Heat dissipation device for detection equipment
By configuring a heat dissipation structure and a drainage unit in the testing equipment, and using a temperature controller to monitor the temperature and initiate the air extraction action, the problem of insufficient heat dissipation of the testing equipment is solved, achieving efficient heat dissipation and energy saving.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SILICONWARE PRECISION IND CO LTD
- Filing Date
- 2025-03-27
- Publication Date
- 2026-07-21
AI Technical Summary
Existing testing equipment lacks a heat dissipation mechanism, which makes the internal circuitry or components of the circuit base prone to damage due to overheating.
The system is equipped with a heat dissipation structure and a diversion unit. The temperature controller monitors the real-time temperature and starts the air extraction action of the diversion unit. The airflow is guided through the guide pipe and air vents for heat dissipation.
It effectively prevents damage to internal circuits or components of the testing machine due to overheating, improves heat dissipation efficiency, and meets energy-saving requirements.
Smart Images
Figure CN224538552U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor packaging inspection technology, and more particularly to a heat dissipation device for an inspection equipment. Background Technology
[0002] With the booming development of portable electronic products in recent years, the development of various related products is also trending towards high density, high performance, and lightweight, thin, short, and small designs. To this end, the industry has developed various integrated multi-functional packaging designs to meet the requirements of lightweight, thin, short, and high-density electronic products. Therefore, testing equipment for various consumer electronics products also needs to be designed to meet the specific needs of the products.
[0003] Figure 1A This is a partial three-dimensional schematic diagram of the existing testing equipment 1. Figure 1B This is a partial side view cross-sectional diagram of the existing testing equipment 1.
[0004] like Figure 1A and Figure 1B As shown, the testing device 1 is an electrical testing device, which includes a working platform 1a, a circuit base 90 disposed on the working platform 1a, a test socket 91 disposed on the circuit base 90, a movable base 92 disposed above the test socket 91, and a high-speed input / output (HSIO) element 93 disposed on the circuit base 90.
[0005] The circuit base 90 is a large rectangular plate with the necessary circuitry (not shown) inside to transmit test data or other information to a computer (not shown).
[0006] The test socket 91 is electrically connected to the circuit base 90 and has at least one groove for placing the target test object 8 to facilitate positioning the target test object 8. Multiple probes 910, such as spring needles, are provided in the groove to contact the target test object 8. The target test object 8 is an electronic package containing a semiconductor wafer.
[0007] The movable base 92 is a robotic arm or other displaceable holding mechanism used to move the target test object 8 to the desired position.
[0008] The high-speed input / output element 93 is electrically connected to the circuit base 90 to cooperate with the operation of the circuit base 90.
[0009] However, the existing testing equipment 1 does not have a heat dissipation mechanism, so the middle area of the circuit base 90 is prone to heat accumulation, which can easily cause the internal circuits of the circuit base 90 or its components (such as high-speed input / output components 93) to be damaged due to overheating.
[0010] Therefore, how to overcome the problems of the aforementioned existing technologies has become a pressing issue that the industry urgently needs to address. Utility Model Content
[0011] In view of the various deficiencies of the prior art, this application provides a heat dissipation device for a testing equipment, comprising: a heat dissipation structure disposed on the testing machine of the testing equipment; and a flow diversion unit connected to the heat dissipation structure and including a flow diversion host and a temperature controller for controlling the flow diversion host, wherein the flow diversion host is used to guide airflow through the heat dissipation structure, and the temperature controller is used to measure the real-time temperature of the testing machine and to start the air extraction action of the flow diversion host according to the real-time temperature.
[0012] This application also provides a heat dissipation method for a testing device, comprising: positioning a target test object on the testing platform of the testing device, and the testing device further comprising the aforementioned heat dissipation device; monitoring the instantaneous temperature of the testing platform through the temperature controller, and dissipating heat through the heat dissipation structure; and when the instantaneous temperature obtained by the temperature controller is greater than or equal to the reference temperature, the temperature controller activates the suction action of the drainage host.
