Shielding assembly and wireless communication module

Abstract

The utility model provides a shielding assembly and wireless communication module, shielding assembly includes: shielding frame and shielding cover, be provided with a plurality of heat conduction grooves of default number on the shielding frame, the PCB board of wireless communication module is connected with the shielding frame, the shielding cover is connected with shielding frame through buckle connection mode, the utility model discloses show a kind of shielding assembly applied to wireless communication module, the shielding assembly includes shielding frame and shielding cover, the PCB board of wireless communication module is connected with the shielding frame by being provided with a plurality of heat conduction grooves of default number, the shielding cover is connected with the shielding frame through buckle connection mode. To fix the size of heat conduction silica gel by heat conduction groove, to solve the industry problem that the heat conduction efficiency of the upper surface of communication module heating chip is not high, so as to improve the heat dissipation rate of heat conduction silica gel.

Description

Technical Field

[0001] This utility model relates to the field of automotive wireless communication module technology, and in particular to a shielding component and a wireless communication module. Background Technology

[0002] With the evolution of intelligent and connected vehicles, the computing power of processors and hardware are developing rapidly. More and more complex and diverse electronic systems are entering the vehicle, and the number of ECUs and the amount of data interaction in the vehicle are increasing exponentially, thus requiring higher in-vehicle network bandwidth.

[0003] Vehicle-mounted network bandwidth access wireless communication modules enable control commands to reach the executor in a timely and accurate manner even with large amounts of data transmission. Their functions are becoming more abundant, but their power consumption and the heat generated during operation are also increasing.

[0004] Due to the design requirements for electromagnetic interference and electromagnetic radiation, wireless communication modules typically employ a two-piece metal sheet metal structure consisting of a shielding cover and a shielding frame for electromagnetic shielding. The module circuit board integrates multiple high-heat-generating collector circuit chips. The heat from the chips is transferred to the surface of the shielding cover by applying thermally conductive adhesive, which fills the gap between the shielding cover and the chip surface.

[0005] Since the main component of thermally conductive adhesive is silicone, the shape of the adhesive during dispensing is not fixed, resulting in a small effective heat dissipation area. Utility Model Content

[0006] In view of this, the present invention provides a shielding component and a wireless communication module to solve the problem of insufficient heat dissipation area caused by the non-fixed shape of thermally conductive adhesive in existing computing.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A first aspect of this utility model discloses a shielding assembly, the shielding assembly comprising: a shielding frame and a shielding cover;

[0009] The shielding frame is provided with a preset number of heat-conducting grooves;

[0010] The shielding frame is connected to the PCB board of the wireless communication module;

[0011] The shielding cover is connected to the shielding frame by a snap-fit ​​connection.

[0012] Optionally, the shielding frame is connected to the PCB board by bonding.

[0013] Optionally, the position of the heat-conducting groove is aligned with the position of the heat-generating chip on the PCB board.

[0014] Optionally, the size of the heat-conducting groove is a preset ratio of the surface area of ​​the heat-generating chip it is aligned with.

[0015] Optionally, the heat-conducting groove includes a groove body and a bent member disposed at the bottom of the groove body.

[0016] Optionally, the bending element is an elastic arc-shaped bending element.

[0017] Optionally, the heat-conducting groove, the connecting edge, and the frame of the shielding frame are integrated into a single structure, and the integrated structure is square.

[0018] Optionally, the shielding frame is provided with internal shielding ribs;

[0019] The shielding inner ribs are used to separate all the heat-generating chips within the PCB board of the wireless communication module.

[0020] Optionally, the outer periphery of the shielding frame is provided with multiple female buckles;

[0021] The inner periphery of the frame of the shielding cover is provided with multiple male buckles;

[0022] The female buckle on the outer periphery of the shielding frame engages with the male buckle on the inner periphery of the shielding cover.

[0023] The second aspect of this utility model illustrates a wireless communication module, including the shielding component described in any one of the first aspects of this utility model.

