A heat dissipation mounting structure of a home electric stimulator

Abstract

The utility model relates to a kind of heat dissipation mounting structures of domestic electric stimulator, shell and the mounting chamber of circuit board contained in shell interior, the shell bottom surface is equipped with heat dissipation hole, mounting chamber is equipped with the support part for placing circuit board, shell bottom surface and circuit board installed on support part form uniform flow layer.The utility model is by the shell equipped with heat dissipation hole and set support seat, so that circuit board installed on support part and shell bottom surface form uniform flow layer, the heat generated by circuit board can be dissipated from heat dissipation hole by uniform flow layer, avoid circuit board and shell bottom adhere, so that the local heat of circuit board not contacted with heat dissipation hole cannot be dissipated by heat dissipation hole.Local overheating leads to circuit board damage.

Description

Technical Field

[0001] This utility model relates to the field of magnetic field stimulation instrument technology, specifically to a heat dissipation installation structure for a home-use electrical stimulator. Background Technology

[0002] With ongoing research and exploration into improving brain function and treating neurological diseases, transcranial electrical stimulation (TCS) has become one of the effective methods for treating various neurological disorders, in addition to drug therapy.

[0003] Electrical stimulators are generally divided into open-loop stimulation and closed-loop stimulation. Open-loop stimulation usually generates fixed electrical stimulation pulses, which are independent of whether the patient is in an epileptic state. Closed-loop stimulation, on the other hand, determines the patient's epileptic state by detecting the patient's nerve signals and adjusts the electrical stimulation parameters accordingly. By using the patient's nerve signals as feedback to initiate electrical stimulation, better therapeutic effects can be achieved.

[0004] Home-use electrical stimulators are small in size, and the electrical components inside the device generate a lot of heat when working. If the heat cannot be dissipated in time, it will cause the electrical components to overheat and be damaged. Utility Model Content

[0005] The first aspect of this utility model aims to solve the technical problem of poor heat dissipation in existing electrostimulators by providing a heat dissipation installation structure for a home electrostimulator. This structure can dissipate heat from the internal electrical components by setting heat dissipation holes and heat dissipation layers, thereby preventing overheating and damage to the internal electrical components.

[0006] To achieve the above objectives, this utility model provides a heat dissipation mounting structure for a home-use electrostimulator, including a housing and an internal mounting chamber for accommodating a circuit board. The bottom surface of the housing has heat dissipation holes, and the mounting chamber has a support for placing the circuit board. A uniform flow layer is formed between the bottom surface of the housing and the circuit board mounted on the support. This solution, by providing a support for the housing with heat dissipation holes, allows the circuit board mounted on the support to form a uniform flow layer with the bottom surface of the housing. The heat generated by the circuit board can be dissipated through the uniform flow layer from the heat dissipation holes, preventing the circuit board from sticking to the bottom of the housing and preventing localized overheating and damage to the circuit board.

[0007] Preferably, the heat dissipation holes are evenly distributed in the housing; and / or, the heat dissipation holes are opened at relative positions to the heat-generating parts of the circuit board.

[0008] Preferably, the support includes multiple pillars, each pillar having threaded holes, and the pillars are connected to the circuit board by bolts.

[0009] Preferably, the support is installed around the perimeter of the housing.

[0010] Preferably, the support pillar is also located in the middle of the housing. By placing the support pillar in the middle, the circuit board is prevented from denting and deforming under gravity, thus avoiding damage to the circuit board.

[0011] The second aspect of this invention aims to solve the technical problem that the upward movement of hot airflow in the uniform flow layer cannot accurately dissipate heat through the bottom heat dissipation holes, leading to heat accumulation in the mounting cavity. Furthermore, the support portion also includes multiple side plates, which are connected end-to-end to form a baffle frame. This baffle frame is used to constrain the airflow. By using the side plates to form the baffle frame to enclose the area where the circuit board is mounted, the hot airflow from the circuit board is confined within the uniform flow channel and flows towards the heat dissipation holes.

[0012] The third aspect of this invention aims to solve the technical problem that when heat is dissipated through the heat dissipation holes, the holes are blocked by the base plane, affecting the heat dissipation effect. Furthermore, foot pads are installed on the outside of the housing, forming a heat dissipation channel between the housing and the base plane. The foot pads elevate the bottom of the housing, creating a certain gap between it and the reference plane, allowing heat inside the equipment to flow outwards for better heat exchange and preventing the reference ground from overheating.

