A forced air cooled silicon carbide module

Abstract

The application relates to the technical field of heat dissipation of electrical equipment, in particular to a forced air-cooled silicon carbide module, which comprises a shell, a plurality of heat dissipation fans are installed in the shell, a fan cover plate is arranged outside the heat dissipation fan to form an independent heat dissipation air duct; a plurality of power unit modules and inductors are arranged in the shell, each power unit module comprises a radiator and silicon carbide components installed on the radiator, the radiator is arranged opposite to the heat dissipation air duct; the radiator comprises heat dissipation fins extending outwards, and the inductor is installed at a downstream position of the heat dissipation fin outflow direction. The utility model has the advantages of compact structure and high heat dissipation efficiency, the integration of power components and the radiator reduces the volume of the equipment, and the heat dissipation bottleneck of the silicon carbide components in high-power application is solved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electrical equipment, and more specifically, to a forced air-cooled silicon carbide module. Background Technology

[0002] Traditional multi-layer modular air ducts are circuitous, resulting in high airflow resistance, low heat dissipation efficiency, and thus large equipment size.

[0003] Conventional air cooling relies on the overall airflow of the equipment, which is easily affected by other heat-generating components, resulting in uneven heat dissipation and high noise. Uneven heat dissipation of silicon carbide devices during high-temperature operation leads to thermal stress concentration.

[0004] The high-frequency and high-temperature characteristics of silicon carbide devices place higher demands on heat dissipation. General heat dissipation solutions are difficult to match the parallel layout of single IGBTs, resulting in redundant equipment size and excessive noise.

[0005] In summary, existing technologies are insufficient to meet the requirements of compact design and efficient heat dissipation for forced air-cooled silicon carbide modules. Utility Model Content

[0006] The purpose of this application is to provide a forced air-cooled silicon carbide module with a compact structure and efficient heat dissipation. By integrating power components and heat sinks, the size of the device is reduced, and the heat dissipation bottleneck of silicon carbide devices in high-power applications is solved.

[0007] To achieve the above objectives, this utility model provides a forced air-cooled silicon carbide module, including a housing, in which multiple cooling fans are installed, and the cooling fans are covered with fan covers to form independent cooling air ducts. The housing contains multiple power unit modules and inductors. Each power unit module includes a heat sink and silicon carbide components mounted on the heat sink. The heat sink and the heat dissipation duct are arranged facing each other. The heat sink includes heat dissipation fins extending outwards, and the inductor is installed downstream of the heat dissipation fins in the direction of airflow.

[0008] In an optional embodiment, the housing includes a front panel with an air inlet, a fan mounting bracket is installed at the air inlet, the cooling fan is fixedly installed on the fan mounting bracket, and the fan cover includes a U-shaped cover that is upside down and installed on the fan mounting bracket.

[0009] In an optional embodiment, the fan cover extends along the air outlet direction of the cooling fan and is connected to the inner sidewall of the front panel. The length of the fan cover plate is greater than the length of the fan mounting bracket.

[0010] In an optional embodiment, the power unit module is disposed at the port of the fan cover plate, and there is an air outlet gap of at least a certain length between it and the cooling fan.

[0011] In an optional embodiment, the radiator includes a base, the base and the heat dissipation fins are integrally formed, and the heat dissipation fins are installed facing upward and fully distributed on the base; At least a portion of the radiator extends into the air outlet port of the fan cover.

[0012] In an optional embodiment, the silicon carbide components are mounted on the base, and the heat sink is fixed to the PCBA board inside the housing by copper pillars connected to the base.

[0013] In an optional embodiment, the silicon carbide components are bonded to the base with thermally conductive silicone grease and fixed by screws.

[0014] In an optional embodiment, the inductor includes a first inductor and a second inductor arranged sequentially along the air outlet direction; There are air outlet gaps between the first inductor and the heat sink, and between the second inductor and the first inductor.

[0015] In an optional embodiment, the first inductor, the second inductor, and the heat sink are arranged in the same straight line direction.

[0016] In an optional embodiment, the housing further includes a rear perforated plate, which is disposed opposite to the front panel and has ventilation holes.

[0017] The forced air-cooled silicon carbide module in this invention can form an independent heat dissipation air duct through the heat dissipation fan and the fan cover plate.

