Wafer edge cleaning mechanism

Abstract

The utility model discloses a kind of wafer edge washing mechanisms, including bearing assembly, first supply component and at least one second supply component, bearing assembly includes the bearing platform for bearing and fixed wafer, first supply component includes the first supply head for providing first cleaning fluid flow to wafer front, second supply component includes the second supply head for providing second cleaning fluid flow to wafer back;The position of second supply head on wafer radial, the angle between second cleaning fluid flow and wafer back, the distance between second supply head and wafer back can be adjusted.The utility model is by being provided with rotatable bearing platform, first supply component and at least one second supply component, realize wafer front and back synchronous efficient cleaning.Meanwhile, it can adapt to the cleaning demand of multiple different size wafers, effectively improve the application range of wafer edge washing mechanism.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and more specifically, to a wafer edge washing mechanism. Background Technology

[0002] The content in this section only provides background information related to this utility model and may not constitute prior art.

[0003] In the semiconductor manufacturing industry, wafer edge washing is a common process to ensure clean wafers for subsequent processing. Wafer edge washing typically refers to cleaning the areas of a wafer near its edges.

[0004] Currently, the typical method for wafer edge cleaning is to fix the wafer on a rotatable support platform, and then place a supply component above the wafer to provide cleaning fluid to the front side of the wafer. The support platform drives the wafer to rotate, and the cleaning fluid is sprayed onto the front side of the wafer to achieve front-side cleaning.

[0005] However, in addition to the need to clean the front side of the wafer, some processes also require cleaning the back side of the wafer. Utility Model Content

[0006] In view of this, the purpose of this utility model is to provide a wafer edge cleaning mechanism, especially an edge cleaning mechanism that can clean both the front and back sides of the wafer.

[0007] The objective of this utility model is achieved through the following technical solution:

[0008] This utility model discloses a wafer edge washing mechanism, comprising:

[0009] The support assembly includes a support platform rotatable about its own axis; the support platform is used to support and fix the wafer;

[0010] A first supply assembly includes a first supply head; the first supply head is disposed above the wafer and configured to provide a first cleaning fluid flow to the front side of the wafer;

[0011] At least one second supply component; the second supply component includes a second supply head disposed below the wafer and configured to provide a second cleaning fluid flow to the back side of the wafer;

[0012] The position of the second supply head in the radial direction of the wafer, the angle between the second cleaning fluid flow and the back surface of the wafer, and the distance between the second supply head and the back surface of the wafer are all adjustable.

[0013] Optionally, the second supply component further includes:

[0014] A movable base is arranged below the wafer and can reciprocate along the radial direction of the wafer;

[0015] A rotating seat is rotatably connected to the movable seat, such that the rotating seat can rotate about the rotatable connection point in a vertical plane;

[0016] The rotating base is provided with a positioning channel, and the second supply head passes through the positioning channel and is aligned with the back side of the wafer;

[0017] A positioning element is threaded onto the rotating seat, and the end of the positioning element extends into the positioning channel and abuts against the outer wall of the second supply head.

[0018] Optionally, the first supply head is configured to reciprocate both radially and vertically along the wafer.

[0019] The first supply head moves along the radial direction of the wafer via the support stage.

[0020] Optionally, the first supply component further includes:

[0021] A linear drive unit is arranged beside the support stage and is adapted to output reciprocating motion along the radial direction of the wafer;

[0022] A lifting drive unit is located at the output end of the linear drive unit and is adapted to output reciprocating motion along the height direction; the output end of the lifting drive unit is provided with a mounting bracket, and the first supply head is connected to the mounting bracket.

[0023] Optionally, the mounting bracket is V-shaped and includes a first mounting arm and a second mounting arm;

[0024] The first supply head passes through the first mounting arm and the second mounting arm in sequence and is fixed.

[0025] Optionally, the first cleaning fluid flow and / or the second cleaning fluid flow may both contact the front and back sides of the wafer in the form of jets, respectively.

