Circuit board with high heat dissipation function

Abstract

The utility model relates to electronic engineering and circuit design technical field discloses the circuit board with high -efficient heat dissipation function, including circuit board outer frame, both sides of circuit board outer frame all install heat dissipation component, the inside installation of circuit board outer frame has the PCB board, the heat dissipation component includes cooling tank, the inside of cooling tank is provided with cooling pump, the inside both sides of circuit board outer frame all install cooling liquid pipe, the output of cooling pump is connected to the inside of cooling liquid pipe through pipeline, the outside four corners of PCB board all install guide component. In the utility model, through water cooling component and heat dissipation port combination, realized the efficient initiative cooling of circuit board. Meanwhile, its clamping piece integrates the guide roller and the buffer structure, can guide the safe installation of board body, prevent side damage, can also absorb impact and provide shock absorption protection, thereby comprehensively guarantee the stable operation of circuit board and electronic component.

Description

Technical Field

[0001] This utility model relates to the field of electronic engineering and circuit design technology, and in particular to a circuit board with efficient heat dissipation function. Background Technology

[0002] Currently, electronic information technology is undergoing rapid iteration, with the functions of various electronic devices becoming increasingly complex, and their integration and power density continuously rising. This trend has led to a sharp increase in heat flux density on circuit boards, and heat dissipation has become a key technical bottleneck restricting the performance, stability, and lifespan of equipment. Therefore, designing efficient and reliable heat dissipation solutions for circuit boards is a common challenge facing the entire electronics industry.

[0003] Regarding the issues mentioned above, existing heat dissipation solutions typically employ relatively traditional methods. For example, the PCB board is fixed to the chassis support pillars with screws. Major heat-generating components, such as the central processing unit (CPU), are coated with thermal paste and then fitted with a separate, large finned heatsink. The overall cooling of the chassis relies on one or two fans, which use forced convection to either extract internal air or blow cool air in to dissipate the heat generated by the electronic components and maintain system operation.

[0004] However, the aforementioned existing technologies have significant shortcomings in practical applications. First, this heat dissipation method, which relies on air as a cooling medium, has an efficiency limit. When the power density of components on the circuit board reaches a certain level, airflow alone is insufficient to quickly remove heat, often leading to localized high-temperature areas on the board. This affects the performance of high-power devices and can even cause permanent damage due to overheating. The heat dissipation process is relatively passive and lacks targeted cooling paths. Second, there are also potential risks during circuit board installation. Traditional slot or screw fixing methods rely entirely on manual alignment during assembly. Slight carelessness by the operator can cause scratches or abrasions to the edges of the PCB board when inserted into the rigid slots. This physical damage not only affects aesthetics but may also damage the wiring along the board edges, or cause micro-cracks in the board due to stress concentration during repeated insertion and removal, posing a risk to the long-term reliability of the equipment.

[0005] To address the above issues, a circuit board with efficient heat dissipation is proposed. Summary of the Invention

[0006] To overcome the above shortcomings, this utility model provides a circuit board with high-efficiency heat dissipation function, aiming to solve the problems of poor heat dissipation effect and easy damage to the board body during installation and disassembly of existing circuit boards with high-efficiency heat dissipation function.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a circuit board with high-efficiency heat dissipation function, including a circuit board frame, heat dissipation components are installed on both the front and rear sides of the circuit board frame, and heat dissipation vents are symmetrically opened on both the left and right sides of the circuit board frame. A PCB board is installed inside the circuit board frame. The heat dissipation components include a cooling box, a cooling pump is installed inside the cooling box, coolant pipes are installed on both sides of the inside of the circuit board frame, the output end of the cooling pump is connected to the inside of the coolant pipes through a pipe, and guide components are installed at the four outer corners of the PCB board.

[0008] As a further description of the above technical solution: The PCB board has multiple electronic components installed inside, and the two coolant pipes are located on the outer sides of the PCB board.

[0009] As a further description of the above technical solution: The cooling box is fixedly connected to the outside of the circuit board frame, and the inside of the cooling box is filled with coolant.

[0010] As a further description of the above technical solution: A metal heat-conducting plate is installed at the bottom of the PCB board, and pads are installed at the four corners of the bottom of the metal heat-conducting plate.

[0011] As a further description of the above technical solution: The guiding component includes a clamping block, a buffer plate is provided inside the clamping block, side sliders are fixedly connected to both sides of the buffer plate, multiple guide rollers are arranged side by side at the bottom of the buffer plate, and multiple buffer springs are provided inside the clamping block.

[0012] As a further description of the above technical solution: The clamping block has a groove inside, and the side slider is slidably connected inside the groove.

