A tool for placing wafers

Abstract

The utility model provides a kind of tool for placing wafer, comprising: annular pedestal, inside side is surrounded and is formed wafer placement area, the size of the wafer placement area is greater than the size of wafer to be placed;At least three rotating mechanisms, along the circumferential interval distribution of the annular pedestal, the output end of the rotating mechanism is connected with the support piece, the support piece is rotated relative to the annular pedestal under the drive of the rotating mechanism;The support piece has bearing part, when the bearing part rotates into the wafer placement area and its end points to the center of the annular pedestal, the bearing part carries wafer;When the bearing part rotates out of the wafer placement area, to release wafer.The tool drives the bearing part of support piece into and out of wafer placement area to carry and release wafer by rotating mechanism, realizes the contactless transfer and placement of wafer, avoids the pollution caused by manual contact.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a tool for placing wafers. Background Technology

[0002] In semiconductor wafer manufacturing processes, SUSS double-sided alignment precision measurement equipment typically employs two modes to place wafers onto the measurement stage: automated robotic arm transfer mode and manual placement mode. While the automated robotic arm transfer mode enables clean operation, it often struggles to stably grip and transfer special wafers with significant warpage or thicknesses that do not meet standard specifications. In such cases, manual placement mode is necessary to complete the operation. However, the manual placement mode has significant drawbacks in practical applications: even when operators wear clean gloves, they still need to hold the wafer edge area with both hands to complete the transfer and placement after removing the wafer from the wafer cassette. During this process, micro-dust, fibers, or residual contaminants on the glove surface can easily adhere to the wafer edge and even spread to the effective detection area. At the same time, the pressure applied by the hands may cause micro-scratches on the wafer surface. In addition, after placement, the alignment of the wafer edge with the stage edge needs to be manually adjusted, and the wafer notch needs to be aligned with the 6 o'clock position. The secondary contact between the hands and the wafer during this adjustment process further exacerbates the risk of contamination, ultimately leading to a decrease in the cleanliness of the wafer surface. In severe cases, this can cause circuit failure, reduced yield, and other problems, adversely affecting the economics and product quality of semiconductor manufacturing. Utility Model Content

[0003] To address all or part of the problems in the prior art, this utility model provides a wafer placement tool. By using a rotating mechanism to drive the carrier portion of the tray to move in and out of the wafer placement area to carry and release the wafer, it achieves contactless transfer and placement of the wafer, avoiding contamination caused by manual contact.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] A tool for placing wafers, comprising:

[0006] An annular base, with an inner side surrounding a wafer placement area, the size of which is larger than the size of the wafer to be placed.

[0007] At least three rotating mechanisms are distributed circumferentially along the annular base. The output end of each rotating mechanism is connected to a support plate, which rotates relative to the annular base under the drive of the rotating mechanism.

[0008] The tray has a support portion. When the support portion rotates into the wafer placement area and its end points towards the center of the annular base, the support portion carries the wafer. When the support portion rotates out of the wafer placement area, the wafer is released.

[0009] The annular region 2mm from the edge of the supporting wafer towards its center is an invalid region; when the supporting part points to the center of the annular base, the end edge of the supporting part is located within the invalid region.

[0010] The outer side of the annular base is provided with a handle for easy gripping; the annular base has an opening on its ring body, which is used to avoid the structure on the measurement stage when placing the wafer.

[0011] The arc length of the opening is between 90mm and 120mm.

[0012] The tray is made of aluminum alloy, and the upper surface of the support part is provided with ceramic bumps, which are used to support the wafer.

[0013] The annular base includes an upper wall, a lower wall, and a connecting wall connecting the upper wall and the lower wall. The upper wall, the lower wall, and the connecting wall together form a U-shaped groove.

[0014] The rotating mechanism includes an adjusting rod. The upper wall of the annular base has a through hole. The adjusting rod passes through the through hole, with its upper end located above the upper wall and its lower end located in the U-shaped groove. The support piece is fixed to the adjusting rod in the U-shaped groove. Rotating the adjusting rod causes the support piece to rotate.

