Heat dissipation mechanism and high-temperature reverse bias testing machine

Abstract

This utility model discloses a heat dissipation mechanism and a high-temperature reverse-bias testing machine, including a heat-conducting base. The heat-conducting base includes a seat body with several heat dissipation fins. The seat body is detachably connected to a directional heat dissipation structure, which includes a shell. A fan device is fixedly installed on the inner wall of the shell. An air outlet is opened on the surface of the other end of the shell, and several insertion slots are opened on the top and bottom inner walls. A flow guide is provided at the other end of the seat body. A matching interface corresponding to the air outlet is opened on one side of the flow guide, and several outflow slots are opened through the bottom inner wall of the flow guide. The heat is conducted to the heat dissipation fins at the contact point between the test base and the device under test through the heat-conducting base. The fan device generates airflow that enters the flow guide through the air outlet and matching interface. The airflow acts on the surface of the test base through the outflow slots, achieving directional heat dissipation of localized heat accumulation areas and avoiding abnormal temperature affecting test data and damaging the device under test.

Description

Technical Field

[0001] This utility model relates to the field of high temperature reverse bias testers, and more specifically, to a heat dissipation mechanism and a high temperature reverse bias tester. Background Technology

[0002] High-temperature reverse bias testers are key equipment for semiconductor device reliability testing. They need to apply reverse bias voltages to diodes, transistors, and other devices under test in a high-temperature environment to simulate extreme operating conditions. The devices under test generate heat under the combined effects of high temperature and reverse bias voltage. At the same time, the contact area between the test socket and the device under test is prone to local heat accumulation due to contact resistance and other factors. The heat dissipation mechanism of existing high-temperature reverse bias testers is mostly based on the entire test chamber as the heat dissipation target, such as through cooling fans or water cooling devices on the outside of the chamber. This method is difficult to achieve directional heat dissipation at the contact area between the test socket and the device under test, which makes the temperature of this area easily exceed the set test temperature. This not only interferes with the accuracy of the test data, but may also damage the device under test due to local overheating.

[0003] How to invent a heat dissipation mechanism and a high-temperature reverse bias testing machine to improve these problems has become an urgent problem to be solved by those skilled in the art. Utility Model Content

[0004] To overcome the above deficiencies, this utility model provides a heat dissipation mechanism and a high-temperature reverse bias tester, aiming to improve the problem that the contact area between the device under test and the test base in the high-temperature reverse bias tester is prone to local heat accumulation due to the difficulty of directional heat dissipation in the existing heat dissipation mechanism, which causes the temperature of this part to exceed the set test temperature, thereby interfering with the accuracy of test data and potentially damaging the device under test.

[0005] In a first aspect, this utility model provides a heat dissipation mechanism and a high-temperature reverse bias testing machine, including a heat-conducting base. The heat-conducting base includes a seat body. One end of the upper surface of the seat body is integrally provided with a plurality of evenly distributed heat dissipation fins. The other end of the upper surface of the seat body is detachably connected to a directional heat dissipation structure. The directional heat dissipation structure includes a shell. One end of the bottom inner wall of the shell body is fixedly installed with a fan device. The other end surface of the shell body is provided with an air outlet, and the top and bottom inner walls are provided with a plurality of insertion slots corresponding to the heat dissipation fins. Each heat dissipation fin is inserted into the corresponding insertion slot. The other end of the seat body is provided with a flow guide shroud. One side surface of the flow guide shroud is provided with a connecting interface corresponding to the air outlet, and the bottom inner wall of the flow guide shroud is provided with a plurality of outflow slots.

[0006] In a preferred embodiment of this utility model, several connecting ear plates are integrally provided on both sides of the seat body.

[0007] In a preferred embodiment of this utility model, a connecting groove is provided at one end of the upper surface of the base, and a connecting strip is correspondingly provided at one end of the bottom surface of the outer shell, and the connecting strip is slidably installed in the connecting groove.

