A multi-module dense-stacked heat conduction and dissipation structure

Abstract

The application provides a multi-module dense stacking heat conduction and heat dissipation structure, which is used for solving the problems of large volume and high cost of the heat dissipation mechanism in the existing multi-module multi-layer stacking structure. The structure comprises a box body, a first mounting plate is arranged in the box body, and a heat dissipation box with an open lower end is arranged at both ends of the first mounting plate; a heat dissipation fan and a plurality of heat dissipation fins are arranged in the heat dissipation box, a first heat plate is embedded and mounted on the first mounting plate, a plurality of second mounting plates are sequentially and spacedly arranged above the first mounting plate, a second heat plate is embedded and mounted on the second mounting plate, and first and second heat conduction pipes are arranged between the first and second heat plates and the top end of the heat dissipation box; the first heat conduction pipe is used for conducting heat on the first heat plate to the heat dissipation box, and the second heat conduction pipe is used for conducting heat on the second heat plate to the heat dissipation box. The heat of the multi-layer stacking is conducted to the heat dissipation boxes on both sides for heat dissipation through the arrangement of the heat plates and the heat conduction pipes, and the structure has the advantages of high heat dissipation efficiency, compact heat dissipation structure and low cost.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation in stacked structures, and in particular to a heat conduction and heat dissipation structure with densely stacked multi-module components. Background Technology

[0002] There are three main heat dissipation methods for existing stacked structures. The first is to install a set of heat sinks under each module and use air convection generated by a fan to dissipate heat. This method increases the thickness and weight of the entire device and cannot meet the high protection and sealing requirements of the entire device. The second method is to use liquid cooling to direct the heat from the module to the heat sink for heat dissipation. However, this method is relatively expensive to manufacture, has the risk of leakage, and requires the addition of water pumps and other mechanisms, which complicates the equipment and makes maintenance difficult. The third method is to use copper pipes for heat conduction. Copper pipes conduct heat by transferring heat from the higher temperature end to the lower temperature end through the internal heat-conducting liquid. This structure is compact and low in cost, but it is difficult to meet the heat dissipation requirements of multi-module, multi-layer stacked structures.

[0003] With the rapid development of technologies such as 5G communication and artificial intelligence, electronic devices are becoming increasingly integrated, and the stacking density and number of layers of modules such as chips and power devices are continuously increasing. Therefore, how to reduce the cost and size of heat dissipation equipment in multi-module, multi-layer stacked structures while meeting heat dissipation requirements has become an urgent technical problem to be solved. Summary of the Invention

[0004] The purpose of this invention is to provide a heat conduction and dissipation structure with densely stacked multi-module components. This addresses the technical problem of large size and high cost of heat dissipation mechanisms in existing multi-module, multi-layer stacked structures.

[0005] A multi-module densely stacked heat conduction and heat dissipation structure includes a housing, a first mounting plate is disposed inside the housing, and heat dissipation boxes with lower openings are disposed at both ends of the first mounting plate.

[0006] The heat sink is equipped with a cooling fan and several heat dissipation fins. A first heat spreader is embedded in the first mounting plate. A first heat pipe is provided between the first heat spreader and the top of the heat sink. The first heat pipe is used to conduct heat from the first heat spreader to the heat sink.

[0007] Optionally, a plurality of second mounting plates are arranged sequentially at intervals above the first mounting plate;

[0008] A second heat spreader is embedded in the second mounting plate, and a second heat pipe is provided between the second heat spreader and the top of the heat sink box. The second heat pipe is used to conduct heat from the second heat spreader to the heat sink box.

[0009] Optionally, the box body includes a bottom plate and a box cover that is fastened and installed on the bottom plate;

[0010] The bottom of the heat sink is mounted on the base plate, and the base plate has several heat dissipation holes that communicate with the heat sink.

[0011] Optionally, several heat dissipation fins are arranged in parallel, the heat dissipation fins are installed on the inner side wall of the top of the heat dissipation box, and the cooling fan is installed in the heat dissipation box at one end of several heat dissipation fins.

