Chip and pin assembly

Abstract

The utility model provides a kind of chip and pin assembly device, it is related to chip processing technical field.A kind of chip and pin assembly device includes cabinet, the cabinet top is equipped with support frame, the support frame top is slidably connected with longitudinal slide, the longitudinal slide side wall is slidably connected with horizontal slide, the inside of the horizontal slide is movably connected with lifting plate, the bottom of the lifting plate is equipped with at least two material taking disc;The cabinet top is equipped with assembly station, and the assembly station table top is equipped with at least two assembly stations.The device can complete tin paste point coating and chip mounting action simultaneously in the same station, simultaneously two products are assembled, improve processing efficiency and assembly accuracy, meet the demand of modern electronic manufacturing to high speed and high-precision production.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and more specifically, to a chip and pin assembly device. Background Technology

[0002] In modern electronics manufacturing, chips, as core electronic components, are widely used in various electronic products. During the connection process between chips and circuit boards, the soldering quality directly affects the product's performance and reliability. Currently, the common chip packaging and assembly process involves applying solder paste before mounting the chips. Specifically, solder paste is typically applied to the chip pin locations on the circuit board or lead frame using dispensing equipment. Then, a pick-and-place device such as a nozzle is used to pick up the chip and precisely mount it onto the solder paste-coated pin areas. Finally, a reflow soldering process completes the soldering.

[0003] However, existing technologies have the following shortcomings: process separation and low efficiency: current assembly processes are usually performed in steps, that is, solder paste application and chip mounting are completed by different equipment or workstations, resulting in a long assembly cycle and affecting overall production efficiency. Complex equipment structure and high maintenance costs: traditional equipment often requires multiple actuators to complete the solder paste application and chip mounting functions separately, which not only increases the size and structural complexity of the equipment, but also increases the difficulty of later maintenance and debugging. Utility Model Content

[0004] The purpose of this invention is to provide a chip and pin assembly device that can simultaneously complete solder paste application and chip mounting at the same workstation, assembling two products at the same time, thereby improving processing efficiency and assembly accuracy, and meeting the needs of modern electronic manufacturing for high-speed and high-precision production.

[0005] This utility model is achieved through the following technical solution: A chip and pin assembly apparatus includes a chassis, a support frame on the top of the chassis, a longitudinal slide plate slidably connected to the top of the support frame, a transverse slide plate slidably connected to the side wall of the longitudinal slide plate, a lifting plate movably connected to the inner side of the transverse slide plate, and at least two picking trays at the bottom of the lifting plate; an assembly table is provided on the top of the chassis, and the assembly table surface has at least two assembly stations.

[0006] Furthermore, a motor is installed inside the transverse sliding plate, and a lead screw is connected to the power output end of the motor. The lead screw is threadedly connected to the lifting plate.

[0007] Furthermore, the material receiving tray is detachably connected to the lifting plate.

[0008] Furthermore, one of the feeding trays has several steel needles arranged in an array at its bottom, and the other feeding tray has several suction cups arranged in an array at its bottom.

[0009] Furthermore, the top of the chassis is also provided with a shelf, and the shelf surface is provided with several storage slots arranged in an array.

[0010] Furthermore, the top of the chassis is also equipped with a shelf, inside which is a cylinder, and the power output end of the cylinder is connected to the shelf plate.

[0011] Furthermore, telescopic columns are provided on both sides of the cylinder, and the top of the telescopic columns is fixedly connected to the bottom of the storage plate.

[0012] Furthermore, the assembly device also includes a longitudinal drive mechanism and a transverse drive mechanism, wherein the longitudinal drive mechanism is used to drive the longitudinal slide plate to move longitudinally, and the transverse drive mechanism is used to drive the transverse slide plate to move transversely.