[0013] As a further description of the above technical solution: The guide roller is rotatably connected inside the buffer plate, and a slot is provided in the middle of one side of the clamping block, into which the PCB board is inserted.

[0014] As a further description of the above technical solution: The clamping block is fixedly connected to the inner wall of the outer frame of the circuit board.

[0015] This utility model has the following beneficial effects: 1. In this utility model, two sets of water-cooling components are symmetrically arranged on the outside and inside of the circuit board. The coolant in the external cooling tank is injected into the coolant pipe close to the PCB board by the pump to achieve effective cooling of the internal equipment. The heat dissipation vents on both sides of the outer frame can effectively dissipate the heat generated by the equipment.

[0016] 2. In this utility model, when the PCB board is installed, the side of the board can slide into the slot opened in the clamping block, and multiple guide rollers can effectively guide the PCB board, effectively prevent damage to the side of the board, and effectively absorb impact energy, playing a shock-absorbing role, thereby comprehensively protecting the PCB board and the precision electronic components soldered on it. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the circuit board with high-efficiency heat dissipation function proposed in this utility model; Figure 2 This is a schematic diagram of the structure of the cooling pump for the circuit board with high-efficiency heat dissipation function proposed in this utility model; Figure 3 This is a schematic diagram of the structure of the metal heat-conducting plate of the circuit board with high-efficiency heat dissipation function proposed in this utility model. Figure 4 This is a schematic diagram of the guide roller of the circuit board with high-efficiency heat dissipation function proposed in this utility model.

[0018] Legend: 1. Circuit board frame; 2. Heat dissipation vent; 3. Cooling box; 4. PCB board; 5. Coolant pipe; 6. Cooling pump; 7. Metal heat-conducting plate; 8. Clamping block; 9. Buffer plate; 10. Buffer spring; 11. Side slider; 12. Guide roller; 13. Slot. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Reference Figure 1 - Figure 4This utility model provides an embodiment of a circuit board with high-efficiency heat dissipation. Its overall structure includes a circuit board frame 1, which provides a basic mounting platform and structural support for the entire device. To achieve efficient active heat dissipation, heat dissipation components are fixedly connected to the front and rear exterior sides of the circuit board frame 1. Specifically, the heat dissipation component is a cooling tank 3 filled with coolant. A miniaturized cooling pump 6 is also integrated inside the cooling tank 3. Inside the circuit board frame 1, two coolant pipes 5 are installed parallel to each other along both sides of the location where the PCB board 4 will be installed. The output end of the cooling pump 6 is connected to the input end of the coolant pipes 5 through a dedicated pressure-resistant pipe, thus forming a complete liquid circulation loop. When multiple electronic components on the PCB board 4 installed inside the circuit board frame 1 begin to operate and generate a large amount of heat, the cooling pump 6 starts, pumping the low-temperature coolant in the cooling tank 3 into the coolant pipes 5 located close to the exterior sides of the PCB board 4. As the coolant flows within the pipes, it continuously absorbs the heat transferred from the PCB board 4. To enhance thermal conductivity, a single metal heat-conducting plate 7 is specially installed on the bottom of the PCB board 4. This plate rapidly diffuses point heat sources generated by electronic components into surface heat sources, which are then evenly transferred to the coolant pipes 5. The coolant, having absorbed heat, flows back to the cooling tank 3 for further cooling, thus creating a continuous heat transfer process. Simultaneously, to expel the hot air accumulated inside the circuit board frame 1, multiple symmetrical heat dissipation vents 2 are provided on both its left and right sides. Utilizing the convection of internal and external air, the entire system is assisted in heat dissipation, ensuring stable operation of the internal equipment at a suitable temperature.

[0021] To facilitate convenient installation and secure fixation of the PCB board 4, and to provide effective cushioning protection, this invention includes guide components fixedly connected to the four corners of the inner wall of the circuit board frame 1. The main structure of this guide component is a clamping block 8. A slot 13, matching the thickness of the PCB board 4, is provided in the center of one side of the clamping block 8 for insertion and positioning of the PCB board 4. During installation, the side of the PCB board 4 can smoothly slide into the slot 13. To prevent damage to the board edges due to friction or misalignment during insertion, a guiding and cushioning mechanism is cleverly designed inside the clamping block 8. This mechanism includes a movable buffer plate 9, with multiple guide rollers 12 rotatably connected side-by-side at its bottom. When the PCB board 4 is inserted, its bottom edge first contacts these guide rollers 12. The rolling action of the guide rollers 12 greatly reduces friction, effectively guiding the PCB board 4 smoothly into the predetermined position. Furthermore, the buffer plate 9 itself is not rigidly fixed; side sliders 11 are fixedly connected to both its outer sides. These side sliders 11 are slidably connected in grooves opened inside the clamping block 8, allowing the buffer plate 9 to make slight displacements. Multiple buffer springs 10 are also installed inside the clamping block 8, providing continuous support for the buffer plate 9. When the PCB board 4 is installed or the equipment is subjected to external impact vibration during operation, this system consisting of buffer springs 10, buffer plate 9, and side sliders 11 can effectively absorb impact energy, playing a shock-absorbing role and thus comprehensively protecting the PCB board 4 and the precision electronic components soldered on it. Simultaneously, the pads installed at the four corners of the bottom of the metal heat-conducting plate 7 ensure a safe distance between the PCB board 4 and the bottom of the circuit board frame 1.

