A fully-automatic semiconductor package degumming machine feeding mechanism

Abstract

The utility model relates to the technical field of semiconductor feeding technology discloses a kind of full-automatic glue removing machine feeding mechanism of semiconductor packaging, including glue removing box, the inside bottom of glue removing box is fixedly connected with slide rail, the top left side of slide rail is slidably connected with sliding block, the right side of sliding block is fixedly connected with multistage telescopic link, the top of sliding block is fixedly connected with connecting plate, the top of connecting plate is provided with placing plate, the top of placing plate is provided with multiple placing grooves, the top right side of glue removing box is fixedly connected with mechanical arm, the right side of mechanical arm is fixedly connected with mounting plate. In the utility model, multistage telescopic link contraction drives sliding block right shift to make placing plate leak, mechanical arm starts to adjust angle, suction cup is aligned and adsorbs semiconductor, multiple suction cups can evenly adsorb semiconductor, place into placing groove inside, telescopic link pushes placing plate to box, mechanical arm combines suction cup accurate operation, realizes to semiconductor adsorption even.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor feeding technology, and in particular to a feeding mechanism for a fully automatic desizing machine for semiconductor packaging. Background Technology

[0002] The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine is a key mechanical device used in the semiconductor packaging process to automate the feeding of chips or packages. It is used to remove residual adhesive during the packaging process to meet the requirements of subsequent processes. Its function is to achieve precise positioning, orderly transmission and automatic feeding of the workpiece to be processed, ensuring the efficiency and stability of the de-adhesive process.

[0003] In the feeding mechanism of the degumming machine, the vacuum suction cup relies on the flatness of the workpiece surface. If there are depressions, holes or adhesive residue on the workpiece surface, it will lead to poor adhesion, workpiece falling off or being damaged. Existing technology uses adjustable grippers to automatically adjust the clamping range according to workpieces of different sizes. However, in actual use, when using adjustable grippers, the grippers will cause compression deformation of the semiconductor, which will damage the semiconductor structure and increase manufacturing costs. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a feeding mechanism for a fully automatic desizing machine for semiconductor packaging. It aims to improve the problem that when using adjustable grippers in the prior art, the grippers will cause compression and deformation of the semiconductor, which will damage the semiconductor structure and increase manufacturing costs.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a feeding mechanism for a fully automatic desmearing machine for semiconductor packaging, comprising a desmearing box, a slide rail fixedly connected to the bottom inner side of the desmearing box, a slider slidably connected to the top left side of the slide rail, a multi-stage telescopic rod fixedly connected to the right side of the slider, a connecting plate fixedly connected to the top of the slider, a placement plate provided on the top of the connecting plate, multiple placement slots opened on the top of the placement plate, a robotic arm fixedly connected to the top right side of the desmearing box, an mounting plate fixedly connected to the right side of the robotic arm, multiple suction cups fixedly connected to the right side of the mounting plate, two hinges fixedly connected to the front right side of the desmearing box, the same cabinet door fixedly connected to the rear side of each of the two hinges, and an installation mechanism provided on the top of the connecting plate.

[0006] As a further description of the above technical solution:

[0007] The installation mechanism includes two positioning pins, the bottom of which is fixedly connected to the top of the connecting plate. Two positioning holes are opened on the bottom left side of the placement plate, and a threaded hole is opened on the left side of the placement plate. A threaded rod is threadedly connected inside the threaded hole, and the outer wall of the threaded rod passes through the two positioning pins.

[0008] As a further description of the above technical solution:

[0009] A support plate is fixedly connected to the center of the front side of the glue removal box, and the front side of the support plate is designed with a chamfer.

[0010] As a further description of the above technical solution:

[0011] An operating table is fixedly connected to the top of the support plate, and multiple buttons are fixedly connected to the top of the operating table.

[0012] As a further description of the above technical solution:

[0013] A display screen is fixedly connected to the upper front side of the glue removal box, and the display screen is electrically connected to the operating table.

[0014] As a further description of the above technical solution:

[0015] Two support rods are fixedly connected to the bottom of the support plate, and the bottoms of the two support rods are fixedly connected to the lower front part of the glue removal box.

[0016] As a further description of the above technical solution:

[0017] The bottom of the glue removal box is fixedly connected to multiple support columns, and the bottom of each of the multiple support columns is fixedly connected to an anti-slip sleeve.

[0018] As a further description of the above technical solution:

[0019] A handle is fixedly connected to the rear right side of the cabinet door, and multiple semi-circular grooves are provided inside the handle on the right side.

