A mobile device charging radiator and charging assembly

Abstract

The utility model relates to a kind of mobile equipment charging radiator and charging assembly, radiator includes heat dissipation piece, fan, refrigeration sheet, charging coil, first magnetic attraction piece and circuit board, heat dissipation piece includes bottom disc and the heat dissipation frame of a circle being set around bottom disc edge, heat dissipation frame is equipped with several heat dissipation holes;Fan and circuit board are fixedly installed in the side surface of bottom disc, and the side surface of fan is surrounded with heat dissipation hole;Refrigeration sheet, charging coil and first magnetic attraction piece are fixedly installed in the other side surface of bottom disc.By setting heat dissipation piece, fan and refrigeration sheet, the heat generated by charging coil and mobile equipment charging is quickly discharged, without triggering temperature protection mechanism to cause charging power to drop.Circuit board and charging coil are set on different sides, avoid the influence of charging coil heat production on the component work on circuit board, ensure the working stability of circuit board;Circuit board and fan are set on the same side, can make fan air intake to circuit board heat dissipation, ensure the working stability of circuit board.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, and in particular to a mobile device charging heat sink and charging assembly. Background Technology

[0002] Wireless charging technology has been widely adopted in smartphones and other mobile devices due to its convenience. However, existing wireless charging solutions suffer from significant heat generation during charging, especially at high power, where the charging coil and surrounding electronic components experience substantial temperature rise. When the wireless charger or phone overheats, it may trigger a temperature protection mechanism, forcing a reduction in charging current or halting charging, thus affecting charging efficiency. Utility Model Content

[0003] Therefore, it is necessary to provide a mobile device charging heat sink and charging component to address the problem of reduced charging efficiency caused by overheating during wireless charging of mobile devices.

[0004] This utility model provides a mobile device charging heat sink, including a heat sink, a fan, a cooling plate, a charging coil, a first magnetic chuck, and a circuit board. The heat sink includes a chassis and a heat sink frame surrounding the edge of the chassis, and the heat sink frame has a plurality of heat dissipation holes. The fan and the circuit board are fixedly mounted on one side of the chassis, and the side of the fan is surrounded by the heat dissipation holes. The cooling plate, the charging coil, and the first magnetic chuck are fixedly mounted on the other side of the chassis.

[0005] In some embodiments, the side of the cooling chip away from the chassis, the side of the charging coil, and the side of the first magnetic chuck are on the same plane.

[0006] In some embodiments, the other side of the chassis is provided with a first groove adapted to the cooling chip, a second groove adapted to the charging coil, and a third groove adapted to the first magnetic attractor; the center of the second groove and the center of the third groove are located within the first groove.

[0007] In some embodiments, the bottom plane of the second groove is the opening plane of the first groove, and the bottom plane of the third groove is the opening plane of the second groove.

[0008] In some embodiments, the inner ring of the charging coil is a hollow structure, the cooling chip is disposed inside the hollow structure, and the first magnetic attractor is arranged around the charging coil.

[0009] In some embodiments, a thermal pad or thermal sheet is also included, which is fixedly connected to the side of the cooling chip away from the chassis, and the thermal pad or thermal sheet covers the cooling chip, the charging coil and the first magnetic attractor.

[0010] In some embodiments, the contact surface between the cooling element and the chassis is provided with a heat-conducting medium.

[0011] In some embodiments, the heat sink is a ring-shaped finned heat sink composed of multiple heat sink plates.

[0012] In some embodiments, one side of the fan is disposed adjacent to the chassis, and the other side of the fan is disposed adjacent to one side of the circuit board, wherein the circuit board is provided with through holes adapted to the rotation area of ​​the fan blades.

[0013] In some embodiments, an air inlet cover is also included, which is disposed adjacent to the other side of the circuit board; the fan is provided with a fan bracket; the air inlet cover, the circuit board, the fan bracket and the chassis are fixedly connected in sequence.