[0026] Optionally, the rotation speed of the support stage is 2000-4000 rpm; the pressure of the first cleaning fluid flow and the second cleaning fluid flow is 0.2-0.4 MPa; the angle between the first cleaning fluid flow and the front side of the wafer and the angle between the second cleaning fluid flow and the back side of the wafer are both 30-50°.

[0027] Optionally, the support assembly further includes a rotary drive unit for driving the support platform to rotate about its own axis.

[0028] Optionally, the wafer edge washing mechanism further includes a receiving assembly, which includes a plurality of receiving posts, the receiving posts being configured to reciprocate between a receiving position and a receiving position along the axial direction of the support platform.

[0029] Wherein, at the receiving position, the top of the receiving column is located above the top surface of the support platform; at the waiting position, the top of the receiving column is located below the top surface of the support platform.

[0030] Optionally, the wafer edge washing mechanism further includes a base, on which the supporting component, the first supply component, and the second supply component are disposed.

[0031] The technical solution of this utility model embodiment has at least the following advantages and beneficial effects:

[0032] The wafer edge cleaning mechanism disclosed in this utility model achieves simultaneous and efficient cleaning of the front and back sides of the wafer by setting a rotatable support platform, a first supply component, and at least one second supply component. Furthermore, by making multiple positions of the second supply head in the second supply component and the angle between the second cleaning fluid flow provided by the second supply head and the back side of the wafer adjustable, it can adapt to the cleaning needs of wafers of various sizes, effectively expanding the applicability of the wafer edge cleaning mechanism. Attached Figure Description

[0033] Figure 1 A schematic diagram of the wafer edge washing mechanism provided for an embodiment of this utility model;

[0034] Figure 2 for Figure 1 The diagram shows a partial structural schematic of the wafer washing mechanism in cross-sectional view.

[0035] Figure 3 for Figure 1 The top view of the wafer washing mechanism shown in the figure;

[0036] Figure 4 for Figure 1 A simplified diagram of the wafer washing mechanism's support stage is shown in the image.

[0037] Figure 5 A schematic diagram of the structure of the first supply head and mounting bracket provided for an embodiment of this utility model;

[0038] Figure 6 A schematic diagram of the structure of the second supply component provided in an embodiment of this utility model.

[0039] Icons: 10-Base, 20-Bearing component, 21-Bearing platform, 22-Rotary drive unit, 30-First supply component, 31-First supply head, 32-Linear drive unit, 33-Lifting drive unit, 34-Mounting bracket, 341-First mounting arm, 342-Second mounting arm, 40-Second supply component, 41-Second supply head, 42-Moving seat, 43-Rotating seat, 44-Positioning component, 50-Receiving component, 51-Receiving column, 52-Receiving drive unit, w-Wafer, w1-To be cleaned section. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with specific embodiments. The same reference numerals in the accompanying drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0041] Compared to the embodiments shown in the accompanying drawings, feasible embodiments within the scope of protection of this utility model may have fewer components, have other components not shown in the drawings, different components, components arranged differently, or components with different connections, etc. Furthermore, two or more components shown in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0042] An embodiment of this utility model discloses a wafer edge washing mechanism. Figure 1 This is a schematic diagram of the structure of an exemplary wafer edge washing mechanism disclosed in the embodiments of this utility model. Figure 2 for Figure 1 The diagram shows a partial structural schematic of the wafer washing mechanism in cross-sectional view. Figure 1 and Figure 2 In the embodiment shown, the wafer edge washing mechanism may include a base 10, a support component 20, a first supply component 30, and a second supply component 40.

[0043] The base 10 is mainly used to provide a carrier for the installation of components such as the load-bearing component 20, the first supply component 30, and the second supply component 40.

[0044] The support assembly 20 may include a support stage 21 and a rotation drive unit 22. The support stage 21 is used to support the wafer w, and the support stage 21 may be a negative pressure adsorption worktable with a negative pressure adsorption function, so that when the wafer w is supported on the support stage 21, the negative pressure adsorption function of the support stage 21 can temporarily adsorb and fix the wafer w on the support stage 21, and the fixed wafer w is basically parallel to the horizontal plane. The wafer w fixed on the support stage 21 is coaxial with the support stage 21.

