A heat exchange structure
By setting multiple heat exchange channels and heat exchange teeth of different shapes in the heat exchange structure, and using independent heat dissipation circuits, the problem of insufficient contact of the cooling medium is solved, achieving a highly efficient heat dissipation effect and ensuring stable operation of electronic equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN RAYSEES TECHNOLOGY CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-21
AI Technical Summary
In existing cooling solutions, the cooling medium does not make sufficient contact with the cooling plate, resulting in low cooling efficiency and consequently low heat dissipation efficiency.
The heat exchange structure includes multiple heat exchange channels and heat exchange teeth of different shapes within the heat exchange body, ensuring that the cooling medium is in full contact with the heat exchange channels and heat exchange teeth, and achieving simultaneous filling of the cooling medium and uniform heat absorption through an independent heat dissipation circuit.
It improves cooling efficiency, ensures that electronic devices operate within the normal temperature range, avoids burn-out of critical components, and provides better heat dissipation and user experience.
Smart Images
Figure CN224538572U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation, and more particularly to a heat exchange structure. Background Technology
[0002] Electronic devices that generate heat typically require cooling. Absorbing the heat generated by these devices prevents them from becoming too hot and reduces their efficiency, while also ensuring their safety. Current solutions for cooling multiple electronic devices utilize cooling plates to absorb heat, thus cooling all of them.
[0003] However, in existing solutions, when the cooling medium contacts the cooling plate for heat exchange, the cooling medium fails to make sufficient contact with the cooling plate, resulting in low efficiency in heat absorption and thus low overall heat dissipation efficiency. Utility Model Content
[0004] This application provides a heat exchange structure for improving heat dissipation efficiency.
[0005] This application provides a heat exchange structure, including: a heat exchange body;
[0006] The heat exchange body has an inlet and an outlet, a heat exchange surface is formed on the heat exchange body, and multiple heat exchange channels are provided inside the heat exchange body. At least some of the heat exchange channels are provided with multiple spaced heat exchange teeth, and at least some of the heat exchange teeth have different shapes.
[0007] Optionally, the shape of the heat exchange teeth may be different for different heat exchange channels, and the shape of the heat exchange teeth may be the same or different for the same heat exchange channel.
[0008] Optionally, the spacing of the heat exchange teeth in different heat exchange channels may be equal or unequal, and for each heat exchange channel, the spacing of the heat exchange teeth may be equal or unequal.
[0009] Optionally, the width of the heat exchange teeth is 1 / 4 to 1 / 2 of the width of the heat exchange channel;
[0010] The thickness of the heat exchange teeth is the same as the thickness of the heat exchange channel.
[0011] Optionally, for each of the heat exchange channels, the excavation direction of the heat exchange channel is parallel to the heat exchange surface.
[0012] Optionally, the multiple heat exchange channels are arranged in parallel.
[0013] or,
[0014] The adjacent heat exchange channels are arranged in a V-shape or an S-shape.
[0015] Optionally, the water inlet of each heat exchange channel is connected to the water inlet of the heat exchange body, and the water outlet of each heat exchange channel is connected to the water outlet of the heat exchange body.
[0016] Alternatively, the heat exchange body may have multiple heat dissipation circuits inside, each heat dissipation circuit including several heat exchange channels. For each heat dissipation circuit, one heat exchange channel is connected to the water inlet of the heat exchange body, and one heat exchange channel is connected to the water outlet of the heat exchange body. The two heat exchange channels are not the same.
[0017] Optionally, the heat exchange structure further includes an inlet pipe and an outlet pipe;
[0018] The water inlet pipe is provided with multiple water inlet branch pipes, and the water outlet pipe is provided with multiple water outlet branch pipes;
[0019] The inlet branch pipes are connected to the heat exchange channel respectively, and the outlet branch pipes are connected to the heat exchange channel respectively.
[0020] Optionally, the heat exchange surface is pre-divided into multiple heat dissipation zones, which are distributed at positions corresponding to the heat exchange channels. The heat dissipation zones are configured to assemble laser chips, and the heat exchange channels are capable of circulating cooling media to absorb the heat from the laser chips.