[0013] Preferably, the mounting chamber is provided with a connecting seat, which is installed on the top surface of the housing and is used to install electrical components. By installing the electrical components on the top of the housing, a certain distance is maintained between the electrical components and the circuit board to avoid mutual heat interference.

[0014] Preferably, the side wall of the housing has a side hole. The side hole allows heat from inside the housing to escape through the side hole.

[0015] The beneficial effects of this utility model are as follows:

[0016] By providing a support base to the lower housing with heat dissipation holes, the circuit board mounted on the support and the bottom surface of the lower housing form a uniform flow channel. The heat generated by the circuit board can be dissipated through the heat dissipation holes via the uniform flow channel, thus preventing localized overheating of the circuit board that is in contact with the bottom of the lower housing but not with the heat dissipation holes. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model.

[0018] Figure 2 This is a cross-sectional view of the structure of this utility model.

[0019] The reference numerals in the attached drawings include: 1. Housing; 11. Mounting chamber; 12. Fluid leveling layer; 13. Heat dissipation channel; 2. Heat dissipation hole; 3. Support; 31. Column; 32. Side plate; 33. Threaded hole; 4. Connecting seat; 5. Foot pad; 6. Circuit board; 7. Electrical assembly. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0021] In this disclosure, unless otherwise stated, directional terms such as "inner" and "outer" are defined based on the contours of the corresponding components. Terms such as "first" and "second" used in this disclosure are for distinguishing one element from another and do not imply sequence or importance.

[0022] Example 1

[0023] like Figures 1-2 As shown, this embodiment provides a heat dissipation mounting structure for a home-use electrical stimulator, including a housing 1 and a mounting chamber 11 inside the housing 1 for accommodating a circuit board 6. The bottom surface of the housing 1 is provided with heat dissipation holes 2, and the mounting chamber 11 is provided with a support part 3 for placing the circuit board 6. A uniform flow layer 12 is formed between the bottom surface of the housing 1 and the circuit board 6 mounted on the support part 3.

[0024] In this embodiment, a support base is provided on the housing 1 with heat dissipation holes 2, so that the circuit board 6 mounted on the support 3 and the bottom surface of the housing 1 form a uniform flow layer 12. The heat generated by the circuit board 6 can be dissipated through the uniform flow layer 12 from the heat dissipation holes 2, avoiding the circuit board 6 from sticking to the bottom of the housing 1. This would prevent the heat of the circuit board 6 that is not in contact with the heat dissipation holes 2 from being dissipated through the heat dissipation holes 2, which would lead to local overheating and damage to the circuit board 6.

[0025] The heat dissipation holes 2 are evenly distributed in the housing 1, and the heat dissipation holes 2 are opened at the relative positions of the heat-generating parts of the circuit board 6.

[0026] In this embodiment, the heat dissipation holes 2 are adapted to the actual heat-generating locations of the circuit board. The heat dissipation holes are concentrated at the heat-generating locations of the circuit board, and heat dissipation holes are evenly opened at the relative positions of the heat-generating locations of the circuit board at the bottom of the housing 1. In addition, heat dissipation holes 2 with a relatively dispersed density can be opened at the relative positions of the housing and other locations of the circuit board for basic heat dissipation.

[0027] Furthermore, the support part 3 includes multiple support columns 31, each with a threaded hole 33. The support columns 31 are connected to the circuit board 6 by bolts. Corresponding connection through holes are provided on the circuit board 6 at positions that mate with the support columns 31. The circuit board is placed above the support columns 31, and the threaded holes 33 of the support columns 31 and the connection through holes of the circuit board 6 are aligned. Bolts are then threaded through the connection through holes and into the threaded holes 33 of the support columns 31, thus securing the circuit board 7 to the support part 3.

[0028] The support column 31 is installed around the perimeter of the housing 1 to provide stable support for the installation of the circuit board 7; the support column 31 is also set in the middle of the housing 1. By setting the support column 31 in the middle, the circuit board 6 is prevented from being dented and deformed in the middle under the action of gravity, which would cause damage to the circuit board 6.