[0024] Based on the above-described embodiments of this utility model, a shielding component and a wireless communication module are provided. The shielding component includes a shielding frame and a shielding cover. A preset number of heat-conducting grooves are provided on the shielding frame, and the heat-conducting grooves are connected to the shielding frame. The shielding frame is connected to the PCB board of the wireless communication module. The shielding cover is connected to the shielding frame via a snap-fit ​​connection. This utility model illustrates a shielding component for a wireless communication module, comprising a shielding frame and a shielding cover. The shielding frame, constructed from a preset number of heat-conducting grooves, is connected to the PCB board of the wireless communication module. The shielding cover is connected to the shielding frame via a snap-fit ​​connection. The size of the thermally conductive silicone is fixed by the heat-conducting grooves to solve the problem of low thermal conductivity on the surface of the heat-generating chip in the communication module, thereby improving the heat dissipation rate of the thermally conductive silicone. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the architecture of a shielding component according to an embodiment of the present invention;

[0027] Figure 2 This is a cross-sectional view showing the specific structure of the heat sink in an embodiment of the present invention;

[0028] Figure 3 This is a side view schematic diagram showing the contact between the heat-conducting groove and the heating chip in an embodiment of the present invention;

[0029] Figure 4 This is a side view schematic diagram showing the dimensions of the shielding groove in an embodiment of the present utility model;

[0030] Figure 5 This is a cross-sectional view of a shielding frame shown in an embodiment of the present invention;

[0031] Figure 6 This is a cross-sectional view of another shielding frame shown in an embodiment of the present invention;

[0032] Figure 7 This is a cross-sectional view of another shielding frame shown in an embodiment of the present utility model;

[0033] Figure 8 This is a cross-sectional view of the shielding assembly shown in an embodiment of the present invention;

[0034] Figure 9 This is a cross-sectional view of a wireless communication module shown in an embodiment of the present invention. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] It should be noted that the descriptions involving "first," "second," etc., in this utility model are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope claimed by this utility model.

[0037] See Figure 1 This is a schematic diagram of the architecture of a shielding component according to an embodiment of the present utility model. The shielding component includes a shielding frame 1 and a shielding cover 2.

[0038] The shielding frame 1 is provided with a preset number of heat-conducting grooves 11;

[0039] The shielding frame 1 is connected to the PCB board 3 of the wireless communication module;

[0040] The shielding cover 2 is connected to the shielding frame 1 by a snap-fit ​​connection.

[0041] Specifically, the shielding cover 2 is connected to the first side of the frame 12 of the shielding frame 1 by means of a snap-fit ​​connection.

[0042] It should be noted that the material of the shielding frame 1 can be metal.

[0043] The heat conduction groove 11 can be a silicone groove.

[0044] The preset quantity is the same as the number of heat-generating chips 31 on the PCB board 3 of the wireless communication module. In other words, the number of heat-conducting grooves 11 is the same as the number of heat-generating chips 31 on the PCB board 3 of the wireless communication module.

[0045] Specifically, the shielding frame 1 is provided with the same number of heat-conducting grooves 11 as the number of heat-generating chips 31 on the PCB board 3 of the wireless communication module. Then, the heat-conducting grooves 11 are integrated with the outer frame of the shielding frame 1 to stably maintain the overall flatness of the shielding frame.

[0046] The shielding frame 1 is disposed between the shielding cover 2 and the PCB board 3 of the wireless communication module. Its heat-conducting groove 11 is used to store thermally conductive silicone, so that the shape of the thermally conductive silicone is consistent with the heat-conducting groove, thereby improving the heating effect of the heating chip 31.

[0047] The shielding cover 2 is connected to the outside of the first side of the frame 12 of the shielding frame 1 by means of a snap-fit ​​connection.

[0048] Optionally, the shielding cover 2 is also externally attached to the second side of the frame 12 of the shielding frame 1, and the first side and the second side of the frame 12 form an inverted L-shaped structure.

[0049] It should be noted that the first side is welded to the second side, so that the first side and the second side present an inverted L-shaped integrated structure.

[0050] In one embodiment, the shielding frame 1 is connected to the side of the PCB board 3 by means of bonding.

[0051] Specifically, the frame 12 of the shielding frame 1 is enclosed on the outer periphery of the PCB board 3 of the wireless communication module through the interior of the first side, so as to achieve the side contact between the shielding frame 1 and the PCB board 3.

[0052] Optionally, the frame 12 of the shielding frame 1 is disposed above the PCB board 3 of the wireless communication module through the interior of the second side.

[0053] Optionally, the shielding component may be a shielding cover.

[0054] Optionally, the shielding frame 1 can be generated by a stamping process, in which a silicone groove for storing thermally conductive silicone is formed simultaneously with the stamping of the metal shielding frame.

[0055] This invention discloses a shielding assembly for a wireless communication module. The assembly includes a shielding frame and a shielding cover. The shielding frame, constructed from a predetermined number of heat-conducting grooves, is connected to the PCB board of the wireless communication module. The shielding cover is connected to the shielding frame via a snap-fit ​​connection. By fixing the size of the thermally conductive silicone pad through the heat-conducting grooves, the industry-wide problem of low thermal conductivity on the surface of the heat-generating chip in the communication module is solved, while maintaining the original compact size of the communication module and reducing manufacturing costs. This achieves the dual benefits of improved heat dissipation efficiency and cost control.