[0020] As a further description of the above technical solution:

[0021] Two clip fasteners are fixedly connected to the lower right side of the glue removal box, and two pipe clamps are fixedly connected to the bottom of the cabinet door.

[0022] As a further description of the above technical solution:

[0023] A washer is fixedly connected to the left side of the outer wall of the threaded rod, and the outer wall of the washer is designed with a smooth surface.

[0024] This utility model has the following beneficial effects:

[0025] 1. In this utility model, the retraction of the multi-stage telescopic rod drives the slider to move to the right, causing the placement plate to be exposed. The robotic arm starts and adjusts the angle, the suction cups align and adsorb the semiconductor. Multiple suction cups can evenly adsorb the semiconductor and place it into the placement slot. The telescopic rod pushes the placement plate into the box. The robotic arm, combined with the suction cups, operates precisely to achieve uniform adsorption of the semiconductor.

[0026] 2. In this utility model, during installation, the positioning hole is aligned with the positioning pin, so that the positioning pin is accurately inserted into the positioning hole to limit its horizontal displacement. The threaded rod is rotated to screw it into the threaded hole on the left side of the placement plate. Since the outer wall of the threaded rod passes through the positioning pin, the fastening force of the threaded rod is used to prevent loosening. When disassembling the placement plate, the directional operation is performed, thereby realizing the quick installation and disassembly of the placement plate. Attached Figure Description

[0027] Figure 1 This is a perspective view of the feeding mechanism of a fully automatic descaling machine for semiconductor packaging proposed in this utility model;

[0028] Figure 2 This is a front view of the feeding mechanism of a fully automatic descaling machine for semiconductor packaging proposed in this utility model;

[0029] Figure 3 This is a right view of the feeding mechanism of a fully automatic descaling machine for semiconductor packaging proposed in this utility model;

[0030] Figure 4 This is an exploded view of the placement plate of the feeding mechanism of a fully automatic descaling machine for semiconductor packaging proposed in this utility model;

[0031] Figure 5 This is an exploded view of the threaded rod of the feeding mechanism of a fully automatic descaling machine for semiconductor packaging, as proposed in this utility model.

[0032] Legend:

[0033] 1. Glue box; 2. Mounting mechanism; 201. Positioning pin; 202. Positioning hole; 203. Threaded hole; 204. Threaded rod; 3. Slide rail; 4. Slider; 5. Multi-stage telescopic rod; 6. Connecting plate; 7. Placement plate; 8. Placement slot; 9. Robotic arm; 10. Mounting plate; 11. Suction cup; 12. Hinge; 13. Cabinet door; 14. Support plate; 15. Operating table; 16. Button; 17. Display screen; 18. Support rod; 19. Support column; 20. Anti-slip sleeve; 21. Handle; 22. Semi-circular groove; 23. Clip fastener; 24. Pipe clamp; 25. Gasket. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Reference Figure 1 , Figure 3 and Figure 4 This utility model provides an embodiment of a fully automatic semiconductor packaging adhesive removal machine feeding mechanism, including an adhesive removal box 1 for removing adhesive from semiconductors. A slide rail 3 is fixedly connected to the bottom inner side of the adhesive removal box 1. A slider 4 is slidably connected to the top left side of the slide rail 3, allowing the slider 4 to move left and right on the slide rail 3. A multi-stage telescopic rod 5 is fixedly connected to the right side of the slider 4, pushing the slider 4 to slide. A connecting plate 6 is fixedly connected to the top of the slider 4, and a placement plate 7 is provided on the top of the connecting plate 6. The placement plate 7 has multiple placement slots 8 for placing semiconductors. When semiconductors need to be placed... The multi-stage telescopic rod 5 retracts, causing the slider 4 to move to the right on the slide rail 3, causing the placement plate 7 to be exposed. A mechanical arm 9 is fixedly connected to the top right side of the glue removal box 1. A mounting plate 10 is fixedly connected to the right side of the mechanical arm 9. Multiple suction cups 11 are fixedly connected to the right side of the mounting plate 10, which can evenly adsorb semiconductors. By rotating the mechanical arm 9, the suction cups 11 are driven to pick up semiconductors. Two hinges 12 are fixedly connected to the front right side of the glue removal box 1. The same cabinet door 13 is fixedly connected to the rear side of both hinges 12. The cabinet door 13 is opened through the hinges 12. An installation mechanism 2 is provided on the top of the connecting plate 6.