[0022] Working Principle: After the equipment is started, multiple electronic components on the PCB board 4 installed inside the circuit board frame 1 generate heat through power operation. This heat is conducted downwards to the metal heat-conducting plate 7 installed at its bottom and diffuses on its surface. At the same time, the cooling pump 6 in the cooling box 3 fixedly connected to the outside of the circuit board frame 1 starts, pumping the coolant inside the cooling box 3 through pipes into the coolant pipes 5 installed inside the circuit board frame 1 and located on both sides of the outside of the PCB board 4. When the coolant flows in the coolant pipes 5, it exchanges heat with the adjacent PCB board 4 and the metal heat-conducting plate 7. After absorbing heat, the coolant flows back to the cooling box 3, forming an active liquid circulation loop. While the liquid is dissipating heat, the air heat inside the circuit board frame 1 will convect with the external environment through the heat dissipation vents 2 symmetrically opened on its left and right sides. During installation, the edge of the PCB board 4 is inserted into the slot 13 opened on one side of the clamping block 8 fixedly connected to the inner wall of the circuit board frame 1. Its bottom will contact multiple guide rollers 12 rotatably connected to the bottom of the buffer plate 9 and slide inward under their guidance. The buffer plate 9 slides in the groove opened inside the clamping block 8 through the side sliders 11 fixedly connected to its outer two sides, and the buffer plate 9 itself is supported by multiple buffer springs 10 inside the clamping block 8, while the pads at the four corners of the bottom of the metal heat-conducting plate 7 keep the PCB board 4 at a certain distance from the bottom of the circuit board frame 1.

[0023] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A circuit board with high-efficiency heat dissipation function, including a circuit board frame (1), characterized in that: Heat dissipation components are installed on both the front and rear sides of the circuit board frame (1), and heat dissipation vents (2) are symmetrically opened on both the left and right sides of the circuit board frame (1). A PCB board (4) is installed inside the circuit board frame (1). The heat dissipation components include a cooling box (3). A cooling pump (6) is installed inside the cooling box (3). Cooling pipes (5) are installed on both sides of the inside of the circuit board frame (1). The output end of the cooling pump (6) is connected to the inside of the cooling pipe (5) through a pipe. Guide components are installed on the four outer corners of the PCB board (4).

2. The circuit board with high-efficiency heat dissipation function according to claim 1, characterized in that: The PCB board (4) has multiple electronic components installed inside, and the two coolant pipes (5) are located on the outer sides of the PCB board (4).

3. The circuit board with high-efficiency heat dissipation function according to claim 1, characterized in that: The cooling box (3) is fixedly connected to the outside of the circuit board frame (1), and the inside of the cooling box (3) is filled with coolant.

4. The circuit board with high-efficiency heat dissipation function according to claim 1, characterized in that: A metal heat-conducting plate (7) is installed at the bottom of the PCB board (4), and pads are installed at the four corners of the bottom of the metal heat-conducting plate (7).

5. The circuit board with high-efficiency heat dissipation function according to claim 1, characterized in that: The guiding component includes a clamping block (8), a buffer plate (9) is provided inside the clamping block (8), and side sliders (11) are fixedly connected to both sides of the buffer plate (9). Multiple guide rollers (12) are arranged side by side at the bottom of the buffer plate (9), and multiple buffer springs (10) are provided inside the clamping block (8).

6. The circuit board with high-efficiency heat dissipation function according to claim 5, characterized in that: The clamping block (8) has a groove inside, and the side slider (11) is slidably connected inside the groove.

7. The circuit board with high-efficiency heat dissipation function according to claim 6, characterized in that: The guide roller (12) is rotatably connected inside the buffer plate (9), and a slot (13) is provided in the middle of one side of the clamping block (8), and the PCB board (4) is inserted into the slot (13).

8. The circuit board with high-efficiency heat dissipation function according to claim 7, characterized in that: The clamping block (8) is fixedly connected to the inner wall of the outer frame (1) of the circuit board.

Images