A multilayer wiring board press device

Abstract

The utility model discloses a kind of multilayer circuit board compression devices, belong to circuit board compression technical field.A kind of multilayer circuit board compression device, including first electric slide rail fixedly installed on machine body, first electric slide rail is slidably connected with second electric slide rail, further include: the stepped down plate of sliding connection on second electric slide rail, and the stepped surface of the down plate is equidistantly arranged with positioning area, and stepped up plate is fixedly installed on machine body by drive cylinder, and the stepped surface of up plate and the stepped surface of down plate are complementary cooperation;Positioning member movably installed on up plate, the position of the positioning member corresponds with positioning area;The utility model uses stepped down plate and up plate cooperation, so that compression device can be compressed to multiple groups of circuit board once, effectively improve the working efficiency of device, while positioning member can effectively prevent the problem that multiple layers of circuit board slip relatively when being pressed.

Description

Technical Field

[0001] This utility model relates to the field of circuit board lamination technology, and in particular to a multilayer circuit board lamination device. Background Technology

[0002] Circuit boards are the core substrates in electronic devices used to carry and connect electronic components. They are composed of insulating materials and conductive circuit layers. When manufacturing multilayer circuit boards, high-temperature and high-pressure processing is required using a lamination device: by precisely controlling the temperature, pressure and time, the multilayer insulating materials and copper foil are melted together, eliminating interlayer bubbles and gaps, ensuring that the board structure is compact, uniform in thickness and flat, thereby meeting the precision requirements of high-density circuit design. This is a key process in the production of high-performance complex electronic devices.

[0003] The multilayer circuit board laminating device mainly consists of a hydraulic or mechanical pressure system, a heating plate module, a multilayer high-flatness laminating platform, a precision positioning system, a cooling device, and an intelligent control system. Its operation process is as follows: First, the core board, prepreg, and copper foil are stacked and precisely aligned in sequence and loaded between the hot plates of the laminating machine; then, pressure is applied in stages, with low temperature and low pressure pre-pressing to expel air, followed by heating and applying high pressure to melt the resin and fill the gaps between the layers, and heat preservation and pressure holding to solidify the structure; finally, the cooling system is activated to cool down and shape the board, and the laminated board is removed for subsequent processing.

[0004] In existing technologies, conventional circuit board laminating devices typically employ a single-press-one-circuit-board working mode, which has significant limitations in processing efficiency and cannot meet the production needs of simultaneously laminating multiple circuit boards. Furthermore, a particularly prominent technical problem during the lamination process is that when the adhesive coating on the circuit board surface is not yet cured and dried, pressure is applied. Because the adhesive is still in a highly fluid state, it is very easy for the stacked circuit boards to slip relative to each other or shift as a whole under pressure. This positional shift during the lamination process not only directly affects the interlayer alignment accuracy but also damages the structural reliability and electrical performance of the final product. Utility Model Content

[0005] The purpose of this invention is to solve the problems of low working efficiency of existing lamination devices and the resulting relative slippage or overall displacement of the circuit board during the lamination process, and to propose a multi-layer circuit board lamination device.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A multilayer circuit board laminating device includes a first electric slide rail fixedly mounted on a machine body, a second electric slide rail slidably connected to the first electric slide rail, and a stepped lower pressure plate slidably connected to the second electric slide rail, wherein positioning areas are evenly distributed on the stepped surface of the lower pressure plate. A stepped upper pressure plate is fixedly mounted on the machine body via a drive cylinder, the stepped surfaces of the upper pressure plate and the lower pressure plate complement each other, and when the upper pressure plate moves downward, it can tightly fit against the stepped surface of the lower pressure plate. A positioning component is movably mounted on the upper pressure plate, the position of the positioning component corresponding to the positioning area, and the inner end face of the positioning component coincides with the edge of the corresponding positioning area.

