Wafer electrostatic chuck base with rapid cooling channel

Abstract

The utility model is suitable for wafer electrostatic chuck base technical field provides a kind of wafer electrostatic chuck base with quick cooling passage, including base, cavity is provided in base inside, a plurality of communication holes that are circumferentially arrayed are set up on base, cavity is communicated with outside through communication hole, support seat is fixedly installed in base inner bottom, support seat is set to groove, a plurality of ventilation openings that are circumferentially arrayed are set up in support seat outer side, servo motor is fixedly installed in support seat in, and servo motor output shaft end is fixedly installed with multiple blades. Through servo motor drive blade high-speed rotation, form forced air circulation, can quickly take away the heat generated in wafer processing process. Vortex-shaped cooling passage design prolongs the residence time of air in passage, enhances heat exchange efficiency, ensures wafer temperature uniform, avoids warping or deformation due to thermal stress, to ensure the flatness and processing precision of wafer.

Description

Technical Field

[0001] This utility model belongs to the technical field of wafer electrostatic chuck base, and particularly relates to a wafer electrostatic chuck base with a rapid cooling channel. Background Technology

[0002] The wafer electrostatic chuck base is a key component in semiconductor manufacturing equipment. It is typically made of high-precision, high-stability materials to ensure stable support during wafer processing. The base integrates electrostatic adsorption electrodes, which firmly hold the wafer in place via electrostatic attraction, ensuring processing accuracy.

[0003] In semiconductor manufacturing processes, wafers need to be processed at specific temperatures. For example, dry etching requires controlling the wafer at a specific temperature between 100°C and -70°C to maintain certain etching characteristics. However, existing wafer electrostatic chuck bases do not have cooling structures. If the base lacks a cooling structure, the wafer will experience uneven temperature due to heat accumulation during processing, leading to thermal stress, which can cause the wafer to warp or deform, affecting its flatness and reducing processing accuracy.

[0004] Photolithography and etching processes place extremely high demands on the temperature and surface flatness of wafers. Uneven temperature can lead to variations in the performance of the photoresist, affecting the accuracy and resolution of the lithographic pattern. During etching, temperature differences can cause uneven etching rates, resulting in inconsistent etching depths and impacting device performance and yield. To address these issues, designing a wafer electrostatic chuck base with rapid cooling channels is essential. Utility Model Content

[0005] This invention provides a wafer electrostatic chuck base with a rapid cooling channel to solve the above-mentioned problems in the prior art.

[0006] This invention is implemented as follows: a wafer electrostatic chuck base with a rapid cooling channel includes a base with a cavity inside. Multiple interconnecting holes arranged in a circumferential array are formed on the base, all penetrating the base. The cavity is connected to the outside through these holes. A support base is fixedly installed at the bottom of the base. The support base is groove-shaped, and multiple vents arranged in a circumferential array are formed on the outside of the support base, penetrating the support base. A servo motor is fixedly installed inside the support base, and multiple blades arranged in a circumferential array are fixedly installed on the output shaft end of the servo motor.

[0007] The base has a groove at its bottom, which is connected to the inner cavity of the support base. A cooling channel is provided inside the base, which is vortex-shaped. The inner end of the cooling channel is connected to the groove. An exhaust hole is provided on the outer side of the base, and the outer end of the cooling channel is connected to the exhaust hole. Multiple electrostatic adsorption electrodes are embedded inside the base.

[0008] Preferably, the outer edge of the base is provided with a plurality of mounting holes arranged in a circumferential array.

[0009] Preferably, the plurality of electrostatic adsorption electrodes are arranged in a circumferential array, and an electrostatic adsorption electrode is also provided at the center of the top of the base.

[0010] Preferably, the base surface is covered with a ceramic material layer, and the ceramic material layer is alumina.

[0011] Preferably, the base is provided with a plurality of fixing mechanisms arranged in a circular array.

[0012] Preferably, the fixing mechanism includes a bracket disposed above the base, a pressure plate provided on one side of the bracket, one end of the pressure plate extending into the bracket, two spaced horizontal bars fixedly installed inside the bracket, the horizontal bars passing through the pressure plate, a screw rotatably mounted on the bracket, the screw passing through the pressure plate and threadedly connected to the pressure plate, two spaced telescopic rods provided below the bracket, the telescopic rods being fixedly installed on the base and their movable ends being fixedly connected to the bracket, and an elastic sheet being fixedly connected between the bracket and the base.

[0013] Preferably, the bottom of the pressure plate is provided with a flexible pad, and a handle is fixedly installed at one end of the screw.