[0012] Optionally, the first mounting plate has two first mounting through slots;

[0013] The two first heat spreaders are respectively embedded in the two first mounting slots, and the two sets of first heat pipes are used to guide the heat from the two first heat spreaders to the heat dissipation boxes on both sides.

[0014] Optionally, the first heat pipe includes a first main pipe and a plurality of first secondary pipes connected to the first main pipe, the plurality of first secondary pipes being arranged in parallel.

[0015] The first mounting plate, heat sink, and first heat spreader are provided with a first placement slot that is connected to each other. The first placement slot has the same shape as the first heat pipe, and the first secondary pipe is located in the placement slot on the first heat spreader.

[0016] Optionally, the second mounting plate has two second mounting through slots;

[0017] Two second heat spreaders are respectively embedded in two second mounting slots, and two sets of second heat pipes are used to guide the heat from the two second heat spreaders to the heat dissipation boxes on both sides.

[0018] Optionally, the second heat pipe includes a second main pipe and a plurality of second secondary pipes connected to the second main pipe, the plurality of second secondary pipes being arranged in parallel;

[0019] The second mounting plate and the second heat exchanger plate are provided with a second placement slot that is connected to each other. The heat dissipation box is provided with a third placement slot. The upper part of the second main pipe and the second auxiliary pipe are placed in the second placement slot, and the lower part of the second main pipe is placed in the third placement slot. The upper part and the lower part of the second main pipe are connected by a vertical pipe, and the second auxiliary pipe is located in the placement slot on the second heat exchanger plate.

[0020] Optionally, a plurality of threaded support columns are provided between the first mounting plate and the bottommost second mounting plate, as well as between adjacent second mounting plates.

[0021] Optionally, a heat-conducting pressure plate is installed on the top surface of the heat sink box, and one end of the first heat-conducting pipe and the second heat-conducting pipe are both located in the placement groove below the heat-conducting pressure plate.

[0022] Because of the adoption of the above technical solution, the present invention has the following advantages:

[0023] 1. This application uses a first heat spreader and several second heat spreaders, as well as a first heat pipe and several second heat pipes, to conduct heat from the multi-module, multi-layer stacked structure to the heat dissipation boxes on both sides for heat dissipation. The structure has high heat dissipation efficiency, compact heat dissipation structure, and low cost.

[0024] 2. This application reduces the use of heat sinks and cooling fans by setting heat sink boxes at both ends of the first mounting plate and installing heat sink fins and cooling fans inside the heat sink boxes.

[0025] Other advantages, objectives, and features of the invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination, or may be learned from practice of the invention. The objectives and other advantages of the invention can be realized and obtained through the following description. Attached Figure Description

[0026] The accompanying drawings of this invention are described below.

[0027] Figure 1 This is a schematic diagram of the structure of the housing of the present invention.

[0028] Figure 2 This is a front view of the heat conduction and heat dissipation structure inside the housing of the present invention.

[0029] Figure 3 This is a bottom view of the heat conduction and heat dissipation structure inside the housing of the present invention.

[0030] Figure 4 This is a diagram showing the positional relationship between the first heat pipe and the second heat pipe of the present invention.

[0031] Figure 5 This is a schematic diagram of the structure of the first mounting plate, heat sink box, and first heat spreader of the present invention.

[0032] Figure 6 This is a schematic diagram of the structure of the second mounting plate and the second heat spreader of the present invention.

[0033] Figure 7 This is a schematic diagram of the structure of the second mounting plate, the second heat spreader, and the second heat pipe of the present invention.

[0034] Figure 8 This is a schematic diagram of the structure of the second mounting plate of the present invention.

[0035] Figure 9 This is a schematic diagram of the structure of the first heat pipe of the present invention.

[0036] Figure 10 This is a schematic diagram of the structure of the second heat pipe of the present invention.

