Multi-band electromagnetic shielding electrically conductive sponge

Abstract

The utility model discloses a kind of multi-band electromagnetic shielding conductive sponge, it is related to conductive sponge technical field, including sponge matrix, conductive layer is arranged on sponge matrix, conductive layer is provided with multi-band shielding layer, conductive adhesive layer is arranged on multi-band shielding layer, low-frequency shielding layer and high-frequency shielding layer in multi-band shielding layer are respectively for low-frequency electromagnetic signal and high-frequency electromagnetic signal absorption shielding, different frequency band electromagnetic wave signal can be shielded, the realization from low frequency to high frequency wide band, high intensity electromagnetic absorption shielding effect is realized, all-round electromagnetic shielding is carried out to electronic device under different environment, avoid electronic device to be subjected to electromagnetic interference, improve the signal stability of electronic device.

Description

Technical Field

[0001] This utility model relates to the field of conductive sponge technology, and in particular to a conductive sponge with multi-band electromagnetic shielding. Background Technology

[0002] Conductive sponge is produced using polymer composite material foaming technology. The foam has uniform pore size, is soft and elastic, and does not shed. The uniform distribution of conductive sponge can protect the pins of devices, and it is also corrosion-resistant. It is an ideal medium material for long-term storage of devices. In currently used electronic products, conductive sponge is generally attached to the internal electronic components to achieve the effects of conductivity, anti-static, reduction of electromagnetic interference, and shock protection.

[0003] However, existing conductive sponges, such as the composite electromagnetic shielding conductive sponge described in utility model patent CN218831167U, which includes a sponge layer as the substrate, with carbon conductive layers and composite metal film layers sequentially arranged on the upper and lower sides of the sponge layer, present a different performance in shielding electromagnetic waves. The proposed conductive sponge, with its multi-layered structure, exhibits excellent conductivity and electromagnetic wave shielding effect, capable of broadly shielding electromagnetic waves radiated by various electronic products. The sponge layer is a three-dimensional mesh structure with uniform foam pore size, softness, elasticity, and non-shedding properties. All cross-sections of the conductive sponge possess good conductivity, achieving omnidirectional conductivity and significantly improving shielding effectiveness. It also boasts advantages such as long conductive lifespan and immunity to temperature and humidity influences, making it a more ideal electromagnetic shielding conductive material. This solves the problem that existing technologies cannot simultaneously conduct electricity and shield electromagnetic waves, leading to interference and low conductivity when applied to various electrical appliances.

[0004] In the aforementioned patent, the electromagnetic frequency bands that it can shield are relatively fixed, and it cannot achieve shielding of electromagnetic wave signals of multiple frequency bands, nor can it achieve all-round shielding of electromagnetic wave signals in different environments, which affects the signal stability of electrical equipment.

[0005] Therefore, it is necessary to propose a new technical solution to address the above problems. Utility Model Content

[0006] To overcome the shortcomings mentioned above, this utility model aims to provide a technical solution that can solve the aforementioned problems.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a multi-band electromagnetic shielding conductive sponge, comprising a sponge substrate, a conductive layer disposed on the sponge substrate, a multi-band shielding layer disposed on the conductive layer, and a conductive adhesive layer disposed on the multi-band shielding layer.

[0008] As a further embodiment of this utility model: the multi-band shielding layer includes a low-frequency shielding layer disposed on the conductive layer and a high-frequency shielding layer disposed on the low-frequency shielding layer, and the high-frequency shielding layer is bonded to the conductive adhesive layer.

[0009] As a further embodiment of this utility model: the lower end of the high-frequency shielding layer has a frosted surface, and the conductive adhesive layer is bonded to the frosted surface.

[0010] As a further embodiment of this utility model: the two ends of the sponge matrix are bent downward to form side wrapping parts, and an inner groove is formed between the two side wrapping parts; The conductive layer and the multi-band shielding layer are both disposed within the inner groove.

[0011] As a further embodiment of this utility model: the lower end face of the multi-band shielding layer is flush with the lower end face of the side cover, and the conductive adhesive layer covers the lower end face of the multi-band shielding layer and the side cover.