[0029] Example 2

[0030] Based on Example 1, such as Figures 1-2 As shown, the support part 3 in this embodiment also includes a plurality of side plates 32, which are connected end to end to form a baffle frame. The baffle frame is used to constrain airflow. The baffle frame formed by the side plates 32 encloses the area where the circuit board 6 is installed, so that the hot airflow of the circuit board 6 can be constrained within the uniform flow channel and flow towards the heat dissipation hole 2.

[0031] In this embodiment, the side plates 32 are connected end to end by support columns 31. The two ends of the side plates 32 are respectively connected to the outer walls of the support columns 31. After the bottom of the housing is positioned by the support columns 31, the side plates connected to the support columns 31 can be more stably supported and installed.

[0032] In this embodiment, the height of the support column 31 is slightly higher than the height of the side plate 32, so that there is also a small gap between the side plate forming the enclosure frame and the circuit board 7. The heat exchange airflow entering the uniform flow layer through the heat dissipation holes can also flow into the heat exchange chamber through this gap for heat exchange.

[0033] Example 3

[0034] like Figure 2 As shown, in this embodiment, the outer surface of the housing 1 is equipped with foot pads 5, and the housing 1 and the base plane form a heat dissipation channel 13. The foot pads 5 can raise the bottom of the housing 1, forming a certain distance gap with the reference plane, so that the heat inside the equipment can flow outward, and heat exchange can be carried out better to dissipate heat, and the reference ground can also be prevented from overheating.

[0035] The mounting chamber 11 is provided with a connecting seat 4, which is installed on the top surface of the housing 1. The connecting seat 4 is used to install the electrical component 7. By installing the electrical component 7 on the top of the housing 1, a certain distance is reserved between the electrical components and the circuit board 6 to avoid mutual heat interference.

[0036] The side wall of the housing 1 has a side opening. The side opening allows heat inside the housing 1 to be discharged from the side. A ventilation fan can be installed in the side opening to exchange heat within the installation chamber 11.

[0037] The above descriptions are merely embodiments of this utility model, and common knowledge regarding specific structures and characteristics is not elaborated upon here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the structure of this utility model, and these should also be considered within the scope of protection of this utility model. These modifications will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application shall be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A heat dissipation mounting structure for a home-use electrical stimulator, comprising a housing (1) and a mounting chamber (11) inside the housing (1) for accommodating a circuit board (6), characterized in that: The bottom surface of the housing (1) is provided with heat dissipation holes (2), and the mounting chamber (11) is provided with a support (3) for placing the circuit board (6). A uniform flow layer (12) is formed between the bottom surface of the housing (1) and the circuit board (6) mounted on the support (3).

2. The heat dissipation mounting structure of a home-use electrical stimulator according to claim 1, characterized in that: The heat dissipation holes (2) are evenly distributed on the bottom surface of the housing (1); and / or, the heat dissipation holes (2) are opened at the relative positions of the heat-generating parts of the circuit board (6).

3. The heat dissipation mounting structure for a home-use electrical stimulator according to claim 1, characterized in that: The support (3) includes multiple pillars (31), each pillar (31) having a threaded hole (33), and the pillars (31) are detachably connected to the circuit board (6) by bolts.

4. The heat dissipation mounting structure of a home-use electrical stimulator according to claim 3, characterized in that: The support column (31) is located around the bottom surface of the shell (1).

5. The heat dissipation mounting structure of a home-use electrical stimulator according to claim 3, characterized in that: The support column (31) is also located in the middle of the bottom surface of the shell (1).

6. The heat dissipation mounting structure of a home-use electrical stimulator according to claim 1, characterized in that: The support (3) also includes multiple side plates (32), which are connected end to end to form a enclosure frame, which is used to constrain airflow.

7. The heat dissipation mounting structure of a home-use electrical stimulator according to claim 1, characterized in that: The outer side of the housing (1) is fitted with foot pads (5), and the housing (1) forms a heat dissipation channel (13) with the base plane.

8. The heat dissipation mounting structure of a home-use electrical stimulator according to claim 1, characterized in that: The installation chamber (11) is provided with a connecting seat (4), which is installed on the top surface of the housing (1) and is used to install electrical components (7).

9. The heat dissipation mounting structure of a home-use electrical stimulator according to claim 1, characterized in that: The side wall of the housing (1) is provided with a side hole for installing the chamber (11) for heat dissipation.

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