Three-finger wafer handling apparatus

By designing a three-finger wafer handling device, employing multiple handling supports and toothed fork structures, combined with servo motors and slide rails, the problems of low efficiency and insufficient precision of traditional equipment are solved, achieving efficient and stable wafer handling.

CN224538697UActive Publication Date: 2026-07-21天津龙创恒盛实业有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
天津龙创恒盛实业有限公司
Filing Date
2025-08-14
Publication Date
2026-07-21

AI Technical Summary

Technical Problem

Traditional wafer handling equipment is inefficient and lacks precision in multi-station production, and is also subject to vibration and collision risks, making it difficult to meet the needs of large-scale mass production.

Method used

Design a three-finger wafer handling device, which adopts multiple overlapping handling brackets and toothed fork structures, combined with servo motors, linear slide rails and circular slide rails, to achieve efficient handling of multi-layer and multi-wafer wafers, and ensures accuracy and stability through belt drive and adjusting wheel structure.

Benefits of technology

It improves handling efficiency and accuracy, reduces the risk of mechanical vibration and collision, adapts to the needs of multi-station transfer, and reduces the probability of equipment failure and maintenance difficulty.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a three finger wafer carrying equipment, including the substrate, be provided with the rotating motor on the bottom surface fixed setting of substrate, the top surface fixed setting of substrate has the annular rail, be provided with the sliding frame on the annular rail, the fixed setting of sliding frame has the rotating plate, the output of rotating plate is linked with rotating motor, and the rotating plate top is provided with the protection frame, and the fixed setting of protection frame has the mounting panel in, the top fixed setting of mounting panel has material moving component no.
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Description

Technical Field

[0001] This utility model belongs to the technical field of wafer handling equipment, and in particular relates to a three-finger wafer handling equipment. Background Technology

[0002] In the semiconductor manufacturing industry, wafer handling is a crucial link in the entire production process, and its efficiency and precision directly affect the chip production quality and capacity. As chip manufacturing processes continue to upgrade, wafer sizes are gradually increasing, with 12-inch and larger wafers becoming the mainstream, and surface-integrated circuit structures becoming increasingly sophisticated. This places extremely high demands on the stability, cleanliness, and operational precision of handling equipment.

[0003] Traditional wafer handling typically employs single-arm or double-arm mechanical structures. Single-arm equipment can only handle one wafer at a time, requiring frequent switching of work positions in multi-station production scenarios, which leads to an extended overall production cycle and makes it difficult to meet the demands of large-scale mass production. While double-arm equipment can handle two wafers simultaneously, its structural design limits the movement trajectories of the two handling arms, which are prone to interference. Furthermore, it is difficult to flexibly adjust the posture within the confined wafer storage cassette or process equipment, posing a risk of collision.

[0004] Meanwhile, the drive and transmission structures of existing material handling equipment often suffer from insufficient precision. For example, some equipment uses gear transmission, which, although highly efficient in power transmission, is prone to vibration and noise during operation, potentially causing particle shedding or structural damage to the wafer surface, leading to wafer scrap. Other equipment uses a single slide rail design for linear motion guidance, which is prone to wobbling during high-speed movement, affecting the accuracy of pick-and-place positions.

[0005] Therefore, we need to design a three-finger wafer handling device to solve these problems. Utility Model Content

[0006] The problem to be solved by this utility model is to provide a three-finger wafer handling device.

[0007] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0008] A three-finger wafer handling device includes a substrate, a rotary motor fixedly mounted on the bottom surface of the substrate, an annular rail fixedly mounted on the top surface of the substrate, a sliding frame mounted on the annular rail, a rotating plate fixedly mounted on the sliding frame, the rotating plate being connected to the output end of the rotary motor, a protective frame mounted on the top of the rotating plate, a mounting plate fixedly mounted inside the protective frame, and a transfer component one, a transfer component two, and a transfer component three fixedly mounted on the top of the mounting plate, with the output ends of the transfer component one, the transfer component two, and the transfer component three all located outside the protective frame.