[0036] Specifically, the desmearing box 1 is a device used to remove the adhesive from the surface of semiconductors. A slide rail 3 is fixedly connected to the bottom inner side of the desmearing box 1. A slider 4 is slidably connected to the top left side of the slide rail 3. The slider 4 can move left and right on the slide rail 3, providing a basic moving carrier for the placement and transfer of semiconductors. A multi-stage telescopic rod 5 is fixedly connected to the right side of the slider 4. The multi-stage telescopic rod 5 pushes the slider 4 to slide on the slide rail 3 through its telescopic movement, achieving precise control of the slider 4's position. When a semiconductor needs to be placed, the multi-stage telescopic rod 5 retracts, causing the slider 4 to move to the right on the slide rail 3, thereby gradually revealing the connecting plate 6 at the top of the slider 4 and the placement plate 7 above it. The top of the placement plate 7 has multiple placement slots 8, which are used to neatly place the semiconductors, ensuring that the semiconductors maintain a stable position during the desmearing process. A machine is fixedly connected to the top right side of the desmearing box 1. The robotic arm 9 has a mounting plate 10 fixedly connected to its right side. Further fixed to the right side of the mounting plate 10 are multiple suction cups 11. These suction cups 11 can evenly adsorb semiconductors. By adjusting the rotation angle of the robotic arm 9, the suction cups 11 can precisely perform the adsorption and transfer operations on the semiconductors, placing the adsorbed semiconductors into the placement slot 8, thus achieving automated transfer of the semiconductors within the adhesive removal box 1. Two hinges 12 are fixedly connected to the front right side of the adhesive removal box 1. The rear sides of both hinges 12 are fixedly connected to the same cabinet door 13. The cabinet door 13 can be flexibly opened and closed via the hinges 12. When it is necessary to place semiconductors inside the adhesive removal box 1, the internal structure can be easily accessed by opening the cabinet door 13, ensuring convenient operation and maintenance of the equipment and providing reliable hardware support for the efficient removal of adhesive from semiconductor surfaces.

[0037] Reference Figure 5 The installation mechanism 2 includes two positioning pins 201. The bottom of the two positioning pins 201 is fixedly connected to the top of the connecting plate 6. Two positioning holes 202 are opened on the bottom left side of the placement plate 7. The positioning pins 201 can be inserted into the positioning holes 202 for positioning during installation. A threaded hole 203 is opened on the left side of the placement plate 7. A threaded rod 204 is threadedly connected inside the threaded hole 203. The threaded rod 204 can be rotated into the threaded hole 203. The outer wall of the threaded rod 204 passes through the two positioning pins 201 to fix the positioning pins 201.

[0038] Specifically, the bottoms of the two positioning pins 201 are fixed to the top of the connecting plate 6 and are symmetrically distributed. Two positioning holes 202, adapted to the positioning pins 201, are opened on the bottom left side of the placement plate 7. During installation, the placement plate 7 is aligned with the connecting plate 6, and the positioning pins 201 can be precisely inserted into the positioning holes 202. Initial positioning is achieved through the pin-hole engagement, ensuring the positional accuracy of the placement plate 7 on the connecting plate 6 and preventing misalignment of the semiconductor placement slot 8 due to installation deviations. A threaded hole 203 is opened on the left side of the placement plate 7, with a threaded rod 204 internally connected to it. The outer wall of the threaded rod 204 penetrates the two positioning pins 201. When the positioning pins 201 are inserted into the positioning holes, the positioning pins 201 are positioned to engage with the positioning pins 201. After the hole 202 is initially positioned, the threaded rod 204 is rotated to gradually screw it into the threaded hole 203. As the threaded rod 204 goes deeper, its outer wall applies a lateral compressive force to the two positioning pins 201, which tightly fixes the positioning pins 201 between the positioning hole 202 and the threaded rod 204. The positioning pins 201 and the positioning hole 202 cooperate to achieve rapid positioning. The fastening effect of the threaded rod 204 also prevents the positioning pins 201 from loosening, ensuring that the placement plate 7 remains stable when it moves back and forth under the action of the slider 4. This avoids positional deviation caused by vibration or external force, thereby ensuring the positioning accuracy and transmission stability of the semiconductor during the desizing process.

[0039] Reference Figure 1 and Figure 2 A support plate 14 is fixedly connected to the middle of the front side of the glue removal box 1. The front side of the support plate 14 is chamfered for support. An operating table 15 is fixedly connected to the top of the support plate 14. Multiple buttons 16 are fixedly connected to the top of the operating table 15 for controlling the device. A display screen 17 is fixedly connected to the upper middle of the front side of the glue removal box 1. The display screen 17 is electrically connected to the operating table 15 for displaying device information. Two support rods 18 are fixedly connected to the bottom of the support plate 14. The bottoms of the two support rods 18 are fixedly connected to the lower middle of the front side of the glue removal box 1 to increase the support of the support plate 14.

