A battery replacement cabinet facilitating heat dissipation of a semiconductor refrigeration module

Abstract

The utility model discloses a kind of battery replacement cabinet convenient to semiconductor refrigeration module heat dissipation, it is related to battery replacement cabinet technical field, including cabinet and cabinet inside cabinet frame;The upper end inboard of cabinet is equipped with first heat dissipation fan;One side of cabinet frame and located below first heat dissipation fan is equipped with heat dissipation box, one side of heat dissipation box is equipped with the heat dissipation mounting bracket for installing semiconductor refrigeration module, second heat dissipation fan is installed on heat dissipation box and located above heat dissipation mounting bracket;Heat dissipation backboard is installed between heat dissipation mounting bracket and heat dissipation box, heat dissipation setting for heat dissipation is installed in heat dissipation box.The utility model is equipped with multiple heat dissipation structure, can effectively improve the heat dissipation efficiency of semiconductor refrigeration module in battery replacement cabinet, guarantee its working performance stable, simultaneously have the characteristics of convenient maintenance and protection semiconductor refrigeration module.

Description

Technical Field

[0001] This utility model relates to the field of battery swapping cabinet technology, specifically to a battery swapping cabinet that facilitates heat dissipation of the semiconductor cooling module. Background Technology

[0002] With the increasing popularity of battery-swapping electric vehicles, higher demands are being placed on the temperature control capabilities of battery swapping cabinets. Semiconductor cooling modules (TECs), with their advantages of small size and compressor-free operation, are widely used in battery temperature control applications. However, current TEC modules in battery swapping cabinets are typically distributed in a single location, with mixed flow between hot and cold ends, poor independent temperature control across different battery compartments, and low heat exchange efficiency.

[0003] Battery swapping cabinets are devices used to provide battery replacement services for electric vehicles and other equipment. During operation, the internal semiconductor cooling module generates heat. If this heat cannot be dissipated in time, it will affect the efficiency and lifespan of the semiconductor cooling module. Existing battery swapping cabinets are inadequate in terms of heat dissipation for the semiconductor cooling module, with a simple heat dissipation structure and poor heat dissipation effect, failing to meet actual usage requirements. Utility Model Content

[0004] The present invention aims to solve the above-mentioned technical problems by providing a battery swapping cabinet that facilitates heat dissipation of semiconductor cooling modules.

[0005] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0006] A battery swapping cabinet for facilitating heat dissipation of a semiconductor cooling module includes a cabinet body and a frame inside the cabinet body; a first cooling fan is installed on the upper inner side of the cabinet body; a heat dissipation box is provided on one side of the frame body and below the first cooling fan, a heat dissipation mounting bracket for mounting the semiconductor cooling module is provided on one side of the heat dissipation box, and a second cooling fan is installed on the heat dissipation box and above the heat dissipation mounting bracket; a heat dissipation backplate is installed between the heat dissipation mounting bracket and the heat dissipation box; and heat dissipation devices for heat dissipation are installed inside the heat dissipation box.

[0007] Preferably, the heat dissipation device includes a cavity inside the heat dissipation box and multiple sets of ventilation holes on the heat dissipation box. The ventilation holes are connected to the cavity, and a heat dissipation pipe is installed inside the cavity. One side of the heat dissipation pipe is connected to an air inlet pipe.

[0008] Preferably, the heat pipe has a U-shaped structure and its two ends pass through the heat dissipation backplate and the heat dissipation box, respectively.

[0009] Preferably, a maintenance window for inspecting and repairing the semiconductor cooling module is installed on the back of the cabinet.

[0010] Preferably, the heat dissipation mounting bracket is bolted to a protective cover for protecting the semiconductor cooling module, and the protective cover has heat dissipation holes.

[0011] Preferably, the heat dissipation mounting bracket has multiple sets of heat dissipation mounting holes for heat dissipation and installation.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. By setting up a first cooling fan and a second cooling fan, this utility model can form air convection, accelerate the air circulation in the battery swapping cabinet, and promptly remove the heat generated by the semiconductor cooling module, thereby improving the heat dissipation effect.

[0014] 2. The heat dissipation design inside the heat dissipation box further enhances the heat dissipation capacity. The cavity, ventilation holes, heat dissipation pipes and air inlet pipes work together to effectively dissipate heat to the outside and prevent heat from accumulating in the battery swapping cabinet.

