated with a 30 μm thick paraffin nanocoating.

[0011] The beneficial effects of the technical solution provided by this utility model are as follows: The capacitor mounting structure of this utility model, by vertically inserting the capacitor leads into the transition circuit board and soldering them to the transition circuit board, and then vertically inserting the transition circuit board into the main circuit board, eliminates the need to bend the capacitor leads, eliminates bending stress concentration, reduces the probability of breakage during vibration testing, and improves tensile strength. In addition, the direct-insertion structure improves the yield rate of wave soldering, increases soldering efficiency, and eliminates manual processes, realizing fully automated production. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments of this utility model will be briefly introduced below.

[0013] Figure 1 This is a schematic diagram of the electronic speed controller capacitor mounting structure provided in one embodiment of the present invention;

[0014] Figure 2 for Figure 1 A schematic diagram of the electronic speed controller capacitor mounting structure from another perspective.

[0015] Figure 3 This is a schematic diagram of the structure of a transition circuit board provided in one embodiment of the present invention. Detailed Implementation

[0016] Embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While some embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the accompanying drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0017] It should be understood that the steps described in the method embodiments of this utility model may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of this utility model is not limited in this respect.

[0018] The term "comprising" and its variations as used herein are open-ended, meaning "including but not limited to". The term "connection" can refer to a direct connection or an indirect connection via intermediate components (elements). The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the following description.

[0019] It should be noted that the concepts of "first" and "second" mentioned in this utility model are only used to distinguish between devices, modules or units, and are not used to limit these devices, modules or units to necessarily be different devices, modules or units, nor are they used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0020] See Figures 1 to 3 This utility model provides an electronic speed controller capacitor mounting structure (hereinafter referred to as "mounting structure") and an electronic speed controller capacitor mounting method for forming the mounting structure (hereinafter referred to as "mounting method"), which improves the tensile strength, enhances stability, improves welding efficiency, and enables fully automated production.

[0021] The mounting structure includes a main circuit board 3, a transition circuit board 31, and a capacitor 1. The capacitor 1 is preferably an electrolytic capacitor 1, which is inserted into the transition circuit board 31. The transition circuit board 31 is vertically inserted into the main circuit board 3, and the capacitor 1 is electrically connected to the main circuit board 3 via the transition circuit board 31.

[0022] Specifically, the main circuit board 3 has a first through hole, and a reinforced pad is formed at the first through hole. The transition circuit board 31 has a second through hole, and a gold finger pad 311 is provided at the lower end of the transition circuit board 31. The gold finger pad 311 is electrically connected to the second through hole. The gold finger pad 311 of the transition circuit board 31 passes through the first through hole and is soldered to form a composite solder joint 314. Multiple capacitors 1 are arranged along the length of the transition circuit board 31. The leads 2 of the capacitors 1 are vertically inserted into the second through hole and soldered to form composite solder joints 314. The composite solder joint 314 is a solder joint that realizes both mechanical connection and fixation between the capacitors 1 and the transition circuit board 31 or between the transition circuit board 31 and the main circuit board 3, and also realizes their electrical connection.

[0023] In one embodiment, the transition circuit board 31 includes a PCB substrate with multiple layers of copper foil conductive layers 313 forming an integrated current distribution network. The PCB substrate uses a high-TG substrate, capable of withstanding temperatures above 150°C. The bottom layer of the substrate features gold finger pads with immersion gold surface treatment to ensure reliable contact. The implementation of a multi-layer copper foil stack architecture on the substrate, along with a high-density copper via array, increases the effective conductive cross-sectional area, reducing the current density under the same operating current. This lowers the overall system temperature, preventing capacitor 1 pin 2 from melting and improving system stability. Furthermore, the multiple layers of copper foil conductive layers 313 form a grid-like reinforcing rib structure on the substrate, enhancing its bending strength.

[0024] In one embodiment, the integrated current distribution network includes a parallel current path with multiple current paths and multiple vias, a heat-diffusion copper foil area with multiple thermally conductive through-holes 312, and a mechanically reinforcing frame surrounding the edge of the PCB substrate, which reduces the probability of breakage during vibration testing and improves the tensile strength of the mounting structure.

[0025] In one embodiment, the multilayer copper foil conductive layer 313 defines a positive electrode setting area and a negative electrode setting area. The positive electrode pin 2 of the capacitor 1 is soldered to the positive electrode setting area, and the negative electrode pin 2 of the capacitor 1 is soldered to the negative electrode setting area. The pin 2 of at least one capacitor 1 is arranged perpendicular to the arrangement direction between multiple capacitors 1. Thus, the positions of the positive electrode setting area and the negative electrode setting area are arranged in a reasonable manner, improving the space utilization of the transition circuit board 31.

[0026] In one embodiment, the transition circuit board 31 is provided with positioning holes for the positioning pins on the carrier holding the capacitor 1 to be inserted and positioned.

[0027] Secondly, this utility model also provides a method for mounting an electronic speed controller capacitor, used to assemble the above-mentioned electronic speed controller capacitor mounting structure, comprising the following steps:

[0028] The transition circuit board 31 is positioned and mounted on a carrier made of high-temperature resistant synthetic stone. The carrier is designed with positioning pins (tolerance ±0.02mm) that precisely match the positioning holes on the substrate of the transition circuit board 31, achieving zero-skew insertion.