[0040] Specifically, a support plate 14 is fixedly connected to the center of the front side of the glue removal box 1. The front side of the support plate 14 features a chamfered design, which reduces the risk of collision during operation and improves the smoothness of the equipment's appearance. An operating table 15 is fixedly installed on the top of the support plate 14. Multiple buttons 16 are integrated on the top of the operating table 15. These buttons 16 are connected to the equipment control system via internal circuitry, enabling precise control of the multi-stage telescopic rod 5's start / stop, the robotic arm 9's action mode, and the suction force adjustment of the suction cup 11. Operators can complete equipment parameter settings and process initiation by pressing different buttons 16. A display screen 17 is fixedly connected to the upper front side of the 1, which is electrically connected to the operating console 15 via a data cable. It displays the equipment operating status, parameter settings, and fault alarm information in real time, helping operators to intuitively monitor the equipment operation and adjust parameters in a timely manner. To enhance the structural stability of the support plate 14, two support rods 18 are fixedly connected to its bottom. The support rods 18 are distributed in an inclined manner, and their bottoms are fixed to the lower front side of the glue removal box 1. The triangular support principle significantly improves the load-bearing capacity of the support plate 14 on the operating console 15, preventing structural loosening due to long-term operation.

[0041] Reference Figure 2 and Figure 5 The bottom of the glue removal box 1 is fixedly connected to multiple support columns 19, and the bottom of each support column 19 is fixedly connected to an anti-slip sleeve 20 to prevent the device from moving when it is started. The right rear end of the cabinet door 13 is fixedly connected to a handle 21 for easy opening of the cabinet door 13. The inside right side of the handle 21 has multiple semi-circular grooves 22 to fit the fingers. The lower right side of the glue removal box 1 is fixedly connected to two buckle fasteners 23. The bottom of the cabinet door 13 is fixedly connected to two pipe clamps 24 for locking the cabinet door 13. The outer left side of the threaded rod 204 is fixedly connected to a gasket 25. The outer wall of the gasket 25 is rounded to prevent the threaded hole 203 from being screwed shut.

[0042] Specifically, the bottom of the glue removal box 1 is fixedly connected to multiple support columns 19, and the bottom of each support column 19 is fitted with an anti-slip sleeve 20. The anti-slip sleeve 20 is made of elastic rubber material, which increases the friction with the ground and effectively prevents displacement due to vibration when the equipment is started. The right rear end of the cabinet door 13 is fixedly connected to a handle 21, the surface of which is treated with anti-slip material to facilitate gripping and applying force by the operator. The inside right side of the handle 21 has multiple semi-circular grooves 22, the curvature of which conforms to the curve of the fingertip, providing a comfortable grip even when operating with gloves and reducing fatigue when opening the cabinet door 13. Two clip fasteners 23 are fixedly installed on the lower right side of the glue removal box 1, corresponding to two pipe clamps 24 at the bottom of the cabinet door 13. When the cabinet door 13 is closed, the pipe clamps 24 can be accurately inserted into the clip fasteners 23 to form a locking structure, preventing the cabinet door 13 from opening on its own due to equipment vibration. In the positioning structure of the placement plate 7, a washer 25 is fixedly connected to the left side of the outer wall of the threaded rod 204. Its outer wall adopts a smooth transition design. When the threaded rod 204 is rotated to fix the positioning pin 201, the washer 25 can evenly distribute the turning torque, avoiding the threaded rod 204 from being over-screwed into the threaded hole 203 and causing it to seize up.

[0043] Working principle: The operator opens the cabinet door 13, and the multi-stage telescopic rod 5 retracts to move the slider 4 to the right, exposing the placement plate 7. The semiconductor is placed into the placement slot 8. The multi-stage telescopic rod 5 extends to push the slider 4 to the left, and the robotic arm 9 starts. By rotating and adjusting the angle, the suction cup 11 on the right side of the mounting plate 10 is aligned with the semiconductor. After uniform adsorption, the semiconductor is lifted from the placement slot 8 and transferred to the inside of the placement slot 8. The multi-stage telescopic rod 5 extends inward to push the placement plate 7 into the inside of the glue removal box 1. The cooperation between the slide rail 3 and the slider 4 realizes the horizontal transfer of the semiconductor. The multi-stage telescopic rod 5 controls the position switching. The suction cup 11 can evenly adsorb the semiconductor. The robotic arm 9, in conjunction with the suction cup 11, completes precise gripping and placement. The cabinet door 13 provides an operation entrance for loading, unloading, and maintenance, realizing the fully automated control of the entire process from semiconductor loading, transfer, glue removal to unloading.