[0021] Optionally, the heat exchange structure further includes multiple heat conduction elements, the array of which is distributed on the heat exchange surface. The heat conduction elements are configured to mount a laser chip to transfer the heat from the laser chip to the heat exchange body.
[0022] As can be seen from the above technical solutions, the embodiments of this application have the following advantages:
[0023] In the heat exchange structure of this application, a heat exchange main body is provided, and the heat exchange channel inside the heat exchange main body is provided with multiple heat exchange teeth, and some of the heat exchange teeth have different shapes. Compared with only a cooling plate for cooling, this application not only provides a dedicated heat exchange channel, but also has heat exchange teeth of different shapes in the heat exchange channel. This increases the contact area, thereby making the overall heat dissipation efficiency higher and bringing a better experience to the user. Attached Figure Description
[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings.
[0025] Figure 1 This is a schematic diagram of the internal structure of the heat exchange unit disclosed in this application;
[0026] Figure 2 This is a schematic diagram of an embodiment of a heat exchange structure disclosed in this application;
[0027] Figure 3 This is a schematic diagram of another structure of a heat exchange structure disclosed in this application;
[0028] Figure 4 This is an internal cross-sectional view of the heat exchange structure disclosed in this application.
[0029] The attached figures are labeled as follows:
[0030] 1. Water inlet; 2. Water outlet; 3. Heat exchange main body; 4. Heat conduction component; 5. Laser chip; 6. Water inlet pipe; 61. Water inlet branch pipe; 7. Water outlet pipe; 71. Water outlet branch pipe; 8. Heat exchange channel; 9. Heat exchange surface; 10. Heat exchange teeth. Detailed Implementation
[0031] The present application will be further described in detail below with reference to the accompanying drawings.
[0032] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.
[0033] The terms "first," "second," "third," "fourth," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.
[0034] This application provides a heat exchange structure for improving heat dissipation efficiency.
[0035] Electronic devices generate heat during use, requiring cooling to ensure reliability. One existing solution uses a cooling plate for heat exchange; however, the cooling medium often fails to make sufficient contact with the plate, resulting in low heat exchange efficiency and overall low heat dissipation. Another solution uses a single pipe to cool multiple electronic devices sequentially. However, in this approach, the cooling medium's temperature rises after each device is cooled, significantly reducing its heat absorption efficiency and leading to low overall heat dissipation. To address these issues, this application provides a heat exchange structure with dedicated heat exchange channels and differently shaped heat exchange teeth. This increases the contact area, resulting in higher overall heat dissipation efficiency. Furthermore, all heat exchange channels are filled with cooling medium almost simultaneously, ensuring consistent heat absorption and further enhancing overall heat dissipation efficiency, providing a better user experience.
[0036] The following describes a heat exchange structure according to this application. Please refer to [link / reference]. Figure 1 One embodiment of a heat exchange structure according to this application includes: a heat exchange body 3;
[0037] The heat exchange body 3 has an inlet and an outlet. A heat exchange surface 9 is formed on the heat exchange body 3. Multiple heat exchange channels 8 are provided inside the heat exchange body 3. At least a portion of the heat exchange channels 8 are provided with multiple spaced-apart heat exchange teeth 10, and at least a portion of the heat exchange teeth 10 have different shapes. The inlet is used for the entry of cooling medium, and the outlet is used for the exit of cooling medium. The heat exchange surface 9 can exchange heat with the high-heat-generating components of the electronic device, specifically absorbing the heat emitted by the electronic device to cool it, ensuring its continuous and stable operation and preventing the motherboard and other critical components from burning out due to excessive temperature.
[0038] Furthermore, to improve the heat exchange effect, the heat exchange channel 8 can be filled with cooling medium. The cooling medium will fully contact the inner wall of the heat exchange channel 8 and the surface of the heat exchange teeth 10 inside the heat exchange channel 8. When the heat absorbed by the heat exchange surface 9 is transferred to the heat exchange channel 8 and the heat exchange teeth 10, the cooling medium can absorb all the heat from the heat exchange channel 8 and the heat exchange teeth 10, dissipating heat from the heat exchange channel 8 and the heat exchange teeth 10, thereby reducing the temperature of the heat exchange surface 9, so that the heat exchange surface 9 can continuously absorb the heat of the electronic equipment for a long time, enabling it to work stably for a long time. After the cooling medium has undergone heat exchange, it can flow out from the outlet, while the cooling medium that has not yet undergone heat exchange can enter the interior of the heat exchange channel 8 from the inlet and exchange heat with the inner wall of the heat exchange channel 8 and the surface of the heat exchange teeth 10.
