Water-cooled plate for electronic device heat dissipation

Abstract

The utility model discloses a kind of water-cooled plates for electronic device heat dissipation, including multiple water-cooled plate units, any water-cooled plate unit includes plate body, it is internally hollow cavity structure, the inner chamber of plate body is separated into multiple flow passages by multiple rib plates, two sleeve pipes are respectively welded in the both ends of plate body, the both ends of multiple flow passages are respectively communicated with two sleeve pipes, two water-cooled plate units adjacent are detachably connected by the sleeve pipe;Multiple sleeve pipes located at the same end are sequentially communicated to form pipeline with one end as opening and the other end sealed, the opening end of two pipelines is opposite, the opening end of two pipelines is respectively connected with water inlet connector and water outlet connector.The utility model can flexibly select corresponding number of water-cooled plate units according to the size of electronic device to assemble, to realize the size of water-cooled plate after assembly and the size of electronic device match, high adaptability, without different specifications water-cooled plate according to different electronic device customization, production design cost is low.

Description

Technical Field

[0001] This utility model relates to the field of water cooling technology. More specifically, this utility model relates to a water-cooled plate for heat dissipation of electronic devices. Background Technology

[0002] In recent years, as electronic devices have developed towards high performance and miniaturization, their heat flux density has increased significantly, which has placed higher demands on heat dissipation technology. Water-cooled radiators have been widely used in heat dissipation applications with high heat flux density, such as servers, new energy vehicles, and high-power LEDs, due to their advantages of high heat dissipation efficiency, compact size, and low cost.

[0003] However, existing water-cooled plates are usually of fixed size, which cannot be flexibly adjusted according to the actual size of electronic devices, resulting in poor applicability. In order to adapt to different electronic devices, water-cooled plates of various specifications need to be customized, which leads to high production and design costs. Summary of the Invention

[0004] Another objective of this invention is to provide a water-cooled plate for heat dissipation of electronic devices, which can be flexibly assembled with a corresponding number of water-cooled plate units according to the size of the electronic devices, thus exhibiting high adaptability and low production and design costs.

[0005] To achieve these objectives and other advantages according to the present invention, a water-cooled plate for heat dissipation of electronic devices is provided, comprising a plurality of continuously arranged water-cooled plate units. Each water-cooled plate unit includes a plate body, which is a hollow cavity structure. The cavity of the plate body is divided into a plurality of flow channels by a plurality of ribs. Two sleeves are welded to both ends of the plate body respectively. The two ends of the plurality of flow channels are respectively connected to the two sleeves. Two adjacent water-cooled plate units are detachably connected through the sleeves. In this system, multiple sleeves located at the same end are connected in sequence to form a pipe with one end open and the other end sealed. The open ends of the two pipes face opposite directions, and the open ends of the two pipes are respectively connected to an inlet connector and an outlet connector.

[0006] Preferably, the cross-section of the flow channel is a regular polygon or rectangle, and the cross-sectional shapes of the flow channels of two adjacent water-cooled plate units are the same or different.

[0007] Preferably, the sleeves at both ends of any of the plates include a first sleeve and a second sleeve, respectively. The outer periphery of both ends of the first sleeve is provided with a first annular groove, and a rubber sealing ring is provided in the first annular groove. The inner periphery of both ends of the second sleeve is provided with two second annular grooves. The first sleeve is interference-fitted with the second annular groove on the inner periphery of the second sleeve of the adjacent plate through the rubber sealing ring.

[0008] Preferably, the end of any pipe is sealed with a tapered plug.

[0009] Preferably, a plurality of first flow guiding units are provided in the pipe connected to the water inlet connector, which are respectively arranged in a plurality of sleeves. Each first flow guiding unit includes a plurality of rectangular flow guiding plates, which are spaced apart in the sleeve along the axial direction of the sleeve. The flow guiding plates are arranged perpendicular to the axial direction of the sleeve, and there is a gap between the outer periphery of the flow guiding plate and the inner sidewall of the sleeve.

[0010] Preferably, a plurality of second flow guiding units are provided in the pipe connected to the water outlet connector, which are respectively arranged in a plurality of sleeves. Each second flow guiding unit includes a plurality of flow guiding parts, which are spaced apart along the axial direction of the sleeve on the inner bottom surface of the sleeve. The flow guiding parts are conical with their tails facing the pipe outlet.

[0011] Preferably, the top surface of the plate has a threaded hole corresponding to the rib, and a mounting post is threaded into the threaded hole for fixing electronic components.

