A multi-head mounting head switching device
By designing a rotating and placement mechanism and utilizing a contact separation mechanism between the telescopic head and the conductive sheet, the problem of nozzle lag or premature adsorption is solved, enabling efficient and precise chip placement in multi-head placement equipment and improving the equipment's intelligence and placement accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HONGXIN MICRO GRP TECH CO LTD
- Filing Date
- 2025-07-31
- Publication Date
- 2026-07-21
AI Technical Summary
In existing multi-head placement equipment, during high-speed switching and placement processes, the nozzles are prone to lag or prematurely picking up chips, resulting in chip squeezing, misalignment, or reduced placement accuracy.
By employing a rotating mechanism and a placement mechanism, and through the contact separation design between the telescopic head and the conductive sheet in the first placement assembly, the suction head can instantly adsorb the chip upon contact, eliminating the problem of nozzle lag or premature adsorption, and ensuring the immediate response and accuracy of the adsorption action.
It improves placement accuracy and reliability, avoids chip squeezing and misalignment, and enhances placement efficiency and intelligent equipment control.
Smart Images

Figure CN224538633U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip mounting technology, and more specifically, to a multi-head mounting head switching device. Background Technology
[0002] With the rapid development of the electronics manufacturing industry, surface mount technology (SMT) has been widely used in the assembly process of various electronic products. As one of the key pieces of equipment in the SMT process, placement equipment's main function is to accurately and efficiently pick up and place various microelectronic chips onto designated locations on the circuit board using placement heads. To improve placement efficiency and adapt to the process requirements of different types of chips, modern placement equipment is increasingly equipped with multiple nozzle types and multi-head structures to achieve rapid head switching and efficient coordination. However, ensuring that the nozzles move accurately, respond quickly, and are reliably controlled during high-speed switching and placement remains one of the key technical challenges facing the industry.
[0003] In existing multi-head placement equipment, the suction action is usually initiated by human control commands, such as by pressing with your hand or stepping on the foot to trigger negative pressure suction. However, the above methods often have the hidden dangers of response delay or judgment error. Especially when the chip placement speed is high or the placement head structure is complex, it often causes the nozzle to lag or pick up the chip prematurely, which can cause excessive compression or displacement of the chip and reduce the placement accuracy.
[0004] Therefore, there is a need to provide a multi-head placement head switching device to solve the problem that existing multi-head placement equipment causes the nozzle to lag or pick up the chip prematurely. Utility Model Content
[0005] The main objective of this invention is to provide a multi-head placement head switching device, which aims to solve the technical problems mentioned in the background section.
[0006] The present invention adopts the following technical solution: A multi-head placement head switching device includes a rotating mechanism and a placement mechanism. The rotating mechanism includes a rotating shaft, and the placement mechanism includes a bracket, which is fixedly sleeved on the outside of the rotating shaft. The mounting mechanism further includes a first mounting assembly, which is provided with a first mounting frame connected to the bracket. A first suction head and a telescopic head are connected to the lower part of the first mounting frame, and the first suction head passes through the bottom end of the telescopic head. An L-shaped conductive sheet is slidably connected to the side of the bracket facing the first suction head. One end of the conductive sheet abuts against the bottom end of the telescopic head. When the first suction head abuts against the chip, the telescopic head separates from the conductive sheet, and the first suction head picks up the chip.
[0007] Furthermore, the first mounting assembly is also provided with a connecting cylinder, which is fixedly connected to the first mounting frame, and the connecting cylinder is provided with a sliding cavity. The telescopic head is slidably connected to the sliding cavity, and the top end of the telescopic head is provided with an elastic element, the end of the elastic element away from the telescopic head abutting against the top wall of the sliding cavity.
[0008] Furthermore, an adjustment frame is provided at the end of the first mounting bracket away from the support, and a micrometer is fixedly connected to the adjustment frame. A transmission member is located on the upper end face of the conductive sheet. The transmission member extends around the connecting cylinder to the top of the micrometer, and the transmission member abuts against the adjustment end of the micrometer to adjust the compression of the elastic member.
[0009] Furthermore, a first negative pressure connector is rotatably connected to the upper end face of the connecting cylinder, and a first negative pressure air passage connected to the negative pressure connector is provided inside the connecting cylinder. A flexible tube is connected between one side of the telescopic head and the first negative pressure air passage, and the first suction head communicates with the flexible tube.