[0045] The support stage 21 can be circular. Furthermore, the wafer w supported and fixed on the support stage 21 has a cleaning portion w1 protruding from the support stage 21; this cleaning portion w1 is the part on the back side of the wafer w that needs to be cleaned. (See...) Figure 4 .

[0046] The rotary drive unit 22 can be fixedly mounted on the base 10 and used to drive the support platform 21 to rotate about its own axis. For example, the rotary drive unit 22 can be a drive motor fixedly mounted at the bottom of the base 10, and the output shaft of the drive motor extends along the axis of the support platform 21 and is coaxially connected to the support platform 21.

[0047] In addition, the wafer edge washing mechanism may also include, for example Figure 1 The receiving assembly 50 is shown. This receiving assembly 50 can be arranged below the support platform 21.

[0048] The receiving assembly 50 may include a plurality of receiving posts 51 and a receiving drive unit 52 for driving the receiving posts 51 to move axially along the support platform 21. Under the drive of the receiving drive unit 52, the receiving posts 51 can reciprocate between the receiving position and the waiting position along the axial direction of the support platform 21. In the receiving position, the top of the receiving post 51 is above the top surface of the support platform 21; in the waiting position, the top of the receiving post 51 is below the top surface of the support platform 21. The receiving drive unit 52 may be a linear actuator such as a cylinder or hydraulic cylinder, and the receiving drive unit 52 may be fixedly mounted on the bottom of the base 10 to optimize the structural design of the entire wafer edge washing mechanism.

[0049] In the actual placement of wafer w, the receiving post 51 is first moved from the receiving position to the receiving position. Then, the wafer w to be cleaned is placed on the receiving post 51, so that the back side of wafer w is temporarily supported by the tops of several receiving posts 51. Subsequently, the receiving post 51 is moved from the receiving position to the receiving position, so that the back side of wafer w is supported on the support stage 21. After that, the negative pressure adsorption function of the support stage 21 can be used to adsorb and fix wafer w on the support stage 21.

[0050] The first supply component 30 may include a first supply head 31. (See reference...) Figure 2 or Figure 4As shown, a first supply head 31 can be disposed above the wafer w, and the first supply head 31 is configured to provide a first cleaning fluid flow to the front side of the wafer w, especially the front side of the part w1 to be cleaned. Exemplarily, the first supply head 31 can be a tubular nozzle capable of spraying cleaning fluid to form a cleaning fluid flow, and the first supply head 31 can be kept in communication with an external cleaning fluid source so that the first supply head 31 can continuously provide the first cleaning fluid flow.

[0051] The cleaning fluid contained in the first cleaning fluid stream described in this embodiment of the invention and the second cleaning fluid stream described below can be ultrapure water, acetone, etc.

[0052] Reference Figure 1 and Figure 3 As shown, the first supply assembly 30 may further include a linear drive unit 32 and a lifting drive unit 33. The linear drive unit 32 may be arranged on the base 10 beside the support stage 21 and is adapted to output reciprocating motion along the radial direction of the wafer w. Exemplarily, the linear drive unit 32 may be a linear driver such as a linear module.

[0053] The lifting drive unit 33 is disposed at the output end of the linear drive unit 32 and is adapted to output reciprocating motion along the height direction. For example, the lifting drive unit 33 can be a linear actuator such as a cylinder. Additionally, the output end of the lifting drive unit 33 can be provided with a mounting bracket 34, and the first supply head 31 is connected to the mounting bracket 34 so that the first supply head 31 can reciprocate both radially and vertically along the wafer w, and the movement path of the first supply head 31 when moving radially along the wafer w passes through the support stage 21.