[0015] The rotating mechanism also includes a knob, which is fixedly connected to the upper end of the adjusting rod. An elastic element is sleeved on the adjusting rod located above the upper wall, and the elastic element is in a compressed state.

[0016] The lower wall has a limiting hole corresponding to the through hole, and the bottom of the lower end of the adjusting rod is located in the limiting hole; a limiting piece is provided on the adjusting rod, and the limiting piece is located between the upper wall and the support piece.

[0017] The adjusting rod is a screw, and the through hole is a threaded hole, with the adjusting rod threaded into the through hole. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the specific embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a wafer placement tool according to an embodiment of the present invention.

[0020] Figure 2 This is a schematic diagram of the structure of a wafer placement tool releasing a wafer according to an embodiment of the present invention.

[0021] Figure 3 This is a side cross-sectional view of a tool for placing wafers according to an embodiment of the present invention.

[0022] Reference numerals: 1. Annular base; 101. Upper wall; 102. Lower wall; 103. Connecting wall; 2. Rotating mechanism; 201. Adjusting rod; 202. Knob; 203. Elastic element; 204. Limiting hole; 205. Limiting piece; 3. Support piece; 301. Bump; 4. Handle; 5. Wafer. Detailed Implementation

[0023] The technical solutions in specific embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] The implementation of this utility model will be described in detail below with reference to specific embodiments.

[0025] In this embodiment of the utility model, in conjunction with reference to the reference Figures 1 to 3 As shown, a tool for placing wafers is provided, the specific structure and usage of which are as follows:

[0026] The tool includes an annular base 1 and at least three rotating mechanisms 2, which are spaced apart along the circumference of the annular base 1. Each rotating mechanism 2 has a support plate 3 connected to its output end, and each support plate 3 can rotate relative to the annular base 1 under the drive of its corresponding rotating mechanism 2. When the support plate 3 rotates to a preset position, the multiple support plates 3 together form a bearing surface for supporting the wafer 5. In this embodiment, four rotating mechanisms 2 are specifically provided, with a central angle of 90° between adjacent rotating mechanisms 2 to achieve stable support for the wafer 5.

[0027] The annular base 1 is an annular structure, with its inner side enclosed by annular walls to form a wafer placement area for placing wafer 5. For a 200mm diameter wafer, the inner diameter of the annular base 1 is set to 202mm, ensuring that the size of the wafer placement area is larger than the size of the wafer 5 to be placed, allowing the wafer 5 to be placed stably without contacting the inner wall of the annular base 1. The width of the annular base 1 (i.e., the radial dimension of the annular wall) is 15mm, ensuring both structural strength and adaptability to operating space requirements. An opening with an arc length of 100mm, between 90mm and 120mm, is provided on the annular base 1 to avoid protrusions and positioning components on the measurement stage when placing wafer 5, preventing interference between the tool and the measurement stage. At least one handle 4 is provided on the outer wall of the annular base 1, allowing the operator to grasp the handle 4 to move the tool, along with the wafer 5 it carries, to the measurement stage and complete the placement operation. In this embodiment, two handles 4 are symmetrically arranged on the annular base 1 to facilitate the operator to hold the tool with both hands and move it smoothly.

[0028] The annular base 1 includes an upper wall 101, a lower wall 102, and a connecting wall 103 connecting the upper wall 101 and the lower wall 102. The upper wall 101 and the lower wall 102 are arranged in parallel, and the connecting wall 103 is vertically connected to the edges of the upper wall 101 and the lower wall 102. The three together form a U-shaped groove with a U-shaped cross section. The U-shaped groove provides installation space and protection for the rotating mechanism 2 and the support plate 3.

