Variable frequency drive heat dissipation structure and variable frequency drive
By setting an inclined surface on the inverter heat sink base plate to guide the airflow of the fan, the problem of poor heat dissipation inside the inverter is solved, achieving efficient heat dissipation and low temperature rise, while keeping the overall size unchanged and the production cost low.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU GTAKE ELECTRIC CO LTD
- Filing Date
- 2025-07-14
- Publication Date
- 2026-07-21
AI Technical Summary
The limited internal space of the frequency converter and the insufficient thickness of the heat sink substrate prevent the airflow blown out by the fan from flowing smoothly over the fin surface, resulting in increased temperature and preventing further reduction in the overall size of the unit.
An inclined surface is set at the end of the heat sink base plate near the fan to guide the airflow generated by the fan to the top of the base plate, ensuring that the airflow can be completely blown on the surface of the base plate and fins, avoiding taking up extra space.
It achieves smooth airflow, reduces temperature rise, maintains the same overall size, and eliminates the need to redesign other components, resulting in low cost.
Smart Images
Figure CN224538581U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of internal heat dissipation technology of frequency converters, specifically to the heat dissipation structure of frequency converters and frequency converters. Background Technology
[0002] As power density requirements increase and overall machine size requirements decrease, the internal space of the inverter is almost filled. Since the size of the power board cannot be reduced further, in order to ensure heat dissipation, on the one hand, the power board needs to be attached to the surface of the heat sink base plate, and the thickness of the heat sink base plate is required to be relatively large. Otherwise, an excessively thin heat sink base plate cannot play a good role in heat conduction, resulting in increased temperature. On the other hand, under the extreme compression of the overall machine length, the heat sink is close to the fan. Because the heat sink base plate is relatively thick, the airflow is somewhat blocked when the fan blows air onto the heat sink. The airflow generated by the fan cannot flow quickly and efficiently over the surface of the heat sink base plate and fins, that is, the airflow is not smooth and the temperature rises. Utility Model Content
[0003] The purpose of this utility model is to provide a heat dissipation structure and a frequency converter to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, this utility model provides the following technical solution:
[0005] The inverter heat dissipation structure includes a heat sink, a power board, and a fan. The bottom surface of the heat sink's base plate is attached and fixed to the power board. The fan is disposed at one end of the heat sink, and the height of its bottom surface is lower than the height of the top surface of the base plate. A guide portion is provided at the end of the base plate near the fan, and the guide portion is used to guide the airflow generated when the fan starts to the top of the base plate.
[0006] Preferably, the guide portion is an inclined surface disposed on the end of the substrate near the fan, and the height of the lower end of the inclined surface is lower than the airflow height generated when the fan starts.
[0007] Preferably, the heat sink, the power board, and the fan are all fixedly installed inside the housing.
[0008] Preferably, the top of the fins of the heat sink abuts against the inner top wall of the housing.
[0009] A frequency converter, wherein the frequency converter includes the above-described frequency converter heat dissipation structure.
[0010] Compared with the prior art, the beneficial effects of this utility model are:
[0011] The guide part in this invention is an inclined surface located at one end of the substrate near the fan. This arrangement does not require space and ensures that the overall size of the machine remains unchanged. The lower end of the inclined surface is lower than the height of the airflow generated when the fan starts, so that the airflow generated after the fan starts can be blown onto the surface of the substrate and fins, achieving the technical effect of smooth airflow and low temperature rise. In addition, since only an inclined surface needs to be set on the substrate, there is no need to redesign other components, resulting in low production costs. Attached Figure Description
[0012] Figure 1 This is a cross-sectional structural diagram of the present invention;
[0013] Figure 2 This is a schematic diagram of the radiator structure in this utility model.
[0014] In the diagram: 1. Heat sink; 11. Base plate; 12. Fins; 2. Power board; 3. Fan; 4. Sloping surface; 5. Housing. Detailed Implementation
[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0016] Please see Figures 1-2 This utility model provides a technical solution:
[0017] The inverter's heat dissipation structure includes a heat sink 1, a power board 2, and a fan 3. The heat sink 1, power board 2, and fan 3 are all fixedly installed inside the housing 5. The relative positions of each component are shown in the figure. The heat sink 1 is a finned heat sink, specifically including a base plate 11 and multiple fins 12 disposed on the top surface of the base plate 11. The bottom surface of the base plate 11 of the heat sink 1 is attached and fixed to the power board 2; the fan 3 is disposed at one end of the heat sink 1.
[0018] As can be clearly seen from the figure, the height of the top surface of the substrate 11 is higher than the height of the bottom surface of the fan 3. Therefore, after the fan 3 is powered on and rotates, some of the airflow generated will blow onto the end surface of the substrate 11 near the fan 3, causing the airflow to be obstructed and the temperature to rise. To solve this problem, in this embodiment, a guide part is provided at the end of the substrate 11 near the fan 3. Specifically, the guide part is used to guide the airflow generated when the fan 3 is started to the top of the substrate 11.
[0019] Because the overall size of the machine needs to be compressed, the distance between the fan 3 and the substrate 11 is very small. Therefore, in order to solve the problem of poor airflow, in this embodiment, the guide part is an inclined surface 4 set at the end of the substrate 11 near the fan 3 (or a large straight chamfer is set at the end of the substrate 11 near the fan 3). This setting does not occupy space and can ensure that the overall size of the machine remains unchanged. The height of the lower end of the inclined surface 4 is lower than the height of the airflow generated when the fan 3 starts, so that the airflow generated after the fan 3 starts can be blown onto the surface of the substrate 11 and the fins 12, achieving the technical effect of smooth airflow and low temperature rise. In addition, since only the inclined surface 4 needs to be set on the substrate 11, there is no need to redesign the other components, and the production cost is low.
[0020] The top of the fins 12 of the heat sink 1 abuts against the inner top wall of the outer casing 5. The upward airflow guided by the inclined surface 4 blows against the inner top wall of the outer casing 5 and then flows back between the two adjacent fins 12, resulting in good heat dissipation.
[0021] A frequency converter includes a frequency converter body, which contains the aforementioned frequency converter heat dissipation structure.
[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A frequency converter heat dissipation structure, comprising a heat sink, a power board, and a fan, wherein the bottom surface of the heat sink's substrate is fixedly attached to the power board; the fan is disposed at one end of the heat sink, and the height of its bottom surface is lower than the height of the top surface of the substrate, characterized in that, A guide portion is provided at one end of the substrate near the fan, and the guide portion is used to guide the airflow generated when the fan is started to the top of the substrate.
2. The inverter heat dissipation structure according to claim 1, characterized in that, The guide portion is an inclined surface disposed on one end of the substrate near the fan, and the lower end of the inclined surface is at a height lower than the airflow height generated when the fan is started.
3. The inverter heat dissipation structure according to claim 1, characterized in that, The heat sink, the power board, and the fan are all fixedly installed inside the housing.
4. The inverter heat dissipation structure according to claim 3, characterized in that, The tips of the fins of the radiator abut against the inner top wall of the outer casing.
5. A frequency converter, characterized in that, The frequency converter includes the frequency converter heat dissipation structure described in any one of claims 1-4.