High utilization LED light source packaging structure

Abstract

The utility model discloses a high utilization rate LED light source packaging structure, including the packaging support, and the convex that is located packaging support surface four all around upward extension and has two mesa, the convex includes first mesa and second mesa, and the surface of second mesa is provided with the packaging lens above, the filling layer is formed to the object plane between the bottom surface of packaging lens and packaging support, a plurality of of the center of filling layer is provided with the LED chip that is in a character even arrangement. Make the light of LED chip through the light of packaging lens dispersion finally concentrate for strip light spot, and do not carry out light segmentation, improve the light utilization of UV light source, reduce the air residue in filling layer, and need not control the dosage of filling.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging structure technology, specifically to a high-utilization LED light source packaging structure. Background Technology

[0002] Currently, conventional ultraviolet LED (UV LED) light sources are packaged between LED chips and encapsulating lenses. The LED chips are arranged in a rectangular structure, which leads to light spot segmentation during the curing process, affecting light intensity concentration and reducing the utilization rate of the light source during curing. Simultaneously, a gap exists between the LED chip and the encapsulating lens, which is filled with a material to improve the overall light extraction efficiency. However, controlling the amount of filler material is difficult, leading to filler material overflow and difficulty in escaping some gas within the filler layer, resulting in air bubbles and affecting the overall light extraction efficiency.

[0003] Therefore, this application is submitted. Utility Model Content

[0004] The purpose of this invention is to provide a high-utilization LED light source packaging structure. By setting LED chips arranged in a uniform line, a packaging lens with vertical and curved sections, and an overflow groove located on the inner sidewall of the first platform, the invention solves the problems of light segmentation, air bubbles in the filling layer, and difficulty in controlling the amount of filling material in the prior art.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following solution: A high-utilization LED light source packaging structure includes a packaging bracket and a protrusion extending upward around the perimeter of the packaging bracket and having two platforms. The protrusion includes a first platform and a second platform. A packaging lens is disposed above the surface of the second platform. A filling layer is formed between the bottom surface of the packaging lens and the carrier surface of the packaging bracket. A plurality of LED chips are disposed at the center of the filling layer in a uniformly arranged line. The packaging lens includes a vertical segment at the bottom and a curved segment at the top. The surface of the curved segment has a continuous curve.

[0006] Furthermore, there is a gap of 0.2mm to 0.4mm between adjacent LED chips.

[0007] Furthermore, the included angle formed by the two ends of the first arc segment is greater than the included angle formed by the two ends of the second arc segment.

[0008] Furthermore, the bottom surface of the vertical segment, the second platform, and the upper surface of the filling layer are located on the same medium connection surface, and the curved segment has multiple vertices that are coaxial with several LED chips.

[0009] Furthermore, the vertical section is higher than the first platform and there is a gap between the side of the vertical section and the inner wall of the first platform.

[0010] Furthermore, the inner sidewall of the first platform is provided with an overflow groove for filling the excess filler material that overflows from the second platform, and the overflow groove surrounds the encapsulated lens.

[0011] Furthermore, the overflow trough is higher than the medium connection surface.

[0012] Furthermore, the longitudinal section of the overflow trough is square or rectangular.

[0013] Furthermore, the width of the first tabletop is smaller than the width of the second tabletop.

[0014] Furthermore, the bottom surface of the packaging bracket is provided with multiple downwardly protruding pads.

[0015] The beneficial effects of this utility model are: This invention features a filling layer with several LED chips arranged in a uniform line. Above the filling layer, there is an encapsulation lens with a vertical bottom section and a curved top section. The surface of the curved section has a continuous curve. Light travels directly from the LED chip surface through the vertical section to the interior of the curved section for transmission. When it reaches the surface composed of the continuous curve, it is refracted outward and then passes through a secondary light distribution lens to reach the working area. Finally, the light is concentrated into a strip-shaped light spot without light splitting, thus improving the light utilization rate of the ultraviolet light source.