[0009] Preferably, the first, second, and third material transfer components each include a first slide rail fixed to the mounting plate, a first slider slidably disposed on the first slide rail, a slide plate fixedly disposed on the first slider, a second slide rail and a connecting frame fixedly disposed on the slide plate, a second slider slidably disposed on the second slide rail, and a transport bracket fixedly disposed on the second slider.

[0010] This configuration, with the sliding engagement of the first slide rail and the first slider, and the second slide rail and the second slider in the transfer assembly, provides stable linear motion guidance for the slide and the transport bracket, ensuring no deviation during movement and guaranteeing the accuracy of wafer handling. The sliding connection method results in low friction and wear, extending the assembly's lifespan and facilitating smooth speed adjustment via subsequent drive structures, meeting the high requirements for stable handling of precision components like wafers. The unified assembly structure design ensures consistency among the three transfer assemblies, facilitating standardized production, installation, and subsequent maintenance, and reducing equipment debugging difficulty.

[0011] Preferably, a movable motor is fixedly mounted on the mounting plate on one side of the first slide rail, a drive wheel is fixedly mounted on the output end of the movable motor, a driven wheel is rotatably mounted on the mounting plate on one side of the drive wheel, the drive wheel and the driven wheel are connected by a transmission belt, the transmission belt is parallel to the first slide rail, and the slide plate is connected to the transmission belt through the sliding frame.

[0012] With this configuration, the moving motor drives the slide along the first guide rail via the driving wheel, driven wheel, and transmission belt. Belt drive offers smooth transmission and low noise, reducing the impact of mechanical vibration on the wafers. The transmission belt is parallel to the first guide rail, ensuring the slide's movement direction is perfectly aligned with the rail, preventing deviations and improving displacement accuracy. The drive structure is simple and reliable, with high power transmission efficiency, and can precisely control the slide's movement distance, adapting to distance adjustments between different workstations.

[0013] Preferably, a first adjusting wheel and a second adjusting wheel are rotatably mounted on the slide plate on one side of the second slide rail. The first adjusting wheel and the second adjusting wheel are connected by an adjusting belt. The transport bracket is connected to the adjusting belt. An adjusting motor is also fixedly mounted on the slide plate on one side of the first adjusting wheel. The output end of the adjusting motor is connected to the first adjusting wheel.

[0014] This configuration allows the adjusting motor to move the transport bracket along the second slide rail via the first adjusting wheel, the second adjusting wheel, and the adjusting belt, forming a two-stage adjusting structure. This allows for further fine-tuning of the transport bracket's position based on the slide's movement, resulting in more precise wafer placement and removal. The smoothness of the belt drive further ensures the stability of the wafers during transport, preventing damage due to impact or shaking. The rapid response of the adjusting wheels and belt enables quick switching of the transport bracket's position, enhancing the equipment's operational flexibility.

[0015] Preferably, two rotation limiters are also fixedly installed on the rotating plate located within the annular track. Both rotation limiters are electrically connected to the rotary motor. A rotation limit plate is fixedly installed on the sliding frame. When the rotation limit plate moves to be opposite to the input end of the rotation limiter, the rotation limiter controls the rotary motor to stop rotating.

[0016] With this configuration, the rotation limiter and the rotation limit plate work together to limit the rotation angle. When the rotation limit plate triggers the rotation limiter, the limiter immediately controls the rotation motor to stop, which can accurately limit the rotation range of the rotating plate and prevent the material transfer components from colliding with surrounding equipment due to excessive rotation. This significantly improves the safety and reliability of the equipment operation, while ensuring that each material transfer component can accurately stop at the preset position.

[0017] Preferably, the sliding frame is further provided with a locking block and a guide wheel. The locking block and the guide wheel are located on the inner and outer sides of the annular rail, respectively. The locking block is fixedly connected to the sliding frame and slides in contact with the annular rail. The guide wheel is rotatably connected to the sliding frame and rotates in contact with the annular rail.