[0012] The present invention has at least the following beneficial effects: The water-cooled plate for heat dissipation of electronic devices is composed of multiple water-cooled plate units. The appropriate number of water-cooled plate units can be flexibly selected and assembled according to the size of the electronic device to achieve the size of the assembled water-cooled plate matching the size of the electronic device. It has high adaptability, does not require the customization of water-cooled plates of different specifications according to different electronic devices, and has low production and design costs.

[0013] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of the water-cooled plate for heat dissipation of the electronic device of this utility model; Figure 2 This is a schematic diagram of the structure of the water-cooled plate unit of this utility model; Explanation of reference numerals in the instruction manual: 1. Water-cooled plate, 2. Inlet pipe, 3. Outlet pipe, 4. Conical plug, 5. Water-cooled plate unit, 501. Plate body, 502. Flow channel, 503. Rib, 504. First sleeve, 505. Second sleeve, 6. Rectangular guide plate, 7. Flow guide section. Detailed Implementation

[0015] The present invention will now be described in further detail with reference to the accompanying drawings, so that those skilled in the art can implement it based on the description.

[0016] It should be noted that in the description of this utility model, the terms "horizontal", "longitudinal", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0017] like Figure 1-2 As shown, this utility model provides a water-cooled plate for heat dissipation of electronic devices, including multiple water-cooled plate units 5 arranged in succession. Each water-cooled plate unit 5 includes a plate body 501, which is a hollow cavity structure. The inner cavity of the plate body 501 is divided into multiple flow channels 502 by multiple ribs 503. Two sleeves are welded to both ends of the plate body 501 respectively. The two ends of the multiple flow channels 502 are respectively connected to the two sleeves. Two adjacent water-cooled plate units 5 are detachably connected through the sleeves. In this system, multiple sleeves located at the same end are connected in sequence to form a pipe with one end open and the other end sealed. The open ends of the two pipes face opposite directions, and the open ends of the two pipes are respectively connected to an inlet connector and an outlet connector.

[0018] In the above technical solution, the electronic device to be cooled is mounted on the top surface of the water-cooled plate 1. The water-cooled plate 1 is formed by assembling multiple water-cooled plate units 5 sequentially. A suitable number of water-cooled plate units 5 can be assembled according to the area of ​​the electronic device to be cooled, so that the specifications of the water-cooled plate 1 match the area of ​​the electronic device, resulting in high adaptability. Figure 2As shown, the water-cooled plate unit 5 consists of a plate body 501 and sleeves welded to both ends. The plate body 501 is divided into multiple flow channels 502 by multiple ribs 503. Cooling water flows through these channels 502, and each flow channel 502 is connected to the sleeves at both ends. Two adjacent water-cooled plate units 5 are assembled into a whole through corresponding sleeves at both ends. The sleeves at both ends of the assembled water-cooled plate 1 are connected sequentially to form two pipes, named inlet pipe 2 and outlet pipe 3, respectively. Inlet pipe 2 is used to receive cooling water, and its open end is connected to the inlet connector. Outlet pipe 3 is used to discharge cooling water, and its open end... The inlet and outlet pipes are connected. External cooling water enters the inlet pipe 2 through the inlet connector and the opening end of the inlet pipe 2. Then, it enters the multiple flow channels 502 of the multiple water-cooled plate units 5 in sequence, and then flows out from the opening end of the outlet pipe 3 through the outlet connector. The cooling water carries away the heat on the water-cooled plate 1 by flowing in the flow channels 502, thereby achieving the purpose of heat dissipation for electronic devices. The opening ends of the inlet pipe 2 and the outlet pipe 3 face opposite directions, so that the cooling water enters the inlet pipe 2, passes through each flow channel 502, and then flows out from the outlet pipe 3, ensuring the heat dissipation effect of the water-cooled plate 1. This utility model can flexibly select the appropriate number of water-cooled plate units 5 for assembly according to the size of electronic devices, so that the size of the assembled water-cooled plate 1 matches the size of the electronic devices. It has high adaptability and does not require customization of different specifications of water-cooled plates 1 for different electronic devices. The production and design cost is low. The plate body 501 and the sleeve are welded by friction stir welding to ensure the sealing of the weld and the sealing of the water-cooled plate unit 5.

[0019] In another technical solution, the cross-section of the flow channel 502 is a regular polygon or a rectangle, and the cross-sectional shapes of the flow channels 502 of two adjacent water-cooled plate units 5 may be the same or different.