[0008] In a preferred embodiment of this utility model, a plurality of connection slots are provided on the other end face of the base, and a plurality of plug-in blocks corresponding one-to-one with the connection slots are integrally provided on one side surface of the flow guide, and each plug-in block is plugged into the corresponding connection slot.

[0009] In a preferred embodiment of this utility model, a limiting snap-fit ​​groove is provided on one side of the inner wall of each of the connecting slots and connecting slides, and a corresponding flexible snap-fit ​​protrusion is provided on one side of each of the plug-in blocks and connecting slides.

[0010] In a preferred embodiment of this utility model, a shock-absorbing pad is provided between the fan device and the inner wall of the bottom of the housing.

[0011] In a preferred embodiment of this utility model, the top inner wall of the outer shell near the fan device has a two-section triangular raised structure, one section of which has several air inlet grooves on its top surface, and the other end is connected to the air outlet as a first guide slope structure.

[0012] In a preferred embodiment of this utility model, a plurality of extended flow guides are connected and arranged on the side surface of the flow guide shroud away from the base. The bottom of each extended flow guide is an open structure and corresponds to and is connected to a plurality of outflow grooves. The inner wall of the flow guide shroud facing the interface is set as a second flow guide slope. The bottom height of the second flow guide slope is consistent with the top height of the openings of all extended flow guides.

[0013] On the other hand, this utility model also provides a high-temperature reverse bias testing machine, including the heat dissipation mechanism described above.

[0014] The beneficial effects of this utility model are as follows: The heat dissipation mechanism and high-temperature reverse bias tester obtained by the above design can accurately conduct the heat from the contact area between the test base and the device under test to the heat dissipation fin assembly through the heat-conducting base. With the heat dissipation fan facing the heat dissipation fin assembly and the air guide shroud forming the airflow channel, the airflow can be guided to flow through the heat dissipation fin assembly and the surface of the test base, so as to achieve directional heat dissipation of the local heat accumulation area. This avoids the situation where it is difficult to directionally handle local heat accumulation, which would lead to the impact of abnormal temperature on the accuracy of test data and the risk of damage to the device under test. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic perspective view of the overall structure provided by the embodiment of this utility model; Figure 2 A three-dimensional schematic cross-sectional view of the overall structure provided for the embodiments of this utility model; Figure 3 A perspective view of the overall separable structure provided for an embodiment of this utility model; Figure 4 A three-dimensional schematic diagram of the overall structure of the heat-conducting base provided for an embodiment of this utility model; Figure 5 A perspective view of the overall structure of the heat-conducting base on the other side, provided for an embodiment of this utility model; Figure 6 A three-dimensional cross-sectional view of the directional heat dissipation structure provided for an embodiment of this utility model; Figure 7 A three-dimensional cross-sectional view of the other side directional heat dissipation structure provided for an embodiment of this utility model; Figure 8 A three-dimensional schematic cross-sectional view of the overall structure of the guide shield provided for an embodiment of this utility model.

[0017] In the diagram: 1-Heat-conducting base; 2-Directional heat dissipation structure; 3-Airflow guide; 4-Flexible snap-fit ​​protrusion; 101-Base; 102-Heat dissipation fin; 103-Connecting ear plate; 104-Connecting slide; 105-Connecting slot; 106-Limiting snap-fit ​​groove; 201-Outer shell; 202-Fan assembly; 203-Plug-in slot; 204-Air outlet; 205-Air inlet slot; 206-First airflow guide slope; 207-Connecting slide bar; 301-Mating interface; 302-Outflow slot; 303-Plug-in block; 304-Extended airflow guide; 305-Second airflow guide slope. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0019] Please see Figures 1 to 8 This utility model provides a technical solution: a heat dissipation mechanism and a high-temperature reverse bias tester, including a heat-conducting base 1, the heat-conducting base 1 including a seat body 101, a plurality of evenly distributed heat dissipation fins 102 integrally provided on one end of the upper surface of the seat body 101, a directional heat dissipation structure 2 detachably connected to the other end of the upper surface of the seat body 101, the directional heat dissipation structure 2 including a shell 201, a fan device 202 fixedly installed on one end of the bottom inner wall of the shell 201, an air outlet 204 is opened on the other end surface of the shell 201, and a plurality of insertion slots 203 corresponding one-to-one with the heat dissipation fins 102 are opened on the top and bottom inner walls, each heat dissipation fin 102 is inserted into the corresponding insertion slot 203, a flow guide shroud 3 is provided on the other end of the seat body 101, a matching interface 301 corresponding to the air outlet 204 is opened on one side surface of the flow guide shroud 3, and a plurality of outflow slots 302 are opened through the bottom inner wall of the flow guide shroud 3.

