A power amplifier assembly, a radio frequency thawing device and a refrigeration appliance

Abstract

The power amplifier assembly provided by the embodiment of the application comprises a shell, a power supply circuit board and a filtering structure. The shell has a panel and a shielding cavity, the panel is provided with a first wire outlet hole and a second wire outlet hole which are in communication with the shielding cavity, and the power supply circuit board is installed in the shielding cavity. The filtering structure is installed in the shielding cavity, the filtering structure is attached to the panel and covers the first wire outlet hole and the second wire outlet hole, the filtering structure comprises a filtering circuit board, a filtering circuit arranged on the filtering circuit board, a power connection end and a signal connection end, the filtering circuit board is connected with the power supply circuit board and grounded, and the power connection end and the signal connection end are connected to the filtering circuit. The power connection end is wired through the first wire outlet hole, and the signal connection end is wired through the second wire outlet hole.

Description

Technical Field

[0001] This application belongs to the field of household appliance technology, and in particular relates to a power amplifier component, a radio frequency defrosting device, and a refrigeration equipment. Background Technology

[0002] Radio frequency (RF) solid-state power amplifiers are increasingly used in home appliances, especially in microwave heating and RF defrosting. To ensure these products meet testing requirements, addressing EMC (Electromagnetic Compatibility) issues is crucial, particularly for products containing RF signals, where mitigating radiated interference is paramount. To address these issues, home appliance manufacturers need to implement measures to improve shielding effectiveness. For example, in microwave ovens, metal shielding enclosures can prevent microwave leakage, and filters can be used to reduce EMC interference.

[0003] During food heating or defrosting, high radio frequency (RF) power is required to meet the energy needs of the food. High-power, high-frequency RF signals place significant demands on the EMC design of the entire product. Solid-state power amplifiers include a housing for shielding radiation; however, in related technologies, because solid-state power amplifiers require signal and power lines to pass through the housing, cable coupling radiation occurs, affecting the shielding effectiveness of the solid-state power amplifier. Summary of the Invention

[0004] This application aims to solve, at least to some extent, the technical problem. To this end, this application provides a solution.

[0005] In a first aspect, embodiments of this application provide a power amplifier component, including:

[0006] The housing and power circuit board are provided. The housing has a panel and a shielding cavity. The panel has a first cable outlet and a second cable outlet communicating with the shielding cavity. The power circuit board is installed inside the shielding cavity.

[0007] A filtering structure is installed inside the shielding cavity. The filtering structure is attached to the panel and covers the first and second cable outlet holes. The filtering structure includes a filtering circuit board and a filtering circuit, a power connection terminal, and a signal connection terminal disposed on the filtering circuit board. The filtering circuit board is connected to the power supply circuit board and grounded. The power connection terminal and the signal connection terminal are connected to the filtering circuit.

[0008] The power connection terminal is routed through the first output hole, and the signal connection terminal is routed through the second output hole.

[0009] In the power amplifier assembly proposed in this application embodiment, the power connection terminal is routed through the first output hole, and the signal connection terminal is routed through the second output hole. Therefore, the power line can be connected to the power connection terminal through the first output hole, and the signal line can be connected to the signal connection terminal through the second output hole. Since the power connection terminal and the signal connection terminal are connected to the filter circuit, and the filter circuit board is grounded, the coupling radiation at the power line and the signal line can be filtered to ground by the filter circuit, which greatly improves the shielding effectiveness of the power amplifier assembly.

[0010] In some embodiments, the filter circuit board and the power circuit board are arranged at an angle, the power connection terminal and the signal connection terminal are located on the side of the filter circuit board facing the panel, the power connection terminal is corresponding to the first output hole, and the signal connection terminal is corresponding to the second output hole.

[0011] In some embodiments, the filter circuit board is spaced apart from the panel, and the filter structure further includes an adapter made of metal material. The adapter is connected between the filter circuit board and the panel, and is attached to the panel and covers the first and second cable outlets. The adapter has a first transition hole and a second transition hole. The power connection end is disposed in the first transition hole, and the signal line structure is disposed in the second transition hole.

[0012] In some embodiments, the housing is grounded, and the adapter is attached to the filter circuit board.