[0016] This invention features an overflow trough, into which excess filler material is fed. During the flow, the air within the filler layer moves first, thereby reducing residual air within the filler layer and eliminating the need to control the amount of filler used. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a side view of the structure of this utility model; Figure 3 This is a cross-sectional structural diagram of the present invention; Figure 4 This is a top-section structural diagram of the present invention; Figure 5 This is a partially enlarged structural diagram of the overflow groove after encapsulation of this utility model; Figure 6 Simulated light spot pattern after light distribution of conventional rectangular array chips; Figure 7 This is a simulated light spot diagram of the chip after light distribution according to this utility model; Figure 8For the light transmission / refraction path of this utility model, A adopts a non-circular encapsulated lens, and B adopts a circular encapsulated lens.

[0018] Reference numerals: 1-Packaging bracket, 2-Protrusion, 20-First platform, 21-Second platform, 3-Packaging lens, 30-Vertical segment, 31-Curved segment, 4-LED chip, 5-Fill layer, 50-Fill material, 6-Overflow groove, 7-Pad. Detailed Implementation

[0019] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of the present invention is not limited thereto.

[0020] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "have," "install," "connect," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] Example 1 Embodiment 1 of this utility model is a high-utilization LED light source packaging structure, including a packaging bracket 1 and a protrusion 2 extending upward around the surface of the packaging bracket 1 and having two platforms. The protrusion 2 includes a first platform 20 and a second platform 21. A packaging lens 3 is disposed above the surface of the second platform 21. A filling layer 5 is formed between the bottom surface of the packaging lens 3 and the loading surface of the packaging bracket 1. A plurality of LED chips 4 are disposed at the center of the filling layer 5 in a uniform line arrangement. The packaging lens 3 includes a vertical segment 30 at the bottom and a curved segment 31 at the top. The surface of the curved segment 31 has a continuous curve.

[0023] Reference Figures 1 to 4This invention involves placing a plurality of LED chips 4 arranged in a uniform line inside the filling layer 5 formed above the substrate surface of the encapsulation bracket 1. When the LED chips 4 are powered on and emit light, the light is transmitted directly from the surface of the LED chip 4 to the interior of the encapsulation lens 3 (which is a non-circular structure). After continuous curvature refraction on its surface, the light passes through a secondary light distribution lens to reach the predetermined working area, ultimately concentrating the light into a strip-shaped light spot. (Refer to...) Figure 7 and Figure 8 A. Improves the light utilization rate of the light source during subsequent curing; however, the rectangular arrangement of the unconventional LED chips results in light spot segmentation, affecting light concentration. (Refer to...) Figure 6 This reduces the light utilization rate of the light source. Figure 5 The use of a semi-circular encapsulated lens allows light to be transmitted directly outwards without refraction, resulting in light dispersion.

[0024] In some preferred embodiments, adjacent LED chips 4 are spaced 0.2mm to 0.4mm apart. This spacing allows for more uniform light emission after the LED chips 4 are powered on.

[0025] Within this interval range, an appropriate interval value can be selected according to the actual length of the packaging bracket 1; and the center line of each LED chip 4 coincides with the center line of the filling layer 5 to ensure the position of the LED chip 4 inside the filling layer 5 and to ensure the concentration effect of the light.

[0026] In some preferred embodiments, the bottom surface of the vertical segment 30, the second platform 21, and the upper surface of the filling layer 5 are located on the same medium connection surface, and the curved segment 31 has multiple vertices that are coaxial with several LED chips 4 respectively.

[0027] In addition, the overall length of the encapsulation lens 3 is greater than the total length of several LED chips 4 arranged in a line, so that the LED chips 4 are completely located at the bottom of the encapsulation lens 3, which provides the conditions for the final formation of a concentrated strip of light spot, improves the utilization rate of UV light source during curing, and improves curing efficiency.

[0028] The medium connection surface here refers to the medium connection surface formed between the bottom surface of the vertical section and the second platform surface, and between the bottom surface of the vertical section and the filling layer after the filler is filled.