[0013] In the aforementioned heat dissipation device and method, the heat dissipation structure includes at least one guide pipe with multiple first openings, and the airflow supplied by the main unit is blown toward the test machine through the multiple first openings to dissipate heat from the test machine.
[0014] In the aforementioned heat dissipation device and method, the heat dissipation structure includes at least one guide tube with multiple second openings, so that the air extraction action of the main unit guides the airflow through the multiple second openings.
[0015] In the aforementioned heat dissipation device and method, the heat dissipation structure includes at least one air extraction section with multiple air holes, so that the air extraction action of the main unit guides the airflow through the multiple air holes.
[0016] In the aforementioned heat dissipation device and method, the heat dissipation structure includes a frame and a plurality of guide pipes disposed on the frame.
[0017] In the aforementioned heat dissipation device and method, the frame has an opening corresponding to the detection device, part of the guide tube is mounted on the opening, and part of the guide tube is laid along the edge of the opening.
[0018] In the aforementioned heat dissipation device and method, the temperature controller measures the fixed-point temperature at various points on the testing machine and then converts it into an average temperature, which is used as the instantaneous temperature.
[0019] In the aforementioned heat dissipation device and method, the reference temperature is 55°C. When the instantaneous temperature is greater than or equal to 55°C, the temperature controller activates the air extraction action of the heat dissipation unit.
[0020] In the aforementioned heat dissipation device and method, the temperature controller further stops the suction operation of the drainage unit based on the instantaneous temperature, so that when the instantaneous temperature is lower than the reference temperature, the temperature controller stops the suction operation of the drainage unit. For example, if the reference temperature is 55°C, the temperature controller stops the suction operation of the drainage unit when the instantaneous temperature is lower than 55°C.
[0021] As can be seen from the above, the heat dissipation device of this application mainly measures the real-time temperature of the test machine through the temperature controller, and starts the air extraction action of the drain host according to the real-time temperature. Therefore, compared with the prior art, the heat dissipation device of this application arranges the heat dissipation structure on the test machine to dissipate heat from the test machine. As a result, the test machine is not prone to heat accumulation, thereby avoiding the problem of damage to the internal circuits or components of the test machine due to overheating. Attached Figure Description
[0022] Figure 1A This is a partial three-dimensional schematic diagram of existing testing equipment.
[0023] Figure 1B This is a partial side view sectional diagram of an existing testing device.
[0024] Figure 2A This is a partial three-dimensional schematic diagram of the heat dissipation device of this application applied to testing equipment.
[0025] Figure 2B This is a three-dimensional schematic diagram of the heat dissipation device of this application.
[0026] Figures 3A to 3D This is a schematic diagram of the heat dissipation method of the heat dissipation device of this application.
[0027] Explanation of reference numerals in the attached figures
[0028] 1,9 testing equipment
[0029] 1a working platform
[0030] 2. Heat dissipation device
[0031] 2a heat dissipation structure
[0032] 2b drainage unit
[0033] 20 frames
[0034] 20a, 20b exhaust section
[0035] 200 opening
[0036] 202 pores
[0037] 21 guide tubes
[0038] 211 First opening
[0039] 212 Second Opening
[0040] 22-channel host
[0041] 23 Thermostat
[0042] 8 Target Test Objects
[0043] 9a test machine
[0044] 90 circuit base
[0045] 91 test socket
[0046] 910 probe
[0047] 92 mobile base
[0048] 93 High-speed input / output components
[0049] Area S1~S16
[0050] H and P arrow directions. Detailed Implementation
[0051] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0052] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0053] Figure 2A This is a partial three-dimensional schematic diagram of the heat dissipation device 2 of this application applied to the testing equipment 9. Figure 2B This is a three-dimensional schematic diagram of the heat dissipation device 2 of this application.
[0054] like Figure 2A As shown, the testing device 9 is an electrical testing device, which includes a testing platform 9a and a heat dissipation device 2 disposed on the testing platform 9a.
[0055] In this embodiment, the test platform 9a includes a working platform (not shown), a circuit base 90 disposed on the working platform, a test socket 91 disposed on the circuit base 90, a movable base 92 disposed above the test socket 91, and a high-speed input / output element 93 disposed on the circuit base 90.