[0014] In some embodiments, a second magnetic attraction element is also provided between the air inlet cover and the circuit board.

[0015] This utility model provides a charging component, including a bracket and the aforementioned mobile device charging heat sink, wherein the bracket and the mobile device charging heat sink are detachably and fixedly connected.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects:

[0017] 1. By incorporating heat sinks, fans, and cooling pads, the heat generated by the charging coil and the mobile device during charging is rapidly dissipated without triggering temperature protection mechanisms that would reduce charging power, thereby reducing energy loss and achieving energy conservation and environmental protection. A first magnetic component enhances the positional stability of the mobile device relative to the charging coil during charging, ensuring stable alignment between the mobile device and the charging coil. Furthermore, by placing the circuit board and the charging coil on different sides, the heat generated by the charging coil avoids affecting the operation of components on the circuit board, ensuring its operational stability. Additionally, placing the circuit board and the fan on the same side allows the fan to draw air in and dissipate heat from the circuit board, further ensuring its operational stability.

[0018] 2. By integrating the cooling element, charging coil, and magnetic attachment into the heat sink, a multi-functional heat sink combining rapid heat dissipation, wireless charging, and magnetic fixation is achieved. This simultaneously meets the user's needs for heat dissipation, charging, and fixation during mobile device use / charging. The cooling element, charging coil, and magnetic attachment are nested on one side of the heat sink chassis, while the fan and circuit board are located on the other side. Compared to traditional heat sinks, this reduces the need for housings, mounting brackets, and other components, resulting in a simpler structure and novel layout, thus lowering the hardware cost. The nested design between the cooling element, charging coil, and magnetic attachment makes the overall size of the heat sink more compact, achieving miniaturization and meeting the user's needs for portability and ease of use. Furthermore, the nested design facilitates assembly, improving assembly efficiency and reducing assembly costs. Attached Figure Description

[0019] Figure 1 This is a side view structural diagram of a mobile device charging heat sink according to an embodiment of the present utility model.

[0020] Figure 2 This is a schematic diagram of the structure of a mobile device charging heat sink from another side, as shown in an embodiment of the present invention.

[0021] Figure 3 This is an exploded view structural diagram of a mobile device charging heat sink according to an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the chassis structure shown in an embodiment of the present utility model;

[0023] Figure 5 This is a schematic diagram of the air inlet cover plate shown in an embodiment of the present utility model;

[0024] Figure 6 A schematic diagram of the fan structure is shown for an embodiment of this utility model. Detailed Implementation

[0025] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0026] It should be noted that when an element is said to be "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is said to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is said to be "directly on" another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] See Figures 1 to 3 This utility model provides a mobile device charging heat sink, including a heat sink 1, a fan 2, a cooling plate 3, a charging coil 4, a first magnetic accommodating member 5, and a circuit board 6. The heat sink 1 includes a chassis 11 and a heat sink frame 12 surrounding the edge of the chassis 11. The heat sink frame 12 is provided with a plurality of heat dissipation holes 121. The fan 2 and the circuit board 6 are fixedly installed on one side of the chassis 11, and the side of the fan 2 is surrounded by the heat dissipation holes 121. The cooling plate 3, the charging coil 4, and the first magnetic accommodating member 5 are fixedly installed on the other side of the chassis 11.

[0029] In this embodiment, the heat sink 1 serves as the main frame of the heat sink and is provided with several heat dissipation holes 121 for the fan 2 to dissipate and exhaust air; the fan 2 serves as the driving component for the air intake and exhaust of the heat sink, and the fan 2 includes fan blades and a small motor. The small motor drives the fan blades to rotate to drive the airflow of the heat sink; the cooling chip 3 is used to cool and quickly transfer the heat generated by the charging coil 4 and the charging of the mobile device. The cooling chip 3 can be a semiconductor cooling chip; the charging coil 4 provides wireless power to the mobile device, and it can be a charging coil with a magnetic strip. The contact position between the magnetic strip and the cooling chip 3 can be coated with a thermally conductive medium; the first magnetic attractor 5 serves as a connector for magnetic connection with the mobile device, and it can be selected with a magnetic material of appropriate magnetic force according to actual needs; the circuit board 6 is used to control the working logic of various electronic structures in the heat sink.