[0029] The capacitor 1 is gripped by a vacuum nozzle clamp, and its leads 2 are vertically inserted into the second through hole of the transition circuit board 31. A wave soldering machine is then used to form a composite solder joint 314. In this embodiment, an AV132 series high-precision automatic insertion machine is used to complete the vertical assembly of the straight leads 2 of the capacitor 1 with the transition circuit board 31. The automatic insertion machine uses a customized vacuum nozzle clamp (with an aperture adapted to the capacitor diameter ±0.05mm) to grip the capacitor 1, ensuring stable gripping of the leads 2. The insertion pressure is 50±5N to prevent lead 2 deformation, the insertion speed is 200 leads 2 / minute, and a vision positioning system (accuracy ±0.01mm) is used for real-time calibration.

[0030] The workpiece, after being welded to the transition circuit board 31 and capacitor 1, is inserted into the main circuit board 3, and a composite solder joint 314 is formed by wave soldering at the gold finger pads 311 of the transition circuit board 31 and the reinforced pads of the main circuit board 3. A selective dual-wave soldering machine (model RS-1R) is used for soldering, equipped with a nitrogen protection system (oxygen content <100ppm) to reduce oxidation. The welding carrier is made of titanium alloy with a Teflon coating to prevent weld slag adhesion.

[0031] Furthermore, it also includes a pin trimming step, which includes: after the capacitor 1 is soldered to the transition circuit board 31, the length of the pin 2 of the capacitor 1 protruding from the transition circuit board 31 is fed back in real time by the laser ranging module; the excess part of the pin 2 is trimmed by a CNC pin trimming machine of model BEX-113, so that the target value of the pin 2 length is 2.0±0.1mm.

[0032] Furthermore, the method includes the following steps: after the capacitor 1 is soldered to the transition circuit board 31, the integrity of the solder joint and the perpendicularity of the pin 2 are detected by an automatic optical inspection module. Specifically, the void ratio of the solder joint is <5%, and the deviation of the perpendicularity of the pin 2 is <0.5°.

[0033] Furthermore, the method includes the following steps: before assembling capacitor 1 with transition circuit board 31, plasma cleaning is performed on the leads 2 of the capacitor to remove the oxide layer and improve wettability. The plasma cleaning power is 300W, and the time is 30s.

[0034] After the capacitor 1 is soldered to the transition circuit board 31, the pin 2 is vacuum coated to form a 30μm thick paraffin nano-coating, which enhances the pin's vibration resistance and corrosion resistance.

[0035] Furthermore, the method includes the following steps: Preheating is performed in three stages: 80°C → 120°C → 160°C, for 60 seconds, before soldering the capacitor 1 to the transition circuit board 31. Soldering is then performed using a solder bath at 245±2°C, which helps reduce moisture absorption by the substrate and control soldering quality. In other embodiments, other temperature values ​​can be used for preheating as needed, with the temperature difference between adjacent stages being the same, for example, a temperature difference of 40°C.

[0036] The above description is merely a preferred embodiment of this utility model and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of this utility model is not limited to the specific combination of the above-described technical features, but also includes other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features of the utility model in this utility model that have similar functions.

[0037] Although the subject matter has been described using language specific to structural features and / or methodological logic, it should be understood that the subject matter defined in the appended claims is not necessarily limited to the specific features or actions described above. Rather, the specific features and actions described above are merely illustrative examples of implementing the claims.

Claims

1. A capacitor mounting structure for an electronic speed controller, characterized in that, include: Main circuit board, transition circuit board and capacitors; The main circuit board has a first through hole, and a reinforced pad is formed at the first through hole; The transition circuit board has a second through hole and a gold finger pad at the lower end. The gold finger pad is electrically connected to the second through hole. The gold finger pad of the transition circuit board passes through the first through hole and forms a composite solder joint through welding. The capacitor is an electrolytic capacitor, and the capacitor leads are vertically inserted into the second through hole and welded to form a composite solder joint.

2. The electronic speed controller capacitor mounting structure according to claim 1, characterized in that, The transition circuit board includes a PCB substrate, on which multiple layers of copper foil conductive layers are provided to form an integrated current distribution network.

3. The electronic speed controller capacitor mounting structure according to claim 2, characterized in that, The integrated current distribution network includes parallel current paths with multiple current paths and multiple vias, a heat-diffusion copper foil area with multiple thermally conductive through holes, and a mechanically reinforcing frame surrounding the edge of the PCB substrate.

4. The electronic speed controller capacitor mounting structure according to claim 2, characterized in that, The capacitor is provided in multiple ways. The multilayer copper foil conductive layer defines a positive electrode setting area and a negative electrode setting area. The positive electrode pin of the capacitor is soldered to the positive electrode setting area, and the negative electrode pin of the capacitor is soldered to the negative electrode setting area. The pin arrangement direction of at least one capacitor is perpendicular to the arrangement direction between the multiple capacitors.

5. The electronic speed controller capacitor mounting structure according to claim 4, characterized in that, The capacitors are arranged along the length of the transition circuit board.

6. The electronic speed controller capacitor mounting structure according to claim 1, characterized in that, The transition circuit board is provided with positioning holes for the positioning pins on the carrier that holds the capacitor to be inserted and positioned.

7. The electronic speed controller capacitor mounting structure according to claim 1, characterized in that, The capacitor leads are coated with a Pyrelin nano-coating.

8. The electronic speed controller capacitor mounting structure according to claim 7, characterized in that, The thickness of the Pirilin nanocoating is 30 μm.

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