[0013] In some embodiments, the power amplifier assembly further includes a connector and a sealing structure disposed on the connector. The sealing structure is a conductive structure. The housing also has a connection hole communicating with the shielding cavity. The connector is connected to the outside of the housing. The connector pins pass through the connection hole to connect to the radio frequency power amplifier circuit. The sealing structure seals the connection hole.

[0014] In some embodiments, the sealing structure is sleeved on the pin and located outside the housing, and the sealing structure seals the housing and the connector.

[0015] In some embodiments, the sealing structure is sleeved on the pin, and the sealing structure is disposed inside the connection hole and threadedly connected to the connection hole.

[0016] In some embodiments, the housing includes a shielding top cover, a shielding bottom cover, and a sealing element, wherein the sealing element is a conductive element, the shielding top cover and the shielding bottom cover are connected to form the shielding cavity, and the sealing element is disposed between the shielding top cover and the shielding bottom cover to seal the shielding top cover and the shielding bottom cover.

[0017] In some embodiments, the shielding top cover has a pressure strip on the side facing the shielding bottom cover, and the shielding bottom cover has a sealing groove on the side facing the shielding top cover. The sealing element is installed in the sealing groove, and the pressure strip presses the sealing element.

[0018] Secondly, embodiments of this application provide a radio frequency defrosting device, including a main body and the aforementioned power amplifier assembly, wherein the power amplifier assembly is installed on the outside of the main body and connected to an electrode plate inside the main body.

[0019] The beneficial effects of the radio frequency defrosting device provided in the second aspect are the same as those of the power amplifier component provided in the first aspect, and will not be repeated here.

[0020] Thirdly, embodiments of this application provide a refrigeration device, including a cabinet and the aforementioned radio frequency defrosting device, wherein the radio frequency defrosting device is disposed within the cabinet.

[0021] The beneficial effects of the refrigeration equipment provided in the third aspect are the same as those of the radio frequency defrosting device provided in the second aspect, and will not be repeated here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A schematic diagram of the radio frequency defrosting device is shown.

[0024] Figure 2 It shows Figure 1 A schematic diagram of the intermediate power amplifier component.

[0025] Figure 3 It shows Figure 2 Exploded view of the local structure.

[0026] Figure 4 It shows Figure 3 A schematic diagram of one side of the filter circuit board.

[0027] Figure 5 It shows Figure 3 A schematic diagram of the structure on the other side of the filter circuit board.

[0028] Figure 6 It shows Figure 2 Explosion of the connector Figure 1 .

[0029] Figure 7It shows Figure 2 Explosion of the connector Figure 2 .

[0030] Figure 8 It shows Figure 2 Exploded view of the inner shell.

[0031] Figure 9 It shows Figure 8 A sectional view.

[0032] Figure label:

[0033] 1-RF defrosting device, 10-Power amplifier assembly, 20-Main body, 100-Housing shell, 110-Panel, 111-First cable outlet, 112-Second cable outlet, 120-Shielding cavity, 130-Connection hole, 140-Shielding top cover, 150-Shielding bottom cover, 160-Sealing element, 170-Sealing groove, 180-Pressure strip, 200-Power circuit board, 210-Pin, 300-Filtering structure, 310-Filtering circuit board, 320-Power connection terminal, 330-Signal connection terminal, 340-First capacitor, 350-Second capacitor, 360-Adapter, 361-First transition hole, 362-Second transition hole, 400-Connector, 410-Pin, 420-N-type through-wall flange female, 430-N-type through-wall flange male, 440-Cable, 500-Sealing structure. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that all directional indications in the embodiments of the present invention are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0036] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this invention.

[0038] Radio frequency (RF) solid-state power amplifiers are increasingly used in home appliances, especially in microwave heating and RF defrosting. To ensure these products meet testing requirements, addressing EMC (electromagnetic compatibility) issues is crucial, particularly for products containing RF signals, where mitigating radiated interference is paramount. To address these problems, home appliance manufacturers need to implement measures to improve shielding effectiveness. For example, in microwave ovens, metal shielding enclosures can prevent microwave leakage, and filters can be used to reduce EMC interference.