[0007] To prevent relative slippage of the circuit board, preferably, the positioning component includes a top plate slidably mounted on the upper pressure plate, wherein the upper pressure plate has a mounting groove, a buffer spring is fixedly installed in the mounting groove, and the two ends of the buffer spring abut against the upper pressure plate and the top plate respectively. When the upper pressure plate moves down, the inner end face of the top plate contacts the circuit board.

[0008] To prevent the edge of the circuit board from being damaged due to the downward movement of the top plate edge, the inner end face of the top plate is further provided with an inclined surface, and the inclination angle of the inclined surface is in the range of 30-60 degrees.

[0009] To further prevent the circuit board from moving under pressure, the top plate is designed in an "L" shape, and the included angle of the inner end face of the top plate coincides with the corner of the positioning area.

[0010] To accommodate circuit boards of different sizes, preferably, the area of ​​the positioning area corresponds to the stepped surface of the pressure plate decreasing from bottom to top.

[0011] To prevent the overflowing adhesive from sticking to the equipment, preferably, the surfaces of the lower pressure plate, upper pressure plate, and top plate are all coated with a Teflon coating.

[0012] Compared with the prior art, the present invention provides a multilayer circuit board laminating device, which has the following beneficial effects: 1. This multi-layer circuit board pressing device, through the cooperation of a stepped lower pressing plate and an upper pressing plate, and through multiple positioning areas set on the stepped surface, can simultaneously press multiple circuit boards, avoiding the problem of low work efficiency caused by pressing a single circuit board at a time, and effectively improving the working efficiency of the pressing device.

[0013] 2. This multi-layer circuit board laminating device, by using a top plate and buffer spring set with positioning components in conjunction with the positioning area, ensures that the inner end face of the top plate contacts the edge of the circuit board. At this time, the upper pressure plate does not directly contact the circuit board. By restricting the edge of the circuit board through the top plate, it can effectively prevent relative slippage between the multi-layer circuit boards due to the adhesive not being dry during the lamination process of the upper pressure plate. This improves the alignment accuracy between the layers of the circuit board during the lamination process, and effectively enhances the reliability and electrical performance of the product structure.

[0014] The parts not covered in this device are the same as or can be implemented using existing technology. This utility model uses a stepped lower pressure plate and an upper pressure plate in combination to enable the pressing device to press multiple circuit boards at one time, effectively improving the working efficiency of the device. At the same time, the positioning component can effectively prevent the relative slippage of multi-layer circuit boards when they are under pressure. Attached Figure Description

[0015] Figure 1 This is an isometric structural diagram of a multilayer circuit board laminating device proposed in this utility model; Figure 2 This is a partial structural diagram of a multilayer circuit board laminating device proposed in this utility model. Figure 1 ; Figure 3 This is a partial structural diagram of a multilayer circuit board laminating device proposed in this utility model. Figure 2 ; Figure 4 This utility model proposes a multilayer circuit board laminating device. Figure 3 Enlarged structural diagram at point A in the middle; Figure 5 This is a schematic diagram of the lower pressure plate structure of a multilayer circuit board pressing device proposed in this utility model; Figure 6 This is a schematic diagram of the upper pressure plate structure of a multilayer circuit board pressing device proposed in this utility model.