[0056] The circuit base 90 is a large rectangular plate with the necessary circuitry (not shown) inside to transmit test data or other information to a computer (not shown).
[0057] The test socket 91 is electrically connected to the circuit base 90 and has at least one groove for placing the target test object (not shown) to facilitate positioning the target test object. Multiple probes 910, such as spring needles, are provided in the groove to contact the target test object, wherein the target test object is an electronic package or electronic component with a semiconductor wafer.
[0058] The movable base 92 is a robotic arm or other displaceable holding mechanism used to move the target test object to the desired position.
[0059] The high-speed input / output element 93 is electrically connected to the circuit base 90 to cooperate with the operation of the circuit base 90.
[0060] like Figure 2B As shown, the heat dissipation device 2 includes a heat dissipation structure 2a disposed at the bottom of the test platform 9a (or the circuit base 90) and a heat sink unit 2b connected to the heat dissipation structure 2a.
[0061] In this embodiment, the heat dissipation structure 2a includes a frame 20 and a plurality of (e.g., four) guide tubes 21 disposed on the frame 20.
[0062] The frame 20 is generally rectangular in shape and has an opening 200 corresponding to the circuit base 90. The frame 20 has a wing-like air extraction part 20a, 20b on opposite sides of the opening 200, and a plurality of arrayed air holes 202 are formed on the air extraction part 20a, 20b.
[0063] The guide tube 21 spans the opposite sides of the frame 20, and a portion (such as two) of the guide tubes 21 is mounted on the opening 200 to divide it into multiple areas of equal area, while another portion (such as two) of the guide tubes 21 is arranged along the edge of the opening 200. The surface of the guide tube 21 on the opening 200 is provided with multiple first openings 211, and the surface of the guide tube 21 at the edge of the opening 200 is provided with multiple second openings 212.
[0064] Furthermore, the drainage unit 2b includes a drainage host 22 and a temperature controller 23 for controlling the drainage host 22.
[0065] The airflow guiding host 22 guides airflow within and around the heat dissipation structure 2a, directing airflow through the air vent 202 and the first opening 211 and the second opening 212. In this embodiment, the airflow guiding host 22 is a blower.
[0066] The temperature controller 23 measures the real-time temperature of the circuit base 90 of the test machine 9a, and starts or stops the operation of the drainage host 22 based on the real-time temperature of the circuit base 90 of the test machine 9a.
[0067] Figures 3A to 3D The operation process of the heat dissipation device 2 of this application.
[0068] like Figure 3A As shown, the target test object (not shown) is positioned in the test socket 91 groove provided in the circuit base 90 by the movable base 92 to start the test.
[0069] like Figure 3B As shown, during the test, the temperature controller 23 begins to monitor the real-time temperature of the circuit base 90 of the test machine 9a, and the heat dissipation structure 2a dissipates heat.
[0070] In this embodiment, the drainage host 22 supplies airflow or blows out cold air, so that the airflow is blown through the first opening 211 of the guide tube 21 towards the bottom of the circuit base 90 of the test machine 9a (e.g., Figure 3C The arrow (P) indicates that the hot air from the circuit base 90 of the test bench 9a is dissipated to the surroundings for heat dissipation. For example, the airflow of each of the first openings 211 is equal.
[0071] Furthermore, the temperature controller 23 measures the fixed-point temperature at various locations on the bottom of the circuit base 90 of the testing machine 9a, and then converts it into an average temperature for use as the instantaneous temperature, in order to determine whether the average temperature reaches or exceeds the reference temperature. For example, the bottom of the circuit base 90 can be arrayed into sixteen regions S1~S16, so that the temperature controller 23 measures the fixed-point temperature of the sixteen regions S1~S16 on the bottom of the circuit base 90, and then converts it into an average temperature as the instantaneous temperature, and the reference temperature is set to 55°C.