[0039] During food heating or defrosting, high radio frequency (RF) power is required to meet the energy needs of the food. High-power, high-frequency RF signals place significant demands on the EMC design of the entire product. Solid-state power amplifiers include a housing for shielding radiation; however, in related technologies, because solid-state power amplifiers require signal and power lines to pass through the housing, cable coupling radiation can occur, affecting the shielding effectiveness of the solid-state power amplifier.

[0040] To address the problems existing in related technologies to some extent, this application proposes a power amplifier component, a radio frequency defrosting device, and a cooling device, which can filter the coupled radiation at the power line and signal line to the ground through a filter circuit, thereby improving the shielding effectiveness of the power amplifier component.

[0041] This application is described below with reference to the accompanying drawings and specific embodiments:

[0042] Please see Figure 1 This application provides a power amplifier component 10. The power amplifier component 10 provided in this application can filter the coupled radiation at the power line and signal line to the ground through the filter circuit, thereby improving the shielding effectiveness of the power amplifier component 10.

[0043] Please see Figure 2 and Figure 3In this embodiment, the power amplifier assembly 10 includes a housing 100, a power circuit board 200, and a filter structure 300. The housing 100 has a panel 110 and a shielding cavity 120. The panel 110 has a first cable outlet 111 and a second cable outlet 112 communicating with the shielding cavity 120. The power circuit board 200 is installed inside the shielding cavity 120. The filter structure 300 is installed inside the shielding cavity 120, and is attached to the panel 110 and covers the first cable outlet 111 and the second cable outlet 112. The filter structure 300 includes a filter circuit board 310 and a filter circuit, a power connection terminal 320, and a signal connection terminal 330 disposed on the filter circuit board 310. The filter circuit board 310 is connected to the power circuit board 200 and grounded. The power connection terminal 320 and the signal connection terminal 330 are connected to the filter circuit.

[0044] The power connection terminal 320 is routed through the first output hole 111, and the signal connection terminal 330 is routed through the second output hole 112.

[0045] The housing 100 is the basic component of the power amplifier assembly 10, providing installation and protection for other parts of the power amplifier assembly 10. Made of metal, the housing 100 also serves as the main shielding element for the power amplifier assembly 10, shielding radiation within the shielded cavity 120. The shielded cavity 120 houses a power circuit and an RF power amplifier circuit to generate RF signals of the required frequency and power. The power circuit provides power, while the RF power amplifier circuit generates the RF signal at the set frequency, amplifies the RF signal, enhances its power, and outputs the power amplifier signal. A power circuit board 200 is installed within the shielded cavity 120, and the power circuit is located on the power circuit board 200. All circuitry of the power amplifier assembly 10 ultimately converges to the power circuit board 200 and transmits signals to the outside via the power circuit board 200.

[0046] The panel 110 of the housing 100 is provided with a first outlet hole 111 and a second outlet hole 112 that communicate with the shielding cavity 120. The filter structure 300 is attached to the panel 110 and covers the first outlet hole 111 and the second outlet hole 112. Therefore, under the obstruction of the filter structure 300, the radiation in the space of the shielding cavity 120 can be prevented from leaking out from the first outlet hole 111 and the second outlet hole 112 as much as possible.

[0047] The filtering structure 300 includes a filtering circuit board 310 and a filtering circuit, a power connection terminal 320, and a signal connection terminal 330 disposed on the filtering circuit board 310. Since the filtering circuit board 310 is connected to the power supply circuit board 200 through pin 210, the power connection terminal 320 and the signal connection terminal 330 can be connected to the corresponding lines of the power supply circuit board 200 through the filtering circuit board 310. Specifically, the filtering circuit board 310 is connected to the power supply circuit board 200 through pin 210. The power connection terminal 320 is an interface for connecting to power lines, and the signal connection terminal 330 is an interface for connecting to signal lines. Since the power connection terminal 320 is routed through the first exit hole 111, and the signal connection terminal 330 is routed through the second exit hole 112, the power line can be connected to the power connection terminal 320 through the first exit hole 111, and the signal line can be connected to the signal connection terminal 330 through the second exit hole 112, so that the RF power amplifier circuit and the power circuit can exchange signals with the outside through the power line and the signal line, respectively.