[0018] This design allows the locking block to slide and engage from the inside of the circular rail, while the guide wheel rotates and engages from the outside. Together, they create a bidirectional limiting mechanism for the connection between the sliding frame and the circular rail, effectively preventing radial offset or wobbling of the sliding frame during rotation. This ensures the sliding frame always moves stably along the circular rail, improving the overall operational stability of the rotating plate and its upper components. The rotating engagement design of the guide wheel converts sliding friction into rolling friction, significantly reducing motion resistance and component wear, extending the equipment's lifespan, and making rotation smoother and more efficient.

[0019] Preferably, a mounting bracket is fixedly provided on the substrate. The rotary motor is connected to the substrate through the mounting bracket. A coupling is also provided inside the mounting bracket. One end of the coupling is connected to the output end of the rotary motor, and the other end is fixedly provided with a connecting shaft. The free end of the connecting shaft passes through the substrate and is connected to the rotating plate.

[0020] This design provides a stable and secure support for the rotating motor, preventing wobbling during operation and ensuring stable power output. The coupling effectively compensates for coaxiality errors between the motor's output shaft and the connecting shaft, reducing mechanical vibration and stress concentration caused by insufficient installation precision, protecting the motor and connecting components, and lowering the probability of failure. The connecting shaft passes through the base plate and connects to the rotating plate, achieving efficient power transmission from the motor to the rotating plate. The overall structure is compact, with minimal power loss, ensuring sufficient and stable rotational power for the rotating plate.

[0021] Preferably, the transport bracket includes three overlapping brackets: bracket one, bracket two, and bracket three. A toothed fork one is fixedly mounted on bracket one, a toothed fork two is fixedly mounted on bracket two, and a toothed fork three is fixedly mounted on bracket three. Bracket one corresponds to material transfer component one, bracket two corresponds to material transfer component two, and bracket three corresponds to material transfer component three.

[0022] This design, with its overlapping conveyor supports, allows for the independent arrangement of the three forks within a limited space, saving equipment space. Each support corresponds to an independent transfer component, enabling the three forks to be individually positioned and controlled for movement. This allows for both individual wafer handling and collaborative operation, significantly improving the equipment's operational flexibility and efficiency. The fork structure is adapted to the shape of the wafers, providing stable support and preventing slippage or damage during transport.

[0023] Preferably, a protective cover is also fitted on the outside of the rotary motor, and the protective cover is fixedly connected to the base plate by bolts.

[0024] This design effectively isolates the rotating motor from the external environment, preventing dust, moisture, and impurities from entering the motor and affecting its performance. It also prevents operators from accidentally touching operating motor components, thus improving equipment safety. The protective cover is securely bolted to the base plate, ensuring a strong connection and easy disassembly. When the motor requires inspection or maintenance, the cover can be quickly opened for operation, reducing the difficulty of equipment maintenance.

[0025] The advantages and positive effects of this utility model are:

[0026] The three-finger wafer handling equipment of this invention can quickly adsorb wafers in multiple layers and multiple wafers in the wafer cassette through multiple overlapping supports and toothed forks, which greatly improves the handling efficiency, adapts to the wafer transfer needs of multiple workstations, and the overlapping handling supports make the overall size of the equipment small and the operation efficient and stable.

[0027] This invention utilizes a structure including a servo motor, linear guide rail, circular guide rail, and coupling, which facilitates control and ensures high efficiency and accuracy. Compared to traditional wafer handling equipment, it can significantly improve efficiency. The circular track can rotate back and forth in multiple directions and angles, expanding the operating range. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is an isometric schematic diagram of the overall structure of this utility model;

[0030] Figure 2 This is a schematic diagram of the connection structure of the annular track, rotating plate and sliding frame of this utility model;

[0031] Figure 3 This is a schematic diagram of the internal structure of the protective cover and protective frame of this utility model;

[0032] Figure 4 This is a schematic diagram of the connection and drive part of the material transfer component of this utility model.