[0054] With this setup, assuming the initial state, the first supply head 31 is located beside the support platform 21 to facilitate the placement of the wafer w on the support platform 21. Based on this, when it is necessary to supply the first cleaning fluid flow to the front of the wafer w supported on the support platform 21 via the first supply head 31, the linear drive unit 32 can first drive the lifting drive unit 33 and the mounting bracket 34, along with the first supply head 31, to move synchronously along the radial direction of the wafer w towards the support platform 21 until the first supply head 31 is above and aligned with the wafer w. Subsequently, the lifting drive unit 33 drives the mounting bracket 34, along with the first supply head 31, to move synchronously downwards along the height direction until the distance between the first supply head 31 and the front of the wafer w meets the corresponding cleaning requirements.

[0055] It is understandable that the above method not only allows the first supply head 31 to move between the top of the wafer w and the side of the support stage 21, but also allows the position of the first supply head 31 in the radial direction of the wafer w and the distance from the first supply head 31 to the front of the wafer w to be adjusted according to different cleaning requirements.

[0056] The second supply component 40 is at least one. For example, refer to... Figure 3 As shown, there can be three second supply components 40, and the three second supply components 40 can be distributed sequentially along the circumference of the wafer w. For example, there can be a 120° interval between two adjacent second supply components 40.

[0057] The second supply component 40 may include a second supply head 41. For example... Figure 2 or Figure 4 As shown, the second supply head 41 can be disposed below the wafer w, and the second supply head 41 is configured to provide a second cleaning fluid flow to the back side of the wafer w, especially the back side of the part w1 to be cleaned. Exemplarily, the second supply head 41 can also be a tubular nozzle capable of spraying cleaning fluid to form a cleaning fluid flow, and the second supply head 41 can be kept in communication with an external cleaning fluid source so that the second supply head 41 can continuously provide a second cleaning fluid flow.

[0058] Considering that during the wafer cleaning operation, for wafers of different sizes, cleaning fluid needs to be supplied to different positions in the radial direction of the wafer w, and that the angle between the second cleaning fluid flow provided by the second supply head 41 and the back surface of the wafer w, as well as the distance from the second supply head 41 to the back surface of the wafer w, may need to be adjusted, the second supply assembly 40 disclosed in this embodiment of the present invention may further include a movable base 42 and a rotating base 43.

[0059] Combination Figure 2 and Figure 6 As shown, the movable base 42 is arranged below the wafer w and can reciprocate radially along the wafer w. Exemplarily, the movable base 42 can be slidably connected to the base 10 via a slider-groove structure, allowing the movable base 42 to reciprocate radially along the wafer w, and the position of the movable base 42 can be fixed.

[0060] The rotating base 43 is rotatably connected to the movable base 42, allowing the rotating base 43 to rotate in a vertical plane about the rotatable connection point. The rotating base 43 has a positioning channel (not shown in the figure) through which the second supply head 41 passes. After passing through the positioning channel, the second supply head 41 aligns with the cleaning portion w1 on the back side of the wafer w. Simultaneously, a positioning element 44 is threadedly connected to the rotating base 43. The end of the positioning element 44 extends into the positioning channel and abuts against the outer wall of the second supply head 41. The positioning element 44 can be a bolt.

[0061] Based on the above settings, the position of the second supply head 41 in the radial direction of the wafer w, the angle between the second cleaning fluid flow provided by the second supply head 41 and the back surface of the wafer w, and the distance between the second supply head 41 and the back surface of the wafer w are all adjustable. The specific adjustment process is as follows: If it is necessary to adjust the position of the second supply head 41 in the radial direction of the wafer w, simply move the moving base 42 along the radial direction of the wafer w to the target position along with the rotating base 43, and then fix the position of the moving base 42; if it is necessary to adjust the angle between the second cleaning fluid flow provided by the second supply head 41 and the back surface of the wafer w, simply rotate the rotating base 43 by a predetermined angle to rotate the second supply head 41 to a suitable position, and then fix the position of the rotating base 43. This allows the second cleaning fluid flow, which is at a predetermined angle to the back surface of the wafer w, to be provided by the second supply head 41. The rotating base 41... Position 3 can be fixed by means of threaded fastening, etc. If it is necessary to adjust the distance between the second supply head 41 and the back of the wafer w, first loosen the positioning member 44 so that its end no longer abuts against the outer wall of the second supply head 41, so that the second supply head 41 can move freely in the positioning channel along the axial direction of the positioning channel, so that the second supply head 41 is closer to or farther away from the back of the wafer w, thereby achieving the purpose of adjusting the distance between the second supply head 41 and the back of the wafer w. After the distance is determined, simply tighten the positioning member 44 until its end abuts against the outer wall of the second supply head 41 again to lock the position of the second supply head 41.