[0048] Since the filter circuit board 310 is grounded, and the power connection terminal 320 and the signal connection terminal 330 are connected to the filter circuit, the filter circuit can filter the coupled radiation at the power line and signal line, thus filtering it to ground and significantly reducing the coupled radiation of the cable. That is, under the joint shielding of the housing 100 and the filter structure 300, the radiation in the shielding cavity 120 space can be shielded, and the setting of the filter circuit can significantly reduce the coupled radiation of the cable, thereby improving the overall shielding effectiveness of the power amplifier assembly 10.

[0049] Please see Figure 4 and Figure 5 It should be noted that the filtering circuit on the filter circuit board 310 can be formed by setting capacitors. The filter circuit board 310 is provided with a first capacitor 340 and a second capacitor 350. The first capacitor 340 is connected to the power connection terminal 320, and the second capacitor 350 is connected to the signal connection terminal 330. The first capacitor 340 and the power connection terminal 320 can be respectively set on opposite sides of the filter circuit board 310 and correspondingly arranged. The second capacitor 350 and the signal connection terminal 330 can also be respectively set on opposite sides of the filter circuit board 310 and correspondingly arranged. Of course, since the filter circuit board 310 is grounded, the first capacitor 340 and the second capacitor 350 are also grounded. Thus, the first capacitor 340 and the second capacitor 350 can respectively filter the coupled radio frequency signals at the power line and the signal line to ground. Depending on the actual filtering situation, a C-type filter network, an LC-type filter network, or an RC-type filter network can be established using the first capacitor 340 and the second capacitor 350 to achieve effective filtering of the cable. There are no restrictions on this.

[0050] Specifically, since the power line is high-voltage and subject to greater electromagnetic interference, the first capacitor 340 can be a surface-mount Y capacitor to meet safety requirements, while the second capacitor 350 can be a regular surface-mount capacitor. Furthermore, when the cable-coupled RF signal strength is high, an LC filter network can be constructed using a combination of ferrite beads and capacitors. The ferrite beads should have sufficiently high impedance at the high-frequency points requiring filtering; the higher the impedance, the better the noise suppression effect.

[0051] Please see Figure 3 In some embodiments, the filter circuit board 310 and the power circuit board 200 are arranged at an angle, and the power connection terminal 320 and the signal connection terminal 330 are arranged on the side of the filter circuit board 310 facing the panel 110. The power connection terminal 320 is correspondingly arranged with the first output hole 111, and the signal connection terminal 330 is correspondingly arranged with the second output hole 112.

[0052] The housing 100 is roughly rectangular. The power circuit board 200 is disposed on the bottom surface of the housing 100, and the front panel 110 is perpendicular to the bottom surface. Therefore, to facilitate the routing of the power connection terminal 320 and the signal connection terminal 330 through the first cable outlet 111 and the second cable outlet 112 respectively, the filter circuit board 310 is set at an angle to the power circuit board 200, so that the filter circuit board 310 can face the front panel 110. By placing the power connection terminal 320 and the signal connection terminal 330 on the side of the filter circuit board 310 facing the front panel 110, with the power connection terminal 320 corresponding to the first cable outlet 111 and the signal connection terminal 330 corresponding to the second cable outlet 112, the power connection terminal 320 is exposed in the first cable outlet 111 and the signal connection terminal 330 is exposed in the second cable outlet 112, which facilitates connection with external cables.

[0053] Specifically, the filter circuit board 310 is arranged perpendicularly to the power supply circuit board 200, that is, the filter circuit board 310 is arranged parallel to the panel 110, so that the power connection terminal 320 corresponds to the first output hole 111 and the signal connection terminal 330 corresponds to the second output hole 112.

[0054] Please see Figure 3 In some embodiments, the filter circuit board 310 is spaced apart from the panel 110. The filter structure 300 also includes an adapter 360 made of metal material. The adapter 360 is connected between the filter circuit board 310 and the panel 110. The adapter 360 is attached to the panel 110 and covers the first cable outlet 111 and the second cable outlet 112. The adapter 360 has a first transition hole 361 and a second transition hole 362. The power connection end 320 is disposed in the first transition hole 361, and the signal line structure is disposed in the second transition hole 362.