[0018] The silicon carbide components that generate heat are mounted on the heat sink, which can transfer the heat generated by the silicon carbide components to the heat sink in a timely manner. Combined with the heat sink being set directly opposite the heat dissipation air duct, the heat on the heat sink can be directly blown out by the externally introduced cooling air.

[0019] The heat sink includes extended airflow fins that can extend the cooling airflow and further flow it to the inductor downstream of the airflow direction of the heat sink fins, thereby achieving effective heat dissipation for different components inside the module housing.

[0020] The forced air-cooled silicon carbide module of this invention has a compact structure, high heat dissipation efficiency, and can achieve integrated assembly of power components and heat sink, effectively reducing the volume of silicon carbide.

[0021] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the internal structure of the forced air-cooled silicon carbide module in this application; Figure 2 This is a schematic diagram of the power unit module in this application.

[0024] icon: 1-Housing; 11-Front panel; 12-PCBA board; 13-Rear panel; 14-Ventilation hole; 2-Cooling fan; 21-Fan cover plate; 22-Fan mounting bracket; 3-Power unit module; 31-Heat sink; 311-Heat sink fins; 312-Base; 313-Copper pillar; 4-Inductor; 41-First inductor; 42-Second inductor; 5-Silicon carbide components. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0027] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] The forced air-cooled silicon carbide module in this application mainly integrates the main heat-generating components with the heat sink by constructing independent air ducts for the heat-generating components. The heat sink is positioned directly opposite the independent air duct, and other low-heat-generating components are installed downstream of the heat sink fins that allow for airflow. This forms a straight air duct cooling structure for the forced air-cooled silicon carbide module, effectively improving the existing traditional air duct configuration and increasing heat dissipation efficiency.

[0029] The linear airflow cooling structure in this invention is mainly used in the field of heat dissipation technology for power electronic devices, specifically for forced air cooling of silicon carbide power modules, and is particularly suitable for the optimized airflow design of single-layer rectangular modules.

[0030] See Figure 1 and combined Figure 2 The forced air-cooled silicon carbide module of this utility model has a main structure including a housing 1, and multiple cooling fans 2 are installed inside the housing 1. By installing the cooling fans inside the housing 1, the flow path of the cooling air can be shortened, so that the cooling air introduced by the cooling fans from outside the housing 1 can directly dissipate heat from the components inside the housing 1.

[0031] From the perspective of forming an independent air duct, a fan cover plate 21 is provided on the outside of the cooling fan 2, which can form an independent cooling air duct. The independent cooling air duct can limit the direct blowing direction of the external cooling air, which is conducive to forming a direct blowing cooling form of a straight air duct.

[0032] The housing 1 contains multiple power unit modules 3 and inductors 4. The power unit modules 3 and inductors 4 generate heat during operation. Furthermore, the power unit modules 3 include silicon carbide components 5, and the heat generated during operation is greater than that generated by the inductors 4.

[0033] Each power unit module 3 includes a heat sink 31. The silicon carbide components 5 with large heat generation are mounted on the heat sink 31. This arrangement realizes the integration of the power components and the heat sink 31, and at the same time, it can conduct the heat generated during operation to the heat sink 31. Combined with the heat sink 31 and the heat dissipation air duct being set up directly opposite each other, the direct cooling air can force the heat on the heat sink 31 to be discharged, forming a forced air cooling effect.

[0034] The heat sink 31 includes heat dissipation fins 311 extending outwards. The inductor 4 is installed downstream of the heat dissipation fins 311 in the direction of airflow. The inductor 4, which generates less heat than the silicon carbide component 5, is installed downstream of the independent air duct. Ultimately, under the effect of forced air cooling, the hot air carrying heat is discharged outwards through the heat dissipation perforated plate on the housing 1.

[0035] By combining the linear cooling airflow formed by forced air cooling, the different power components of the forced air-cooled silicon carbide module in this utility model are all arranged on the forced air cooling heat dissipation path, resulting in a compact structure, efficient heat dissipation, and effective reduction of the volume of silicon carbide while meeting the requirements for sufficient heat dissipation.

[0036] In one specific embodiment, the housing 1 includes a front panel 11, on which an air inlet is provided. A fan mounting bracket 22 is installed on the inner side of the air inlet, and the cooling fan 2 is fixedly installed on the fan mounting bracket 22 to ensure that the cooling fan 2 is installed reliably and stably.