[0012] As a further embodiment of this invention: the low-frequency shielding layer is a nickel-iron alloy coating.

[0013] As a further embodiment of this utility model: the high-frequency shielding layer is an electroplated copper coating.

[0014] As a further embodiment of this invention, the conductive layer is made of graphene material.

[0015] As a further embodiment of this utility model: a release film layer is provided on the conductive adhesive layer.

[0016] Compared with the existing technology, the beneficial effects of this technical solution are as follows: When in use, it is bonded to the mounting surface through the conductive adhesive layer. In application, the sponge matrix can provide basic shockproof and antistatic protection for electronic devices, while the conductive adhesive layer has both adhesive and conductive properties, so that the conductive layer and the multi-band shielding layer can achieve a stable grounding connection with the mounting surface through the conductive adhesive layer. By utilizing the low-frequency shielding layer and high-frequency shielding layer in the multi-band shielding layer to absorb and shield low-frequency and high-frequency electromagnetic signals respectively, electromagnetic wave signals of different frequency bands can be shielded, achieving a wide-band, high-intensity electromagnetic absorption and shielding effect from low frequency to high frequency. This provides comprehensive electromagnetic shielding for electronic devices in different environments, preventing electronic devices from being subjected to electromagnetic interference and improving the signal stability of electronic devices.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic cross-sectional view of the overall structure of this utility model; Figure 2 This is a schematic diagram of the cross-sectional structure of the multi-band shielding layer of this utility model; Figure 3 This is a schematic diagram of the cross-sectional structure of the sponge matrix of this utility model; The corresponding labels in the attached diagram are explained as follows: 1. Sponge substrate; 11. Side covering; 2. Conductive layer; 3. Multi-band shielding layer; 31. Low-frequency shielding layer; 32. High-frequency shielding layer; 321. Frosted surface; 4. Conductive adhesive layer; 5. Release film layer; 6. Inner groove. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-3 A multi-band electromagnetic shielding conductive sponge includes a sponge substrate 1, a conductive layer 2 disposed on the sponge substrate 1, a multi-band shielding layer 3 disposed on the conductive layer 2, and a conductive adhesive layer 4 disposed on the multi-band shielding layer 3.

[0022] Specifically, during use, the conductive adhesive layer 4 is bonded to the mounting surface. In application, the sponge substrate 1 can provide basic shockproof and antistatic protection for electronic devices, while the conductive adhesive layer 4 has both adhesive and conductive properties, enabling the conductive layer 2 and the multi-band shielding layer 3 to achieve a stable grounding connection with the mounting surface through the conductive adhesive layer 4. The multi-band shielding layer 3 set on the conductive layer 2 can shield electromagnetic wave signals of different frequency bands, achieve wide bandwidth coverage, and provide all-round electromagnetic shielding for electronic devices in different environments, so as to avoid electromagnetic interference to electronic devices and improve the signal stability of electronic devices.

[0023] refer to Figure 1-2Based on the above embodiments, it is further proposed that the multi-band shielding layer 3 includes a low-frequency shielding layer 31 disposed on the conductive layer 2 and a high-frequency shielding layer 32 disposed on the low-frequency shielding layer 31, and the high-frequency shielding layer 32 is bonded to the conductive adhesive layer 4.

[0024] Specifically, the low-frequency shielding layer 31 is a nickel-iron alloy coating, and the high-frequency shielding layer 32 is an electroplated copper coating. In application, the low-frequency shielding layer 31 with the nickel-iron alloy coating absorbs and shields low-frequency electromagnetic signals, and the high-frequency shielding layer 32 with the electroplated copper coating absorbs and shields high-frequency electromagnetic signals, thereby achieving a wide-band, high-intensity electromagnetic absorption and shielding effect from low to high frequencies. The low-frequency shielding layer and the conductive layer 2 can be bonded and cured using adhesives such as epoxy resin that do not affect conductivity.

[0025] Based on the above embodiments, it is further proposed that the conductive layer 2 is made of graphene material, which can provide a stable conductive network for the entire conductive sponge.