[0055] The filter circuit board 310 is approximately located in the middle of the power circuit board 200. Therefore, even though the power circuit board 200 abuts against the edge where the bottom surface and the front panel 110 intersect, there is still a gap between the filter circuit board 310 and the front panel 110, preventing it from being fully attached to the front panel 110. Consequently, the filter circuit board 310 cannot effectively shield the radiation within the shielding cavity 120. Therefore, an adapter 360 made of metal is provided between the filter circuit board 310 and the front panel 110. The adapter 360 is attached to the front panel 110 and covers the first cable outlet 111 and the second cable outlet 112 to achieve a shielding effect against radiation within the shielding cavity 120.

[0056] Of course, in order to ensure that the configuration of the adapter 360 does not affect the connection between the power connection terminal 320 and the power line, and the connection between the signal connection terminal 330 and the signal line, a first transition hole 361 and a second transition hole 362 are provided on the adapter 360. The power connection terminal 320 is disposed in the first transition hole 361, and the signal line is disposed in the second transition hole 362. Thus, the power line can be connected to the power connection terminal 320 through the first outlet hole 111 and the first transition hole 361 in sequence, and the signal line can be connected to the signal connection terminal 330 through the second outlet hole 112 and the second transition hole 362 in sequence.

[0057] Specifically, the adapter 360 can be integrally machined from aluminum. The adapter 360 can be connected to the panel 110 and the filter circuit board 310 respectively by connecting bolts, so as to make the adapter 360 stable in installation.

[0058] In some implementations, housing 100 is grounded and adapter 360 is attached to filter circuit board 310.

[0059] The housing 100 can be grounded via a grounding wire. Since the two sides of the adapter 360 are respectively attached to the filter circuit board 310 and the panel 110, and the adapter 360 is made of metal, the filter circuit board 310 is grounded through the adapter 360 and the housing 100. Of course, both sides of the filter circuit board 310 are provided with a conductive coating to ensure effective grounding of the filter circuit board 310 to the housing 100.

[0060] Specifically, the front and back sides of the filter circuit board 310 can be fully copper-clad to ensure effective grounding of the filter circuit board 310 to the housing 100, and can further form a shielding barrier against radiation, thereby enhancing the shielding effect against radiation.

[0061] Please see Figure 2 and Figure 6In some embodiments, the power amplifier assembly 10 further includes a connector 400 and a sealing structure 500 disposed on the connector 400. The sealing structure 500 is a conductive structure. The housing 100 also has a connection hole 130 communicating with the shielding cavity 120. The connector 400 is connected to the outside of the housing 100. The pins 410 of the connector 400 pass through the connection hole 130 to connect to the radio frequency power amplifier circuit. The sealing structure 500 seals the connection hole 130.

[0062] Since the pins 410 of connector 400 pass through the connection hole 130 to connect to the RF power amplifier circuit, connector 400 can transmit the amplified RF signal to the next stage, such as the electrode plate or other external devices. Since the sealing structure 500 is a conductive structure and seals the connection hole 130, the sealing structure 500 can shield radiation, significantly reducing the radiation leaked from the connection hole 130.

[0063] Specifically, connector 400 may include an N-type through-wall flange, which includes an N-type through-wall flange female connector 420 and an N-type through-wall flange male connector 430. The N-type through-wall flange is a commonly used component for signal transmission, and its structural principle will not be elaborated here. In addition, connector 400 also includes a cable 440, which connects to the N-type through-wall flange male connector 430 for signal transmission. Cable 440 may be a coaxial semi-rigid cable 440. Coaxial semi-rigid cable is a commonly used cable type, consisting of an inner conductor, an insulation layer, a semi-rigid shielding layer, an outer insulation layer, and an outer sheath layer. The semi-rigid shielding layer is made of solid copper, with a shielding effectiveness greater than 150dB, ensuring ultra-low radiation leakage of the signal along its path.

[0064] Please see Figure 6 In some embodiments, the sealing structure 500 is sleeved on the pin 410 and located on the outside of the housing 100, and the sealing structure 500 seals the housing 100 and the connector 400.

[0065] After the pin 410 passes through the connection hole 130, the sealing structure 500 is tightly disposed between the housing 100 and the connector 400, thereby elastically sealing the housing 100 and the connector 400 and reducing radiation leakage through the connection hole 130. Specifically, the sealing structure 500 can use a conductive O-ring, which ensures shielding effectiveness while providing waterproofing. The shielding effectiveness is greater than 120dB, and the waterproof rating can reach IP67.