[0030] When mobile devices such as mobile phones are being charged, the first magnetic component 5 is magnetically connected to the mobile phone. Under the control of the circuit board 6, the charging coil 4 wirelessly charges the mobile phone. The cooling plate 3 cools the charging coil 4 and the mobile phone to conduct heat, thereby cooling the charging coil 4 and the mobile phone. The fan blades of the fan 2 rotate to draw in fresh air from the front of the fan blades. After the fresh air rushes into the chassis 11, it spreads to the surroundings, carrying away the heat conducted by the cooling plate 3 and the heat generated by the components of the circuit board 6. The hot air is then discharged from the side of the fan blades through the heat dissipation holes 121 of the heat sink 1.

[0031] This embodiment utilizes a heat sink 1, a fan 2, and a cooling pad 3 to quickly dissipate the heat generated by the charging coil 4 and the mobile device during charging, without triggering a temperature protection mechanism that would reduce charging power. The first magnetic chuck 5 enhances the positional stability of the mobile device relative to the charging coil 4 during charging, ensuring stable alignment between the mobile device and the charging coil 4. Furthermore, by placing the circuit board 6 and the charging coil 4 on different sides, the heat generated by the charging coil 4 is prevented from affecting the operation of components on the circuit board 6, ensuring the operational stability of the circuit board 6. Conversely, placing the circuit board 6 and the fan 2 on the same side allows the fan 2 to draw in air to dissipate heat from the circuit board 6, further ensuring its operational stability.

[0032] It is understood that, for power supply, a power interface is connected to the circuit board 6, and the charging coil 4 and the cooling element 3 are electrically connected to the circuit board 6. The chassis 11 can be provided with through holes or slots for the wires of the charging coil 4 and the cooling element 3 to pass through, which is not limited. To make the heat sink aesthetically pleasing, high-temperature resistant stickers, covers, etc., can be provided on the side away from the chassis 11, the side of the charging coil 4, the side of the cooling element 3, and the side of the magnetic ring 5, which is not limited. The heat sink and corresponding structural components shown in the figure are circular, but in other embodiments they can be square or irregular in shape, which is not limited.

[0033] In some embodiments, the other side of the chassis 11 is a plane. Because the cooling element 3, charging coil 4, and first magnetic accommodator 5 have different thicknesses, the sides of the cooling element 3, charging coil 4, and first magnetic accommodator 5 that are away from the chassis 11 are not on the same plane. Therefore, by providing a flat surface structure such as a cover plate on the cooling element 3, charging coil 4, and first magnetic accommodator 5, the contact surface between the heat sink and mobile devices such as mobile phones can be made flat.

[0034] In some embodiments, the side of the cooling chip 3 away from the chassis 11, the side of the charging coil 4, and the side of the first magnetic attractor 5 are on the same plane.

[0035] In this embodiment, the other side of the chassis 11 is a plane. In order to make the contact surface between the heat sink and the mobile device flat, the cooling chip 3, the charging coil 4 and the first magnetic accommodating member 5 can be set to the same thickness, so that the side of the cooling chip 3 away from the chassis 11, the side of the charging coil 4 and the side of the first magnetic accommodating member 5 are on the same plane.

[0036] In some embodiments, the other side of the chassis 11 is not a plane. The other side of the chassis 11 is provided with a first groove 111 adapted to the cooling chip 3, a second groove 112 adapted to the charging coil 4, and a third groove 113 adapted to the first magnetic attractor 5; the center of the second groove 112 and the center of the third groove 113 are within the first groove 111.