[0013] The technical solution of this utility model has at least the following advantages and beneficial effects: This invention utilizes two pick-up trays to pick up solder paste and chips separately. After picking up the materials, solder paste application and chip mounting are simultaneously completed at two assembly stations, allowing for the simultaneous assembly of two products and improving chip processing efficiency. The movable design of the longitudinal slide, transverse slide, and lifting plate allows for adjustment of the pick-up tray position to facilitate material picking and assembly operations. Mechanized operation improves product assembly accuracy, meeting the demands of modern electronics manufacturing for high-speed and high-precision production. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the chip and pin assembly device provided in Embodiment 1 of this utility model; Figure 2 Provided for Embodiment 1 of this utility model Figure 1 A magnified view of a portion of the image; Figure 3 Provided for Embodiment 1 of this utility model Figure 1 Top view; Figure 4 Provided for Embodiment 1 of this utility model Figure 1 The front view; Figure 5 This is a front view of the shelf provided in Embodiment 1 of this utility model.

[0016] Icons: 1-Chassis, 2-Support frame, 3-Vertical slide plate, 4-Horizontal slide plate, 5-Lifting plate, 6-Material tray, 7-Assembly table, 8-Assembly station, 9-Storage platform, 10-Storage rack, 11-Solder paste tray, 12-Vertical drive mechanism, 13-Horizontal drive mechanism, 14-Suction cup, 15-Cylinder, 16-Storage plate, 17-Telescopic column, 18-Storage slot. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0018] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0020] In the description of this utility model, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] Example 1 Reference Figures 1-5 This embodiment provides a chip and pin assembly device, including a chassis 1. The top of the chassis 1 is provided with a support frame 2. A longitudinal slide plate 3 is slidably connected to the top of the support frame 2. A transverse slide plate 4 is slidably connected to the side wall of the longitudinal slide plate 3. A lifting plate 5 is movably connected to the inner side of the transverse slide plate 4. At least two picking trays 6 are provided at the bottom of the lifting plate 5. An assembly table 7 is provided on the top of the chassis 1. The surface of the assembly table 7 is provided with at least two assembly stations 8.

[0022] The two pick-up trays 6 allow for separate picking of solder paste and chips. After picking, solder paste application and chip mounting are performed simultaneously at two assembly stations 8, enabling the simultaneous assembly of two products and improving chip processing efficiency. The movable design of the longitudinal slide plate 3, the transverse slide plate 4, and the lifting plate 5 allows for adjustment of the position of the pick-up trays 6 to facilitate picking and assembly operations. Mechanized operation improves product assembly accuracy, meeting the demands of modern electronics manufacturing for high-speed and high-precision production.

[0023] In a preferred embodiment, a motor is installed inside the transverse sliding plate 4, and a lead screw is connected to the power output end of the motor. The lead screw is threadedly connected to the lifting plate 5. The motor and the lead screw adjust the rise and fall of the lifting plate 5, synchronously driving the material picking tray 6 at the bottom of the lifting plate 5 to rise and fall, so as to realize the picking and assembly of materials by the material picking tray 6.

[0024] In a preferred embodiment, the material receiving tray 6 is detachably connected to the lifting plate 5. This detachable design facilitates maintenance and replacement of the material receiving tray 6; specifically, it can be connected using bolts.

[0025] In a preferred embodiment, one of the pick-up trays 6 has a plurality of steel pins arranged in an array at its bottom, and the other pick-up tray 6 has a plurality of suction cups 14 arranged in an array at its bottom. The suction cups 14 are connected to a vacuum device via suction tubes. By using the steel pins to pick up solder paste and the suction cups 14 to pick up the chip, multiple solder paste applications and chip placements can be performed simultaneously, further improving chip processing efficiency.

[0026] In a preferred embodiment, the top of the chassis 1 is also provided with a shelf 9, and the shelf 9 has a plurality of storage slots 18 arranged in an array. The chip is placed in the storage slot 18, and the storage slot 18 corresponds one-to-one with the suction cup 14.

[0027] In a preferred embodiment, the top of the chassis 1 is also provided with a shelf 10, and the shelf 10 contains a cylinder 15. The power output end of the cylinder 15 is connected to a shelf plate 16. Spare lead brackets can be placed on the upper surface of the shelf plate 16. After the lead brackets of the assembly station 8 are assembled with the chip, solder paste is applied to the chip surface. The spare lead brackets are then picked up using a suction cup 14 and placed on the chip surface to complete the product assembly. The product structure is: lead bracket - chip - lead bracket. A solder paste tray 11 is placed on the other side of the assembly table 7. The solder paste tray 11, the assembly table 7, and the shelf 10 can be located on the same straight line, with the assembly table 7 located between the solder paste tray 11 and the shelf 10.

