A carrying piece basket capable of blowing dry and clean chips

Abstract

The utility model relates to chip processing auxiliary equipment technical field especially, a kind of load chip basket of blowing dry and blowing clean chip.Its technical scheme includes frame, two groups of load frame for placing chip are equipped on the frame, the water guide tray for receiving moisture is fixedly arranged below multiple load frame, water collection tank for collecting moisture is fixedly arranged in the side of water guide tray, the utility model is set by PLC, photoelectric switch, motor, wind collecting pipe one, wind collecting pipe two and wind collecting pipe three, multiple air jet nozzles can be fan-shaped swing and blow, improve the sweeping uniformity of load chip basket, cooperate two wind collecting pipe threes of continuous horizontal air outlet, can form three-dimensional airflow network, cover every corner on the surface of chip, avoid the local dry delay caused by airflow distribution uneven, cross airflow can produce turbulent effect in contact area, turbulent flow can accelerate heat exchange between chip surface and surrounding air further improve moisture evaporation speed, improve drying efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip processing auxiliary equipment technology, and in particular to a chip carrier basket that can dry and clean chips. Background Technology

[0002] In the precision manufacturing process of semiconductor chips, chips undergo multiple critical steps, including photolithography, etching, and cleaning. Among these, cleaning is the core step in ensuring the cleanliness of the chip surface. After cleaning, liquid media such as deionized water and cleaning agents inevitably remain on the chip surface. If these residual liquids are not removed in a timely and thorough manner, they will directly lead to a series of quality hazards. The chip carrier commonly used in the industry is the traditional wafer basket, with air nozzles installed above or on one side of the wafer basket to achieve the purpose of drying and cleaning.

[0003] Because blowing from a single angle can result in uneven airflow distribution and residual moisture in dead corners, thus reducing drying efficiency, this application proposes a carrier basket that can dry and clean chips. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing a carrier basket that can blow dry and clean chips.

[0005] The technical solution of this utility model is as follows: a carrier basket for drying and cleaning chips includes a frame, two sets of carrier racks for placing chips are provided on the frame, a water guide plate for receiving moisture is fixed below the multiple carrier racks, a water collection tank for collecting moisture is fixed on one side of the water guide plate, a drying structure for air drying is provided inside the frame, and two photoelectric switches and a PLC are provided on the frame.

[0006] The drying structure includes an air collecting pipe 1 and an air collecting pipe 2 for collecting air, and an air compressor tank for ensuring a stable air source. An air compressor for providing a high-pressure air source is provided below the air compressor tank. An air collecting pipe 3 is provided on one side of each of the air collecting pipes 1 and 2. A motor for driving is fixed on the frame.

[0007] Optionally, the bottom of the frame is fixedly provided with four support legs arranged in a rectangle, and the bottom of the support legs is provided with anti-slip pads.

[0008] Optionally, one side of the support frame is provided with multiple placement slots, the bottom inner wall of the placement slot is provided with multiple drainage holes, and rubber pads are fixedly provided on both sides of the inner wall of the placement slot.

[0009] Optionally, the thickness of the rubber pad is 1-3 cm, and the surface of the rubber pad is provided with micro-protrusion texture.

[0010] Optionally, air nozzles are fixedly provided at the bottom of the first, second and third air collection pipes. The first and second air collection pipes are movably connected to the frame. A rotating shaft is fixedly provided at the end of the first and second air collection pipes near the motor. The two rotating shafts are rotatably connected to the frame. A pulley is fixedly provided on the two rotating shafts. The same belt is fitted on the two pulleys.

[0011] Optionally, one end of one of the rotating shafts is fixedly provided with a first gear, and the output end of the motor is fixedly provided with a second gear, and the first gear and the second gear mesh for transmission.

[0012] Optionally, a baffle is fixedly provided on the outside of the second air collection pipe. The first air collection pipe and the second air collection pipe are connected by a hose. The first air collection pipe, the second air collection pipe and the two third air collection pipes are respectively connected by hoses. The exhaust end of the air compressor and the air inlet end of the air compressor tank are connected by a hose. The exhaust end of the air compressor tank and the second air collection pipe are connected by a hose.

[0013] Compared with the prior art, the present invention has the following beneficial technical effects:

[0014] 1. This utility model, through the arrangement of PLC, photoelectric switch, motor, and air collection pipe one, air collection pipe two, and air collection pipe three, enables multiple air nozzles to swing and blow in a fan shape, improving the blowing uniformity of the carrier basket. With the help of two air collection pipes three that continuously emit air laterally, a three-dimensional airflow network can be formed, covering every corner of the chip surface, avoiding local drying delays caused by uneven airflow distribution. Cross airflow will generate turbulence effect in the contact area. Turbulence can accelerate the heat exchange between the chip surface and the surrounding air, further increasing the moisture evaporation rate and improving drying efficiency.