[0029] Meanwhile, the cross-section of the vertical segment 30 is rectangular, and the length of the curved segment 31 is consistent with the length of the vertical segment 30. That is, the curved segment 31 has multiple vertices, and among its multiple vertices there are multiple points coaxial with several LED chips 4. When any LED chip 4 emits light, the light will be transmitted through the inside of the encapsulation lens 3, and then refracted outward through the surface composed of its continuous curves. After passing through the secondary light distribution lens, it reaches the designated working area and forms a strip-shaped light spot with concentrated light.

[0030] The curvature of the continuous curve of the curved surface segment 31 here is designed using the imaging optical design software Zemax through optical function equations, based on the size and position of different LED chips 4. This is existing technology and will not be elaborated here.

[0031] Example 2 This embodiment 2 is implemented based on embodiment 1. The vertical section 30 is higher than the first tabletop 20, and there is a gap between the side of the vertical section 30 and the inner wall of the first tabletop 20. The vertical section 30 is higher than the first tabletop 20, which can prevent the filler 50 in the gap from contacting the surface of the curved section 31, thus preventing the light source from scattering and affecting the surface.

[0032] Furthermore, the inner wall of the first platform 20 is provided with an overflow groove 6 for filling the excess filler 50 that overflows from the second platform 21 through the filler layer 5, and the overflow groove 6 surrounds the encapsulated lens 3. During the assembly of the encapsulated lens 3, the bottom surface of the vertical section 30 of the encapsulated lens 3 will contact the second platform 21. The excess filler 50 first flows into the overflow groove 6 through the gap between the second platform 21 and the bottom surface of the vertical section 30 to the gap between the inner wall of the first platform 20 and the vertical section 30 (this gap is lower than the overflow groove 6). At this time, the excess filler 50 enters the circular overflow groove 6. After the overflow groove 6 is filled with filler 50, the excess filler 50 in the gap between the second platform 21 and the bottom surface of the vertical section 30, the excess filler 50 in the gap below the overflow groove 6, and the excess filler 50 in the overflow groove 6 are combined into one. Meanwhile, adhesive or sealant is filled into the gap above the overflow groove 6 to further fix the encapsulation lens 3 to the encapsulation bracket 1, thereby improving the fixation and sealing performance.

[0033] In some preferred embodiments, the overflow groove 6 is higher than the medium connection surface. When the encapsulated lens 3 is installed, the encapsulated lens 3 squeezes the filler 50 inside the filling layer 5 outward. During this process, air will flow outward from the gap between the filling layer 5 and the encapsulated lens 3. The overflow groove 6 is higher than the bonding surface between the encapsulated lens 3 and the filling layer 5 so that the filler 50 flowing into the overflow groove 6 can be refluxed by gravity and undergo a secondary displacement in the filling layer 5.

[0034] In some preferred embodiments, the longitudinal section of the overflow groove 6 is square or rectangular. A rectangular shape allows for better filling of excess filler 50 in the gap between the second platform 21 and the bottom surface of the vertical section 30, and in the gap below the overflow groove 6. Simultaneously, during the curing of the filler 50, it forms a convex solid at the overflow groove 6, which helps to fix the encapsulated lens 3. (Refer to...) Figure 5 The specific specifications of the overflow trough 6 can be set according to the actual packaging requirements, and will not be elaborated here.

[0035] In some preferred embodiments, the width of the first platform 20 is smaller than the width of the second platform 21. The second platform 21 is mainly used to support the bottom surface of the vertical section 30 of the encapsulated lens 3, providing a load-bearing function for the bottom surface of the vertical section 30, thereby ensuring the secure installation of the encapsulated lens 3 above the second platform 21.

[0036] In addition, the bottom surface of the packaging bracket 1 is provided with multiple downward-protruding pads 7. The pads 7 are mainly used for connection with the substrate, so as to conduct the cathode or anode of the LED chip 4 to the substrate circuit and thus emit light.