[0010] Furthermore, the rotating mechanism also includes a support frame, the rotating shaft is rotatably connected to the support frame via a bearing, and a transmission wheel is sleeved on the outer side of the rotating shaft. A rotating motor is fixedly connected to the bottom end of the support frame, and the output shaft of the rotating motor is connected to the transmission wheel via a belt.
[0011] Furthermore, a limiting block is provided on one side of the support frame facing the bracket, and the limiting block extends to both sides of the bracket with limiting portions, which are used to abut against the side of the bracket to limit the rotation range of the bracket.
[0012] Furthermore, the mounting mechanism also includes a second mounting assembly, the second mounting assembly including a second suction head disposed on one side of the first mounting assembly, the second suction head being distributed at an angle to the first suction head; The upper end face of the second suction head is connected to a connecting air tube, and the top end of the connecting air tube is rotatably connected to a second negative pressure connector.
[0013] Furthermore, the second mounting assembly also includes a second mounting frame connected to the bracket, the second mounting frame being fixedly connected to an adjustment motor, an adjustment pulley being sleeved on the outside of the connecting air tube, and the output shaft of the adjustment motor being connected to the adjustment pulley via a belt.
[0014] Furthermore, the mounting mechanism also includes a dispensing assembly, which includes a dispensing frame disposed on the side of the support away from the second mounting frame. The dispensing frame is connected to a fixing clip, which is detachably connected to a dispensing syringe. The bottom end of the dispensing syringe is connected to a dispensing needle, which is bent and extended toward the side away from the first suction head, so that the dispensing needle and the first suction head are distributed at an angle.
[0015] Beneficial effects: This utility model provides a multi-head placement head switching device. By setting a rotation mechanism and a placement mechanism, different placement components can be switched around the rotating axis, realizing rapid collaborative operation of multi-head structures. The bracket in the placement mechanism is fixedly sleeved on the outside of the rotating shaft to ensure the structural stability of each placement component during rotation. The first placement component is fixed below the bracket by the first placement frame, which connects the first suction head and the telescopic head. The first suction head forms a contact structure with an L-shaped conductive sheet that is slidably connected on one side. One end of the conductive sheet abuts against the bottom end of the telescopic head. When the suction head is not in contact with the chip, the telescopic head and the conductive sheet remain in contact, thereby maintaining the stability of the electrical connection signal. When the first suction head abuts against the chip surface, the telescopic head is compressed due to force, and then instantly separates from the conductive sheet, and the electrical connection state changes accordingly. Thus, the chip is picked up by the suction head, realizing an instant response to the adsorption action. This ensures that the suction head only starts adsorption when in actual physical contact with the chip, fundamentally eliminating the problem of the nozzle lags or prematurely adsorbing the chip, effectively preventing chip squeezing, offset, or placement errors, and greatly improving placement accuracy and reliability. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of a multi-head mounting head switching device according to this utility model; Figure 2 This is a structural schematic diagram of the first mounting component of this utility model; Figure 3 This is a cross-sectional structural diagram of the first mounting component of this utility model; Figure 4 This is a schematic diagram of the overall structure of a multi-head mounting head switching device of this utility model from another perspective; in: 1. Rotating mechanism; 101. Rotating shaft; 102. Support frame; 103. Transmission wheel; 104. Rotating motor; 105. Limit block; 2. Mounting mechanism; 210. Support; 220. First mounting assembly; 221. First mounting frame; 222. First suction head; 223. Telescopic head; 224. Conductive sheet; 225. Connecting cylinder; 2251. Sliding cavity; 226. Elastic element; 227. Adjusting frame; 228. Micrometer; 229. Transmission element; 22a. First negative pressure connector; 22b. Flexible tube; 230. Second mounting assembly; 231. Second suction head; 232. Connecting air tube; 233. Second negative pressure connector; 234. Second mounting frame; 235. Adjusting motor; 236. Adjusting pulley; 240. Dispensing assembly; 241. Dispensing frame; 242. Fixing clamp; 243. Dispensing syringe; 244. Dispensing needle.
[0017] The purpose, features, and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0018] It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.