[0015] 2. The present invention, by setting a rubber pad, can prevent the chip from directly contacting the hard placement slot, thus protecting the chip. The micro-protrusion texture on its surface can optimize the airflow path of the blowing and improve the drying and cleaning efficiency. In addition, the drainage holes can quickly discharge the sewage and impurities generated during blowing, preventing them from accumulating in the basket and ensuring the cleanliness of the chip surface. Attached Figure Description

[0016] Figure 1 A three-dimensional structural schematic diagram of this utility model is provided;

[0017] Figure 2 A three-dimensional schematic diagram of the drying structure in this utility model is provided;

[0018] Figure 3 An enlarged structural schematic diagram of point A in this utility model is provided;

[0019] Figure 4 A three-dimensional structural diagram of the rubber pad in this utility model is provided.

[0020] Figure label:

[0021] 1. Framework;

[0022] 2. Support frame;

[0023] 3. Placement slot;

[0024] 4. Leaks;

[0025] 5. Rubber pad;

[0026] 6. Water guide plate;

[0027] 7. Water collection tank;

[0028] 8. Drying structure; 801. Air collection duct one; 802. Air collection duct two; 803. Air compressor tank; 804. Air compressor; 805. Shaft; 806. Pulley; 807. Gear one; 808. Gear two; 809. Motor; 8010. Air collection duct three; 8011. Baffle;

[0029] 9. Photoelectric switch;

[0030] 10. PLC. Detailed Implementation

[0031] The technical solutions of this disclosure will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments.

[0032] The components of the embodiments of this disclosure, which are typically described and shown in the accompanying drawings, can be arranged and designed in a variety of different configurations. Therefore, the following detailed description of embodiments of this disclosure provided in the drawings is not intended to limit the scope of the claimed disclosure, but merely to illustrate selected embodiments of the disclosure.

[0033] All other embodiments obtained by those skilled in the art based on the embodiments in this disclosure without inventive effort are within the scope of protection of this disclosure.

[0034] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0035] In the description of this disclosure, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.

[0036] Example

[0037] like Figure 1-4 As shown, the present invention proposes a chip carrier basket that can dry and clean chips, including a frame 1. The bottom of the frame 1 is fixedly provided with four support feet arranged in a rectangular shape, and the bottom of the support feet is provided with anti-slip pads. The frame 1 is provided with two sets of carrier racks 2 for placing chips. A water guide plate 6 for receiving moisture is fixedly provided below the multiple carrier racks 2. A water collection tank 7 for collecting moisture is fixedly provided on one side of the water guide plate 6. A drying structure 8 for air drying is provided inside the frame 1. The frame 1 is provided with two photoelectric switches 9 and a PLC 10.

[0038] The drying structure 8 includes a first air collecting pipe 801, a second air collecting pipe 802 for collecting air, and an air compressor tank 803 for ensuring a stable air source. Air nozzles are fixedly installed at the bottom of the first air collecting pipe 801, the second air collecting pipe 802, and the third air collecting pipe 8010. The first air collecting pipe 801 and the second air collecting pipe 802 are movably connected to the frame 1. A rotating shaft 805 is fixedly installed at the end of the first air collecting pipe 801 and the second air collecting pipe 802 near the motor 809. Both rotating shafts 805 are rotatably connected to the frame 1. A pulley 806 is fixedly installed on each of the two rotating shafts 805, and the same belt is fitted onto both pulleys 806. A gear 807 is fixedly installed at one end of one of the rotating shafts 805. An air compressor 804 for providing a high-pressure air source is located below the air compressor tank 803. One side of the first air collecting pipe 801 and the second air collecting pipe 802... The system includes a third air collection pipe 8010 and a baffle 8011 fixed to the outside of the second air collection pipe 802. The baffle 8011, in conjunction with two photoelectric switches 9, allows the first air collection pipe 801 and the second air collection pipe 802 to swing and blow within a specified angle range. This not only reduces energy consumption but also ensures uniform blowing. The first air collection pipe 801 and the second air collection pipe 802 are connected by a hose. The first air collection pipe 801, the second air collection pipe 802, and the two third air collection pipes 8010 are also connected by hoses. The exhaust end of the air compressor 804 and the inlet end of the air compression tank 803 are connected by a hose. The exhaust end of the air compression tank 803 and the second air collection pipe 802 are connected by a hose. A motor 809 for driving is fixed on the frame 1. A gear 808 is fixed to the output end of the motor 809. The gear 807 and the gear 808 mesh and drive each other.

[0039] The support frame 2 has multiple placement slots 3 on one side. The bottom inner wall of the placement slot 3 has multiple drainage holes 4. The drainage holes 4 can quickly discharge the sewage and impurities generated by the purging, preventing them from accumulating in the basket and ensuring the cleanliness of the chip surface. Rubber pads 5 are fixedly installed on both sides of the inner wall of the placement slot 3. The rubber pads 5 can prevent the chip from directly contacting the hard placement slot 3. The rubber pads 5 are 2 cm thick and have micro-protrusion texture on the surface. The micro-protrusion texture can guide airflow and also guide moisture on the chip surface.