[0056] Optionally, based on the shielding assembly shown in the above embodiments of the present invention, a cross-sectional view of the specific structure of the heat-conducting groove is also shown, such as... Figure 2 As shown.

[0057] The heat-conducting groove 11 includes a groove body 111 and a bent part 112 disposed at the bottom of the groove body 111.

[0058] It should be noted that the bending member 112 is an elastic arc-shaped bending member that bends inward toward the groove body 111.

[0059] Specifically, the tank body 111 is used to fill the thermally conductive silicone.

[0060] In the specific implementation, due to the physical properties of thermally conductive silicone, when the silicone is dispensed to the thermally conductive groove 11, it will form a cuboid similar to a metal shielding frame under the action of gravity, that is, a cuboid similar to the thermally conductive groove 11; thus, the thermally conductive silicone maintains the same area in contact with the chip surface as the vertical heat dissipation channel, thereby improving the heat dissipation rate of the thermally conductive silicone.

[0061] It should be noted that the bending component 112 adopts a contact-type arc design, which has elastic deformation capability. It can ensure an interference fit without increasing pressure and damaging the chip. The contact-type arc design can perfectly contact the upper surface of the heat-generating chip 31, while preventing the thermal conductive silicone from flowing out from the gap between the chip and the thermal conductive silicone groove of the metal shielding frame, and without the presence of strong pressure that could damage the chip.

[0062] In other words, this application can effectively prevent the thermally conductive silicone from spreading to the PCB board 3, i.e. other parts on the circuit board, through the bending member 112, thus avoiding the risk of short circuit.

[0063] Optionally, an interception component 113 is provided on the top of the slot body 111.

[0064] To prevent thermal conductive silicone from overflowing from the top of the thermal conductive groove 11, an interception component 113 can be provided on the top of the groove body 111 to prevent excessive thermal conductive silicone from overflowing.

[0065] It should be noted that the interception component 113 can be a plate, which is set above the slot body (111) and forms a "7" shape with the inside of the slot body 111.

[0066] In this embodiment of the invention, the thermally conductive silicone dripped into the thermally conductive groove is shaped by the groove body and the bending member disposed at the bottom of the groove body, so as to form a cuboid thermally conductive silicone storage groove that is similar to a metal shielding frame. This makes the thermally conductive silicone have the same contact area with the chip surface as the vertical heat dissipation channel, so that the heat dissipation area of ​​the thermally conductive silicone reaches the maximum, thereby improving the heat dissipation rate of the thermally conductive silicone.

[0067] Based on the specific structural diagram of the heat-conducting groove shown above, this embodiment of the invention also shows a side view of the contact between the heat-conducting groove and the heating chip, as shown below. Figure 3 As shown.

[0068] The position of the heat conduction groove 11 is aligned with the position of the heating chip 31 on the PCB board 3.

[0069] In a specific implementation, the bent part 112 at the bottom of the heat conduction groove 11 contacts the left and right sides of the heating chip 31 on the PCB board 3 to achieve the alignment of the heat conduction groove 11 with the heating chip 31 on the PCB board 3.

[0070] Optionally, this application also shows side views of heat-conducting grooves 11 of different sizes within the shielding frame 1, such as... Figure 4 As shown.

[0071] The size of the heat-conducting groove 11 is a preset ratio of the surface area of ​​the heat-generating chip 31 that it is aligned with.

[0072] It should be noted that the dimensions of the heat-conducting grooves 11 aligned with the surface areas of different heat-generating chips 31 on the PCB board 3 of the wireless communication module are pre-determined. Specifically, the heat generation of the heat-generating chip 31 per unit time is first obtained. If its heat generation is within a first range, a preset area corresponding to the first range is obtained; and the preset area is used as the dimensions of the heat-conducting grooves 11 aligned with it.

[0073] Similarly, when the heat generation is within the second range, a preset area corresponding to the second range is obtained, and the preset area is used as the size of the heat conduction groove 11 aligned with it. This process is repeated until the size of each heat-generating chip 31 is set.

[0074] It should be noted that the first range and the second range were set in advance based on multiple experiments, and the correspondence between different ranges and preset area regions was established through multiple experiments.

[0075] The preset area is a percentage of the surface area of ​​the corresponding heating chip 31, such as an area covering 90% of the surface area of ​​the heating chip 31.