[0037] In the diagram: 1-Box body; 101-Bottom plate; 102-Box cover; 103-Heat dissipation hole; 2-First mounting plate; 201-First mounting slot; 3-Heat dissipation box; 4-Heat dissipation fins; 5-First heat spreader; 6-First heat pipe; 601-First main pipe; 602-First secondary pipe; 7-Second mounting plate; 701-Second mounting slot; 8-Second heat spreader; 9-Second heat pipe; 901-Second main pipe; 902-Second secondary pipe; 10-Heat dissipation fan; 11-First placement slot; 12-Second placement slot; 13-Third placement slot; 14-Threaded support column; 15-Heat-conducting pressure plate. Detailed Implementation

[0038] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0039] Example:

[0040] like Figure 1 , Figure 2 , Figure 3 and Figure 4 The diagram shows a multi-module densely stacked heat conduction and heat dissipation structure, including a housing 1, a first mounting plate 2 is provided inside the housing 1, and heat dissipation boxes 3 with lower openings are provided at both ends of the first mounting plate 2.

[0041] The heat sink 3 is equipped with a cooling fan 10 and several heat sink fins 4. A first heat spreader 5 is embedded in the first mounting plate 2. A first heat pipe 6 is provided between the first heat spreader 5 and the top of the heat sink 3. The first heat pipe 6 is used to conduct heat from the first heat spreader 5 to the heat sink 3.

[0042] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, several second mounting plates 7 are arranged sequentially at intervals above the first mounting plate 2;

[0043] A second heat spreader plate 8 is embedded in the second mounting plate 7. A second heat pipe 9 is provided between the second heat spreader plate 8 and the top of the heat sink 3. The second heat pipe 9 is used to conduct heat from the second heat spreader plate 8 to the heat sink 3.

[0044] In this embodiment, modules such as chips and power devices are stacked on the first mounting plate 2 and the second mounting plate 7. The first mounting plate 2 is located at the bottom, and several second mounting plates 7 are spaced apart on it, such as... Figure 1 The three-layer structure shown includes two second mounting plates 7. The first mounting plate 2 and the second mounting plate 7 are separated by four threaded support columns 14 set at the four corners.

[0045] like Figure 1 and Figure 2 As shown, the box body 1 includes a bottom plate 101 and a box cover 102 that is fastened and installed on the bottom plate 101;

[0046] The bottom end of the heat sink 3 is mounted on the base plate 101, and the base plate 101 has a plurality of heat dissipation through holes 103 that communicate with the heat sink 3.

[0047] like Figure 2 As shown, several heat dissipation fins 4 are arranged in parallel. The heat dissipation fins 4 are installed on the inner side wall of the top of the heat dissipation box 3. The cooling fan 10 is installed in the heat dissipation box 3 at one end of the several heat dissipation fins 4.

[0048] In this embodiment, as Figure 2 As shown, the heat sink 3 has two grooves at both ends. One groove is located below one end of the heat sink fin 4, and the other groove is located below the heat sink fan 10. By opening heat dissipation holes 103 on the end faces of the two grooves, heat dissipation is facilitated. At the same time, the design of the grooves also facilitates the sealing of the box structure.

[0049] like Figure 2 , Figure 4 and Figure 5 As shown, the first mounting plate 2 has two first mounting through slots 201.

[0050] The two first heat spreaders 5 are respectively embedded in the two first mounting slots 201, and the two sets of first heat pipes 6 are used to guide the heat of the two first heat spreaders 5 to the heat dissipation boxes 3 on both sides.

[0051] like Figure 2 , Figure 4 and Figure 9 As shown, the first heat pipe 6 includes a first main pipe 601 and a plurality of first secondary pipes 602 connected to the first main pipe 601, and the plurality of first secondary pipes 602 are arranged in parallel.

[0052] The first mounting plate 2, heat sink 3 and first heat spreader 5 are provided with a first placement groove 11 that is connected to each other. The first placement groove 11 has the same shape as the first heat pipe 6. The first secondary pipe 602 is located in the placement groove on the first heat spreader 5.