[0016] In the diagram: 1. First electric slide rail; 2. Second electric slide rail; 3. Lower pressure plate; 31. Positioning area; 4. Upper pressure plate; 5. Mounting groove; 6. Buffer spring; 7. Top plate. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0018] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0019] Example: Reference Figures 1-6 A multi-layer circuit board pressing device includes a first electric slide rail 1 fixedly mounted on a machine body, a second electric slide rail 2 slidably connected to the first electric slide rail 1, and the second electric slide rail 2 and the first electric slide rail 1 being installed horizontally and vertically. It also includes a stepped lower pressure plate 3 slidably connected to the second electric slide rail 2, with positioning areas 31 evenly arranged on the stepped surface of the lower pressure plate 3. Preferably, the lower pressure plate 3 has three sets of stepped surfaces, and each set of stepped surfaces is provided with positioning areas 31 of equal area. This allows multiple circuit boards to be pressed simultaneously in a single pressing process, thereby improving the working efficiency of this application. The area of ​​the positioning areas 31 decreases from bottom to top on the stepped surface of the lower pressure plate 3. This decreasing area of ​​the positioning areas 31 allows for the adaptation of circuit boards of different sizes, thereby improving the adaptability of this application and avoiding limitations caused by different circuit board sizes. A stepped upper pressure plate 4 is fixedly installed on the machine body via a drive cylinder. The stepped surface of the upper pressure plate 4 complements the stepped surface of the lower pressure plate 3. When the upper pressure plate 4 moves down, it can fit tightly with the stepped surface of the lower pressure plate. Through the complementary cooperation of the stepped surfaces of the upper pressure plate 4 and the lower pressure plate 3, it is convenient to press the circuit board on the positioning area 31, preventing the upper pressure plate 4 from only pressing a single circuit board when it is working, thereby improving the working efficiency of this application. A positioning component is movably installed on the upper pressure plate 4. The position of the positioning component corresponds to the positioning area 31, and the inner end face of the positioning component coincides with the edge of the corresponding positioning area 31. The positioning component can be used to position the circuit board on the one hand, and prevent the circuit board from relatively sliding or shifting as a whole during the pressing process on the other hand. This effectively improves the alignment accuracy between circuit board layers during the pressing process of the circuit board, thereby improving the reliability and electrical performance of the product structure.

[0020] Specifically, by using the stepped lower pressure plate 3 and upper pressure plate 4 in combination, and through the multiple positioning areas 31 set on the stepped surface, multiple circuit boards can be pressed at the same time, avoiding the problem of low work efficiency caused by pressing a single circuit board at a time, and effectively improving the work efficiency of the pressing device.

[0021] The positioning component includes a top plate 7 that is slidably mounted on the upper pressure plate 4. The top plate 7 is L-shaped, and the included angle of the inner end face of the top plate 7 coincides with the corner of the positioning area 31. By utilizing the L-shaped top plate 7, the movement of the circuit board is restricted during the pressing process of the upper pressure plate 4, thereby improving the accuracy of interlayer alignment of the multilayer circuit board during the pressing process. The upper pressure plate 4 has a mounting groove 5, and a buffer spring 6 is fixedly installed in the mounting groove 5. The two ends of the buffer spring 6 abut against the upper pressure plate 4 and the top plate 7, respectively. When the upper pressure plate 4 moves down, the inner end face of the top plate 7 contacts the circuit board. The circuit board is restricted to the inner end face of the top plate 7, thereby avoiding the problem of relative slippage or overall displacement of the circuit board when it is pressed by the upper pressure plate 4. At the same time, when the top plate moves down, the inner end face can be used to align the offset circuit board placed by the operator, thereby improving the interlayer alignment accuracy of the circuit board before pressing and effectively avoiding the problem of reduced product structural reliability due to placement deviation after the circuit board is pressed.

[0022] When the top plate 7 and buffer spring 6, which are set by positioning components, are used in conjunction with the positioning area 31, the inner end face of the top plate 7 contacts the edge of the circuit board. At this time, the upper pressure plate 4 does not directly contact the circuit board. After the edge of the circuit board is restricted by the top plate 7, it can effectively prevent the problem of relative slippage between multiple circuit boards due to the adhesive not being dry when the upper pressure plate 4 is pressing the circuit board. This improves the alignment accuracy between layers of the circuit board during the pressing process and effectively improves the reliability and electrical performance of the product structure.

[0023] The inner end face of the top plate 7 is provided with an inclined surface, and the inclination angle of the inclined surface is in the range of 30-60 degrees. The preferred angle of the inclined surface of the top plate 7 in this application is 45 degrees. The 45-degree inclined surface can prevent the edge of the circuit board from being damaged when the top plate 7 moves down. On the other hand, it can push the circuit board to move when the top plate 7 moves down, thereby improving the interlayer alignment accuracy of the circuit board and thus improving the reliability of the multilayer circuit board structure after lamination processing in this application.