[0037] The fan cover 21 includes a U-shaped cover that is upside down and installed on the fan mounting bracket 22. It can regulate the airflow direction of the cooling fan and facilitate the formation of a straight air duct for forced air cooling by combining the airflow of the cooling fan.

[0038] The U-shaped fan cover 21 has a certain length, extends along the air outlet direction of the cooling fan 2 and connects with the inner sidewall of the front panel 11. Specifically, the fan cover 21 has two ports, including a closed port that connects with the inner sidewall of the front panel 11 and an open air outlet port at the extended end. By connecting the closed port with the inner sidewall of the front panel 11, an envelope structure can be formed at the air outlet of the cooling fan 2.

[0039] In this embodiment, the length of the fan cover plate 21 is greater than the length of the fan mounting bracket 22, which can leave a certain distance between the air outlet and the cooling fan 2, forming a good direct blowing buffer and ensuring the stability of the air force.

[0040] The power unit module 3 is located at the port of the fan cover 21. Preferably, the heat sink 31 and the silicon carbide components 5 mounted on the heat sink 31 are located together at the air outlet of the fan cover 21 and within the air outlet range of the fan cover 21, so that the forced direct cooling air duct can simultaneously dissipate heat from the heat sink 31 and the silicon carbide components 5.

[0041] By leaving at least a certain length of air outlet gap between the power unit module 3 and the cooling fan 2, the airflow state can be improved, and the air outlet direction of the direct airflow duct can be avoided.

[0042] The heat sink 31 includes a base 312, which is integrally formed with the heat sink fins 311. The base 312 is mainly used to conduct heat from the silicon carbide component 5 to the heat sink fins 311, while the heat sink fins 311 are cooled by the direct blowing of cooling air. The heat sink fins 311 are mounted facing upwards and are fully distributed on the base 312, which can ensure good heat dissipation effect.

[0043] At least a portion of the heat sink 31 extends into the air outlet port of the fan cover 21. Combined with the heat sink 31 and silicon carbide components 5, which are positioned within the air outlet range of the fan cover 21, a semi-open blocking state can be formed on the air outlet port of the fan cover 21, thereby maintaining the forced air cooling effect.

[0044] From an installation perspective, the silicon carbide component 5 is mounted on the base 312, which facilitates direct heat conduction. The heat sink 31 is fixed to the PCBA board 12 inside the housing 1 via copper pillars 313 connected to the base 312. During connection and assembly, it can be connected to the threaded holes of the copper pillars 313 by screws passing through the bottom plate of the housing 1.

[0045] The silicon carbide component 5 is bonded to the base 312 with thermally conductive silicone grease. The silicon carbide component 5 can adhere to the base 312 with thermally conductive silicone grease, which increases the conduction area. Furthermore, in order to ensure installation stability, the silicon carbide component 5 is fixed to the base 312 with screws. The cooling air discharged from the air outlet blows directly onto the heat sink 31 as a whole, and also blows directly onto the silicon carbide component 5, which enhances the effect of forced cooling air.

[0046] In another specific embodiment, the inductor 4 includes a first inductor 41 and a second inductor 42 arranged sequentially along the air outlet direction. There are air outlet gaps between the first inductor 41 and the heat sink 31, and between the second inductor 42 and the first inductor 41, which can dissipate the heat carried by the airflow in the air outlet gaps, while optimizing the flow effect of the straight air outlet.

[0047] Specifically, the first inductor 41 includes a bridge-side inductor 4, and the second inductor 42 includes a grid-side inductor 4, both of which allow cooling air to pass through and achieve good air cooling.

[0048] Based on the linear cooling airflow described above, in order to ensure that all inductors 4 can receive air cooling, the first inductor 41, the second inductor 42, and the heat sink 31 are arranged in the same linear direction. This allows for a linear arrangement of different heat-generating components, all of which can meet the heat dissipation requirements.

[0049] It should be noted that other capacitors with low heat generation are arranged in places that do not obstruct the cooling airflow of the straight air duct, thus optimizing the arrangement of components on the forced air-cooled silicon carbide module.

[0050] The housing 1 also includes a rear perforated plate 13, which is disposed opposite to the front panel 11, and a ventilation hole 14 is provided on the rear perforated plate 13 to allow the hot air carrying heat after passing through the second inductor 42 to be smoothly discharged from the rear perforated plate 13.