[0020] It should be noted that a control module and a temperature sensor are also installed inside the outer casing 201. The temperature sensor can detect the temperature of the base 101 and transmit the temperature data to the control module. The control module adjusts the speed of the fan device 202 according to the temperature data, thereby improving heat dissipation efficiency and reducing energy consumption.

[0021] Please refer to the figure. Figures 2 to 8 Several connecting ear plates 103 are integrally provided on both sides of the base 101.

[0022] During the machining of the base 101, several connecting ear plates 103 are integrally formed on both sides of the base. The ear plates have pre-drilled oblong mounting holes, the diameter of which is slightly larger than the diameter of the mounting bolts, and the length of the holes is aligned with the direction of the cooling airflow. During assembly, high-strength nylon bolts are used to pass through the mounting holes and lock the cooling mechanism to the corresponding part of the testing machine. The bolt heads are countersunk to ensure they do not protrude from the ear plate surface. The oblong hole design allows for installation error compensation, reducing assembly difficulty; the nylon bolts have a lower elastic modulus than metal bolts, effectively absorbing the vibration energy generated during the operation of the testing machine, reducing stress concentration at the connection points; the countersunk bolt design avoids disturbance to the airflow.

[0023] Furthermore, a connecting groove 104 is provided at one end of the upper surface of the base 101, and a connecting strip 207 is correspondingly provided at one end of the bottom surface of the outer shell 201. The connecting strip 207 is slidably installed in the connecting groove 104.

[0024] When machining one end of the upper surface of the base 101, a T-shaped connecting groove 104 is formed. At the same time, one end of the bottom surface of the outer shell 202 of the directional heat dissipation structure 2 is machined to form a corresponding T-shaped connecting strip 207. During assembly, the connecting strip 207 is slidably inserted into the groove of the connecting groove 104. The T-shaped structure provides bidirectional limiting, reducing the displacement error of the directional heat dissipation structure 2 on the horizontal plane.

[0025] Furthermore, a number of connection slots 105 are provided on the other end face of the base 101, and a number of plug-in blocks 303 corresponding to the connection slots 105 are integrally provided on one side surface of the flow guide 3, and each plug-in block 303 is plugged into the corresponding connection slot 105.

[0026] Two rectangular connecting slots 105 are formed on the other end face of the machined base 101. Simultaneously, plug-in blocks 303, matching the number and size of the connecting slots 105, are integrally machined onto one side surface of the flow guide shroud 3. The surface of the plug-in blocks is coated with polytetrafluoroethylene (PTFE). During assembly, each plug-in block 303 is aligned with its corresponding connecting slot 105 and inserted. Once inserted, it is locked in place by the elastic latches on the side wall of the slot. The PTFE coating reduces the coefficient of friction between the plug-in block and the slot, while also improving corrosion resistance; the elastic latches effectively resist vibrations generated during the operation of the testing machine, reducing loosening.

[0027] Furthermore, each connecting slot 105 and connecting slide 104 has a limiting snap-fit ​​groove 106 on one side of its inner wall, and each plug block 303 and connecting slide 207 has a corresponding flexible snap-fit ​​protrusion 4 on one side of its surface.