[0062] Understandably, the above settings not only allow for adjustment of multiple positions and angles of the second supply head 41, but also make the entire adjustment process simple and convenient.

[0063] To provide a clearer and more intuitive understanding of the wafer edge washing mechanism disclosed in this embodiment of the present invention, the method of using the wafer edge washing mechanism will be further described below.

[0064] In use, first place the wafer w to be cleaned on the support stage 21 as described above, and rely on the negative pressure adsorption function of the support stage 21 to reliably fix the wafer w. Before this, the position and angle of the second supply head 41 can be adjusted according to the size of the wafer w and the cleaning requirements, so that after the wafer w is fixed on the support stage 21, the radial position of the second supply head 41 on the wafer w, the angle between the second cleaning fluid flow provided by the second supply head 41 and the back surface of the wafer w, and the distance from the second supply head 41 to the back surface of the wafer w all meet the corresponding cleaning requirements.

[0065] Subsequently, following the aforementioned method, the first supply head 31 is moved to a position aligned with the front side of the wafer w, ensuring that the radial position of the first supply head 31 on the wafer w and the distance from the first supply head 31 to the front side of the wafer w both meet the corresponding cleaning requirements. Based on this, the cleaning operation of the wafer w can then begin.

[0066] During cleaning, the first supply head 31 and the second supply head 41 continuously supply the first cleaning fluid flow and the second cleaning fluid flow to the front and back sides of the wafer w, respectively. During this process, the support stage 21 drives the wafer w on it to rotate synchronously, so as to achieve the purpose of thoroughly cleaning the front and back sides of the wafer w.

[0067] Understandably, in actual implementation, components such as the support platform 21 and the second supply head 41 can also be housed in a cavity. During the cleaning process, the waste liquid formed after the cleaning fluid comes into contact with the wafer w will fly out from the edge of the wafer w under the action of centrifugal force and come into contact with the circumferential inner wall of the cavity, so as to prevent the waste liquid from splashing everywhere through the cavity.

[0068] In some embodiments, the first cleaning fluid flow provided by the first supply head 31 and / or the second cleaning fluid flow provided by the second supply head 41 both contact the front and back sides of the wafer w in the form of jets, which is beneficial for removing stubborn foreign matter on the surface of the wafer w through the cleaning fluid in the form of jets, thereby helping to improve the cleaning quality.

[0069] In some embodiments, in order to ensure that the cleaning fluid in contact with the wafer w can only fly out from the edge of the wafer w under the action of centrifugal force, and to prevent the cleaning fluid from splashing everywhere at the moment of contact with the wafer w, the rotation speed of the support stage 21, the angle between the cleaning fluid and the surface of the wafer w, and the pressure of the cleaning fluid flow should be reasonably controlled.

[0070] After multiple tests by the inventors of this utility model, it has been verified that controlling the rotation speed of the support stage 21 to 2000-4000 rpm, controlling the pressure of the first and second cleaning fluid flows to 0.2-0.4 MPa, and controlling the angle between the first cleaning fluid flow and the front side of the wafer w and the angle between the second cleaning fluid flow and the back side of the wafer w to 30-50° can effectively prevent the cleaning fluid from splashing everywhere the moment it comes into contact with the wafer w.

[0071] Among them, such as Figure 4 As shown, the first cleaning fluid flow provided by the first supply head 31 and the second cleaning fluid flow provided by the second supply head 41 are both biased towards the edge of the wafer w, rather than the center of the wafer w.