[0019] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0022] Reference Figures 1 to 3 This utility model proposes a multi-head placement head switching device, including a rotating mechanism 1 and a placement mechanism 2. The rotating mechanism 1 includes a rotating shaft 101, and the placement mechanism 2 includes a bracket 210, which is fixedly sleeved on the outside of the rotating shaft 101. The mounting mechanism 2 further includes a first mounting component 220, which is provided with a first mounting frame 221 connected to the bracket 210. A first suction head 222 and a telescopic head 223 are connected to the lower part of the first mounting frame 221, and the first suction head 222 passes through the bottom end of the telescopic head 223. An L-shaped conductive sheet 224 is slidably connected to the side of the bracket 210 facing the first suction head 222. One end of the conductive sheet 224 abuts against the bottom end of the telescopic head 223. When the first suction head 222 abuts against the chip, the telescopic head 223 separates from the conductive sheet 224, and the first suction head 222 picks up the chip.
[0023] In the above embodiment, a rotating mechanism 1 and a mounting mechanism 2 are included. The rotating mechanism 1 is used to switch between multiple mounting components. The rotating mechanism 1 includes a rotating shaft 101, and the mounting mechanism 2 includes a bracket 210 fixedly installed on the outside of the rotating shaft 101. The bracket 210 serves as the mounting base for each mounting component and can rotate with the rotating shaft 101, thereby driving the switching of multiple mounting components to adapt to different mounting needs and improve equipment flexibility and mounting efficiency. The mounting mechanism 2 is provided with a first mounting component 220, which is connected to the bracket 210 through a first mounting frame 221. A telescopic head 223 and a first suction head 222 are sequentially installed below the first mounting frame 221. The first suction head 222 passes through the bottom end of the telescopic head 223, allowing it to extend and perform suction operation during the mounting process. The telescopic head 223 provides buffering and a response signal during chip contact, ensuring stable contact and controllable pressure between the suction head and the chip.
[0024] Furthermore, an L-shaped conductive sheet 224 is provided on the side of the bracket 210 facing the first suction head 222. The conductive sheet 224 is slidably connected to the bracket 210 structure via a guide rail slider, with one end naturally abutting the bottom end of the telescopic head 223. When the first suction head 222 is not in contact with the chip, the telescopic head 223 is in its initial position, and the end of the conductive sheet 224 remains in contact with its bottom end, thus forming a stable electrical connection path. The system control unit can use this connection to determine whether the suction head is in a non-mounting state. When the mounting process reaches the point where the first suction head 222 contacts the chip, due to the upward reaction force on the first suction head 222, the telescopic head 223 undergoes a compressive movement, and its bottom end rises accordingly, thus momentarily disengaging from the conductive sheet 224. The electrical connection is then interrupted, and the system control unit senses this change in reaction signal to trigger a negative pressure control device, causing a negative pressure to be applied instantaneously to the first suction head 222, achieving rapid chip adsorption. This structure can automatically and accurately trigger the adsorption action based on the actual physical state of contact between the placement head and the chip without the need for external sensors or manual control. This not only improves the intelligence of placement control, but also effectively avoids problems such as chip squeezing, displacement or adsorption failure caused by control lag or premature adsorption.
[0025] refer to Figure 2 and Figure 3 In one embodiment, the first mounting assembly 220 is further provided with a connecting cylinder 225, the connecting cylinder 225 is fixedly connected to the first mounting frame 221, and the connecting cylinder 225 is provided with a sliding cavity 2251. The telescopic head 223 is slidably connected to the sliding cavity 2251. The top end of the telescopic head 223 is provided with an elastic element 226, and the end of the elastic element 226 away from the telescopic head 223 abuts against the top wall of the sliding cavity 2251.
[0026] In the above embodiment, the first mounting assembly 220 is provided with a connecting cylinder 225, which is fixedly connected to the first mounting bracket 221 to form a relatively closed guide structure to accommodate and constrain the up-and-down sliding behavior of the telescopic head 223. A sliding cavity 2251 is provided inside the connecting cylinder 225, and the telescopic head 223 is mounted in the sliding cavity 2251 in a sliding fit manner, allowing it to slide up and down relative to the connecting cylinder 225 in the vertical direction under the action of external force. To provide appropriate elastic restoring force, an elastic element 226 is provided at the top of the telescopic head 223. The elastic element 226 is preferably a coil spring, with one end fixed to the top of the telescopic head 223 and the other end abutting against the top wall of the sliding cavity 2251. With this structure, the telescopic head 223 maintains its natural elongation state when not subjected to external force, and contacts the conductive sheet 224 to form a closed circuit; when the suction head touches the chip surface, the reverse force applied by the chip causes the telescopic head 223 to compress and move downward, thereby compressing the elastic element 226 and causing its bottom to detach from the conductive sheet 224, thus breaking the circuit and triggering the adsorption action.