[0028] When machining the inner wall of the connecting slot 105 and the connecting slide 104, a hemispherical limiting locking groove 106 is formed. When machining the surface of the plug block 303 and the connecting slide 207, a flexible silicone rubber locking protrusion 4 is embedded. When the plug block is inserted into the slot and the slide slide is slid into the slide, the flexible locking protrusion 4 will elastically compress and lock into the limiting locking groove 106, forming an interference fit. This ensures a stable connection and facilitates disassembly. The fit between the hemispherical groove and the spherical protrusion ensures that the pull-out force required during disassembly is evenly distributed, avoiding local stress concentration. The interference fit design can maintain a stable locking force within a temperature range of -40℃ to 120℃, ensuring that the heat dissipation mechanism works reliably in extreme environments.

[0029] Furthermore, a shock-absorbing pad is provided between the fan device 202 and the bottom inner wall of the housing 201.

[0030] Before installing the fan unit 202 onto the bottom inner wall of the housing 201, select silicone damping pads and cut them to a shape consistent with the bottom contour of the fan unit 202, and make mounting holes of the same diameter at the four corners. After laying the damping pads, use bolts to fix the fan unit 202 to the bottom inner wall of the housing 202, causing the damping pads to compress. The silicone damping pads have a low vibration transmission rate in the 10-1000Hz frequency range, effectively attenuating most of the vibration energy generated by the fan unit 202; the compression of the damping pads ensures that the damping performance does not deteriorate significantly after long-term operation of the fan unit 202.

[0031] Furthermore, the top inner wall of the outer casing 201 near the fan device 202 has a two-section triangular raised structure. One section has several air inlet slots 205 on its top surface, and the other end connects to the air outlet 204 as a first guide slope 206 structure.

[0032] The inner top wall of the outer casing 201 near the fan assembly 202 has a two-section triangular raised structure. The first section has a raised angle of 45°, and an air intake groove 205 is formed on its top surface. The other end of the inner top wall connects to the air outlet 204 to form a first guide slope 206 with an inclination angle of 30°. The surface of the slope is anodized to form micro-grooves. The 45° raised angle combined with the 30° guide slope makes the airflow path within the outer casing 202 closer to a straight line, reducing flow resistance. The micro-grooves formed by anodization create a laminar boundary layer on the airflow surface, reducing eddy current generation and improving the airflow uniformity on the surface of the heat dissipation fins 102.

[0033] Furthermore, a plurality of extended flow guides 304 are connected and disposed on the side surface of the flow guide 3 away from the base 101. The bottom of each extended flow guide 304 is an open structure and corresponds to and is connected to a plurality of outflow grooves 302. The inner wall of the flow guide 3 facing the interface 301 is configured as a second flow guide slope 305. The bottom height of the second flow guide slope 305 is consistent with the top height of the opening of all extended flow guides 304.

[0034] On the surface of the guide shroud 3 away from the base 101, several rectangular cross-section extended guide sections 304 are integrally formed, with a width consistent with the outlet groove 302, so that the open structure at the bottom of the extended guide section 304 is connected to the outlet groove 302. At the same time, the inner wall of the guide shroud 3 facing the interface 301 is machined into a second guide slope 305 with an inclination angle of 45°, and adjusted so that the bottom height of the second guide slope 305 is consistent with the top height of the openings of all the extended guide sections 304. Staggered guide ribs are provided on the inner wall of the guide section 304. The extended guide section 304 increases the air outlet area, reduces the outlet wind speed, and reduces airflow noise; the second guide slope 305 reduces the turning loss of the airflow in the guide shroud 3; the arrangement of the guide ribs makes the airflow form a uniform laminar flow at the outlet groove 302, avoiding local high temperature areas caused by eddies, and improving the uniformity of the outlet temperature distribution of the guide shroud 3.