[0072] like Figure 3C As shown, when the instantaneous temperature obtained by the temperature controller 23 (such as...) Figure 3B When the temperature (60°C) shown is greater than or equal to the reference temperature (55°C), it indicates that the circuit base 90 of the test machine 9a is dissipating heat slowly. Therefore, the temperature controller 23 starts the air extraction action of the cooling host 22 to increase the cooling rate.
[0073] In this embodiment, the suction action of the drainage host 22 is absorbed through the air holes 202 of the suction parts 20a and 20b and the second opening 212 of the guide tube 21 (e.g., Figure 3C The arrow H indicates that the hot air that has escaped to the circuit base 90 of the test machine 9a is then guided to the exhaust host 22. For example, the airflow of each of the second openings 212 and each of the air holes 202 is equal.
[0074] like Figure 3D As shown, when the instantaneous temperature (average temperature) obtained by the temperature controller 23 is less than the reference temperature (55°C), the temperature controller 23 automatically stops the air extraction operation of the drainage host 22.
[0075] In this embodiment, the flow-generating unit 2b adopts an automated control design to apply the cooling mechanism of the compressed dry air (CDA) system. Therefore, it can utilize waste heat to recover warm water for pre-cooling operations in other semiconductor packaging processes, thereby saving ice water consumption and achieving energy-saving effects, thus meeting the requirements of energy conservation.
[0076] Therefore, the heat dissipation device 2 of this application measures the instantaneous temperature of the test machine 9a through the temperature controller 23, and starts the suction action of the drain host 22 according to the instantaneous temperature. Therefore, compared with the prior art, the heat dissipation device 2 of this application arranges the heat dissipation structure 2a at the bottom of the test machine 9a (or the circuit base 90) to dissipate heat from the test machine 9a (or the circuit base 90). As a result, the test machine 9a (or the circuit base 90) is less likely to accumulate heat energy, thereby avoiding the problem of damage to the internal circuits or components (such as high-speed input / output components 93) of the test machine 9a (or the circuit base 90) due to overheating.
[0077] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. A heat dissipating device for a detection apparatus, characterized by comprising: Comprising: a heat dissipation structure disposed on a testing machine of the testing apparatus; and a flow guiding unit connected to the heat dissipation structure and comprising a flow guiding main unit and a temperature controller for controlling the flow guiding main unit, wherein the flow guiding main unit is used to guide air flow to pass through the heat dissipation structure, and the temperature controller is used to measure an instant temperature of the testing machine to start the air pumping action of the flow guiding main unit according to the instant temperature.
2. The heat dissipating device of claim 1, wherein The heat dissipation structure comprises at least one guiding pipe provided with a plurality of first openings, and the flow guiding main unit supplies air flow to blow to the testing machine through the plurality of first openings to perform heat dissipation of the testing machine.
3. The heat dissipating device of claim 1, wherein The heat dissipation structure comprises at least one guiding pipe provided with a plurality of second openings to allow the air pumping action of the flow guiding main unit to guide air flow to pass through the plurality of second openings.
4. The heat dissipating device of claim 1, wherein The heat dissipation structure comprises at least one air pumping part provided with a plurality of air holes to allow the air pumping action of the flow guiding main unit to guide air flow to pass through the plurality of air holes.
5. The heat dissipating device of claim 1, wherein The heat dissipation structure comprises a frame and a plurality of guiding pipes provided on the frame.
6. The heat dissipating device of claim 5, wherein The frame has an opening corresponding to the testing apparatus, part of the guiding pipes are arranged on the opening, and part of the guiding pipes are arranged along the edge of the opening.
7. The heat dissipating device of claim 1, wherein The temperature controller measures the spot temperature of each part of the testing machine and converts it into an average temperature as the instant temperature.
8. The heat dissipating device of claim 1, wherein When the instant temperature is greater than or equal to 55℃, the temperature controller starts the air pumping action of the flow guiding main unit.
9. The heat dissipating device of claim 1, wherein The temperature controller also stops the air pumping action of the flow guiding main unit according to the instant temperature.
10. The heat dissipating device of claim 9, wherein When the instant temperature is less than 55℃, the temperature controller stops the air pumping action of the flow guiding main unit.