[0033] The annotations in the attached figures are explained as follows:

[0034] 1. Base plate; 2. Circular rail; 3. Rotary motor; 4. Mounting bracket; 5. Coupling; 6. Connecting shaft; 7. Rotating plate; 81. Transfer assembly one; 82. Transfer assembly two; 83. Transfer assembly three; 801. First slide rail; 802. First slider; 803. Slide plate; 80. Driving wheel; 805. Driven wheel; 806. Transmission belt; 807. Connecting frame; 808. Moving motor; 809. Transport bracket; 8091. Bracket one; 809 2. Tooth fork one; 8093. Bracket two; 8094. Tooth fork two; 8095. Bracket three; 8096. Tooth fork three; 810. Second slide rail; 813. Second slider; 814. First adjusting wheel; 815. Second adjusting wheel; 816. Adjusting belt; 817. Adjusting motor; 9. Sliding frame; 10. Rotation limit plate; 11. Protective frame; 12. Protective cover; 13. Rotation limiter; 14. Mounting plate; 15. Guide wheel; 16. Locking block. Detailed Implementation

[0035] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0036] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] The present invention will be further described below with reference to the accompanying drawings:

[0038] Example 1: As Figures 1-4 As shown, a three-finger wafer handling device includes a substrate 1. A rotary motor 3 is fixedly mounted on the bottom surface of the substrate 1, and an annular rail 2 is fixedly mounted on the top surface of the substrate 1. A sliding frame 9 is mounted on the annular rail 2, and a rotating plate 7 is fixedly mounted on the sliding frame 9. The rotating plate 7 is connected to the output end of the rotary motor 3. When the rotary motor 3 starts, its output end can directly drive the rotating plate 7 to rotate. Since the rotating plate 7 is fixed on the sliding frame 9, the sliding frame 9 slides synchronously along the annular rail 2, forming support and guidance for the rotating plate 7. A protective frame 11 is provided on the top of the plate 7. The protective frame 11 rotates synchronously with the rotating plate 7. A mounting plate 14 is fixedly installed inside the protective frame 11. The mounting plate 14 is stably supported by the protective frame 11. A transfer component 1 81, a transfer component 2 82, and a transfer component 3 83 are fixedly installed on the top of the mounting plate 14. The three transfer components are integrated into one unit through the mounting plate 14. The output ends of the transfer component 1 81, the transfer component 2 82, and the transfer component 3 83 are all located outside the protective frame 11 so as to directly act on the wafer.

[0039] Material transfer assembly 1 81, material transfer assembly 2 82, and material transfer assembly 3 83 all include a first slide rail 801 fixed on the mounting plate 14. The first slide rail 801 provides a reference track for subsequent components. A first slider 802 is slidably disposed on the first slide rail 801. The first slider 802 can move linearly along the first slide rail 801. A slide plate 803 is fixedly disposed on the first slider 802. When the first slider 802 moves, it drives the slide plate 803 to move synchronously. A second slide rail 810 and a connecting frame 807 are fixedly disposed on the slide plate 803. The second slide rail 810 moves synchronously with the slide plate 803. A second slider 813 is slidably disposed on the second slide rail 810. The second slider 813 can move linearly along the second slide rail 810. A transport bracket 809 is fixedly disposed on the second slider 813. When the second slider 813 moves, it drives the transport bracket 809 to move synchronously.

[0040] A movable motor 808 is fixedly installed on the mounting plate 14 on one side of the first slide rail 801. The movable motor 808 provides power for the movement of the slide plate 803. A drive wheel 80 is fixedly installed at the output end of the movable motor 808. When the movable motor 808 starts, it drives the drive wheel 80 to rotate. A driven wheel 805 is rotatably installed on the mounting plate 14 on one side of the drive wheel 80. The rotation of the drive wheel 80 drives the driven wheel 805 to rotate synchronously through the transmission belt 806. The drive wheel 80 and the driven wheel 805 are connected by the transmission belt 806. The transmission belt 806 is parallel to the first slide rail 801 to ensure that the movement direction of the transmission belt 806 is consistent with the first slide rail 801. The slide plate 803 is connected to the transmission belt 806 through the sliding frame 9. When the transmission belt 806 moves, it drives the slide plate 803 to move along the first slide rail 801 through the sliding frame 9.

