LED lamp bead with composite plate type integrated support

Abstract

The utility model discloses a kind of LED lamp beads with composite board type integrated support, to provide a kind of LED lamp beads with composite board type integrated support with good heat dissipation effect, long service life, its technical solution main point is including by at least two layers of substrate fixed connection constitutes integrated structure's lamp bead support and light emitting element, the installation cavity formed by the hollow groove in the upper layer substrate, lower layer substrate surface is equipped with with the etching line corresponding with installation cavity, the light emitting element is set in installation cavity and is connected to etching line, the micro heat dissipation air duct is equipped in the lamp bead support, the micro heat dissipation air duct includes the air inlet channel being set in the installation cavity heating area bottom, the exhaust passage being set in the hollow interlayer between upper layer substrate and lower layer substrate and the thermoelectric drive element embedded in lower layer substrate. The utility model is applicable to LED lamp bead technical field.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, and more specifically, it relates to an LED lamp bead with a composite plate integrated bracket. Background Technology

[0002] Existing technologies include various types of LED beads. For example, Chinese utility model patent application number CN202321007067.9 discloses an LED bead with a composite plate integrated bracket, comprising a bead bracket, pads, and a light-emitting element. The bead bracket is an integrated composite plate structure formed by fixing and assembling at least two substrates through a composite process. The upper substrate has a mounting cavity formed by hollow grooves, and the upper surface of the lower substrate has etched lines corresponding to the mounting cavity. The light-emitting element is disposed in the mounting cavity and electrically connected to the etched lines. The pads are disposed on the top, bottom, and / or side surfaces of the bead bracket. Connection vias are provided through the upper and lower substrates except for the mounting cavity, and the pins of the etched lines are connected to the pads through the connection vias. The mounting cavity is encapsulated and filled with a potting compound layer. Its production process is simplified, which can support the diverse combination requirements of light-emitting elements and control elements. The electrode positions can be flexibly set to meet the die bonding position requirements of various light-emitting chips. The multi-layer composite board, combined with the connecting vias that run through the top and bottom to connect the bottom planar pads, can also be used as a three-dimensional pad. The electrode welding contact is more firm, not easy to fall off, and the conductivity is stable and reliable.

[0003] The existing technical solutions mentioned above have the following drawbacks: integrating the driver chip into the same mounting cavity as the light-emitting chip not only causes interference problems, but also leads to difficulties in heat dissipation and maintenance, and may also cause the chip junction temperature to be too high, reducing luminous efficiency, shortening lifespan, accelerating light decay, or even causing failure. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide an LED lamp bead with a composite plate integrated bracket that has good heat dissipation and long service life.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an LED bead with a composite plate integrated bracket, comprising a bead bracket and a light-emitting element, wherein the upper substrate has a mounting cavity formed by a hollow groove, and the surface of the lower substrate has etched lines corresponding to the mounting cavity. The light-emitting element is disposed in the mounting cavity and connected to the etched lines. The bead bracket has a micro heat dissipation channel, which includes an air inlet channel disposed at the bottom of the heating area of ​​the mounting cavity, an exhaust channel disposed in the hollow interlayer between the upper and lower substrates, and a thermoelectric driving element embedded in the lower substrate.

[0006] The present invention is further configured such that: the air inlet channel includes a honeycomb-shaped through-hole array penetrating the lower substrate, the diameter of the honeycomb-shaped through-hole array is 0.3-0.5mm, and the hole spacing is not greater than twice the hole diameter.

[0007] The present invention is further configured such that: the exhaust channel includes a spiral groove formed by laser engraving, the groove width of the exhaust channel is 0.2mm, and the depth is 1 / 3 of the substrate thickness.

[0008] The present invention is further configured such that: the cold end of the thermoelectric driving element is connected to the etched line, and its hot end extends to the inlet of the exhaust channel, driving the airflow to circulate along the path from the air inlet channel to the mounting cavity to the exhaust channel.

[0009] The present invention is further configured such that: the surface of the lower substrate is provided with a micron-level fin structure, the arrangement direction of which forms a 15° angle with the airflow direction of the exhaust channel.

[0010] The present invention is further configured to include a driver chip, which is disposed in the edge region of the mounting cavity and connected to the auxiliary heat dissipation pad at the bottom of the lower substrate through an independent group of heat-perforated holes.

[0011] The present invention is further configured such that: a grounding shielding wire is provided between the driving chip and the light-emitting element, and the shielding wire also serves as a thermal isolation groove.