[0015] 3. The U-shaped heat pipe design makes the airflow more uniform and can better cooperate with the heat pipe for heat dissipation.

[0016] 4. The maintenance window facilitates the inspection and maintenance of the semiconductor cooling module, reducing maintenance costs.

[0017] 5. The protective cover can protect the semiconductor cooling module from external impacts and damage, and the heat dissipation holes on the protective cover will not affect the heat dissipation effect.

[0018] 6. The heat dissipation mounting holes on the heat dissipation mounting bracket not only facilitate the installation of the semiconductor cooling module, but also play a certain role in heat dissipation.

[0019] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of this utility model;

[0022] Figure 2 This is an installation diagram of the maintenance window of this utility model;

[0023] Figure 3This is an installation diagram of the heat dissipation box of this utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the cabinet frame of this utility model;

[0025] Figure 5 This is a schematic diagram of the structure of the heat dissipation box of this utility model;

[0026] Figure 6 This is a cross-sectional view of point AA of this utility model;

[0027] Figure 7 This is a schematic diagram of the structure of the protective cover of this utility model.

[0028] As shown in the figure: 1. Cabinet body; 2. Cabinet frame; 3. Air inlet; 4. Heat sink box; 5. Heat sink mounting bracket; 6. Second heat sink fan; 7. Maintenance window; 8. Protective cover; 9. Heat sink hole; 10. Cavity; 11. Ventilation hole; 12. Heat sink pipe; 13. Air inlet pipe; 14. Heat sink back panel; 15. Heat sink mounting hole. Detailed Implementation

[0029] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0031] The present invention will now be described in further detail in conjunction with the full text.

[0032] Combined with appendix Figures 1-7 A battery swapping cabinet for facilitating heat dissipation of semiconductor cooling modules includes a cabinet body 1 and a cabinet frame 2 inside the cabinet body 1; a first cooling fan is installed on the inner side of the upper end of the cabinet body 1; an air inlet 3 is located at the upper end of the cabinet body 1 for the first cooling fan to enter. The cabinet body 1 and the cabinet frame 2 are an integral support structure, with the cabinet body used to fix the internal components; the first cooling fan, installed on the inner side of the upper end of the cabinet body, can draw out hot air from the top of the cabinet body, forming a downward airflow.

[0033] In a specific implementation of this utility model, a heat dissipation box 4 is provided on one side of the cabinet frame 2 and below the first heat dissipation fan. A heat dissipation mounting bracket 5 for installing a semiconductor cooling module is provided on one side of the heat dissipation box 4 and above the heat dissipation mounting bracket 5. A second heat dissipation fan 6 is installed on the heat dissipation box 4 and above the heat dissipation mounting bracket 5. The second heat dissipation fan 6 is installed on the heat dissipation box 4 and above the heat dissipation mounting bracket 5, and blows air directly at the heat dissipation mounting bracket 5 to accelerate the air flow on the surface of the module, forming a "top-drawing and bottom-blowing" convection channel with the first heat dissipation fan.

[0034] In a specific implementation of this utility model, a heat dissipation backplate 14 is installed between the heat dissipation mounting bracket 5 and the heat dissipation box 4; the heat dissipation backplate is made of 6061 aluminum alloy with a thermal conductivity ≥200W / (m·K), which can quickly conduct heat from the module to the heat dissipation box 4.

[0035] The heat dissipation box 4 is equipped with a heat dissipation device.

[0036] In a specific implementation, the heat dissipation system includes a cavity 10 inside the heat dissipation box 4 and multiple sets of ventilation holes 11 on the heat dissipation box 4. The ventilation holes 11 connect to the cavity 10, and a heat dissipation pipe 12 is installed inside the cavity 10. One side of the heat dissipation pipe 12 is connected to an air inlet pipe 13. The ventilation holes 11 connect the cavity 10 to the outside. The heat dissipation pipe 12 (made of copper with spiral guide lines on the inner wall to increase the heat dissipation area) is installed inside the cavity 10. The heat dissipation pipe 12 has a U-shaped structure, and the connecting pipes of the heat dissipation pipe 12 pass through the heat dissipation backplate 14 and the heat dissipation box 4 respectively.