[0051] The forced air-cooled silicon carbide module of this utility model mainly includes a power unit module 3, an independent heat dissipation duct, and an inductor 4.

[0052] In each power unit module 3, a single power unit device, namely a silicon carbide component 5, is attached to the surface of the base 312 of the heat sink 31 by thermal grease and fixed to the base 312 of the heat sink 31 with screws to form the power unit module 3.

[0053] The independent heat dissipation duct consists of a fan cover plate 21, a heat dissipation fan 2, and a fan mounting bracket 22. An air inlet is provided on the front panel 11, the fan mounting bracket 22 is fixed to the air inlet of the front panel 11, the heat dissipation fan 2 is fixedly installed on the fan mounting bracket 22, and the fan cover plate 21 is fixed behind the heat dissipation fan 2.

[0054] The power unit module 3 is fixed at the air outlet of the air duct. The air inlet blows into the heat sink 31 through the straight heat dissipation air duct. The closed form of the independent heat dissipation air duct formed by the fan cover 21 allows the air inlet to be effectively transferred to the rear end. The heat-generating devices such as the inductor 4 are arranged in the position directly opposite the air outlet of the heat dissipation fins 311. After passing through the heat-generating devices, the hot air flows out from the ventilation hole 14 of the rear perforated plate 13.

[0055] The heat-generating components, such as inductor 4, are evenly distributed at the rear end of the heat dissipation fins 311 to maintain sufficient airflow for heat dissipation.

[0056] The forced air-cooled silicon carbide module of this utility model provides a compact and efficient heat dissipation structure. Combined with the integrated design of silicon carbide components 5 and heat sink 31 and independent air duct, it can solve the heat dissipation bottleneck of silicon carbide components 5 in high-power SVG (Static Var Generator) applications.

[0057] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0058] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A forced air-cooled silicon carbide module, characterized in that, The system includes a housing, inside which multiple cooling fans are installed, and each cooling fan is covered by a fan cover to form an independent cooling air duct. The housing contains multiple power unit modules and inductors. Each power unit module includes a heat sink and silicon carbide components mounted on the heat sink. The heat sink and the heat dissipation duct are arranged facing each other. The heat sink includes heat dissipation fins extending outwards, and the inductor is installed downstream of the heat dissipation fins in the direction of airflow.

2. The forced air-cooled silicon carbide module according to claim 1, characterized in that, The housing includes a front panel with an air inlet. A fan mounting bracket is installed at the air inlet. The cooling fan is fixedly installed on the fan mounting bracket. The fan cover includes a U-shaped cover that is inverted and installed on the fan mounting bracket.

3. The forced air-cooled silicon carbide module according to claim 2, characterized in that, The fan cover extends along the air outlet direction of the cooling fan and is connected to the inner sidewall of the front panel. The length of the fan cover plate is greater than the length of the fan mounting bracket.

4. The forced air-cooled silicon carbide module according to claim 1, characterized in that, The power unit module is located at the port of the fan cover plate, and there is an air outlet gap of at least a certain length between it and the cooling fan.

5. The forced air-cooled silicon carbide module according to claim 1, characterized in that, The radiator includes a base, the base and the heat dissipation fins are integrally formed, and the heat dissipation fins are installed facing upwards and are fully distributed on the base; At least a portion of the radiator extends into the air outlet port of the fan cover.

6. The forced air-cooled silicon carbide module according to claim 5, characterized in that, The silicon carbide components are mounted on the base, and the heat sink is fixed to the PCBA board inside the housing by copper pillars connected to the base.

7. The forced air-cooled silicon carbide module according to claim 5, characterized in that, The silicon carbide components are bonded to the base with thermally conductive silicone grease and fixed with screws.

8. The forced air-cooled silicon carbide module according to any one of claims 1-7, characterized in that, The inductor includes a first inductor and a second inductor arranged sequentially along the air outlet direction; There are air outlet gaps between the first inductor and the heat sink, and between the second inductor and the first inductor.

9. The forced air-cooled silicon carbide module according to claim 8, characterized in that, The first inductor, the second inductor, and the heat sink are arranged in the same straight line direction.

10. The forced air-cooled silicon carbide module according to claim 2, characterized in that, The housing also includes a rear perforated plate, which is disposed opposite to the front panel, and ventilation holes are provided on the rear perforated plate.

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