[0012] The beneficial effects of this utility model are:

[0013] 1. The LED bead support, consisting of at least two substrates fixedly connected to form an integrated structure, enhances the overall mechanical strength and stability of the LED bead. The lower substrate surface has etched lines corresponding to the mounting cavity, achieving high circuit integration, reducing the complexity of external wiring, and lowering the risk of circuit failure. The upper substrate has a mounting cavity formed by a hollowed-out groove, providing a precise mounting position for the light-emitting element. A miniature heat dissipation channel is incorporated within the LED bead support, with the air inlet channel located at the bottom of the heating area of ​​the mounting cavity. This channel directly absorbs heat from the heat source, quickly removing heat generated by the light-emitting element and preventing heat accumulation inside the LED bead, effectively reducing its operating temperature and improving the LED bead's heat dissipation efficiency. A thermoelectric drive element embedded in the lower substrate actively drives airflow, enhancing heat dissipation. The exhaust channel in the hollow interlayer between the upper and lower substrates provides a smooth path for heat removal.

[0014] 2. The honeycomb through-hole array provides a uniformly distributed air intake path, ensuring stable and even airflow through the underlying substrate, avoiding localized ventilation problems and improving overall ventilation efficiency. The 0.3-0.5mm hole diameter ensures sufficient airflow while effectively filtering some larger particles; the hole spacing is no more than twice the hole diameter, ensuring through-hole density to avoid insufficient ventilation area due to excessive spacing, and also ensuring the stability of the substrate structure to prevent affecting substrate strength due to overly dense through-holes. The thermoelectric drive element, connected to the etched circuitry at its cold end and extending to the exhaust channel inlet, utilizes the thermoelectric effect to create a temperature gradient, precisely driving airflow to circulate along a preset path (intake channel → mounting cavity → exhaust channel), eliminating the need for additional mechanical drive components and simplifying the system structure.

[0015] 3. The spiral grooves directionally guide the exhaust airflow, ensuring orderly flow along a spiral path, reducing turbulence and backflow, improving exhaust efficiency, and ensuring rapid removal of gas or heat from the mounting cavity. The groove width is 0.2mm, offering high dimensional accuracy and precise control of the exhaust volume, adapting to the overall airflow circulation balance of the system; while the depth is 1 / 3 of the substrate thickness, ensuring sufficient exhaust channel capacity while avoiding excessive weakening of the substrate structure. Micron-level fins significantly increase the surface area of ​​the lower substrate, providing more contact points for heat exchange; the 15° angled arrangement creates moderate disturbance as the airflow passes over the fins, breaking down boundary layer thermal resistance, promoting heat transfer between the fins and the airflow, and significantly improving heat dissipation or heat exchange efficiency.

[0016] 4. As a heat-generating component, the driver chip is directly connected to the auxiliary heat dissipation pads on the bottom of the lower substrate via an independent group of thermal vias. This creates a dedicated and efficient heat dissipation path, quickly dissipating the heat generated during chip operation and preventing heat accumulation within the mounting cavity, ensuring stable chip operation at a suitable temperature. The grounding shield effectively blocks electromagnetic signals generated by the driver chip from interfering with the light-emitting element, preventing brightness fluctuations, flickering, or performance instability caused by electromagnetic interference, thus ensuring stable light emission. As a thermal isolation groove, it reduces the direct conduction of heat generated by the driver chip to the light-emitting element through the substrate, preventing issues such as luminous efficiency decay and shortened lifespan due to increased ambient temperature, making it particularly suitable for temperature-sensitive precision light-emitting devices. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a three-dimensional structural diagram of the present invention from another perspective;

[0019] Figure 3 This is a cross-sectional view of the present invention;

[0020] Figure 4 This is a structural diagram of a hollow sandwich structure;

[0021] Figure 1-4 Reference numerals: 1. Lamp bead bracket; 2. Lower substrate; 3. Upper substrate; 4. Through-hole array; 5. Thermoelectric driving element; 6. Groove; 7. Mounting cavity; 8. Driver chip; 9. Heat dissipation pad; 10. Thermal isolation groove; 11. Light-emitting element; 12. Hollow interlayer. Detailed Implementation

[0022] Reference Figures 1 to 4 The embodiments of this utility model will be further described below.

[0023] For ease of explanation, spatial relative terms such as “up,” “down,” “left,” and “right” are used in the embodiments to describe the relationship of one element or feature shown in the figures relative to another element or feature. It should be understood that, in addition to the orientations shown in the figures, spatial terms are intended to include different orientations of the device in use or operation. For example, if the device in the figures is inverted, an element described as being “down” of other elements or features would be positioned “up” of those other elements or features. Therefore, the exemplary term “down” can encompass both up and down orientations. The device may be positioned in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0024] Moreover, relational terms such as “first” and “second” are used merely to distinguish one component from another that has the same name, without necessarily requiring or implying any such actual relationship or order between the components.