[0029] The rotating mechanism 2 includes an adjusting rod 201, a knob 202, and an elastic element 203. The adjusting rod 201 is a vertically arranged rod. The upper wall 101 of the annular base 1 has through holes that penetrate its upper and lower surfaces corresponding to the position of each rotating mechanism 2. The adjusting rod 201 passes through the through hole, with its upper end located above the upper wall 101 and its lower end located in a U-shaped groove. A support plate 3 for carrying the wafer 5 is fixed on the adjusting rod 201 located in the U-shaped groove. The knob 202 is fixedly connected to the upper end of the adjusting rod 201, making it convenient for the operator to rotate the adjusting rod 201. An elastic element 203 is sleeved on the adjusting rod 201 located above the upper wall 101. The elastic element 203 is a spring and is always in a compressed state. One end of the spring abuts against the lower surface of the knob 202, and the other end abuts against the upper surface of the upper wall 101. The lower wall 102 of the annular base 1 has limiting holes 204 corresponding to the through holes. The bottom of the lower end of the adjusting rod 201 is located inside the limiting hole 204. The limiting hole 204 provides radial limiting for the lower end of the adjusting rod 201, preventing the adjusting rod 201 from wobbling during rotation. A limiting piece 205 is fixedly sleeved on the adjusting rod 201 located in the U-shaped groove and above the support plate 3. The outer diameter of the limiting piece 205 is larger than the inner diameter of the through hole, which can limit the axial movement of the adjusting rod 201 and prevent the adjusting rod 201 from moving excessively upward and disengaging from the limiting hole 204.

[0030] The support plate 3 is made of aluminum alloy, possessing good strength and lightweight characteristics. Its overall length is 10mm and its thickness is 1.5mm. The end of the support plate 3 furthest from the connection with the adjusting rod 201 has a support portion. This support portion is triangular, with a tip length of 2.5mm, and this tip is used to support the wafer 5. The upper surface of the support portion has multiple ceramic bumps 301, with flush tips forming a support surface. The wafer 5 is placed directly on these bumps 301. The ceramic material has good insulation and wear resistance, and the small contact area between the bumps 301 and the wafer 5 effectively avoids damage to the wafer 5. The support plate 3 is fixed to the adjusting rod 201 located within the U-shaped groove. Rotating the adjusting rod 201 causes the support plate 3 to rotate synchronously.

[0031] When it is necessary to rotate the tray 3, the operator presses the knob 202 to compress the elastic element 203, thereby releasing the tray 3 from its fixed state. At this time, the knob 202 can be rotated to drive the adjusting rod 201 and the tray 3 to rotate. The tray 3 can rotate into the U-shaped groove or extend into the wafer placement area. When the knob 202 is released, the elastic element 203 pushes the knob 202 upward to reset by its own compression tension, thus fixing the tray 3 and preventing it from rotating.

[0032] When the support unit rotates into the wafer placement area and its tip points towards the center of the annular base 1, the support unit jointly supports the wafer 5. Since the edges of the front and back sides of the wafer 5 are ineffective areas, and the width of these ineffective areas is generally greater than 2mm, the end edge of the support unit is located within the annular area formed by the edge of the supported wafer 5 and its offset 2mm towards the center of the wafer 5. It only contacts the ineffective edge area of ​​the wafer 5, avoiding any impact on the effective functional area of ​​the wafer 5. When the support unit rotates out of the wafer placement area, the wafer 5 loses its support and is thus released onto the measurement stage.

[0033] In other specific embodiments, the specific structural form of the rotating mechanism 2 is not limited to a single one and can be implemented in various ways. For example, the adjusting rod 201 can be set as a screw with threads on its outer circumferential surface. Correspondingly, the through hole of the upper wall 101 of the annular base 1 is set as a threaded hole adapted to the screw, and the screw passes through the threaded hole to form a threaded engagement structure with the threaded hole. Through the threaded transmission action of the screw and the threaded hole, not only can the rotation drive of the adjusting rod 201 be realized, but the axial position of the adjusting rod 201 can also be precisely fine-tuned, thereby further improving the control accuracy of the rotation angle of the support plate 3 and ensuring the stability of the position switching of the bearing part.