[0076] For example: if the heat output of heating chip A is x1 per unit time, and if its heat output x1 is within the first range y1, the preset area area corresponding to the first range y1 is obtained as 60% of the surface area of ​​the heating chip it is aligned with; if the heat output of heating chip B is x2 per unit time, and if its heat output x2 is within the second range y2, the preset area area corresponding to the second range y2 is obtained as 90% of the surface area of ​​the heating chip it is aligned with.

[0077] It should be noted that, generally speaking, the dimensions of the heat conduction groove 11 of different sizes can be achieved by fine-tuning the stamping die.

[0078] In this embodiment of the invention, the amount of thermally conductive adhesive can be controlled by adjusting the size of the thermally conductive silicone groove in the metal shielding frame. This allows for the highest thermal conductivity while controlling costs and maximizing practical benefits.

[0079] Optionally, based on the schematic diagram of the shielding component shown above, this embodiment of the present invention also shows a specific structural diagram of the shielding frame 1, as follows: Figure 5 As shown.

[0080] The heat conduction groove 11, the connecting edge 12, and the frame 12 of the shielding frame 1 form an integrated structure, and the integrated structure is square.

[0081] It should be noted that each heat conduction groove 11 has a square structure with the frame 12 of the shielding frame 1.

[0082] Specifically, the heat conduction groove 11, the two connecting edges 13, and the frame 12 of the shielding frame 1 form a square integrated structure. The heat conduction groove 11 is located at one corner of the square, and the two connecting edges 13 and the shielding frame 12 opposite the corner of the heat conduction groove 11 are the sides of the square.

[0083] In other words, for each heat conduction groove 11, two sides of the frame 12 closest to the heat conduction groove 11 are determined, namely side 1 and side 2; one end of a connecting edge 13 is connected to side 1, and the other end of the connecting edge 13 is connected to the side of the heat conduction groove 11 closest to side 1. Similarly, the other connecting edge 13 of the heat conduction groove 11 is set in the above manner, so that each heat conduction groove 11, the shielding frame 1, and the connecting edge 13 form a square integrated structure.

[0084] In this embodiment of the invention, in order to avoid interference with the optical detection of non-heating chips other than the heat-generating chip, and to maintain the overall flatness of the shielding frame, each heat-conducting groove is made to have a square structure with the shielding frame through the connecting edge, which actually makes the heat-conducting groove obtain a stable triangular structure; thereby increasing the success rate of experimental reliability testing, and maintaining structural stability without affecting the testing of other subsequent modules.

[0085] Optionally, based on the above Figure 5 The diagram showing the specific architecture of the shielding frame, combined with... Figure 5 This application also shows a cross-sectional view of another shielding frame, such as Figure 6 and Figure 7 As shown.

[0086] The shielding frame 1 is provided with shielding inner ribs 14 inside;

[0087] The shielding inner rib 14 is used to divide all the chips within the PCB board 3 of the wireless communication module.

[0088] Specifically, the shielding inner ribs 14 are placed between every two heat conduction grooves 11 and connected to the frame 12 of the shielding frame 1, so that the heat conduction grooves 11 are divided by multiple shielding inner ribs 14, that is, all chips (including heat-generating chips) in the PCB board 3 of the wireless communication module are divided, so that each heat conduction groove 11 is in an independent space to prevent the signals of different chips under the heat conduction groove 11 from interfering with each other.

[0089] It should be noted that multiple shielding inner ribs 14 intersect.

[0090] This application can shield signal interference between adjacent heating chips by dividing the inner shielding rib 14 into individual heating chips, which has the same effect as the material of the entire shielding frame 1.

[0091] Optional, such as Figure 6 and Figure 7 As shown, if there are 4 heat conduction grooves 11, two shielding inner ribs 14 can be set to form a cross shape to divide the 4 heat conduction grooves 11.

[0092] Optionally, the inner shielding rib 14 is also provided with solder points, which are used to solder with the PCB board 3 to increase the adhesion between the shielding frame 1 and the PCB board 3.

[0093] In this embodiment of the invention, by providing shielding inner ribs inside the shielding frame to separate all chips within the PCB board of the wireless communication module, mutual interference of signals is prevented and the overall strength of the shielding frame structure is increased. Furthermore, by adding solder points to the shielding inner ribs to connect the PCB board by soldering with solder paste, the adhesion between the shielding frame and the PCB is increased.

[0094] Optionally, based on the specific cross-sectional views of the shielding frame and shielding cover shown in the present invention, such as... Figure 8 As shown.