[0025] Figures 1 to 4The LED bead shown has a composite plate integrated bracket, comprising a bead bracket 1 consisting of at least two substrates fixedly connected to form an integrated structure, and a light-emitting element 11. This enhances the overall mechanical strength and stability of the bead. The upper substrate 3 has a mounting cavity 7 formed by a hollowed-out groove, providing a precise mounting position for the light-emitting element 11 and ensuring its positional accuracy, thereby optimizing the emission angle and light distribution uniformity. The lower substrate 2 has etched lines on its surface corresponding to the mounting cavity 7, achieving a high degree of circuit integration, reducing the complexity of external wiring, and lowering the risk of circuit failure. The light-emitting element 11 is disposed in the mounting cavity 7 and connected to the etched lines. The bead bracket 1 has a miniature heat dissipation channel, with the air inlet channel located at the bottom of the heat-generating area of ​​the mounting cavity 7, which can directly absorb heat from the heat source. The miniature heat dissipation duct includes an air inlet channel located at the bottom of the heating area of ​​the mounting cavity 7, an exhaust channel located in the hollow interlayer 12 between the upper substrate 3 and the lower substrate 2, and a thermoelectric drive element 5 embedded in the lower substrate 2. The exhaust channel in the hollow interlayer 12 between the upper substrate 3 and the lower substrate 2 provides a smooth path for heat dissipation. It works in conjunction with the air inlet channel and the thermoelectric drive element 5 to form a complete heat dissipation circulation system.

[0026] The air inlet channel includes a honeycomb-shaped through-hole array 4 that penetrates the lower substrate 2, which can ensure that the airflow passes through the lower substrate 2 stably and evenly, avoid the problem of poor local ventilation, improve the overall ventilation efficiency, and the honeycomb structure itself has high mechanical strength. Even with a large number of through-holes, it can still maintain the overall structural stability of the lower substrate 2, withstand a certain amount of external pressure or vibration, and extend its service life.

[0027] When the diameter of the holes in the honeycomb through-hole array 4 is less than 0.3 mm, the small hole diameter will obstruct airflow, resulting in insufficient air intake, disrupting the balance of air intake and exhaust circulation, and affecting heat dissipation or gas exchange efficiency. Moreover, the small hole diameter is easily blocked by dust, water vapor, etc., which will lead to a continuous decrease in air intake capacity after long-term use, requiring frequent cleaning and maintenance. When the diameter of the holes in the honeycomb through-hole array 4 is greater than 0.5 mm, it cannot effectively block small particulate impurities, which may cause dust and foreign objects to enter the mounting cavity 7, affecting the working stability or lifespan of internal components (such as light-emitting elements 11 and driving chips 8). Therefore, the optimal hole diameter for the honeycomb through-hole array 4 is 0.3-0.5 mm, and the hole spacing is no more than twice the hole diameter. This ensures the through-hole density, avoids insufficient ventilation area due to excessive spacing, and also ensures the stability of the substrate structure, preventing the substrate strength from being affected by excessively dense through-holes.

[0028] The exhaust channel includes a spiral groove 6 formed by laser engraving, which can directionally guide the exhaust airflow, allowing it to flow orderly along the spiral path, reducing turbulence and backflow, improving exhaust efficiency, and ensuring the rapid discharge of gas or heat from the mounting cavity 7. The groove 6 of the exhaust channel is 0.2mm wide, which can effectively avoid airflow turbulence caused by excessive gaps and ensure the accuracy of the exhaust process; at the same time, it combines structural stability and exhaust efficiency, allowing the exhaust channel to adapt to various working environments, improving the applicability and practicality of the equipment. The depth is 1 / 3 of the substrate thickness, which is neither too shallow to meet the space required for exhaust, ensuring sufficient exhaust volume, nor too deep to excessively weaken the structural strength of the substrate. This allows the substrate to maintain its own stable structure while well supporting the function of the exhaust channel, greatly enhancing the overall structural stability and durability of the equipment.

