Wafer loading / unloading machine's adsorption mechanism

Abstract

The utility model relates to wafer loading and unloading machine equipment technical field especially is a kind of suction mechanism of wafer loading and unloading machine, including the door frame of taking inside the wafer loading and unloading machine setting, object table device, adjusting mechanism and suction frame mechanism, the object table device is fixedly arranged in the door frame of taking, adjusting mechanism is installed and is arranged in the door frame of taking, adjusting mechanism top is provided with suction frame mechanism, in the utility model, through the setting of gasket, wing plate, connecting plate, second sliding table, suction disc, vacuum chuck and positioning sleeve, positioning sleeve and the vacuum line joint of vacuum pump intercommunication setting carry out sealing installation, vacuum chuck is used to fix wafer, air cylinder device starts to drive rack plate along right direction and carries out adjusting movement, gear and bending member carry out rotation adjusting, bending member extrudes connecting plate inside through-hole, second sliding table and guiding rail top slide, mechanism main body is convenient to carry out fine adjustment movement processing to the distance between suction disc and the door frame of taking.

Description

Technical Field

[0001] This utility model relates to the technical field of wafer loading and unloading equipment, specifically to an adsorption mechanism for a wafer loading and unloading machine. Background Technology

[0002] Wafer loading and unloading machines are key automated equipment in semiconductor manufacturing, responsible for the safe and efficient transfer of wafers in an ultra-clean environment. Fully automated cluster loading and unloading systems that support wafers will become the mainstream, working in conjunction with equipment such as EUV lithography machines to achieve unmanned operation and improve the manufacturing efficiency of wafer semiconductor products. Take the adsorption mechanism of the wafer loading and unloading machine as an example.

[0003] In some wafer loading and unloading machines, the adsorption mechanism has a relatively fixed installation position between the adsorption plate and the pick-up gate, which makes it inconvenient to fine-tune the distance between the adsorption plate and the pick-up gate, thus affecting the adsorption effect of the adsorption plate on brittle wafers. Therefore, an adsorption mechanism for a wafer loading and unloading machine is proposed to address the above problem. Utility Model Content

[0004] The purpose of this invention is to provide an adsorption mechanism for a wafer loading and unloading machine, which solves the problem that the aforementioned adsorption mechanism is inconvenient for fine-tuning the distance between the adsorption plate and the pick-up gate.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An adsorption mechanism for a wafer loading and unloading machine includes a retrieval gate, a platform device, an adjustment mechanism, and an adsorption frame mechanism disposed inside the wafer loading and unloading machine. The platform device is fixedly disposed inside the retrieval gate, and the adjustment mechanism is installed inside the retrieval gate. The adsorption frame mechanism is disposed on the top of the adjustment mechanism. The adsorption frame mechanism includes a pad, a wing plate, a connecting plate, a second slide, an adsorption disk, a vacuum suction cup, and a positioning sleeve. The wing plate is fixedly disposed at the front end of the pad, and the connecting plate is fixedly disposed between the wing plates disposed on the left and right sides. The second slide is fixedly disposed at the bottom end of the connecting plate, and the adsorption disk is fixedly disposed at the front end of the pad. The vacuum suction cup and the positioning sleeve are disposed inside the adsorption disk.

[0007] Preferably, the adjustment mechanism includes a carrier plate, a guide rail, a pneumatic cylinder device, a rack plate, a gear component, a crank component, and a plate frame. The top of the carrier plate is fixedly provided with a guide rail, and the bottom of the carrier plate is fixedly provided with a plate frame. The pneumatic cylinder device is fixedly provided inside the plate frame on the left side. The output rod of the pneumatic cylinder device is fixedly provided with a rack plate. The teeth of the rack plate mesh with the grooves on the outside of the gear component. The crank component is installed inside the gear component and rotates with the outside of the crank component and the inside of the carrier plate.

[0008] Preferably, a first slide is fixedly provided at the rear end of the plate frame, and a sleeve plate is fixedly provided on the outer side of the plate frame on the left side.

[0009] Preferably, the crank component is installed in the through hole inside the connecting plate, and the top of the guide rail is slidably installed with the second slide.