[0039] This application does not limit the distance between the spaced heat exchange teeth 10, which can be set according to actual needs. Similarly, the shape of the heat exchange teeth 10 can also be set according to actual needs, and is not limited here.
[0040] The working principle of this embodiment will now be explained. The electronic device can directly or indirectly contact the heat exchange surface 9 of the heat exchange body 3, generally by being in close contact with the heat exchange surface. The cooling medium flows in from the inlet and can immediately fill all the heat exchange channels 8. The cooling medium is in full contact with the inner wall of the heat exchange channel 8 and the surface of the heat exchange teeth 10. The heat exchange surface 9 transfers the heat emitted by the electronic device during operation to the heat exchange channel 8 and the heat exchange teeth 10. The heat exchange channel 8 and the heat exchange teeth 10 then transfer the heat to the cooling medium. The part of the cooling medium that has undergone heat exchange is discharged from the outlet, carrying away the heat. The cooling medium that has not yet undergone heat exchange will fill the interior of the heat exchange channel 8 again to carry out heat exchange. This cycle continues to ensure that the temperature of the electronic device is within the normal range.
[0041] In some embodiments, the heat exchange channel 8 in the heat exchange body 3 is provided with a plurality of heat exchange teeth 10, and some of the heat exchange teeth 10 have different shapes. Compared with only the cooling plate for cooling, this application provides a dedicated heat exchange channel 8, and the heat exchange channel 8 also has heat exchange teeth 10 with different shapes, which increases the contact area and thus makes the overall heat dissipation efficiency higher, providing users with a better experience.
[0042] Furthermore, the different shapes of some heat exchange teeth 10 can change the flow direction of the cooling medium in the heat exchange channel 8, disrupting the cooling medium and preventing laminar flow. If the cooling medium is in laminar flow, tension will form on the surface of the cooling medium, preventing the internal cooling medium molecules from contacting the heat exchange channel 8 and the heat exchange teeth 10. That is to say, the amount of cooling medium in contact with the inner wall of the heat exchange channel 8 and the surface of the heat exchange teeth 10 is reduced, and the heat carried away by the cooling medium through heat exchange is limited. At this time, the cooling effect on the electronic equipment is not optimal. However, the different shapes of some heat exchange teeth 10 can prevent the cooling medium from being in laminar flow, fully disrupt the cooling medium, and make it more fully in contact with the heat exchange channel 8 and the heat exchange teeth 10. More cooling medium is exchanged, resulting in a better cooling effect on the electronic equipment.
[0043] Furthermore, the shapes of the heat exchange channels 8 and the heat exchange teeth 10 can affect the contact area with the cooling medium and can be set according to actual needs. Specifically, the shapes of the heat exchange teeth 10 are different for different heat exchange channels 8, and the shapes of the heat exchange teeth 10 may be the same or different for the same heat exchange channel 8.
[0044] The heat exchange teeth 10 in different heat exchange channels 8 have different shapes, but in the same heat exchange channel 8, the shape of the heat exchange teeth 10 can be the same or different. For example, in the same heat exchange channel 8, the heat exchange teeth 10 in the front half can be one shape, such as a cube, and the heat exchange teeth 10 in the back half can be another shape, such as a hollow column. The cooling medium can change its flow direction by contacting different shapes, thus avoiding laminar flow.