[0029] The cold end of the thermoelectric drive element 5 is connected to the etched circuit, and its hot end extends to the inlet of the exhaust channel. It utilizes the thermoelectric effect to create a temperature gradient, precisely driving the airflow to circulate along a preset path (inlet channel → mounting cavity 7 → exhaust channel). This eliminates the need for additional mechanical drive components, simplifying the system structure. It not only prevents component performance degradation due to localized overheating but also prevents the accumulation of harmful gases or impurities in the mounting cavity 7 through continuous gas renewal, thereby significantly improving the overall performance and reliability of the device.

[0030] The surface of the lower substrate 2 is provided with a micron-sized fin structure, and its arrangement direction is at a 15° angle with the airflow direction of the exhaust channel. The micron-sized fins greatly increase the surface area of ​​the lower substrate 2, providing more contact points for heat exchange. The 15° angle arrangement causes the airflow to form a moderate disturbance when it passes over the fins, breaking the boundary layer thermal resistance, promoting heat transfer between the fins and the airflow, and significantly improving heat dissipation or heat exchange efficiency.

[0031] It also includes a driver chip 8, which is located in the edge area of ​​the mounting cavity 7. As a heat-generating component, the driver chip 8 is directly connected to the auxiliary heat dissipation pad 9 at the bottom of the lower substrate 2 through an independent heat-through hole group, thus constructing a dedicated and efficient heat dissipation path. This can quickly dissipate the heat generated when the chip is working, prevent heat from accumulating in the mounting cavity 7, and ensure that the chip operates stably at a suitable temperature.

[0032] A grounding shield is provided between the driving chip 8 and the light-emitting element 11, which can effectively block the electromagnetic signals generated by the driving chip 8 during operation from interfering with the light-emitting element 11, avoiding problems such as brightness fluctuations, flickering, or performance instability of the light-emitting element 11 due to electromagnetic interference, and ensuring the stability of the light-emitting effect. As a thermal isolation groove 10, it can reduce the heat generated by the driving chip 8 from being directly conducted to the light-emitting element 11 through the substrate, avoiding problems such as light efficiency decay and shortened lifespan of the light-emitting element 11 due to increased ambient temperature, which is especially suitable for temperature-sensitive precision light-emitting devices. The above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Ordinary changes and substitutions made by those skilled in the art within the scope of the technical solution of this utility model should be included within the protection scope of this utility model.

Claims

1. An LED bead with a composite plate integrated bracket, comprising a bead bracket (1) consisting of at least two substrates fixedly connected to form an integrated structure and a light-emitting element (11), wherein the upper substrate (3) has a mounting cavity (7) formed by a hollow groove, and the surface of the lower substrate (2) has etched lines corresponding to the mounting cavity (7), wherein the light-emitting element (11) is disposed in the mounting cavity (7) and connected to the etched lines, characterized in that, The lamp bead bracket (1) is provided with a miniature heat dissipation channel, which includes an air inlet channel located at the bottom of the heating area of ​​the mounting cavity (7), an exhaust channel located in the hollow interlayer (12) between the upper substrate (3) and the lower substrate (2), and a thermoelectric drive element (5) embedded in the lower substrate (2).

2. The LED lamp bead with a composite plate integrated bracket according to claim 1, characterized in that, The air inlet channel includes a honeycomb through-hole array (4) penetrating the lower substrate (2), the diameter of the holes in the honeycomb through-hole array (4) is 0.3-0.5mm, and the spacing between the holes is no more than twice the diameter of the holes.

3. An LED lamp bead with a composite plate integrated bracket according to claim 1, characterized in that, The exhaust channel includes a spiral groove (6) formed by laser engraving. The groove (6) of the exhaust channel has a width of 0.2 mm and a depth of 1 / 3 of the substrate thickness.

4. An LED bead with a composite plate integrated bracket according to claim 1, characterized in that, The cold end of the thermoelectric drive element (5) is connected to the etched line, and its hot end extends to the inlet of the exhaust channel, driving the airflow to circulate along the path from the air inlet channel to the mounting cavity (7) to the exhaust channel.

5. An LED bead with a composite plate integrated bracket according to claim 1, characterized in that, The surface of the lower substrate (2) is provided with a micron-level fin structure, and its arrangement direction is at a 15° angle with the airflow direction of the exhaust channel.

6. An LED bead with a composite plate integrated bracket according to claim 1, characterized in that, It also includes a driver chip (8), which is disposed in the edge region of the mounting cavity (7) and connected to the auxiliary heat dissipation pad (9) at the bottom of the lower substrate (2) through an independent heat-through hole group.

7. An LED lamp bead with a composite plate integrated bracket according to claim 6, characterized in that, A grounding shield is provided between the driving chip (8) and the light-emitting element (11), and the shield also serves as a thermal isolation groove (10).

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