[0010] Preferably, the guide rail assembly at the rear end of the first slide table and the front end of the retrieval frame is slidably installed, and the sleeve plate is slidably installed with the guide rod assembly below the retrieval frame.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] In this utility model, the above-mentioned pad, wing plate, connecting plate, second slide, adsorption plate, vacuum suction cup and positioning sleeve are used for sealed installation. The positioning sleeve is connected to the vacuum pump and the vacuum pipeline joint is used for sealing installation. The vacuum suction cup is used to fix the wafer. The pneumatic cylinder device is started to drive the rack plate to move and adjust along the right direction. The gear and crank parts are rotated and adjusted. The crank part squeezes the through hole inside the connecting plate, so that the second slide slides with the top of the guide rail. The main body of the mechanism can easily make fine adjustments to the distance between the adsorption plate and the pick-up frame. Attached Figure Description

[0013] Figure 1 This is a schematic diagram showing the distribution of the retrieval gate, the platform device, and the adsorption rack mechanism inside the wafer loading and unloading machine of this utility model.

[0014] Figure 2 This is a schematic diagram showing the distribution and structure of the retrieval gate, the platform device, and the adsorption rack mechanism of this utility model.

[0015] Figure 3 This is a schematic diagram of the structure of the door frame, adjustment mechanism, and suction rack mechanism of this utility model;

[0016] Figure 4 This is a schematic diagram of the combined structure of the adjustment mechanism and the adsorption frame mechanism of this utility model;

[0017] Figure 5 This is a schematic diagram of the carrier plate and pad structure of this utility model;

[0018] Figure 6 This is a schematic diagram of the pneumatic cylinder device, rack plate, and gear components of this utility model.

[0019] Figure 7 This is a schematic diagram of the adsorption plate, vacuum suction cup, and positioning sleeve of this utility model.

[0020] In the diagram: 1. Picking gantry; 2. Platform device; 3. Adjustment mechanism; 31. Carrier plate; 32. Guide rail; 33. Pneumatic cylinder device; 34. Rack plate; 35. Gear component; 36. Crank component; 37. Plate frame; 38. First slide; 39. Sleeve plate; 4. Adsorption rack mechanism; 41. Pad plate; 42. Wing plate; 43. Connecting plate; 44. Second slide; 45. Adsorption plate; 46. Vacuum suction cup; 47. Positioning sleeve. Detailed Implementation

[0021] The technical solutions of the utility model embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the utility model, and not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the utility model.

[0022] In the embodiments of the utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the position or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of the utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Similarly, words such as "an," "a," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. Words such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0023] Furthermore, in the embodiments of the utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0024] Please see Figure 1-7 This utility model provides a technical solution:

[0025] An adsorption mechanism for a wafer loading and unloading machine includes a retrieval gate 1, a platform device 2, an adjustment mechanism 3, and an adsorption rack mechanism 4, all internally arranged within the wafer loading and unloading machine. The platform device 2 is fixedly installed inside the retrieval gate 1. The adjustment mechanism 3 is installed inside the retrieval gate 1. The adsorption rack mechanism 4 is installed on the top of the adjustment mechanism 3. The adsorption rack mechanism 4 includes a pad 41, a wing plate 42, a connecting plate 43, a second slide 44, an adsorption disk 45, a vacuum suction cup 46, and a positioning sleeve 47. The wing plate 42 is fixedly installed at the front end of the pad 41. The connecting plate 43 is fixedly installed between the wing plates 42 on the left and right sides. The second slide 44 is fixedly installed at the bottom end of the connecting plate 43. The adsorption disk 45 is fixedly installed at the front end of the pad 41. The vacuum suction cup 46 and the positioning sleeve 47 are installed inside the adsorption disk 45, forming an adsorption rack mechanism 4 for brittle wafers.

[0026] The adjusting mechanism 3 includes a carrier plate 31, a guide rail 32, a pneumatic cylinder device 33, a rack plate 34, a gear component 35, a crank component 36, and a plate frame 37. The guide rail 32 is fixedly mounted at the top of the carrier plate 31, and the plate frame 37 is fixedly mounted at the bottom of the carrier plate 31. The pneumatic cylinder device 33 is fixedly mounted inside the plate frame 37 on the left side. The output rod of the pneumatic cylinder device 33 is fixedly mounted on the rack plate 34. The teeth of the rack plate 34 mesh with the grooves on the outer side of the gear component 35. The crank component 36 is installed inside the gear component 35, and the outer side of the crank component 36 rotates within the carrier plate 31. This arrangement forms the assembled adjusting mechanism 3. A first slide 38 is fixedly installed at the rear end of the 37, and a sleeve 39 is fixedly installed on the outer side of the plate frame 37 on the left side. Through the above arrangement, a guide and limiting component of the adjustment mechanism 3 is formed. The crank 36 is installed in the through hole inside the connecting plate 43. The top of the guide rail 32 is slidably installed with the second slide 44. Through the above arrangement, the guide rail 32 plays the role of guiding and limiting the movement of the adsorption frame mechanism 4. The rear end of the first slide 38 is slidably installed with the guide rail assembly at the front end of the door frame 1. The sleeve 39 is slidably installed with the guide rod assembly below the door frame 1. Through the above arrangement, the adjustment mechanism 3 and the door frame 1 are installed and limited.