[0066] Specifically, in order to ensure a stable connection between the connector 400 and the housing 100, the connector 400 can be fixedly connected to the housing 100 by multiple screws.

[0067] Please see Figure 7In some embodiments, the sealing structure 500 is sleeved on the pin 410, and the sealing structure 500 is disposed in the connection hole 130 and threadedly connected to the connection hole 130.

[0068] The sealing structure 500 can also seal the connection hole 130 through a threaded structure. The sealing structure 500 has an external thread, while the connection hole 130 has an internal thread. The sealing structure 500 can be threadedly connected to the connection hole 130 by being placed inside the connection hole 130. The threaded connection structure itself has waterproof and shielding functions, with a shielding effectiveness greater than 120dB and a waterproof rating of IP67, thereby sealing the connection hole 130 and reducing radiation leakage from the connection hole 130.

[0069] Since the sealing structure 500 is installed on the connector 400 and the sealing structure 500 is threaded to the connection hole 130, the connector 400 can be fixedly connected to the housing 100. Therefore, the connector 400 does not need to be connected to the housing 100 by screws.

[0070] Please see Figure 8 In some embodiments, the housing 100 includes a shielding top cover 140, a shielding bottom cover 150, and a sealing member 160. The shielding top cover 140 and the shielding bottom cover 150 are connected to form a shielding cavity 120. The sealing member 160 is a conductive member and is disposed between the shielding top cover 140 and the shielding bottom cover 150 to seal the shielding top cover 140 and the shielding bottom cover 150.

[0071] The shielding top cover 140 and the shielding bottom cover 150 can be fixedly connected by connecting bolts. The first cable outlet 111 and the second cable outlet 112 can be provided on the shielding bottom cover 150. Both the shielding top cover 140 and the shielding bottom cover 150 are integral structures made of metal to ensure the shielding effectiveness of the housing 100. The metal material can be aluminum, stainless steel, or other metals. The sealing element 160 can be installed on either the shielding top cover 140 or the shielding bottom cover 150, without limitation. Since the sealing element 160 is a conductive element and is located between the shielding top cover 140 and the shielding bottom cover 150, it elastically seals the shielding top cover 140 and the shielding bottom cover 150, thereby shielding radiation and significantly reducing radiation leakage between the shielding top cover 140 and the shielding bottom cover 150.

[0072] Specifically, the seal 160 can be made of conductive rubber strip, which serves both electromagnetic shielding and waterproofing purposes, with a shielding effectiveness of more than 100dB and a waterproof rating of IP67.

[0073] Please see Figure 9In some embodiments, the shielding top cover 140 is provided with a pressure strip 180 on the side facing the shielding bottom cover 150, and the shielding bottom cover 150 is provided with a sealing groove 170 on the side facing the shielding top cover 140. The sealing element 160 is installed in the sealing groove 170, and the pressure strip 180 presses the sealing element 160.

[0074] Because the bottom cover 150 has a sealing groove 170 on the side facing the top cover 140, and the sealing element 160 is installed in the sealing groove 170, the installation of the sealing element 160 is more stable and less prone to displacement or detachment. Because the pressure strip 180 presses the sealing element 160, the sealing element 160 can make closer contact with the bottom cover 150 and the top cover 140, so as to ensure the electrical continuity of the bottom cover 150 and the top cover 140 and improve the sealing and shielding effect.

[0075] Based on the same inventive concept, please refer to Figure 1 This application also provides a radio frequency defrosting device 1, including a main body 20 and the aforementioned power amplifier assembly 10. The power amplifier assembly 10 is installed on the outside of the main body 20 and connected to an electrode plate inside the main body 20. The power amplifier assembly 10 outputs an amplified signal to the electrode plate, which emits a radio frequency signal to defrost the items inside the main body 20. The beneficial effects of the radio frequency defrosting device 1 provided in this application are the same as those of the aforementioned power amplifier assembly 10, and will not be repeated here.

[0076] Based on the same inventive concept, this application also provides a refrigeration device, including a cabinet and the aforementioned radio frequency defrosting device 1. The radio frequency defrosting device 1 is disposed inside the cabinet, and the refrigeration device can be a refrigerator. The beneficial effects of the refrigeration device provided in this application are the same as those of the radio frequency defrosting device 1 described above, and will not be repeated here.