[0045] Furthermore, the number of heat exchange teeth 10 within the heat exchange channel 8 also affects the contact area with the cooling medium. One aspect of this is the spacing between the heat exchange teeth 10 within the heat exchange channel 8. A larger spacing indicates that a heat exchange channel 8 can accommodate fewer heat exchange teeth 10, while a smaller spacing indicates that a heat exchange channel 8 can accommodate more heat exchange teeth 10. The spacing between the heat exchange teeth 10 in different heat exchange channels 8 can be different or the same. Specifically, the spacing of the heat exchange teeth 10 in different heat exchange channels 8 can be equal or unequal. For each heat exchange channel 8, the spacing of the heat exchange teeth 10 can be equal or unequal. Equal spacing of the heat exchange teeth 10 in the same heat exchange channel 8 allows for more even cooling of all parts of the heat exchange channel 8, while unequal spacing allows for targeted cooling of specific parts of the heat exchange channel 8, which can be set according to actual needs.
[0046] Furthermore, the width and thickness of the heat exchange teeth 10 in the heat exchange channel 8 also affect the contact area with the cooling medium. In the heat exchange channel 8, the wider the heat exchange teeth 10, the larger the contact area with the cooling medium; similarly, the thicker the heat exchange teeth 10, the larger the contact area with the cooling medium. Specifically, the width of the heat exchange teeth 10 is 1 / 4 to 1 / 2 of the width of the heat exchange channel 8, and the thickness of the heat exchange teeth 10 is the same as the thickness of the heat exchange channel 8. The cross-sectional area of the heat exchange teeth 10 cannot be the same as the cross-sectional area of the heat exchange channel 8. Preferably, the width of the heat exchange teeth 10 is one-quarter to one-half of the width of the heat exchange channel 8, which ensures effective cooling without clogging the heat exchange channel 8 and causing the cooling medium flow rate to be too slow. The thickness of the heat exchange teeth 10 can be the same as or different from the thickness of the heat exchange channel 8; no specific limitation is made here.
[0047] To improve heat dissipation, the position of the heat exchange channels 8 needs to be restricted. Specifically, for each heat exchange channel 8, the excavation direction of the heat exchange channel 8 is parallel to the heat exchange surface 9. The excavation direction is the overall extension direction of the heat exchange channel 8; simply put, the heat exchange channel 8 can be considered as a straight line parallel to the plane containing the heat exchange surface 9. This allows the cooling medium in the heat exchange channel 8 to absorb more heat.
[0048] The heat exchange channels 8 are arranged in parallel, or adjacent heat exchange channels 8 are arranged in a V-shape or an S-shape. Specifically, the arrangement of multiple heat exchange channels 8 in parallel or in a certain connection shape, such as a V-shape or an S-shape, can be specifically set according to the shape of the electronic equipment on which the heat exchange surface 9 is located and the parts that need to be cooled, etc., and is not limited here.
[0049] One existing solution uses a pipe as a carrier of the cooling medium. The cooling medium first cools the first electronic device, then the second, and so on, until the last electronic device. However, after cooling the first electronic device, the cooling medium carries some heat back to cool the second and so on. This significantly reduces the efficiency of the cooling medium in absorbing heat, and because the pipe is too long, there is a large temperature difference between the first and last electronic devices, resulting in low overall heat dissipation efficiency.
[0050] To solve the above problems, the water inlet of each heat exchange channel 8 is connected to the water inlet 1 of the heat exchange body 3, and the water outlet of each heat exchange channel 8 is connected to the water outlet 2 of the heat exchange body 3. Alternatively, the heat exchange body 3 has multiple heat dissipation circuits formed inside, and each heat dissipation circuit includes several heat exchange channels 8. For each heat dissipation circuit, one heat exchange channel 8 is connected to the water inlet 1 of the heat exchange body 3, and one heat exchange channel 8 is connected to the water outlet 2 of the heat exchange body 3. These two heat exchange channels 8 are not the same.
[0051] Specifically, in one embodiment, each heat exchange channel 8 is independently connected to the inlet 1 and outlet 2 of the heat exchange body 3. The heat exchange channels 8 are not interconnected. Each heat exchange channel 8 is a small loop, in which the cooling medium flows through the inlet 1, corresponding to one heat exchange channel 8 and the outlet 2.
[0052] In another embodiment, a heat dissipation circuit includes multiple heat exchange channels 8, and each heat dissipation circuit is not interconnected. Specifically, the heat dissipation circuit is: the cooling medium flows through the inlet 1, the multiple heat exchange channels 8 involved and the outlet 2.