[0072] In some embodiments, such as Figure 5As shown, the mounting bracket 34 for mounting the first supply head 31 can be V-shaped and includes a first mounting arm 341 and a second mounting arm 342. The first supply head 31 passes through the first mounting arm 341 and the second mounting arm 342 sequentially and is fixed thereon. This design allows the mounting bracket 34 to provide two fixed positions for the first supply head 31, thereby helping to improve the stability of the first supply head 31 when providing the first cleaning fluid flow to the front side of the wafer w, and minimizing the vibration of the first supply head 31 under the pressure of the first cleaning fluid flow.

[0073] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer edge washing mechanism, characterized in that, include: The support assembly includes a support platform rotatable about its own axis; the support platform is used to support and fix the wafer; The first supply component includes a first supply head; The first supply head is disposed above the wafer and configured to provide a first cleaning fluid flow to the front side of the wafer; At least one second supply component; the second supply component includes a second supply head disposed below the wafer and configured to provide a second cleaning fluid flow to the back side of the wafer; The position of the second supply head in the radial direction of the wafer, the angle between the second cleaning fluid flow and the back surface of the wafer, and the distance between the second supply head and the back surface of the wafer are all adjustable.

2. The wafer edge washing mechanism according to claim 1, characterized in that, The second supply component also includes: A movable base is arranged below the wafer and can reciprocate along the radial direction of the wafer; A rotating seat is rotatably connected to the movable seat, such that the rotating seat can rotate about the rotatable connection point in a vertical plane; The rotating base is provided with a positioning channel, and the second supply head passes through the positioning channel and is aligned with the back side of the wafer; A positioning element is threaded onto the rotating seat, and the end of the positioning element extends into the positioning channel and abuts against the outer wall of the second supply head.

3. The wafer edge washing mechanism according to claim 1, characterized in that, The first supply head is configured to reciprocate both radially and vertically along the wafer. The first supply head moves along the radial direction of the wafer via the support stage.

4. The wafer edge washing mechanism according to claim 3, characterized in that, The first supply component also includes: A linear drive unit is arranged beside the support stage and is adapted to output reciprocating motion along the radial direction of the wafer; A lifting drive unit is located at the output end of the linear drive unit and is adapted to output reciprocating motion along the height direction; the output end of the lifting drive unit is provided with a mounting bracket, and the first supply head is connected to the mounting bracket.

5. The wafer edge washing mechanism according to claim 4, characterized in that, The mounting bracket is V-shaped and includes a first mounting arm and a second mounting arm; The first supply head passes through the first mounting arm and the second mounting arm in sequence and is fixed.

6. The wafer edge washing mechanism according to claim 1, characterized in that, The first cleaning fluid stream and / or the second cleaning fluid stream both contact the front and back sides of the wafer in the form of jets, respectively.

7. The wafer edge washing mechanism according to claim 1 or 6, characterized in that, The rotation speed of the support stage is 2000-4000 rpm; the pressure of the first cleaning fluid flow and the second cleaning fluid flow is 0.2-0.4 MPa; the angle between the first cleaning fluid flow and the front side of the wafer, and the angle between the second cleaning fluid flow and the back side of the wafer are both 30-50°.

8. The wafer edge washing mechanism according to claim 1, characterized in that, The support assembly further includes a rotary drive unit, which drives the support platform to rotate about its own axis.

9. The wafer edge washing mechanism according to claim 1, characterized in that, It also includes a receiving assembly, which includes a plurality of receiving columns, the receiving columns being configured to reciprocate between a receiving position and a receiving position along the axial direction of the support platform; Wherein, at the receiving position, the top of the receiving column is located above the top surface of the support platform; at the waiting position, the top of the receiving column is located below the top surface of the support platform.

10. The wafer edge washing mechanism according to claim 1, characterized in that, It also includes a base, on which the supporting component, the first supply component and the second supply component are disposed.

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