[0044] Furthermore, during installation, first align the positioning holes 202 at the bottom of the placement plate 7 with the symmetrically distributed positioning pins 201 at the top of the connecting plate 6, so that the positioning pins 201 are precisely inserted into the positioning holes 202, achieving the initial positioning of the placement plate 7 on the connecting plate 6. The positioning pins 201 restrict the horizontal displacement of the placement plate 7, ensuring that the positional accuracy of the semiconductor placement slot 8 is aligned with subsequent processes. After the initial positioning is completed, rotate the threaded rod 204 to screw it into the threaded hole 203 on the left side of the placement plate 7. Since the outer wall of the threaded rod 204 penetrates the two positioning pins 201, as... As the threaded rod 204 is screwed in, the axial force generated by its threaded structure is converted into a lateral compressive force on the positioning pin 201, forcing the positioning pin 201 to press tightly against the inner wall of the positioning hole 202. The positioning pin 201 achieves rapid positioning through the pin hole engagement, and also prevents loosening caused by vibration or external force through the fastening force of the threaded rod 204. This ensures that the placement plate 7 remains stable when it reciprocates under the drive of the slider 4, avoiding semiconductor positioning deviation caused by positional offset, thereby providing reliable support for the accurate transfer of semiconductors and process stability during the desizing process.

[0045] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A feeding mechanism for a fully automatic semiconductor packaging de-adhesive machine, comprising a de-adhesive box (1), characterized in that: The bottom inner side of the glue removal box (1) is fixedly connected to a slide rail (3). The top left side of the slide rail (3) is slidably connected to a slider (4). The right side of the slider (4) is fixedly connected to a multi-stage telescopic rod (5). The top of the slider (4) is fixedly connected to a connecting plate (6). The top of the connecting plate (6) is provided with a placement plate (7). The top of the placement plate (7) is provided with multiple placement slots (8). The top right side of the glue removal box (1) is fixedly connected to a mechanical arm (9). The right side of the mechanical arm (9) is fixedly connected to an installation plate (10). The right side of the installation plate (10) is fixedly connected to multiple suction cups (11). The front right side of the glue removal box (1) is fixedly connected to two hinges (12). The rear side of the two hinges (12) is fixedly connected to the same cabinet door (13). The top of the connecting plate (6) is provided with an installation mechanism (2).

2. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 1, characterized in that: The installation mechanism (2) includes two positioning pins (201), the bottom of which is fixedly connected to the top of the connecting plate (6). The bottom left side of the placement plate (7) has two positioning holes (202), and the left side of the placement plate (7) has a threaded hole (203). The threaded hole (203) is threadedly connected to a threaded rod (204), and the outer wall of the threaded rod (204) passes through the two positioning pins (201).

3. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 1, characterized in that: A support plate (14) is fixedly connected to the middle of the front side of the glue removal box (1), and the front side of the support plate (14) is designed with a chamfer.

4. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 3, characterized in that: An operating table (15) is fixedly connected to the top of the support plate (14), and a plurality of buttons (16) are fixedly connected to the top of the operating table (15).

5. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 4, characterized in that: A display screen (17) is fixedly connected to the upper front side of the glue removal box (1), and the display screen (17) is electrically connected to the operating table (15).

6. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 3, characterized in that: The bottom of the support plate (14) is fixedly connected to two support rods (18), and the bottom of the two support rods (18) is fixedly connected to the lower front side of the glue removal box (1).

7. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 1, characterized in that: The bottom of the glue removal box (1) is fixedly connected to a plurality of support columns (19), and the bottom of each of the plurality of support columns (19) is fixedly connected to an anti-slip sleeve (20).

8. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 1, characterized in that: A handle (21) is fixedly connected to the rear right side of the cabinet door (13), and a plurality of semi-circular grooves (22) are provided on the right side inside the handle (21).

9. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 1, characterized in that: Two clip fasteners (23) are fixedly connected to the lower right side of the glue removal box (1), and two pipe clamps (24) are fixedly connected to the bottom of the cabinet door (13).

10. The feeding mechanism of a fully automatic semiconductor packaging de-adhesive machine according to claim 2, characterized in that: A gasket (25) is fixedly connected to the left side of the outer wall of the threaded rod (204), and the outer wall of the gasket (25) is designed with a smooth surface.

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