[0053] Based on the above structure, the heat exchange structure further includes an inlet pipe 6 and an outlet pipe 7. The inlet pipe 6 is provided with multiple inlet branch pipes 61, and the outlet pipe 7 is provided with multiple outlet branch pipes 71. The inlet branch pipes 61 are connected to the heat exchange channel 8, and the outlet branch pipes 71 are also connected to the heat exchange channel 8. Each loop corresponds to one inlet branch pipe 61 and one outlet branch pipe 71, and the inlet branch pipe 61 and outlet branch pipe 71 for each loop are different. The inlet or outlet water flow rates of each branch pipe are approximately the same, ensuring that each loop is simultaneously filled with cooling medium.
[0054] Furthermore, the heat exchange structure of this application can dissipate heat from the laser chip 5. Specifically, the heat exchange surface 9 of the heat exchange structure is pre-divided into multiple heat dissipation zones, which are distributed at positions corresponding to the heat exchange channels 8. Each heat dissipation zone is configured to assemble the laser chip 5, and the heat exchange channels 8 can circulate a cooling medium to absorb the heat from the laser chip 5. Specifically, the laser chip 5 is an electronic device that needs to be cooled. One heat dissipation zone can assemble one or more laser chips 5, and one heat dissipation zone can correspond to one or more heat exchange channels 8. The heat dissipated from the laser chip 5 is transferred to the heat exchange channels 8 via the heat exchange surface 9.
[0055] Furthermore, to ensure reliable heat dissipation, heat conduction elements 4 can also be used for heat dissipation. Specifically, the heat exchange structure further includes multiple heat conduction elements 4, which are arrayed on the heat exchange surface 9. Each heat conduction element 4 is configured to mount a laser chip 5, transferring the heat from the laser chip 5 to the heat exchange body 3. In short, the heat conduction elements 4 are positioned between the laser chip 5 and the heat exchange surface 9, with the heat from the laser chip 5 first transferred to the heat conduction elements 4 and then to the heat exchange surface 9. The heat conduction elements 4 can be arrayed or distributed in other ways; no specific limitation is made here. The heat conduction elements 4 can be sheet-like or of other shapes; no specific limitation is made here.
[0056] In addition, to improve the feasibility and reliability of the solution, the materials of the laser chip 5 and the liquid cooling structure are selected. Specifically, the laser chip 5 is a vertical-cavity surface-emitting laser chip 5, but other types of chips can also be used, depending on actual needs; no specific limitations are made here. The laser chip 5 is made of gallium arsenide, but other materials are also acceptable; no specific limitations are made here. The liquid cooling structure is made of copper, but other metals are also acceptable, depending on actual needs; no specific limitations are made here.
[0057] The working principle of this embodiment will now be explained. When the laser chip 5 needs cooling, the power pump introduces cooling medium from the water inlet 1, and the cooling medium quickly fills the water inlet pipe 6. The water inlet pipe 6 is provided with multiple water inlet branch pipes 61, and the cooling medium enters the water inlet branch pipes 61. Since the time for the cooling medium to enter each water inlet branch pipe 61 is negligible, it can be considered that each heat dissipation circuit is filled simultaneously. The cooling medium in the heat exchange channel 8 of the heat dissipation circuit is also filled simultaneously. The cooling medium will fully contact the heat exchange teeth 10 in the heat exchange channel 8, and the cooling medium will completely fill the gaps between the heat exchange teeth 10 to fully absorb heat. For each heat dissipation circuit, the heat dissipation circuit involves an inlet pipe 6, a corresponding inlet branch pipe 61, a corresponding heat exchange channel 8 with heat exchange teeth 10, a corresponding outlet branch pipe 71, and an outlet pipe 7. After the cooling medium in each small circuit absorbs the heat from its corresponding laser chip 5 and heat conduction component 4, it is collected in the outlet pipe 7 and then discharged from the outlet 2, thus completing the heat exchange and realizing the cooling of the laser chip 5.