[0020] In this technical solution, the water flow resistance of the cooling water is affected by the cross-sectional shape of the flow channel 502, thus affecting the heat dissipation effect of the water-cooled plate unit 5. By setting the cross-sectional shape of the flow channel 502 to different shapes, the cross-sectional shapes of the flow channels 502 of two adjacent water-cooled plate units 5 can be the same or different, so that the heat dissipation effect of the two adjacent water-cooled plate units 5 can be the same or different according to the requirements. When the heat dissipation requirements of various parts of the electronic device are the same, multiple water-cooled plate units 5 with the same cross-sectional shape of the flow channel 502 can be assembled together so that the heat dissipation effect of each water-cooled plate unit 5 of the water-cooled plate 1 is the same. When the heat dissipation requirements of each part of the electronic device are different, water-cooled plate units 5 with different heat dissipation effects can be assembled according to the different heat dissipation requirements, so as to meet the heat dissipation requirements of various parts of the electronic device, which is highly flexible.

[0021] In another technical solution, the sleeves at both ends of any of the plate bodies 501 respectively include a first sleeve 504 and a second sleeve 505. The outer periphery of both ends of the first sleeve 504 is provided with a first annular groove, and a rubber sealing ring is provided in the first annular groove. The inner periphery of both ends of the second sleeve 505 is provided with two second annular grooves. The first sleeve 504 is interference-fitted with the second annular groove on the inner periphery of the second sleeve 505 of the adjacent plate body 501 through the rubber sealing ring.

[0022] In this technical solution, the sleeves at both ends of the plate 501 are a first sleeve 504 and a second sleeve 505, respectively. The first sleeve 504 can be press-fitted with the second annular groove in the second sleeve 505 through a rubber sealing ring. When assembling two adjacent water-cooled plate units 5, the two water-cooled plate units 5 are arranged in opposite directions. For ease of description, the two water-cooled plate units 5 are named the first water-cooled plate unit and the second water-cooled plate unit. The first sleeve 504 on the first water-cooled plate unit and the second sleeve 505 on the second water-cooled plate unit are press-fitted. In this configuration, the second sleeve 505 on the first water-cooled plate unit and the first sleeve 504 on the second water-cooled plate unit are interference-fitted. The reverse setting and interference fit method allows the two adjacent water-cooled plate units 5 to be assembled together, which is convenient for assembly. Moreover, when processing the water-cooled plate units 5, only one specification of water-cooled plate unit 5 needs to be processed. In order to avoid gaps at the assembly point of the two adjacent water-cooled plate units 5 after assembly, which would affect the heat dissipation effect on the electronic components located in the gap, a graphene thermal pad can be filled in the gap to ensure the heat dissipation effect on the electronic components.

[0023] In another technical solution, the end of any pipe is sealed by a tapered plug 4.

[0024] In this technical solution, the conical plug 4 achieves the sealing effect of the pipe end by interfering with the inner wall of the pipe. The conical plug 4 seals one end of the pipe. When assembling the water-cooled plate 1, the number and order of the water-cooled plate units 5 can be freely adjusted according to actual needs. It is not necessary to consider whether the opening ends of the two pipes are opposite after the water-cooled plate 1 is assembled based on the position of the sleeve sealing end. The assembly is highly flexible. The conical plug 4 is available in two sizes, which are adapted to the inner diameter of the first sleeve 504 and the second sleeve 505 respectively.

[0025] In another technical solution, a plurality of first flow guiding units are provided in the pipe connected to the water inlet connector. These units are respectively arranged in a plurality of sleeves. Each first flow guiding unit includes a plurality of rectangular flow guiding plates 6, which are spaced apart along the axial direction of the sleeve. The flow guiding plates 6 are arranged perpendicular to the axial direction of the sleeve, and there is a gap between the outer periphery of the flow guiding plate 6 and the inner sidewall of the sleeve.

[0026] In this technical solution, multiple rectangular guide plates 6 are located inside the water inlet pipe 2. The rectangular guide plates 6 are arranged perpendicular to the axial direction of the water inlet pipe 2. When the cooling water enters the water inlet pipe 2 from the water inlet connector, it will enter the corresponding flow channel 502 under the obstruction of the rectangular guide plates 6, thereby achieving the function of guiding the cooling water and avoiding the cooling water directly impacting the side wall of the flow channel 502 to form a turbulent dead zone, thus ensuring the heat dissipation effect of the water-cooled plate 1. There is a gap between the outer periphery of the guide plate 6 and the inner side wall of the sleeve, which can prevent the guide plate 6 from obstructing the flow of cooling water to other places.