[0035] Working principle: The heat-conducting base 1 is installed on the test stand of the high-temperature reverse bias tester, and conducts the high temperature generated by the test stand to its own heat dissipation fins 102; the fan device 202 inside the directional heat dissipation structure 2 generates airflow, which blows towards the heat dissipation fins 102 and exchanges heat with them to complete the initial heat dissipation. Then the airflow passes through the heat dissipation fins 102, and enters the interior of the guide shroud 3 through the air outlet 204 and the interface 301; then the airflow is discharged through the outflow groove 302 at the bottom of the guide shroud 3 and the corresponding connected extended guide part 304. The extended guide part 304 penetrates into the array of distributed components, so that the airflow directly acts on the surface of the test stand and the gaps between components, realizing comprehensive heat dissipation of the test stand and surrounding components, forming a complete heat dissipation cycle of heat conduction, initial heat dissipation, airflow guidance and precise heat dissipation, effectively maintaining the temperature stability of the test area.

[0036] It should be noted that the specific model and specifications of the fan device 202 need to be selected and determined according to the actual specifications of the device. The specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0037] The power supply and principle of the fan device 202 are clear to those skilled in the art and will not be described in detail here.

[0038] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat dissipation mechanism, characterized in that, The device includes a heat-conducting base, which comprises a base body. One end of the upper surface of the base body is integrally provided with several evenly distributed heat dissipation fins. The other end of the upper surface of the base body is detachably connected to a directional heat dissipation structure. The directional heat dissipation structure includes a shell. One end of the bottom inner wall of the shell body is fixedly installed with a fan device. The other end of the shell body has an air outlet, and the top and bottom inner walls have several insertion slots corresponding to the heat dissipation fins. Each heat dissipation fin is inserted into the corresponding insertion slot. The other end of the base body is provided with a flow guide shroud. One side of the flow guide shroud has a connecting interface corresponding to the air outlet, and the bottom inner wall of the flow guide shroud has several outflow slots.

2. The heat dissipation mechanism as described in claim 1, characterized in that: Several connecting ear plates are integrally formed on both sides of the base.

3. The heat dissipation mechanism as described in claim 1, characterized in that: A connecting groove is provided at one end of the upper surface of the base, and a connecting strip is correspondingly provided at one end of the bottom surface of the outer shell. The connecting strip is slidably installed in the connecting groove.

4. The heat dissipation mechanism as described in claim 1, characterized in that: Several connection slots are provided on the other end face of the base, and several plug-in blocks corresponding to the connection slots are integrally provided on one side surface of the flow guide. Each plug-in block is plugged into the corresponding connection slot.

5. The heat dissipation mechanism as described in claim 4, characterized in that: Each of the connecting slots and connecting slides has a limiting snap-fit ​​groove on one side of its inner wall, and each of the plug blocks and connecting slides has a corresponding flexible snap-fit ​​protrusion on one side of its surface.

6. The heat dissipation mechanism as described in claim 1, characterized in that: A shock-absorbing pad is provided between the fan device and the inner wall of the bottom of the housing.

7. The heat dissipation mechanism as described in claim 1, characterized in that: The inner top wall of the outer casing near the fan device has a two-section triangular raised structure. One section has several air inlet slots on its top surface, and the other end connects to the air outlet as a first guide slope structure.

8. The heat dissipation mechanism as described in claim 1, characterized in that: The flow guide shroud has several extended flow guide sections connected to it on the side surface away from the base. The bottom of each extended flow guide section is an open structure and corresponds to and is connected to several outflow grooves. The inner wall of the flow guide shroud facing the interface is set as a second flow guide slope. The bottom height of the second flow guide slope is the same as the top height of the opening of all extended flow guide sections.

9. A high-temperature reverse polarization testing machine, characterized in that, Includes the heat dissipation mechanism as described in any one of claims 1-8.

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