[0041] On one side of the slide plate 803 of the second slide rail 810, a first adjusting wheel 814 and a second adjusting wheel 815 are rotatably mounted, forming the transmission fulcrum of the adjusting belt 816. The first adjusting wheel 814 and the second adjusting wheel 815 are connected by the adjusting belt 816. With the assistance of the second adjusting wheel 815, when the first adjusting wheel 814 rotates, it drives the transport bracket 809 to move through the adjusting belt 816. An adjusting motor 817 is also fixedly mounted on the slide plate 803 on one side of the first adjusting wheel 814. The adjusting motor 817 provides power for the movement of the transport bracket 809. The output end of the adjusting motor 817 is connected to the first adjusting wheel 814. When the adjusting motor 817 starts, it drives the first adjusting wheel 814 to rotate.

[0042] Two rotation limiters 13 are fixedly installed on the rotating plate 7 located inside the circular track 2. The two rotation limiters 13 correspond to the two extreme positions of the rotating plate 7 respectively. Both rotation limiters 13 are electrically connected to the rotary motor 3 to form a control circuit. A rotation limit plate 10 is fixedly installed on the sliding frame 9. The rotation limit plate 10 rotates synchronously with the sliding frame 9 and the rotating plate 7. When the rotation limit plate 10 moves to be opposite to the input end of the rotation limiter 13, the rotation limiter 13 triggers an electrical signal and transmits it to the rotary motor 3. The rotation limiter 13 controls the rotary motor 3 to stop rotating.

[0043] The sliding frame 9 is also equipped with a locking block 16 and a guide wheel 15. The two work together to achieve a stable connection between the sliding frame 9 and the annular rail 2. The locking block 16 and the guide wheel 15 are located on the inner and outer sides of the annular rail 2, respectively, forming a clamping effect on the annular rail 2. The locking block 16 is fixedly connected to the sliding frame 9 and slides against the annular rail 2, providing inner guidance for the sliding frame 9. The guide wheel 15 is rotatably connected to the sliding frame 9 and rotates against the annular rail 2, providing outer guidance for the sliding frame 9. Together, they constrain the movement trajectory of the sliding frame 9.

[0044] A mounting bracket 4 is fixedly installed on the substrate 1. The mounting bracket 4 provides a fixed base for the rotary motor 3. The rotary motor 3 is connected to the substrate 1 through the mounting bracket 4, so that the rotary motor 3 is stably fixed on the bottom surface of the substrate 1. A coupling 5 is also installed inside the mounting bracket 4. The coupling 5 is used to compensate for installation errors. One end of the coupling 5 is connected to the output end of the rotary motor 3, and the other end is fixedly provided with a connecting shaft 6. The power of the rotary motor 3 is transmitted to the connecting shaft 6 through the coupling 5. The free end of the connecting shaft 6 passes through the substrate 1 and is connected to the rotating plate 7. The connecting shaft 6 transmits the power from the bottom of the substrate 1 to the upper rotating plate 7.

[0045] The transport bracket 809 includes three overlapping brackets: bracket one 8091, bracket two 8093, and bracket three 8095. This overlapping design achieves efficient space utilization. A toothed fork one 8092 is fixedly mounted on bracket one 8091, and bracket one 8091 drives toothed fork one 8092 to move synchronously. A toothed fork two 8094 is fixedly mounted on bracket two 8093, and bracket two 8093 drives toothed fork two 8094 to move synchronously. A toothed fork three 8096 is fixedly mounted on bracket three 8095. The support 3 8095 drives the toothed fork 3 8096 to move synchronously, and the support 1 8091 corresponds to the transfer component 1 81. The transfer component 1 81 directly drives the support 1 8091. The support 2 8093 corresponds to the transfer component 2 82. The transfer component 2 82 directly drives the support 2 8093. The support 3 8095 corresponds to the transfer component 3 83. The transfer component 3 83 directly drives the support 3 8095. The three toothed forks can be matched and transported to wafers of different shapes respectively.