[0077] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

Claims

1. A power amplifier component, characterized in that, include: The housing (100) and the power circuit board (200) are provided. The housing (100) has a panel (110) and a shielding cavity (120). The panel (110) is provided with a first wire outlet hole (111) and a second wire outlet hole (112) communicating with the shielding cavity (120). The power circuit board (200) is installed in the shielding cavity (120). A filter structure (300) is installed inside the shielding cavity (120). The filter structure (300) is attached to the panel (110) and covers the first outlet hole (111) and the second outlet hole (112). The filter structure (300) includes a filter circuit board (310) and a filter circuit, a power connection terminal (320) and a signal connection terminal (330) disposed on the filter circuit board (310). The filter circuit board (310) is connected to the power supply circuit board (200) and grounded. The power connection terminal (320) and the signal connection terminal (330) are connected to the filter circuit. The power connection terminal (320) is routed through the first output hole (111), and the signal connection terminal (330) is routed through the second output hole (112).

2. The power amplifier component according to claim 1, characterized in that, The filter circuit board (310) is set at an angle to the power circuit board (200). The power connection terminal (320) and the signal connection terminal (330) are set on the side of the filter circuit board (310) facing the panel (110). The power connection terminal (320) is set corresponding to the first outlet hole (111), and the signal connection terminal (330) is set corresponding to the second outlet hole (112).

3. The power amplifier component according to claim 1, characterized in that, The filter circuit board (310) is spaced apart from the panel (110). The filter structure (300) also includes an adapter (360) made of metal material. The adapter (360) is connected between the filter circuit board (310) and the panel (110). The adapter (360) is attached to the panel (110) and covers the first wire outlet (111) and the second wire outlet (112). The adapter (360) has a first transition hole (361) and a second transition hole (362). The power connection terminal (320) is disposed in the first transition hole (361), and the signal connection terminal (330) is disposed in the second transition hole (362).

4. The power amplifier component according to claim 3, characterized in that, The housing (100) is grounded, and the adapter (360) is attached to the filter circuit board (310).

5. The power amplifier component according to any one of claims 1-4, characterized in that, The power amplifier assembly further includes a connector (400) and a sealing structure (500) disposed on the connector (400). The sealing structure (500) is a conductive structure. The housing (100) also has a connection hole (130) communicating with the shielding cavity (120). The connector (400) is connected to the outside of the housing (100). The pins (410) of the connector (400) pass through the connection hole (130) to connect to the radio frequency power amplifier circuit. The sealing structure (500) seals the connection hole (130).

6. The power amplifier component according to claim 5, characterized in that, The sealing structure (500) is sleeved on the pin (410) and located on the outside of the housing (100), and the sealing structure (500) seals the housing (100) and the connector (400).

7. The power amplifier component according to claim 5, characterized in that, The sealing structure (500) is sleeved on the pin (410), and the sealing structure (500) is disposed in the connecting hole (130) and threadedly connected to the connecting hole (130).

8. The power amplifier component according to any one of claims 1-4, characterized in that, The housing (100) includes a shielding top cover (140), a shielding bottom cover (150), and a sealing element (160). The sealing element (160) is a conductive element. The shielding top cover (140) and the shielding bottom cover (150) are connected to form the shielding cavity (120). The sealing element (160) is disposed between the shielding top cover (140) and the shielding bottom cover (150) to seal the shielding top cover (140) and the shielding bottom cover (150).

9. The power amplifier component according to claim 8, characterized in that, The shielding top cover (140) has a pressure strip (180) on the side facing the shielding bottom cover (150), and the shielding bottom cover (150) has a sealing groove (170) on the side facing the shielding top cover (140). The sealing element (160) is installed in the sealing groove (170), and the pressure strip (180) presses the sealing element (160).

10. A radio frequency defrosting device (1), characterized in that, It includes a main body (20) and a power amplifier assembly (10) as described in any one of claims 1-9, the power amplifier assembly (10) being mounted on the outside of the main body (20) and connected to the electrode plate inside the main body (20).

11. A refrigeration device, characterized in that, It includes a cabinet and a radio frequency defrosting device (1) as described in claim 10, wherein the radio frequency defrosting device (1) is disposed within the cabinet.

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