[0053] In this embodiment, a limiting ring is provided on the first mounting slot 201, the first heat spreader 5 is embedded in the first mounting slot 201, the upper surfaces of the first mounting plate 2, the first heat spreader 5 and the heat sink 3 are flush, and the first placement slot 11 is formed on the upper surfaces of the first mounting plate 2, the first heat spreader 5 and the heat sink 3. Figure 3As shown, the first main pipe 601 includes three U-shaped pipes connected in sequence. The two ends of several first secondary pipes 602 are connected across the two sides of the middle U-shaped pipe. The several first secondary pipes 602 are connected to the first main pipe 601. A heat-conducting liquid is provided inside the first heat-conducting pipe 6. The heat on the first heat-spreading plate 5 is conducted to the upper surface of the heat sink 3 through the heat-conducting liquid, and then conducted to the heat sink fins 4 inside the heat sink 3. The heat is then dissipated by the heat sink fan 10.

[0054] like Figure 3 , Figure 6 , Figure 7 , Figure 8 and Figure 10 As shown, the second mounting plate 7 has two second mounting slots 701.

[0055] Two second heat spreaders 8 are respectively embedded in two second mounting slots 701, and two sets of second heat pipes 9 are used to guide the heat from the two second heat spreaders 8 to the heat dissipation boxes 3 on both sides.

[0056] like Figure 3 , Figure 6 , Figure 7 , Figure 8 and Figure 10 As shown, the second heat pipe 9 includes a second main pipe 901 and a plurality of second secondary pipes 902 connected to the second main pipe 901, and the plurality of second secondary pipes 902 are arranged in parallel.

[0057] The second mounting plate 7 and the second heat spreader 8 are provided with a second placement slot 12 that is connected to each other. The heat dissipation box 3 is provided with a third placement slot 13. The upper part of the second main pipe 901 and the second secondary pipe 902 are placed in the second placement slot 12, and the lower part of the second main pipe 901 is placed in the third placement slot 13. The upper and lower parts of the second main pipe 901 are connected by a vertical pipe, and the second secondary pipe 902 is located in the placement slot on the second heat spreader 8.

[0058] In this embodiment, a limiting ring platform is provided on the second mounting slot 701, the second heat spreader 8 is embedded in the second mounting slot 701, the upper and lower end faces of the second mounting plate 2 and the second heat spreader 8 are flush, and the second placement slot 12 is opened on the lower end face of the second mounting plate 2 and the second heat spreader 8. Figure 3 As shown, the upper part of the second main pipe 901 is a U-shaped tube, and the two ends of several second auxiliary pipes 902 are horizontally connected to both sides of the U-shaped tube. The lower part of the second main pipe 901 consists of two L-shaped tubes, which are connected to the two ends of the U-shaped tube through vertical pipes. Several second main pipes 901 are connected to the second main pipe 901. A heat-conducting liquid is provided inside the second heat-conducting pipe 9. The heat on the second heat-dissipating plate 8 is conducted to the upper surface of the heat sink 3 through the heat-conducting liquid, and then to the heat dissipation fins 4 inside the heat sink 3, and is dissipated by the cooling fan 10. In this embodiment, as... Figure 4 As shown, two second heat pipes are arranged in 9 seats.

[0059] like Figure 2 As shown, a heat-conducting pressure plate 15 is installed on the top surface of the heat sink 3, and one end of the first heat-conducting pipe 6 and the second heat-conducting pipe 9 are both located in the placement groove below the heat-conducting pressure plate 15.

[0060] In this embodiment, the first heat pipe 6 and the second heat pipe 9 are fixed by the heat-conducting pressure plate 15.

[0061] In summary, this application uses a first heat spreader 5 and several second heat spreaders 8, as well as a first heat pipe 6 and several second heat pipes 9 to conduct heat from the multi-module, multi-layer stacked structure to the heat dissipation boxes 3 on both sides for heat dissipation. The structure has high heat dissipation efficiency, a compact heat dissipation structure, and low cost.

[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation of the present invention. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention should be covered within the scope of protection of the claims of the present invention.

Claims

1. A multi-module densely stacked heat conduction and heat dissipation structure, comprising a housing (1), characterized in that, The box (1) is provided with a first mounting plate (2), and the two ends of the first mounting plate (2) are provided with heat dissipation boxes (3) with lower openings. The heat sink (3) is equipped with a cooling fan (10) and several heat sink fins (4). A first heat spreader (5) is embedded in the first mounting plate (2). A first heat pipe (6) is provided between the first heat spreader (5) and the top of the heat sink (3). The first heat pipe (6) is used to conduct heat from the first heat spreader (5) to the heat sink (3).