[0028] In a preferred embodiment, telescopic columns 17 are provided on both sides of the cylinder 15, and the top of the telescopic columns 17 is fixedly connected to the bottom of the shelf 16. The telescopic columns 17 include multiple sleeved rods. The telescopic columns 17 can improve the stability of the shelf 16 during lifting and lowering.

[0029] In a preferred embodiment, the assembly device further includes a longitudinal drive mechanism 12 and a transverse drive mechanism 13. The longitudinal drive mechanism 12 is used to drive the longitudinal slide plate 3 to move longitudinally, and the transverse drive mechanism 13 is used to drive the transverse slide plate 4 to move transversely.

[0030] The working principle of a chip and pin assembly device is as follows: First, pin supports are placed at the two assembly stations 8 of the assembly table 7. The longitudinal drive mechanism 12 drives the longitudinal slide plate 3 to move longitudinally, and the transverse drive mechanism 13 drives the transverse slide plate 4 to move transversely, so that the lifting plate 5 inside the transverse slide plate 4 is above the solder paste tray 11, and the pick-up tray 6 with steel needles is directly above the solder paste tray 11. Then, the motor drives the lead screw to rotate, which drives the lifting plate 5 to descend, so that the pick-up tray 6 at the bottom of the lifting plate 5 descends, the steel needles pick up the solder paste, the lifting plate 5 rises to complete the solder paste picking, and then the pick-up tray 6 is adjusted to the assembly station 8 to apply the solder paste to a pin support. Similarly, the chip picking and placement are completed to achieve the initial assembly of the chip and the pin support. Next, solder paste is applied to the other pin bracket. After the solder paste and chip are picked up from the pick-up tray 6, the two pick-up trays 6 descend synchronously. At this time, the solder paste is applied to the surface of the chip after preliminary assembly, and the chip is placed on the pin bracket after the solder paste is applied. This allows the solder paste application and chip mounting to be completed synchronously at the same station, and the two products are assembled at the same time.

[0031] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A chip and pin assembly apparatus, characterized in that, The device includes a chassis, a support frame on the top of the chassis, a longitudinal slide plate slidably connected to the top of the support frame, a transverse slide plate slidably connected to the side wall of the longitudinal slide plate, a lifting plate movably connected to the inner side of the transverse slide plate, and at least two material picking trays at the bottom of the lifting plate; the top of the chassis is equipped with an assembly table, and the assembly table surface is equipped with at least two assembly stations.

2. The chip and pin assembly apparatus according to claim 1, characterized in that, The transverse sliding plate is equipped with a motor, and the power output end of the motor is connected to a lead screw, which is threadedly connected to the lifting plate.

3. The chip and pin assembly apparatus according to claim 1, characterized in that, The material receiving tray is detachably connected to the lifting plate.

4. The chip and pin assembly apparatus according to claim 1, characterized in that, One of the feeding trays has several steel needles arranged in an array at its bottom, and the other feeding tray has several suction cups arranged in an array at its bottom.

5. The chip and pin assembly apparatus according to claim 1, characterized in that, The top of the chassis is also provided with a storage platform, and the surface of the storage platform has several storage slots arranged in an array.

6. The chip and pin assembly apparatus according to claim 1, characterized in that, The top of the chassis is also equipped with a shelf, and the shelf contains a cylinder. The power output end of the cylinder is connected to the shelf plate.

7. The chip and pin assembly apparatus according to claim 6, characterized in that, The cylinder is provided with telescopic columns on both sides, and the top of the telescopic columns is fixedly connected to the bottom of the shelf.

8. The chip and pin assembly apparatus according to claim 1, characterized in that, The assembly device further includes a longitudinal drive mechanism and a transverse drive mechanism. The longitudinal drive mechanism is used to drive the longitudinal slide plate to move longitudinally, and the transverse drive mechanism is used to drive the transverse slide plate to move transversely.

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