[0027] Workflow: This utility model provides an adsorption mechanism for a wafer loading and unloading machine, responsible for the safe and pollution-free handling of brittle wafers. The main body of the mechanism facilitates fine-tuning of the distance between the adsorption plate 45 and the retrieval gate 1. Before use, the positioning sleeve 47 made of flexible silicone material is sealed and installed with the vacuum pipeline connector connected to the vacuum pump. The vacuum suction cup 46 made of polymer material is used to fix the wafer and avoid surface damage. The pneumatic cylinder device 33 is activated to drive the rack plate 34 to move to the right. The teeth on the rack plate 34 mesh with the grooves on the outside of the gear component 35, causing the gear component 35 and the crank component 36 to rotate and adjust. The crank component 36 presses the through hole inside the connecting plate 43, causing the second slide 44 to slide on the top of the guide rail 32 for fine-tuning of the distance between the adsorption plate 45 and the retrieval gate 1, facilitating the adjustment and movement of the adsorption position of the brittle wafer.

[0028] Although embodiments of the utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An adsorption mechanism for a wafer loading and unloading machine, comprising a retrieval gate (1), a stage device (2), an adjustment mechanism (3), and an adsorption rack mechanism (4) disposed inside the wafer loading and unloading machine, characterized in that: The retrieval frame (1) is fixedly equipped with a platform device (2), and the retrieval frame (1) is equipped with an adjustment mechanism (3). The top of the adjustment mechanism (3) is equipped with an adsorption frame mechanism (4). The adsorption frame mechanism (4) includes a pad (41), a wing plate (42), a connecting plate (43), a second slide (44), an adsorption plate (45), a vacuum suction cup (46), and a positioning sleeve (47). The front end of the pad (41) is fixedly equipped with a wing plate (42), and the left and right sides of the wing plates (42) are fixedly equipped with a connecting plate (43). The bottom end of the connecting plate (43) is fixedly equipped with a second slide (44). The front end of the pad (41) is fixedly equipped with an adsorption plate (45), and the adsorption plate (45) is equipped with a vacuum suction cup (46) and a positioning sleeve (47).

2. The adsorption mechanism of a wafer loading and unloading machine according to claim 1, characterized in that: The adjustment mechanism (3) includes a carrier plate (31), a guide rail (32), a pneumatic cylinder device (33), a rack plate (34), a gear component (35), a crank component (36), and a plate frame (37). The top of the carrier plate (31) is fixedly provided with a guide rail (32), and the bottom of the carrier plate (31) is fixedly provided with a plate frame (37). The pneumatic cylinder device (33) is fixedly provided inside the plate frame (37) on the left side. The output rod of the pneumatic cylinder device (33) is fixedly provided with a rack plate (34). The teeth of the rack plate (34) mesh with the tooth grooves on the outside of the gear component (35). The crank component (36) is installed inside the gear component (35), and the outside of the crank component (36) rotates with the inside of the carrier plate (31).

3. The adsorption mechanism of a wafer loading and unloading machine according to claim 2, characterized in that: The rear end of the plate frame (37) is fixedly provided with a first slide (38), and the outer side of the plate frame (37) on the left side is fixedly provided with a sleeve plate (39).

4. The adsorption mechanism of a wafer loading and unloading machine according to claim 2, characterized in that: The crank component (36) is installed in the through hole inside the connecting plate (43), and the top of the guide rail (32) is slidably installed with the second slide (44).

5. The adsorption mechanism of a wafer loading and unloading machine according to claim 3, characterized in that: The guide rail assembly at the rear end of the first slide (38) and the front end of the retrieval frame (1) is slidably installed, and the sleeve plate (39) and the guide rod assembly below the retrieval frame (1) are slidably installed.

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