2. The heat conduction and heat dissipation structure of densely stacked multi-modules according to claim 1, characterized in that, Several second mounting plates (7) are arranged sequentially at intervals above the first mounting plate (2); A second heat spreader plate (8) is embedded in the second mounting plate (7). A second heat pipe (9) is provided between the second heat spreader plate (8) and the top of the heat sink box (3). The second heat pipe (9) is used to conduct heat from the second heat spreader plate (8) to the heat sink box (3).

3. The heat conduction and heat dissipation structure of densely stacked multi-modules according to claim 1, characterized in that, The box (1) includes a bottom plate (101) and a box cover (102) that is fastened to the bottom plate (101). The bottom end of the heat sink (3) is mounted on the base plate (101), and the base plate (101) has a plurality of heat dissipation through holes (103) communicating with the heat sink (3).

4. The heat conduction and heat dissipation structure of densely stacked multi-modules according to claim 1, characterized in that, Several heat dissipation fins (4) are arranged in parallel. The heat dissipation fins (4) are installed on the inner side wall of the top of the heat dissipation box (3). The heat dissipation fan (10) is installed in the heat dissipation box (3) at one end of several heat dissipation fins (4).

5. The heat conduction and heat dissipation structure of densely stacked multi-modules according to claim 1, characterized in that, The first mounting plate (2) has two first mounting through slots (201); Two first heat spreaders (5) are respectively embedded in two first mounting slots (201), and two sets of first heat pipes (6) are used to guide the heat from the two first heat spreaders (5) to the heat dissipation boxes (3) on both sides respectively.

6. A multi-module densely stacked heat conduction and dissipation structure according to claim 1 or 5, characterized in that, The first heat pipe (6) includes a first main pipe (601) and a plurality of first secondary pipes (602) connected to the first main pipe (601), the plurality of first secondary pipes (602) being arranged in parallel; The first mounting plate (2), heat sink (3) and first heat spreader (5) are provided with a first placement groove (11) that is connected to each other. The first placement groove (11) has the same shape as the first heat pipe (6). The first secondary pipe (602) is located in the placement groove on the first heat spreader (5).

7. The heat conduction and heat dissipation structure of densely stacked multi-modules according to claim 2, characterized in that, The second mounting plate (7) has two second mounting slots (701); Two second heat spreaders (8) are respectively embedded in two second mounting slots (701), and two sets of second heat pipes (9) are used to guide the heat from the two second heat spreaders (8) to the heat dissipation boxes (3) on both sides respectively.

8. A multi-module densely stacked heat conduction and dissipation structure according to claim 2 or 7, characterized in that, The second heat pipe (9) includes a second main pipe (901) and a plurality of second secondary pipes (902) connected to the second main pipe (901), the plurality of second secondary pipes (902) being arranged in parallel; The second mounting plate (7) and the second heat spreader (8) are provided with a second placement slot (12) that is connected to each other. The heat dissipation box (3) is provided with a third placement slot (13). The upper part of the second main pipe (901) and the second auxiliary pipe (902) are placed in the second placement slot (12). The lower part of the second main pipe (901) is placed in the third placement slot (13). The upper and lower parts of the second main pipe (901) are connected by a vertical pipe. The second auxiliary pipe (902) is located in the placement slot on the second heat spreader (8).

9. The heat conduction and heat dissipation structure of densely stacked multi-module according to claim 2, characterized in that, Several threaded support columns (14) are provided between the first mounting plate (2) and the bottommost second mounting plate (7) as well as between adjacent second mounting plates (7).

10. The heat-conducting and heat-dissipating structure with densely stacked multi-modules according to claim 2, characterized in that, A heat-conducting pressure plate (15) is installed on the top surface of the heat sink (3), and one end of the first heat-conducting pipe (6) and the second heat-conducting pipe (9) are both located in the placement groove below the heat-conducting pressure plate (15).

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