[0058] In this embodiment, a heat exchange body 3 is provided, and the heat exchange channels 8 within the heat exchange body 3 are provided with multiple heat exchange teeth 10, some of which have different shapes. Compared to cooling plates alone, this application provides dedicated heat exchange channels 8 with heat exchange teeth 10 of different shapes, which increases the contact area and thus improves the overall heat dissipation efficiency, providing a better user experience. Furthermore, the heat exchange body 3 contains multiple independent heat dissipation circuits, each with its own unique inlet branch pipe 61 and outlet branch pipe 71. Therefore, when the cooling medium enters the inlet 1, the inlet pipe 6 is filled with the cooling medium, and all the inlet branch pipes 61 are filled with the cooling medium almost simultaneously, indicating that all the heat exchange channels 8 are essentially filled with the cooling medium simultaneously. Since the heat dissipation circuits are independent of each other, the heat absorbed by the cooling medium in each heat dissipation circuit is basically the same, preventing any particular heat dissipation circuit from having a higher cooling medium temperature and lower heat absorption efficiency, resulting in higher overall heat dissipation efficiency and a better user experience. In addition, this embodiment does not require long pipes. The shorter inlet pipe 6 and outlet pipe 7, combined with other structures, have the advantages of low water resistance and low cost.
[0059] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing embodiments, and will not be repeated here.
[0060] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection between apparatuses or units through some interfaces, and may be electrical, mechanical, or other forms.
[0061] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.
[0062] In addition, in the various embodiments of this utility model, each functional unit can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.
[0063] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A heat exchange structure, characterized in that, include: Heat exchanger body; The heat exchange body has an inlet and an outlet, a heat exchange surface is formed on the heat exchange body, and multiple heat exchange channels are provided inside the heat exchange body. At least some of the heat exchange channels are provided with multiple spaced heat exchange teeth, and at least some of the heat exchange teeth have different shapes.
2. The heat exchange structure according to claim 1, characterized in that, The shape of the heat exchange teeth is different for different heat exchange channels, and the shape of the heat exchange teeth may be the same or different for the same heat exchange channel.
3. The heat exchange structure according to claim 1, characterized in that, The spacing between the heat exchange teeth in different heat exchange channels may be equal or unequal. For each heat exchange channel, the spacing between the heat exchange teeth may be equal or unequal.
4. The heat exchange structure according to claim 1, characterized in that, The width of the heat exchange teeth is 1 / 4 to 1 / 2 of the width of the heat exchange channel; The thickness of the heat exchange teeth is the same as the thickness of the heat exchange channel.
5. The heat exchange structure according to claim 1, characterized in that, For each of the heat exchange channels, the excavation direction of the heat exchange channel is parallel to the heat exchange surface.
6. The heat exchange structure according to claim 1, characterized in that, The multiple heat exchange channels are arranged in parallel with each other; or, The adjacent heat exchange channels are arranged in a V-shape or an S-shape.
7. The heat exchange structure according to claim 1, characterized in that, The water inlet of each heat exchange channel is connected to the water inlet of the heat exchange body, and the water outlet of each heat exchange channel is connected to the water outlet of the heat exchange body. Alternatively, the heat exchange body may have multiple heat dissipation circuits inside, each heat dissipation circuit including several heat exchange channels. For each heat dissipation circuit, one heat exchange channel is connected to the water inlet of the heat exchange body, and one heat exchange channel is connected to the water outlet of the heat exchange body. The two heat exchange channels are not the same.
8. The heat exchange structure according to claim 7, characterized in that, The heat exchange structure also includes an inlet pipe and an outlet pipe; The water inlet pipe is provided with multiple water inlet branch pipes, and the water outlet pipe is provided with multiple water outlet branch pipes; The inlet branch pipes are connected to the heat exchange channel respectively, and the outlet branch pipes are connected to the heat exchange channel respectively.
9. The heat exchange structure according to claim 1, characterized in that, The heat exchange surface is pre-divided into multiple heat dissipation zones, which are distributed at positions corresponding to the heat exchange channels. The heat dissipation zones are configured to assemble laser chips, and the heat exchange channels are capable of circulating cooling media to absorb the heat from the laser chips.
10. The heat exchange structure according to claim 1, characterized in that, The heat exchange structure further includes multiple heat conduction elements, which are arrayed on the heat exchange surface. The heat conduction elements are configured to mount laser chips to transfer the heat from the laser chips to the heat exchange body.