[0046] A protective cover 12 is also fitted on the outside of the rotary motor 3. The protective cover 12 isolates the rotary motor 3 from the external environment. The protective cover 12 is fixedly connected to the base plate 1 by bolts, which not only ensures the stable installation of the protective cover 12, but also facilitates disassembly and maintenance in the future.

[0047] The working process of this embodiment is as follows: After the equipment is started, the rotary motor 3 drives the connecting shaft 6 to rotate through the coupling 5 in the mounting frame 4. The connecting shaft 6 drives the rotating plate 7 connected to it to rotate synchronously. Since the rotating plate 7 is fixed on the sliding frame 9, the sliding frame 9 slides against the annular rail 2 through the inner locking block 16 and rotates against the annular rail 2 through the outer guide wheel 15. Therefore, when the rotating plate 7 rotates, the sliding frame 9 slides stably along the annular rail 2, providing support and guidance for the rotating plate 7. The protective frame 11 on the top of the rotating plate 7, the mounting plate 14, and the three material transfer components on the mounting plate 14 rotate synchronously with the rotating plate 7 until the rotation limit plate 10 on the sliding frame 9 moves to be opposite to the input end of the rotation limiter 13 in the annular rail 2. The rotation limiter 13 sends an electrical signal to the rotary motor 3 to control it to stop rotating. At this time, the material transfer component stops precisely at the preset position.

[0048] When the transfer assembly starts working, taking transfer assembly 81 as an example: the moving motor 808 on the mounting plate 14 starts, driving the drive wheel 80 at the output end to rotate. With the assistance of the driven wheel 805, the transmission belt 806 will start to move. Since the transmission belt 806 is parallel to the first slide rail 801 and the slide plate 803 is connected to the transmission belt 806 through the sliding frame 9, the movement of the transmission belt 806 will drive the slide plate 803 to move linearly along the first slider 802 on the first slide rail 801. During the movement of the slide plate 803, the second slide rail 810 on it moves synchronously. At this time, the adjusting motor 817 on the slide plate 803 starts, driving the first adjusting wheel 814 to rotate. The first adjusting wheel 814 drives the second adjusting wheel 815 to rotate through the adjusting belt 816. The transport bracket 809 connected to the adjusting belt 816 moves along the second slide rail 810 with the second slider 813, adjusting the position of the bracket 8091 and the toothed fork 8092 so that they can be accurately moved to the wafer for wafer picking.

[0049] After the wafer is picked up, the support 8091 and the toothed fork 8092 will move in the opposite direction and retract. Then, the rotary motor 3 will drive the rotating plate 7 to rotate again. When it rotates to the wafer placement angle, it will stop. At this time, the support 8091 and the toothed fork 8092 will extend again and place the picked-up wafer at the wafer placement position to prevent the wafer picking-placement process from being repeated after completion.

[0050] The above description details one embodiment of the present utility model, but it is merely a preferred embodiment and should not be construed as limiting the scope of the present utility model. All equivalent variations and improvements made within the scope of the present utility model application should still fall within the patent coverage of the present utility model.

Claims

1. A three-finger wafer handling device, comprising a substrate (1), characterized in that: A rotary motor (3) is fixedly installed on the bottom surface of the substrate (1), and an annular rail (2) is fixedly installed on the top surface of the substrate (1). A sliding frame (9) is installed on the annular rail (2), and a rotating plate (7) is fixedly installed on the sliding frame (9). The rotating plate (7) is connected to the output end of the rotary motor (3). A protective frame (11) is installed on the top of the rotating plate (7). An installation plate (14) is fixedly installed inside the protective frame (11). A material transfer component one (81), a material transfer component two (82), and a material transfer component three (83) are fixedly installed on the top of the installation plate (14). The output ends of the material transfer component one (81), the material transfer component two (82), and the material transfer component three (83) are all located outside the protective frame (11).