[0027] In another technical solution, a plurality of second flow guiding units are provided in the pipe connected to the water outlet connector. These units are respectively installed in a plurality of sleeves. Each second flow guiding unit includes a plurality of flow guiding parts 7, which are spaced apart along the axial direction of the sleeve on the inner bottom surface of the sleeve. The flow guiding parts 7 are conical with their tails facing the pipe outlet.

[0028] In this technical solution, a guide section 7 is provided inside the water outlet pipe 3. The guide section 7 is configured as a cone with its tail facing the outlet of the water outlet pipe 3, which can guide the cooling water to flow towards the outlet of the water outlet pipe 3, ensuring efficient discharge of cooling water and improving the heat exchange efficiency of cooling water.

[0029] In another technical solution, the top surface of the plate 501 is provided with a threaded hole corresponding to the rib plate 503, and a mounting post is threaded into the threaded hole. The mounting post is used to fix electronic devices.

[0030] In this technical solution, a mounting post is provided on the top surface of the plate 501. The electronic device has a mounting hole, which is inserted through the mounting post to fix the electronic device to the water-cooled plate 1. The mounting post is threaded into the threaded hole, making the mounting post detachable. This allows for flexible installation according to the size of the electronic device and the position of the mounting hole, so as to meet the positioning requirements of electronic devices of different sizes. The threaded hole is located at the position of the rib 503 on the plate 501, which can avoid affecting the sealing performance of the water-cooled plate unit 5 when machining the threaded hole.

[0031] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A water-cooled plate for heat dissipation of electronic devices, characterized in that, It includes multiple water-cooled plate units arranged in succession. Each water-cooled plate unit includes a plate body, which is a hollow cavity structure. The cavity of the plate body is divided into multiple flow channels by multiple ribs. Two sleeves are welded to both ends of the plate body. The two ends of the multiple flow channels are respectively connected to the two sleeves. Two adjacent water-cooled plate units are detachably connected through the sleeves. In this system, multiple sleeves located at the same end are connected in sequence to form a pipe with one end open and the other end sealed. The open ends of the two pipes face opposite directions, and the open ends of the two pipes are respectively connected to an inlet connector and an outlet connector.

2. The water-cooled plate for heat dissipation of electronic devices as described in claim 1, characterized in that, The cross-section of the flow channel is a regular polygon or a rectangle, and the cross-sectional shape of the flow channel of two adjacent water-cooled plate units may be the same or different.

3. The water-cooled plate for heat dissipation of electronic devices as described in claim 1, characterized in that, Each of the two ends of the plate body includes a first sleeve and a second sleeve. The outer periphery of both ends of the first sleeve is provided with a first annular groove and a rubber sealing ring is provided in the first annular groove. The inner periphery of both ends of the second sleeve is provided with two second annular grooves. The first sleeve is press-fitted with the second annular groove on the inner periphery of the second sleeve of the adjacent plate body through the rubber sealing ring.

4. The water-cooled plate for heat dissipation of electronic devices as described in claim 1, characterized in that, The end of any pipe is sealed with a tapered plug.

5. The water-cooled plate for heat dissipation of electronic devices as described in claim 1, characterized in that, Multiple first flow guiding units are provided inside the pipe connected to the water inlet connector. Each first flow guiding unit includes multiple rectangular flow guiding plates, which are spaced apart along the axial direction of the sleeve inside the sleeve. The flow guiding plates are arranged perpendicular to the axial direction of the sleeve, and there is a gap between the outer periphery of the flow guiding plate and the inner sidewall of the sleeve.

6. The water-cooled plate for heat dissipation of electronic devices as described in claim 1, characterized in that, Multiple second flow guiding units are provided inside the pipe connected to the water outlet connector. These units are respectively installed inside multiple sleeves. Each second flow guiding unit includes multiple flow guiding parts, which are spaced apart along the axial direction of the sleeve on the inner bottom surface of the sleeve. The flow guiding parts are conical with their tails facing the pipe outlet.

7. The water-cooled plate for heat dissipation of electronic devices as described in claim 1, characterized in that, The top surface of the plate has a threaded hole corresponding to the rib plate, and a mounting post is threaded into the threaded hole. The mounting post is used to fix electronic components.

Images