[0037] In this embodiment, the cooling element 3 is disposed in the first groove 111, the charging coil 4 is disposed in the second groove 112, and the first magnetic chuck 5 is disposed in the third groove 113. The groove depths of the first groove 111, the second groove 112, and the third groove 113 are respectively set to the thicknesses of the cooling element 3, the charging coil 4, and the first magnetic chuck 5, so that the side of the cooling element 3, the side of the charging coil 4, and the side of the first magnetic chuck 5 away from the chassis 11 are on the same plane.

[0038] By providing three recesses in the chassis 11, and ensuring that the cooling element 3, charging coil 4, and first magnetic accommodating element 5 are all positioned as close as possible to the mobile device, the heat conduction effect of the cooling element 3 on the mobile device is improved, the charging efficiency of the charging coil 4 on the mobile device is increased, and the magnetic attraction stability of the first magnetic accommodating element 5 on the mobile device is guaranteed. Furthermore, this embodiment can use universally sized cooling element 3, charging coil 4, and first magnetic accommodating element 5 without requiring customized hardware dimensions, thus reducing hardware costs.

[0039] Optionally, the bottom plane of the second groove 112 is the opening plane of the first groove 111, and the bottom plane of the third groove 113 is the opening plane of the second groove 112.

[0040] In this optional embodiment, the bottom plane of the second groove 112 is the same plane as the opening plane of the first groove 111, so as to remove the groove edge partition between the first groove 111 and the second groove 112; the bottom plane of the third groove 113 is the same plane as the opening plane of the second groove 112, so as to remove the groove edge partition between the second groove 112 and the third groove 113, thereby reducing the lateral volume of the heat sink and meeting the miniaturization requirement.

[0041] In some embodiments, the inner ring of the charging coil 4 is a hollow structure 41, the cooling chip 3 is disposed inside the hollow structure 41, and the first magnetic attractor 5 is arranged around the charging coil 4.

[0042] In this embodiment, the first magnetic element 5 can be a magnetic ring, which can be arranged around the inner ring of the charging coil 4 or around the outer ring of the charging coil 4. By interlocking and surrounding the cooling element 3, the charging coil 4, and the first magnetic element 5, space utilization is improved, meeting the requirement for miniaturization of the heat sink.

[0043] In some embodiments, a thermal pad or thermal sheet 7 is also included, which is fixedly connected to the side of the cooling chip 3 away from the chassis 11, and the thermal pad or thermal sheet 7 covers the cooling chip 3, the charging coil 4 and the first magnetic attractor 5.

[0044] In this embodiment, the thermally conductive material of the thermal pad or thermal sheet 7 can be silicone, glass, or metal. The thermal pad 7 can be uniformly coated with adhesive and attached to the surfaces of the cooling pad 4, charging coil 4, and first magnetic accommodator 5. The surface of the thermal pad or thermal sheet 7 is not lower than the heat sink 12 to ensure that the electronic device contacts the thermal pad or thermal sheet 7 during charging, improving heat dissipation efficiency, charging efficiency, and magnetic stability, and preventing a significant gap between the thermal pad or thermal sheet 7 and the electronic device due to the heat sink 12 being too high. Simultaneously, the silicone material of the thermal pad or thermal sheet 7 can effectively transfer the heat generated by the mobile phone, improving heat transfer efficiency. Optionally, the contact surface between the thermal pad or thermal sheet 7 and the cooling pad 4 is coated with a thermally conductive medium.

[0045] In some embodiments, the charging coil 4 and the first magnetic suction member 5 are fixedly installed on the other side of the chassis 11 with adhesive; the contact surface between the cooling chip 3 and the chassis 11 is provided with a heat-conducting medium.