[0026] refer to Figure 1-2 Based on the above embodiments, it is further proposed that a release film layer 5 be provided on the conductive adhesive layer 4. This improves the ability of the release film layer 5 to cover and protect the surface of the conductive adhesive layer 4 before the conductive sponge is used, preventing dust from adhering to the surface of the conductive adhesive layer 4 and affecting its adhesion. When in use, the release film layer 5 can be removed to bond and fix the conductive adhesive layer 4 to the mounting surface.

[0027] refer to Figure 2 Based on the above embodiments, it is further proposed that the lower end of the high-frequency shielding layer 32 has a frosted surface 321, and the conductive adhesive layer 4 is bonded to the frosted surface 321.

[0028] Specifically, when the conductive adhesive layer 4 is attached to the mounting surface, the concave structure on the frosted surface 321 can be embedded into the conductive adhesive layer 4 by squeezing, thereby making the adhesion between the conductive adhesive layer 4 and the high-frequency shielding layer 32 stronger and preventing the conductive adhesive layer 4 from loosening and separating from the high-frequency shielding layer 32.

[0029] refer to Figure 3 Based on the above embodiments, it is further proposed that the two ends of the sponge substrate 1 bend downward to form side wrapping parts 11, and an inner groove 6 is formed between the two side wrapping parts 11. The conductive layer 2 and the multi-band shielding layer 3 are both disposed within the inner groove 6.

[0030] Specifically, the design of the side wrapping part 11 allows the conductive layer 2 and the multi-band shielding layer 3 to be placed in the formed inner groove 6, thereby wrapping and protecting the sides of the conductive layer 2 and the multi-band shielding layer 3, preventing damage to the conductive layer 2 and the multi-band shielding layer 3, and also preventing delamination between the sponge substrate 1 and the conductive layer 2 and the multi-band shielding layer 3, which would affect the electromagnetic shielding effect.

[0031] Furthermore, the lower end face of the multi-band shielding layer 3 is flush with the lower end face of the side cover portion 11, and the conductive adhesive layer 4 covers the lower end face of the multi-band shielding layer 3 and the side cover portion 11.

[0032] Specifically, the conductive adhesive layer 4 covers both the multi-band shielding layer 3 and the lower end face of the side cover 11, which can establish an adhesive relationship between the sponge substrate 1 and the mounting plane, thereby improving the overall adhesive strength.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A multi-band electromagnetic shielded conductive sponge, characterized by, It includes a sponge substrate (1), a conductive layer (2) is provided on the sponge substrate (1), a multi-band shielding layer (3) is provided on the conductive layer (2), and a conductive adhesive layer (4) is provided on the multi-band shielding layer (3). The two ends of the sponge substrate (1) are bent downward to form side wrapping parts (11), and an inner groove (6) is formed between the two side wrapping parts (11). The conductive layer (2) and the multi-band shielding layer (3) are both disposed in the inner groove (6); The lower end face of the multi-band shielding layer (3) is flush with the lower end face of the side cover (11), and the conductive adhesive layer (4) covers the lower end face of the multi-band shielding layer (3) and the side cover (11).

2. The conductive sponge for multi-band electromagnetic shielding according to claim 1, characterized in that, The multi-band shielding layer (3) includes a low-frequency shielding layer (31) disposed on the conductive layer (2) and a high-frequency shielding layer (32) disposed on the low-frequency shielding layer (31), and the high-frequency shielding layer (32) is bonded to the conductive adhesive layer (4).

3. The conductive sponge for multi-band electromagnetic shielding according to claim 2, characterized in that, The lower end of the high-frequency shielding layer (32) has a frosted surface (321), and the conductive adhesive layer (4) is bonded to the frosted surface (321).

4. The conductive sponge for multi-band electromagnetic shielding according to claim 3, characterized in that, The low-frequency shielding layer (31) is a nickel-iron alloy coating.

5. The conductive sponge for multi-band electromagnetic shielding according to claim 4, characterized in that, The high-frequency shielding layer (32) is an electroplated copper coating.

6. The conductive sponge for multi-band electromagnetic shielding according to claim 5, characterized in that, The conductive layer (2) is made of graphene material.

7. The conductive sponge for multi-band electromagnetic shielding according to claim 1, characterized in that, A release film layer (5) is provided on the conductive adhesive layer (4).

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