[0027] In one example, the first mounting bracket 221 is provided with an adjustment bracket 227 at the end away from the support 210. The adjustment bracket 227 is fixedly connected to a micrometer 228. The upper end face of the conductive sheet 224 has a transmission member 229. The transmission member 229 extends around the connecting cylinder 225 to the top of the micrometer 228, and the transmission member 229 abuts against the adjustment end of the micrometer 228 to adjust the compression of the elastic member 226.
[0028] In the above embodiment, an adjustment frame 227 is installed at the end of the first mounting rack 221 away from the support 210. A micrometer 228 is fixedly connected to the adjustment frame 227. The micrometer 228 is a high-precision displacement adjustment device, and its adjustment end is used to change the initial extension length of the telescopic head 223 and the pre-compression state of the elastic element 226. Structurally, a transmission element 229 is provided at the upper end of the conductive sheet 224. The transmission element 229 extends around the periphery of the connecting cylinder 225 and extends above the micrometer 228, maintaining a contact relationship with the adjustment end of the micrometer 228. When fine adjustment is made by rotating the micrometer 228, the compression amount of the elastic element 226 or the initial downward pre-position of the telescopic head 223 can be indirectly changed through the transmission element 229, thereby realizing the fine adjustment of the signal trigger point when the pick-up head touches the chip, as well as the adjustment of the trigger pressure. This provides a convenient adjustment mechanism, which can be customized according to the chip size, mounting depth, or different production line needs to adjust the sensitivity or action time, enhancing the equipment's ability to adapt to different mounting conditions.
[0029] In one embodiment, a first negative pressure connector 22a is rotatably connected to the upper end face of the connecting cylinder 225, and a first negative pressure air passage connected to the negative pressure connector is provided inside the connecting cylinder 225. A flexible tube 22b is connected between one side of the telescopic head 223 and the first negative pressure air passage, and the first suction head 222 communicates with the flexible tube 22b.
[0030] In the above embodiment, the connecting cylinder 225 not only guides the sliding of the telescopic head 223, but also provides a negative pressure communication function. Specifically, a first negative pressure connector 22a is rotatably connected to the upper end face of the connecting cylinder 225 for connecting to an external negative pressure source. A first negative pressure air passage, communicating with the negative pressure connector, is provided inside the connecting cylinder 225 to conduct external negative pressure into the suction head. To achieve flexible transmission of negative pressure between dynamic structures, one side of the telescopic head 223 is connected to the first negative pressure air passage via a flexible tube 22b, while the first suction head 222 and the flexible tube 22b maintain a communication relationship. This arrangement ensures that the negative pressure channel will not be interrupted or leaked due to structural movement during the up-and-down sliding of the telescopic head 223, improving the stability and continuity of the entire negative pressure system. In addition, the use of the flexible tube 22b avoids the jamming or breakage problems that may occur during the movement of rigid connections.
[0031] refer to Figure 1 In one embodiment, the rotating mechanism 1 further includes a support frame 102, the rotating shaft 101 is rotatably connected to the support frame 102 via a bearing, and a transmission wheel 103 is sleeved on the outer side of the rotating shaft 101. A rotating motor 104 is fixedly connected to the bottom end of the support frame 102, and the output shaft of the rotating motor 104 is connected to the transmission wheel 103 via a belt.
[0032] In the above embodiment, the rotating mechanism 1 is provided with a structure for supporting and driving the rotating shaft 101 to rotate, so as to realize the switching operation of multi-head placement components. Specifically, the rotating shaft 101 is rotatably connected to a support frame 102 through a bearing, so that the rotating shaft 101 maintains coaxial stability and low friction operation when rotating. A transmission wheel 103 is sleeved on the outer side of the rotating shaft 101. The transmission wheel 103 is connected to the output shaft of the rotating motor 104 fixed at the bottom of the support frame 102 through a belt. When the rotating motor 104 is started, its output shaft drives the belt, which in turn drives the transmission wheel 103 to rotate, so that the rotating shaft 101 rotates around its axis, driving the installed placement components to switch between different workstations. This can realize the efficient switching of multiple placement heads between different process sections and improve the collaborative efficiency of multi-type chip placement.
[0033] In one embodiment, the support frame 102 is provided with a limiting block 105 on one side facing the bracket 210, and the limiting block 105 extends to both sides of the bracket 210 with limiting portions, which are used to abut against the side of the bracket 210 to limit the rotation range of the bracket 210.