2. The three-finger wafer handling device according to claim 1, characterized in that: The first material transfer assembly (81), the second material transfer assembly (82), and the third material transfer assembly (83) all include a first slide rail (801) fixed on the mounting plate (14), a first slider (802) slidably disposed on the first slide rail (801), a slide plate (803) fixedly disposed on the first slider (802), a second slide rail (810) and a connecting frame (807) fixedly disposed on the slide plate (803), a second slider (813) slidably disposed on the second slide rail (810), and a transport bracket (809) fixedly disposed on the second slider (813).

3. The three-finger wafer handling device according to claim 2, characterized in that: A moving motor (808) is fixedly installed on the mounting plate (14) on one side of the first slide rail (801). A drive wheel (80) is fixedly installed at the output end of the moving motor (808). A driven wheel (805) is rotatably installed on the mounting plate (14) on one side of the drive wheel (80). The drive wheel (80) and the driven wheel (805) are connected by a transmission belt (806). The transmission belt (806) is parallel to the first slide rail (801). The slide plate (803) is connected to the transmission belt (806) through the sliding frame (9).

4. The three-finger wafer handling device according to claim 2, characterized in that: A first adjusting wheel (814) and a second adjusting wheel (815) are rotatably mounted on the slide plate (803) on one side of the second slide rail (810). The first adjusting wheel (814) and the second adjusting wheel (815) are connected by an adjusting belt (816). The transport bracket (809) is connected to the adjusting belt (816). An adjusting motor (817) is also fixedly mounted on the slide plate (803) on one side of the first adjusting wheel (814). The output end of the adjusting motor (817) is connected to the first adjusting wheel (814).

5. The three-finger wafer handling device according to claim 1, characterized in that: Two rotation limiters (13) are fixedly installed on the rotating plate (7) located inside the annular rail (2). Both rotation limiters (13) are electrically connected to the rotary motor (3). A rotation limit plate (10) is fixedly installed on the sliding frame (9). When the rotation limit plate (10) moves to be opposite to the input end of the rotation limiter (13), the rotation limiter (13) controls the rotary motor (3) to stop rotating.

6. The three-finger wafer handling device according to claim 1, characterized in that: The sliding frame (9) is also provided with a locking block (16) and a guide wheel (15). The locking block (16) and the guide wheel (15) are located on the inner and outer sides of the annular rail (2), respectively. The locking block (16) is fixedly connected to the sliding frame (9) and slides against the annular rail (2). The guide wheel (15) is rotatably connected to the sliding frame (9) and rotatably against the annular rail (2).

7. The three-finger wafer handling device according to claim 1, characterized in that: A mounting bracket (4) is fixedly provided on the substrate (1). The rotary motor (3) is connected to the substrate (1) through the mounting bracket (4). A coupling (5) is also provided inside the mounting bracket (4). One end of the coupling (5) is connected to the output end of the rotary motor (3), and the other end is fixedly provided with a connecting shaft (6). The free end of the connecting shaft (6) passes through the substrate (1) and is connected to the rotating plate (7).

8. A three-finger wafer handling device according to claim 2, characterized in that: The transport bracket (809) includes three overlapping brackets: bracket one (8091), bracket two (8093), and bracket three (8095). A toothed fork one (8092) is fixedly mounted on bracket one (8091), a toothed fork two (8094) is fixedly mounted on bracket two (8093), and a toothed fork three (8096) is fixedly mounted on bracket three (8095). Bracket one (8091) corresponds to material transfer component one (81), bracket two (8093) corresponds to material transfer component two (82), and bracket three (8095) corresponds to material transfer component three (83).

9. A three-finger wafer handling device according to claim 7, characterized in that: A protective cover (12) is also fitted on the outside of the rotary motor (3), and the protective cover (12) is fixedly connected to the base plate (1) by bolts.