[0034] The usage process of this utility model is as follows:

[0035] The operator presses knob 202 and rotates adjusting lever 201 to point the bearing portion of tray 3 towards the center of the annular base 1. Then, knob 202 is released, and tray 3 is fixed under the tension of elastic element 203. The operator uses a suction pen to remove the wafer from the wafer cassette and places it on the bearing portion of tray 3. Next, the operator places the tool on the measuring stage using handle 4, aligns it, presses knob 202, and rotates adjusting lever 201 to rotate the bearing portion of tray 3 into the U-groove, releasing wafer 5 and allowing it to be placed stably on the measuring stage. Finally, the tool is removed, completing the wafer 5 placement operation. Using this tool avoids direct contact between the operator and wafer 5, thus preventing wafer 5 contamination, and is expected to improve product yield by 1% to 5% (the specific improvement varies depending on the existing products).

[0036] It should be noted that, for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the scope of protection of the claims of this utility model.

Claims

1. A tool for placing wafers, characterized in that, include: An annular base (1) is formed by surrounding the inner side of a wafer placement area, the size of which is larger than the size of the wafer (5) to be placed. At least three rotating mechanisms (2) are distributed circumferentially along the annular base (1). The output end of the rotating mechanism (2) is connected to a support plate (3). The support plate (3) rotates relative to the annular base (1) under the drive of the rotating mechanism (2). The tray (3) has a support portion. When the support portion rotates into the wafer placement area and its end points to the center of the annular base (1), the support portion carries the wafer (5). When the support portion rotates out of the wafer placement area, the wafer (5) is released.

2. The tool according to claim 1, characterized in that, The annular region 2 mm from the edge of the carrier wafer (5) toward its center is an invalid region; when the carrier part points to the center of the annular base (1), the end edge of the carrier part is located within the invalid region.

3. The tool according to claim 1, characterized in that, The outer side of the annular base (1) is provided with a handle (4) for easy gripping, through which the tool is placed on the measuring stage; the annular base (1) has an opening on its ring body, which is used to avoid the structure on the measuring stage when placing the wafer (5).

4. The tool according to claim 3, characterized in that, The arc length of the opening is between 90mm and 120mm.

5. The tool according to claim 1, characterized in that, The tray (3) is made of aluminum alloy, and the upper surface of the support part is provided with ceramic bumps (301), which are used to support the wafer (5).

6. The tool according to claim 1, characterized in that, The annular base (1) includes an upper wall (101), a lower wall (102), and a connecting wall (103) connecting the upper wall (101) and the lower wall (102). The upper wall (101), the lower wall (102), and the connecting wall (103) together form a U-shaped groove.

7. The tool according to claim 6, characterized in that, The rotating mechanism (2) includes an adjusting rod (201). The upper wall (101) of the annular base (1) has a through hole. The adjusting rod (201) passes through the through hole, with its upper end located above the upper wall (101) and its lower end located in the U-shaped groove. The support plate (3) is fixed on the adjusting rod (201) in the U-shaped groove. Rotating the adjusting rod (201) drives the support plate (3) to rotate.

8. The tool according to claim 7, characterized in that, The rotating mechanism (2) also includes a knob (202), which is fixedly connected to the upper end of the adjusting rod (201). An elastic element (203) is sleeved on the adjusting rod (201) located above the upper wall (101), and the elastic element (203) is in a compressed state.

9. The tool according to claim 7, characterized in that, The lower wall (102) is provided with a limiting hole (204) corresponding to the through hole, and the bottom of the lower end of the adjusting rod (201) is located in the limiting hole (204); a limiting piece (205) is provided on the adjusting rod (201), and the limiting piece (205) is located between the upper wall (101) and the support piece (3).

10. The tool according to claim 7, characterized in that, The adjusting rod (201) is a screw, the through hole is a threaded hole, and the adjusting rod (201) is threadedly engaged with the through hole.

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