[0034] In the above embodiment, to limit the deflection angle of the bracket 210 during rotation and prevent the rotating shaft 101 from causing the mounting mechanism 2 to rotate excessively or erroneously, a limiting block 105 is provided on one side of the support frame 102. The limiting block 105 extends towards both sides of the bracket 210 to form limiting portions, which are used to contact the side of the bracket 210 when the rotation angle reaches a preset range, thereby physically limiting the rotation amplitude. Even in the event of sensor failure or abnormality of the electronic control system, the mounting components can still be protected from malfunction through hard contact between the structures, improving the safety and mechanical stability of the equipment operation.
[0035] refer to Figure 4 In one embodiment, the mounting mechanism 2 further includes a second mounting component 230, the second mounting component 230 including a second suction head 231 disposed on one side of the first mounting component 220, the second suction head 231 being distributed at an angle to the first suction head 222; The upper end face of the second suction head 231 is connected to a connecting air tube 232, and the top end of the connecting air tube 232 is rotatably connected to a second negative pressure connector 233.
[0036] In the above embodiment, a second mounting component 230 is provided in the mounting mechanism 2 to realize multi-head collaborative mounting operation. The second mounting component 230 includes a second suction head 231 disposed on one side of the first mounting component 220. The second suction head 231 and the first suction head 222 are distributed at an angle, preferably 35 degrees in this embodiment, so that they can correspond to different mounting areas or mounting paths of different types of chips during rotation. The upper end of the second suction head 231 is connected to a connecting air tube 232, and the top end of the connecting air tube 232 is rotatably connected to a second negative pressure connector 233, so that the second suction head 231 also has independent adsorption capacity. The second mounting component 230 allows the mounting mechanism 2 to select different suction heads to perform tasks by rotation, flexibly responding to the mounting needs of multiple varieties, small batches or irregularly shaped chips. This not only improves the compatibility and adaptability of the equipment, but also significantly shortens the process changeover time and improves the overall production efficiency.
[0037] In one embodiment, the second mounting assembly 230 further includes a second mounting frame 234 connected to the bracket 210. The second mounting frame 234 is fixedly connected to an adjustment motor 235. An adjustment pulley 236 is sleeved on the outer side of the connecting air tube 232. The output shaft of the adjustment motor 235 is connected to the adjustment pulley 236 via a belt.
[0038] In the above embodiments, to achieve precise adjustment of the mounting angle or height of the second suction head 231, the second mounting assembly 230 further includes a second mounting frame 234 connected to the bracket 210, on which an adjustment motor 235 is fixedly connected. The output shaft of the adjustment motor 235 is connected to an adjustment pulley 236 sleeved on the outside of the connecting air tube 232 via a belt. The adjustment motor 235 drives the pulley to rotate, thereby causing the connecting air tube 232 to drive the second suction head 231 to rotate around its axis, thereby adjusting the orientation angle of the picked-up chip. Through the second mounting assembly 230, the spatial position of the second suction head 231 can be adjusted in real time according to different mounting requirements, which not only improves the flexibility of the mounting action, but also enables automated adjustment through program control, making it suitable for complex mounting paths or high-precision mounting processes that require dynamic height compensation.
[0039] In one embodiment, the mounting mechanism 2 further includes a dispensing assembly 240, which includes a dispensing frame 241 disposed on the side of the support 210 away from the second mounting frame 234. The dispensing frame 241 is connected to a fixing clip 242, which is detachably connected to a dispensing syringe 243. The bottom end of the dispensing syringe 243 is connected to a dispensing needle, which bends and extends toward the side away from the first suction head 222 to form an angle between the dispensing needle and the first suction head 222.
[0040] In the above embodiment, the mounting mechanism 2 further includes a dispensing assembly 240 for pre-applying adhesive or conductive glue before mounting. The dispensing assembly 240 includes a dispensing frame 241 fixed to the side of the bracket 210 opposite to the second mounting frame 234. The dispensing frame 241 is equipped with a fixing clip 242, which detachably mounts a dispensing syringe 243, facilitating the replacement of dispensing media of different specifications or materials. A dispensing needle is connected to the bottom end of the dispensing syringe 243, and the needle bends and extends in a direction opposite to the first suction head 222, forming an angle with the first suction head 222. Through the dispensing assembly 240, the dispensing operation can be performed in conjunction with the chip mounting action, eliminating the need for a separate dispensing mechanism, improving equipment integration and process continuity, and enabling integrated operation of the mounting process.
[0041] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural or procedural transformations made based on the content of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.