[0037] In specific implementation of this utility model, such as Figure 2 As shown, a maintenance window 7 is installed on the back of the cabinet 1 for inspecting and repairing the semiconductor cooling module. When it is necessary to inspect and repair the semiconductor cooling module, the maintenance window 7 can be opened for operation.

[0038] A protective cover 8 for protecting the semiconductor cooling module is bolted to the heat dissipation mounting bracket 5. The protective cover 8 has heat dissipation holes 9.

[0039] The heat dissipation mounting bracket 5 has multiple sets of heat dissipation mounting holes 15 for heat dissipation and installation.

[0040] The working principle of this utility model:

[0041] During the operation of the battery swapping cabinet, the semiconductor cooling module is mounted on the heat dissipation mounting bracket 5. The first and second cooling fans 6 operate simultaneously, creating airflow to remove some of the heat generated by the semiconductor cooling module. Simultaneously, the first cooling fan delivers cool air into the ventilation hole 11, then into the cavity 10, and finally into the heat dissipation pipe 12 through the air inlet duct 13. The heat dissipation pipe 12 cools the heat dissipation mounting bracket 5 and the semiconductor cooling module from both ends. The second cooling fan 6 further enhances heat dissipation. The heat dissipation backplate 14 transfers heat from the semiconductor cooling module to the heat dissipation box 4, enhancing the cooling effect. When maintenance of the semiconductor cooling module is required, the maintenance window 7 can be opened for operation. The protective cover 8 protects the semiconductor cooling module, while the heat dissipation mounting holes 15 and 9 also assist in heat dissipation.

[0042] The present invention and its embodiments have been described above. This description is not restrictive, and the embodiments shown throughout the text are only one of the embodiments of the present invention. The actual structure is not limited to this. In conclusion, if a person skilled in the art is inspired by this description and designs a similar structure and embodiment without departing from the inventive spirit of the present invention, such design should fall within the protection scope of the present invention.

Claims

1. A battery swapping cabinet for facilitating heat dissipation of a semiconductor cooling module, characterized in that, Includes the cabinet (1) and the cabinet frame (2) inside the cabinet (1); A first cooling fan is installed on the inner side of the upper end of the cabinet (1); A heat sink (4) is provided on one side of the cabinet (2) and below the first heat sink fan. A heat sink mounting bracket (5) for installing a semiconductor cooling module is provided on one side of the heat sink (4). A second heat sink fan (6) is installed on the heat sink (4) and above the heat sink mounting bracket (5). A heat dissipation backplate (14) is installed between the heat dissipation mounting bracket (5) and the heat dissipation box (4); The heat dissipation box (4) is equipped with a heat dissipation device for heat dissipation.

2. The battery swapping cabinet for facilitating heat dissipation of the semiconductor cooling module according to claim 1, characterized in that: The heat dissipation device includes a cavity (10) inside the heat dissipation box (4) and multiple sets of ventilation holes (11) opened on the heat dissipation box (4). The ventilation holes (11) are connected to the cavity (10). A heat dissipation pipe (12) is installed inside the cavity (10). An air inlet pipe (13) is connected to one side of the heat dissipation pipe (12).

3. The battery swapping cabinet for facilitating heat dissipation of the semiconductor cooling module according to claim 2, characterized in that: The heat pipe (12) has a U-shaped structure and its two ends pass through the heat dissipation back plate (14) and the heat dissipation box (4), respectively.

4. The battery swapping cabinet for facilitating heat dissipation of the semiconductor cooling module according to claim 1, characterized in that: The back of the cabinet (1) is equipped with a maintenance window (7) for inspecting and repairing the semiconductor cooling module.

5. The battery swapping cabinet for facilitating heat dissipation of a semiconductor cooling module according to claim 1, characterized in that: The heat dissipation mounting bracket (5) is bolted to a protective cover (8) for protecting the semiconductor cooling module, and the protective cover (8) has heat dissipation holes (9).

6. The battery swapping cabinet for facilitating heat dissipation of the semiconductor cooling module according to claim 1, characterized in that: The heat dissipation mounting bracket (5) has multiple sets of heat dissipation mounting holes (15) for heat dissipation and installation.

7. The battery swapping cabinet for facilitating heat dissipation of a semiconductor cooling module according to claim 1, characterized in that: The upper end of the cabinet (1) has an air inlet (3) for the intake of the first cooling fan.

Images