[0046] In this embodiment, the thermally conductive medium can be a material such as silicone grease. The charging coil 4 and the first magnetic chuck 5 are bonded together with adhesive to stably fix them to the chassis. Optionally, a silicone pad 7 can be used to bond the charging coil 4 and the first magnetic chuck 5 together, so that the cooling chip 3 in the center position is installed stably; alternatively, thermally conductive medium and adhesive can be applied to different areas of the contact surface between the cooling chip 3 and the chassis 11 to achieve both stable installation of the cooling chip 3 and improved heat transfer efficiency of the cooling chip 3.

[0047] In some embodiments, the heat sink 12 is an annular finned heat sink composed of a plurality of heat sink plates 122.

[0048] In this embodiment, the heat sink 12 adopts an annular fin design to guide airflow. Compared with a through-hole design, the fin design has a larger heat dissipation area and is more aesthetically pleasing, improving both heat dissipation performance and appearance. Optionally, the annular fin heat sink frame and the chassis 11 can be integrally die-cast from aluminum alloy to improve hardware production efficiency and reduce production costs. The heat sink 122 can be designed with one thin end and the other thick end. The thin end is located inside the heat sink 1, so that the hot air exhausted by the fan 2 is not blocked by the thickness of the heat sink 122; the thick end is located outside the heat sink 1, improving grip and preventing cuts.

[0049] In some embodiments, one side of the fan 2 is disposed adjacent to the chassis 11, and the other side of the fan 2 is disposed adjacent to one side of the circuit board 6. The circuit board 6 is provided with a through hole 61 adapted to the rotation area of ​​the fan blades of the fan 2.

[0050] In this embodiment, the fan 2 is arranged adjacent to the chassis 11, and the circuit board 6 is arranged adjacent to the fan 2, so that the circuit board 6 is far away from the chassis 11, avoiding the heat conducted by the chassis 11 from affecting the temperature rise of the components on the circuit board 6. At the same time, the circuit board 6 is close to the air inlet, improving the heat dissipation effect of the circuit board 6. Optionally, the circuit board 6 is provided with electronic structures such as buttons, power indicator lights, power display screen, charging interface and discharging interface, and these electronic structures can be embedded in the heat sink 1.

[0051] In some embodiments, such as Figure 5 and Figure 6 As shown, it also includes an air inlet cover 8, which is disposed adjacent to the other side of the circuit board 6; the fan 2 is provided with a fan bracket 21; the air inlet cover 8, the circuit board 6, the fan bracket 21 and the chassis 11 are fixedly connected in sequence.

[0052] In this embodiment, the air inlet cover 8 can shield the circuit board 6 from dust, preventing dust from causing short circuits or other damage. Simultaneously, by sequentially fixing the air inlet cover 8, the circuit board 6, the fan bracket 21, and the chassis 11 together, the heat sink can be quickly assembled, reducing assembly costs.

[0053] Optionally, the air inlet cover 8, circuit board 6, fan bracket 21 and chassis 11 can be fixedly connected by snap-fit ​​connection, bolt connection or adhesive connection, etc.

[0054] For example, the fan bracket 21 is bolted to the chassis 11, the air inlet cover 8 is provided with a fixing screw hole post extending to the chassis 11, the air inlet cover 8 is bolted to the chassis 11, the circuit board 6 is provided with a locking post, the air inlet cover 8 is provided with a locking hole, and the circuit board 6 and the air inlet cover 8 are connected through the locking post and locking hole.

[0055] For example, the fan bracket 21 consists of several fixing strips extending outward from one end of the fan motor, and one end of each fixing strip has a through hole. A groove adapted to the fan bracket 21 is provided on one side of the chassis 11. The groove has a locking hole that aligns with the through hole of the fixing strip, and the fan bracket 21 is disposed within the groove. The air inlet cover 8 has locking posts extending to the chassis 11. The circuit board 6 has through holes adapted to the locking posts, wherein the diameter of the locking post on the side of the circuit board 6 away from the fan 2 is larger than the diameter of the locking post on the other side closer to the circuit board 6. The heat sink 1 has a recessed platform adapted to the edge of the circuit board 6, and the edge of the circuit board 6 abuts against the recessed platform. The locking posts of the air inlet cover 8 pass sequentially through the circuit board 6 and the fan bracket 21 and then engage with the locking holes of the chassis 11, improving assembly convenience.