[0037] The working principle of this utility model is as follows: First, several encapsulation lenses 3 are selected according to the length of the encapsulation lens 3 and the filling layer 5, and LED chips 4 are arranged in a uniform line at the center of the filling layer 5. Then, according to the specific selection of the chip, an encapsulation lens 3 that matches the curved section 31 is selected. Due to the curved section 31 at the top and the vertical section 30 at the bottom, light directly passes from the surface of the LED chip 4 through the vertical section 30 to the inside of the curved section 31, and is then refracted outward through the surface formed by its continuous curves. After passing through the secondary light distribution lens, it reaches the designated working area, so that the light is concentrated into a strip-shaped light spot without light splitting, thereby improving the light utilization rate of the UV light source. The filler 50 is filled to a position slightly higher than the filling layer 5, and the encapsulation lens 3 is pressed downward. The excess filler 50 will flow into the gap between the second platform 21 and the bottom surface of the vertical section 30 of the encapsulation lens 3, and then flow into the gap below the overflow trough 6 and the interior of the overflow trough 6. During this process, since the air mass is less than that of the filler 50, the priority of air outflow is greater than that of the filler 50. Therefore, the air in the filler layer 5 will flow into the overflow trough 6 first. Then, the excess filler 50 mixed with air will flow into the gap below the overflow trough 6 through the gradually narrowing gap between the second platform 21 and the bottom surface of the vertical section 30, and continue to press down on the encapsulated lens 3 until it is completely attached to the filler layer 5. The excess filler 50 will flow into the overflow trough 6 through the gap below the overflow trough 6, reducing the amount of air remaining in the filler layer 5. There is no need to control the amount of filler 50 used.

[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any simple modifications, equivalent substitutions, and improvements made to the above embodiments based on the technical essence of the present utility model and within the spirit and principles of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. A high-utilization LED light source packaging structure, characterized in that, The package includes a packaging bracket (1) and a protrusion (2) extending upward around the surface of the packaging bracket (1) and having two platforms. The protrusion (2) includes a first platform (20) and a second platform (21). A packaging lens (3) is disposed above the surface of the second platform (21). A filling layer (5) is formed between the bottom surface of the packaging lens (3) and the loading surface of the packaging bracket (1). Several LED chips (4) are disposed at the center of the filling layer (5) in a uniform line arrangement. The packaging lens (3) includes a vertical section (30) at the bottom and a curved section (31) at the top. The surface of the curved section (31) has a continuous curve.

2. The high-utilization LED light source packaging structure according to claim 1, characterized in that, There is a gap of 0.2mm to 0.4mm between adjacent LED chips (4).

3. The high-utilization LED light source packaging structure according to claim 2, characterized in that, The angle formed by the two ends of the first arc segment is greater than the angle formed by the two ends of the second arc segment.

4. The high-utilization LED light source packaging structure according to claim 2, characterized in that, The bottom surface of the vertical segment (30), the second platform (21) and the upper surface of the filling layer (5) are located on the same medium connection surface, and the curved segment (31) has multiple vertices that are coaxial with several LED chips (4).

5. The high-utilization LED light source packaging structure according to claim 4, characterized in that, The vertical section (30) is higher than the first platform (20) and there is a gap between the side of the vertical section (30) and the inner wall of the first platform (20).

6. The high-utilization LED light source packaging structure according to claim 4, characterized in that, The inner sidewall of the first platform (20) is provided with an overflow groove (6) for filling the filler layer (5) to overflow the excess filler (50) through the second platform (21), and the overflow groove (6) surrounds the encapsulation lens (3).

7. The high-utilization LED light source packaging structure according to claim 6, characterized in that, The overflow trough (6) is higher than the medium connection surface.

8. The high-utilization LED light source packaging structure according to claim 6, characterized in that, The longitudinal section of the overflow trough (6) is square or rectangular.

9. The high-utilization LED light source packaging structure according to claim 6, characterized in that, The width of the first tabletop (20) is smaller than the width of the second tabletop (21).

10. A high-utilization LED light source packaging structure according to claim 6, characterized in that, The bottom surface of the packaging bracket (1) is provided with multiple downward protruding pads (7).

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