[0040] In this embodiment, the two photoelectric switches 9 can limit the swing angle of the first air collection pipe 801 and the second air collection pipe 802. During use, the chip is placed in the placement slot 3 between two rubber pads 5. Then, the air compressor 804 and motor 809 are started. The rubber pads 5 not only prevent chip damage caused by direct contact between the chip and the hard placement slot 3, but their micro-textured surface also guides airflow and moisture, accelerating the drying speed. Moisture and impurities generated during blowing can be quickly discharged through the drain hole 4 and fall into the water guide plate 6, preventing impurities from accumulating and adhering to the chip surface during the next blow, ensuring the cleanliness of the chip surface. The air compressor 804 introduces gas into the air compression tank 803, and then through multiple hoses into multiple air collection pipes, finally spraying it out from the nozzle onto the chip surface. The motor 809 drives the second gear 808, which in turn drives one of the rotating shafts 805 through the first gear 807. The rotating shaft 805 then drives two pulleys 806... In conjunction with another rotating shaft 805, the first air collection pipe 801 and the second air collection pipe 802 rotate simultaneously. The second air collection pipe 802 drives the baffle 8011. When the baffle 8011 blocks one of the photoelectric switches 9, the photoelectric switch 9 sends a signal to the PLC 10. The PLC 10 then causes the motor 809 to reverse. When the baffle 8011 blocks the other photoelectric switch 9, the PLC 10 causes the motor 809 to rotate forward, thereby causing the first air collection pipe 801 and the second air collection pipe 802 to drive the bottom nozzles to swing in a fan shape and blow, which can improve the blowing uniformity of the chip carrier basket. With the two continuously horizontally air-discharging third air collection pipes 8010, a three-dimensional airflow network can be formed to cover every corner of the chip surface, avoiding local drying delays caused by uneven airflow distribution. The cross airflow will generate a turbulence effect in the contact area. The impact force of turbulence is much greater than that of laminar flow, which can more quickly peel off the attached liquid film on the chip surface. At the same time, turbulence can accelerate the heat exchange between the chip surface and the surrounding air, further increasing the moisture evaporation rate.

[0041] The above specific embodiments are merely several optional embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A chip carrier basket for drying and cleaning chips, comprising a frame (1), wherein the frame (1) is provided with two sets of carrier racks (2) for placing chips, and a water guide plate (6) for receiving moisture is fixedly provided below the plurality of carrier racks (2), and a water collection tank (7) for collecting moisture is fixedly provided on one side of the water guide plate (6), characterized in that: The frame (1) is provided with a drying structure (8) for air drying; The drying structure (8) includes a first air collection pipe (801) and a second air collection pipe (802) for collecting air, and an air compressor tank (803) for ensuring a stable air source. An air compressor (804) for providing a high-pressure air source is provided below the air compressor tank (803). A third air collection pipe (8010) is provided on one side of the first air collection pipe (801) and the second air collection pipe (802). A motor (809) for driving is fixed on the frame (1). Two photoelectric switches (9) and a PLC (10) are provided on the frame (1).

2. The carrier basket for drying and cleaning chips according to claim 1, characterized in that, The bottom of the frame (1) is fixed with four support feet arranged in a rectangular shape, and the bottom of the support feet is provided with anti-slip pads.

3. The carrier basket for drying and cleaning chips according to claim 1, characterized in that, The support frame (2) has multiple placement slots (3) on one side, and multiple drainage holes (4) are provided on the bottom inner wall of the placement slot (3). Rubber pads (5) are fixedly provided on both sides of the inner wall of the placement slot (3).

4. The carrier basket for drying and cleaning chips according to claim 3, characterized in that, The thickness of the rubber pad (5) is 1-3 cm, and the surface of the rubber pad (5) is provided with micro-convex texture.

5. The carrier basket for drying and cleaning chips according to claim 1, characterized in that, Air nozzles are fixedly provided at the bottom of the first (801), second (802) and third (8010) air collection pipes. The first (801) and second (802) air collection pipes are movably connected to the frame (1). The ends of the first (801) and second (802) air collection pipes near the motor (809) are fixedly provided with rotating shafts (805). The two rotating shafts (805) are rotatably connected to the frame (1). The two rotating shafts (805) are fixedly provided with pulleys (806). The same belt is fitted on the two pulleys (806).

6. The carrier basket for drying and cleaning chips according to claim 5, characterized in that, One end of one of the rotating shafts (805) is fixedly provided with a gear one (807), and the output end of the motor (809) is fixedly provided with a gear two (808). The gear one (807) and the gear two (808) mesh and drive each other.

7. The carrier basket for drying and cleaning chips according to claim 1, characterized in that, A baffle (8011) is fixedly provided on the outside of the second air collection pipe (802). The first air collection pipe (801) and the second air collection pipe (802) are connected by a hose. The first air collection pipe (801), the second air collection pipe (802) and the two third air collection pipes (8010) are connected by hoses respectively. The exhaust end of the air compressor (804) and the air inlet end of the air compression tank (803) are connected by a hose. The exhaust end of the air compression tank (803) and the second air collection pipe (802) are connected by a hose.

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