[0056] In some embodiments, a second magnetic element 9 is provided between the air inlet cover 8 and the circuit board 6.

[0057] In this embodiment, the second magnetic component 9 can stabilize the heat sink on a metal table or a mobile phone stand or other support structure, thus meeting the needs of more application scenarios for the heat sink.

[0058] This utility model provides a charging component, including a bracket and the aforementioned mobile device charging heat sink, wherein the bracket and the mobile device charging heat sink are detachably and fixedly connected.

[0059] In this embodiment, the bracket can be of any structure, such as a mobile phone holder, a power bank holder, etc. The bracket is detachably connected to the side of the mobile device charging heat sink with a fan, for example, the bracket is magnetically connected to the second magnetic component 9.

[0060] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A mobile device charging heat sink, characterized in that, The device includes a heat sink, a fan, a cooling plate, a charging coil, a first magnetic chuck, and a circuit board. The heat sink includes a chassis and a heat dissipation frame surrounding the edge of the chassis, and the heat dissipation frame has a plurality of heat dissipation holes. The fan and the circuit board are fixedly mounted on one side of the chassis, and the side of the fan is surrounded by the heat dissipation holes. The cooling plate, the charging coil, and the first magnetic chuck are fixedly mounted on the other side of the chassis.

2. The mobile device charging heat sink according to claim 1, characterized in that, The side of the cooling chip away from the chassis, the side of the charging coil, and the side of the first magnetic chuck are on the same plane.

3. The mobile device charging heat sink according to claim 2, characterized in that, The other side of the chassis is provided with a first groove adapted to the cooling chip, a second groove adapted to the charging coil, and a third groove adapted to the first magnetic attractor; the center of the second groove and the center of the third groove are inside the first groove.

4. The mobile device charging heat sink according to claim 3, characterized in that, The bottom plane of the second groove is the opening plane of the first groove, and the bottom plane of the third groove is the opening plane of the second groove.

5. The mobile device charging heat sink according to claim 1, characterized in that, The inner ring of the charging coil is a hollow structure, the cooling chip is disposed inside the hollow structure, and the first magnetic attractor is arranged around the charging coil.

6. The mobile device charging heat sink according to claim 1, characterized in that, It also includes a thermal pad or thermal sheet, which is fixedly connected to the side of the cooling chip away from the chassis, and the thermal pad or thermal sheet covers the cooling chip, the charging coil and the first magnetic attractor.

7. The mobile device charging heat sink according to claim 1, characterized in that, The contact surface between the cooling element and the chassis is provided with a heat-conducting medium.

8. The mobile device charging heat sink according to claim 1, characterized in that, The heat sink is a ring-shaped finned heat sink composed of multiple heat sink plates.

9. The mobile device charging heat sink according to claim 1, characterized in that, One side of the fan is adjacent to the chassis, and the other side of the fan is adjacent to one side of the circuit board. The circuit board has through holes that are adapted to the rotation area of ​​the fan blades.

10. The mobile device charging heat sink according to claim 9, characterized in that, It also includes an air inlet cover, which is disposed adjacent to the other side of the circuit board; the fan is provided with a fan bracket; the air inlet cover, the circuit board, the fan bracket and the chassis are fixedly connected in sequence.

11. The mobile device charging heat sink according to claim 10, characterized in that, A second magnetic attraction element is also provided between the air inlet cover and the circuit board.

12. A charging component, characterized in that, It includes a bracket and a mobile device charging heat sink as described in any one of claims 1 to 11, wherein the bracket is detachably and fixedly connected to the mobile device charging heat sink.

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