[0095] The outer periphery of the frame 12 of the shielding frame 1 is provided with a plurality of female buckles 121;

[0096] The inner periphery of the frame of the shielding cover 2, i.e. the side, is provided with a plurality of male buckles 21;

[0097] The female buckle 121 on the outer periphery of the frame 12 of the shielding frame 1 engages with the male buckle 21 on the inner periphery of the frame of the shielding cover 2.

[0098] It should be noted that the number of female buckles 121 and male buckles 21 is the same, and the positions of female buckles 121 and male buckles 21 are aligned one by one.

[0099] Both female buckle 121 and male buckle 21 are sheet metal buckles, with male buckle 21 being convex and female buckle 121 being concave.

[0100] Specifically, multiple female buckles 121 are provided at preset intervals on the outer periphery of the first side of the frame 12 of the shielding frame 1, that is, on the side surrounding the outside of the PCB board 3. In other words, multiple female buckles 121 are provided at preset intervals on all four first sides, that is, the outer sides of the shielding frame 1.

[0101] The inner side of the shielding cover 2, i.e. the inner periphery of the frame, is provided with a plurality of male buckles 21. The male buckles 21 are fastened to the female buckles 121 by means of a snap-fit ​​connection, so that the shielding cover 2 covers the shielding frame 1.

[0102] In this embodiment of the invention, a male buckle is provided on the inner side of the periphery of the shielding cover, and a female buckle is provided on the outer side of the shielding frame; by fastening the male and female buckles of the shielding cover together, the shielding cover and shielding frame can be quickly assembled when applied to a wireless communication module.

[0103] Optionally, based on the shielding components shown above, this embodiment of the invention also illustrates a wireless communication module, such as... Figure 9 As shown, it includes the shielding components shown above and PCB board 3.

[0104] It should be noted that the specific implementation process of the shielding components, such as the structure and function of the other parts of the wireless communication module, will not be elaborated in this application.

[0105] The specific principles and execution processes of each unit in the data flow control device disclosed in the above-described embodiments of the present invention are the same as the corresponding contents in the data flow control method provided in the above-described embodiments of the present invention. Please refer to the corresponding parts in the data flow control method disclosed in the above-described embodiments of the present invention, and they will not be repeated here.

[0106] This application provides an electronic device, which includes a processor and a memory. The memory is used to store data flow control program code and data, and the processor is used to call the program instructions in the memory to execute the steps shown in the data flow control method in the above embodiments.

[0107] This utility model provides a storage medium, which includes the electronic device provided in the above-described embodiments of this application. The electronic device is used to execute the data flow control method disclosed in the embodiments of this application.

[0108] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for system or system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the descriptions in the method embodiments. The systems and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0109] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this invention.

[0110] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A shielding component, characterized in that, The shielding assembly includes: a shielding frame (1) and a shielding cover (2); The shielding frame (1) is provided with a preset number of heat conduction grooves (11). The shielding frame (1) is connected to the PCB board (3) of the wireless communication module; The shielding cover (2) is connected to the shielding frame (1) by means of a snap-fit ​​connection.

2. The shielding assembly according to claim 1, characterized in that, The shielding frame (1) is connected to the PCB board (3) by bonding.

3. The shielding assembly according to claim 1, characterized in that, The position of the heat-conducting groove (11) is aligned with the position of the heating chip on the PCB board (3).

4. The shielding assembly according to claim 3, characterized in that, The size of the heat-conducting groove (11) is a preset ratio of the surface area of ​​the heat-generating chip it is aligned with.

5. The shielding assembly according to claim 1, characterized in that, The heat-conducting groove (11) includes a groove body (111) and a bent part (112) disposed at the bottom of the groove body (111).

6. The shielding assembly according to claim 5, characterized in that, The bending component (112) is an elastic arc-shaped bending component.

7. The shielding assembly according to claim 1, characterized in that, The heat-conducting groove (11), the connecting edge (13), and the frame (12) of the shielding frame (1) form an integrated structure, and the integrated structure is square.

8. The shielding assembly according to claim 1, characterized in that, The shielding frame (1) is provided with shielding inner ribs (14). The shielding inner rib (14) is used to separate all the heat-generating chips in the PCB board (3) of the wireless communication module.

9. The shielding assembly according to claim 1, characterized in that, The outer periphery of the frame (12) of the shielding frame (1) is provided with multiple female buckles; The inner periphery of the frame of the shielding cover (2) is provided with multiple male buckles; The female buckle on the outer periphery of the frame (12) of the shielding frame (1) engages with the male buckle on the inner periphery of the frame of the shielding cover (2).

10. A wireless communication module, characterized in that, Includes the shielding component as described in any one of claims 1-9.

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