Claims
1. A multi-head placement head switching device, characterized in that, It includes a rotating mechanism (1) and a mounting mechanism (2). The rotating mechanism (1) includes a rotating shaft (101), and the mounting mechanism (2) includes a bracket (210). The bracket (210) is fixedly sleeved on the outside of the rotating shaft (101). The mounting mechanism (2) further includes a first mounting assembly (220), which is provided with a first mounting frame (221) connected to the bracket (210). A first suction head (222) and a telescopic head (223) are connected below the first mounting frame (221), and the first suction head (222) passes through the bottom end of the telescopic head (223). The bracket (210) has an L-shaped conductive sheet (224) slidably connected to the side facing the first suction head (222). One end of the conductive sheet (224) abuts against the bottom end of the telescopic head (223). When the first suction head (222) abuts against the chip, the telescopic head (223) separates from the conductive sheet (224), and the first suction head (222) picks up the chip.
2. The multi-head placement head switching device according to claim 1, characterized in that, The first mounting assembly (220) is also provided with a connecting cylinder (225), which is fixedly connected to the first mounting frame (221), and the connecting cylinder (225) is provided with a sliding cavity (2251). The telescopic head (223) is slidably connected to the sliding cavity (2251). The top end of the telescopic head (223) is provided with an elastic element (226), and the end of the elastic element (226) away from the telescopic head (223) abuts against the top wall of the sliding cavity (2251).
3. A multi-head placement head switching device according to claim 2, characterized in that, An adjustment frame (227) is provided at one end of the first mounting frame (221) away from the bracket (210). The adjustment frame (227) is fixedly connected to a micrometer (228). A transmission member (229) is located on the upper end face of the conductive sheet (224). The transmission member (229) extends around the connecting cylinder (225) to the top of the micrometer (228), and the transmission member (229) abuts against the adjustment end of the micrometer (228) to adjust the compression of the elastic member (226).
4. A multi-head placement head switching device according to claim 2, characterized in that, The upper end face of the connecting cylinder (225) is rotatably connected to a first negative pressure connector (22a), and a first negative pressure air passage connected to the negative pressure connector is provided inside the connecting cylinder (225). A flexible tube (22b) is connected between one side of the telescopic head (223) and the first negative pressure air passage, and the first suction head (222) is connected to the flexible tube (22b).
5. A multi-head placement head switching device according to claim 1, characterized in that, The rotating mechanism (1) further includes a support frame (102), the rotating shaft (101) is rotatably connected to the support frame (102) through a bearing, and a transmission wheel (103) is sleeved on the outer side of the rotating shaft (101). A rotating motor (104) is fixedly connected to the bottom end of the support frame (102), and the output shaft of the rotating motor (104) is connected to the transmission wheel (103) through a belt.
6. A multi-head placement head switching device according to claim 5, characterized in that, The support frame (102) is provided with a limiting block (105) on one side facing the bracket (210). The limiting block (105) extends to both sides of the bracket (210) with limiting portions. The limiting portions are used to abut against the side of the bracket (210) to limit the rotation range of the bracket (210).
7. A multi-head placement head switching device according to claim 1, characterized in that, The mounting mechanism (2) further includes a second mounting assembly (230), the second mounting assembly (230) including a second suction head (231) disposed on one side of the first mounting assembly (220), the second suction head (231) and the first suction head (222) being distributed at an angle; The upper end face of the second suction head (231) is connected to a connecting air tube (232), and the top end of the connecting air tube (232) is rotatably connected to a second negative pressure connector (233).
8. A multi-head placement head switching device according to claim 7, characterized in that, The second mounting assembly (230) also includes a second mounting frame (234) connected to the bracket (210). The second mounting frame (234) is fixedly connected to an adjustment motor (235). An adjustment pulley (236) is sleeved on the outside of the connecting air tube (232). The output shaft of the adjustment motor (235) is connected to the adjustment pulley (236) via a belt.
9. A multi-head placement head switching device according to claim 8, characterized in that, The mounting mechanism (2) further includes a dispensing assembly (240), which includes a dispensing frame (241). The dispensing frame (241) is disposed on the side of the bracket (210) away from the second mounting frame (234). The dispensing frame (241) is connected to a fixing clip (242). The fixing clip (242) is detachably connected to a dispensing syringe (243). The bottom end of the dispensing syringe (243) is connected to a dispensing needle (244). The dispensing needle (244) bends and extends toward the side away from the first suction head (222) to form an angle between the dispensing needle (244) and the first suction head (222).