[0024] The surfaces of the lower pressure plate 3, upper pressure plate 4, and top plate 7 are all coated with Teflon. The Teflon coating prevents the circuit board from overflowing under pressure when the upper pressure plate 4 is working, thus preventing glue from sticking to the equipment and contaminating the device. This effectively improves the cleanliness of the surfaces of the lower pressure plate 3, upper pressure plate 4, and top plate 7 during operation and avoids the problem of misalignment caused by glue sticking to the device on the circuit board.

[0025] In this invention, the lower pressure plate 3 is first slid outward by the second electric slide rail 2, and then the multilayer circuit board is placed in the corresponding positioning area 31. The second electric slide rail 2 then operates again to move the lower pressure plate 3 into the working area. The drive cylinder then operates and pushes the upper pressure plate 4 downward. During the movement of the upper pressure plate 4, the top plate 7 first contacts the circuit board. Then, the inner end face of the top plate 7 moves downward along the edge of the circuit board and corrects any misalignment, preventing interlayer misalignment. At this point, the upper pressure plate 4 continues to move downward until it contacts the circuit board. The pressure plate 4 presses the circuit board. At this time, the top plate 7 contacts the lower pressure plate 3 and is pressed into the mounting groove 5, compressing the buffer spring 6. The buffer spring 6 deforms and contracts until the pressing process is completed. The top plate 7 always stays at the edge of the circuit board. Then the upper pressure plate 4 moves and separates from the circuit board. At this time, the pressure of the buffer spring 6 decreases and deforms. Then the top plate 7 is pushed out of the mounting groove 5 and reset. The pressing process of the circuit board is completed. Then the second electric slide rail 2 drives the lower pressure plate 3 to slide outward, making it easy for the staff to take the pressed circuit board out of the work area.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A multilayer circuit board laminating device, comprising a first electric slide rail (1) fixedly mounted on a machine body, wherein a second electric slide rail (2) is slidably connected to the first electric slide rail (1), characterized in that, Also includes: A stepped lower pressure plate (3) is slidably connected to the second electric slide rail (2), and positioning areas (31) are equidistantly arranged on the stepped surface of the lower pressure plate (3). Among them, an upper pressure plate (4) in a stepped shape is fixedly installed on the body by a drive cylinder. The stepped surface of the upper pressure plate (4) and the stepped surface of the lower pressure plate (3) complement each other. When the upper pressure plate (4) moves down, it can fit tightly with the stepped surface of the lower pressure plate (3). The positioning element is mounted on the upper pressure plate (4), the position of the positioning element corresponds to the positioning area (31), and the inner end face of the positioning element coincides with the edge of the corresponding positioning area (31).

2. The multilayer circuit board laminating device according to claim 1, characterized in that, The positioning element includes a top plate (7) that is slidably mounted on the upper pressure plate (4). The upper pressure plate (4) has an installation groove (5) and a buffer spring (6) is fixedly installed in the installation groove (5). The two ends of the buffer spring (6) abut against the upper pressure plate (4) and the top plate (7) respectively. When the upper pressure plate (4) moves down, the inner end face of the top plate (7) contacts the circuit board.

3. The multilayer circuit board laminating device according to claim 2, characterized in that, The inner end face of the top plate (7) is provided with an inclined surface, and the inclination angle of the inclined surface is in the range of 30-60 degrees.

4. The multilayer circuit board laminating device according to claim 3, characterized in that, The top plate (7) is set in an "L" shape, and the corner of the inner end face of the top plate (7) coincides with the corner of the positioning area (31).

5. The multilayer circuit board laminating device according to claim 1, characterized in that, The area of ​​the positioning area (31) corresponds to the stepped surface of the pressure plate (3), which decreases from bottom to top.

6. The multilayer circuit board laminating device according to claim 1, characterized in that, The surfaces of the lower pressure plate (3), upper pressure plate (4) and top plate (7) are all coated with Teflon.

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