[0014] Compared with related technologies, the wafer electrostatic chuck base with rapid cooling channel provided by this utility model has the following beneficial effects: Driven by a servo motor, the blades rotate at high speed, creating a forced airflow circulation that quickly removes the heat generated during wafer processing. The vortex-shaped cooling channel design extends the residence time of air within the channel, enhancing heat exchange efficiency, ensuring uniform wafer temperature, and preventing warping or deformation caused by thermal stress, thereby guaranteeing wafer flatness and processing accuracy.

[0015] Continuous airflow circulation effectively controls wafer temperature, reducing processing errors caused by temperature fluctuations. This is especially important for processes such as photolithography and etching, which have extremely high requirements for temperature and surface flatness. It can significantly improve the accuracy and resolution of photolithography patterns, as well as the consistency of etching depth, thereby improving device performance and yield. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the exploded structure of this utility model; Figure 4 This is an enlarged sectional view of the base in this utility model; Figure 5 For the present utility model Figure 1 Enlarged diagram of point A in the diagram.

[0017] In the diagram: 1. Base; 2. Cavity; 3. Connecting hole; 4. Support base; 5. Vent; 6. Servo motor; 7. Blade; 8. Groove; 9. Cooling channel; 10. Exhaust hole; 11. Electrostatic adsorption electrode; 12. Fixing mechanism; 13. Bracket; 14. Pressure plate; 15. Crossbar; 16. Screw; 17. Telescopic rod; 18. Elastic sheet. Detailed Implementation

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0019] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] A preferred embodiment of the wafer electrostatic chuck base with rapid cooling channel provided by this utility model is, for example... Figures 1 to 5 As shown: A wafer electrostatic chuck base with a rapid cooling channel includes a base 1, an interior cavity 2, and multiple circularly arranged connecting holes 3 penetrating the base 1. The cavity 2 is connected to the outside through the connecting holes 3. A support base 4 is fixedly installed at the bottom of the base 1. The support base 4 is groove-shaped, and multiple circularly arranged vents 5 are opened on the outside of the support base 4, penetrating the support base 4. A servo motor 6 is fixedly installed inside the support base 4, and multiple circularly arranged blades 7 are fixedly installed at the output shaft end of the servo motor 6. A groove 8 is opened at the bottom of the base 1, communicating with the interior cavity of the support base 4. A cooling channel 9 is opened inside the base 1, vortex-shaped, with its inner end communicating with the groove 8. An exhaust port 10 is opened on the outside of the base 1, with its outer end communicating with the exhaust port 10. Multiple electrostatic adsorption electrodes 11 are embedded inside the base 1.

[0021] Servo motor 6 drives blade 7 to rotate at high speed, drawing in air from the outside through vent 5 on the outer side of support base 4. The air enters cavity 2 through connecting hole 3, and then enters the inner cavity of support base 4. The air in the inner cavity of support base 4 enters the inner end of vortex-shaped cooling channel 9 through groove 8 at the bottom of base 1. The vortex design prolongs the residence time of air in the channel, enhancing heat exchange efficiency. Cooling channel 9 is close to the inside of base 1, and the heat generated by wafer processing is conducted to cooling channel 9 through base 1. The air absorbs heat as it flows in the channel, achieving rapid cooling. The heated air is discharged from the outer end of cooling channel 9 through exhaust hole 10 on the outer side of base 1, forming a complete airflow circulation.

[0022] Through continuous airflow circulation, the heat generated during wafer processing is quickly removed, avoiding heat accumulation that could lead to uneven wafer temperature. This prevents the wafer from warping or deforming due to thermal stress, ensuring wafer flatness and processing accuracy.

[0023] Multiple electrostatic adsorption electrodes 11 are arranged in a circumferential array inside the base 1, and an electrostatic adsorption electrode 11 is also located at the center of the top of the base 1. This arrangement enables omnidirectional electrostatic adsorption of the wafer. When a voltage is applied to the electrostatic adsorption electrode 11, an electrostatic field is generated on the electrode surface. When the wafer is placed on the base 1, due to electrostatic induction, the wafer surface will induce an opposite charge, thereby generating an electrostatic attraction between the wafer and the electrode, firmly adsorbing the wafer onto the base 1. This ensures accurate positioning of the wafer during processing and avoids affecting the processing quality due to wafer vibration or displacement.

[0024] Several mounting holes arranged in a circular array are provided on the outer edge of the base 1. Multiple electrostatic adsorption electrodes 11 are arranged in a circular array, and an electrostatic adsorption electrode 11 is also provided at the center of the top of the base 1. The surface of the base 1 is covered with a ceramic material layer, and the ceramic material layer is alumina.

[0025] Several mounting holes arranged in a circular array are provided on the outer edge of the base 1 to facilitate fixing the base 1 to the processing equipment. Alumina ceramic has the characteristics of high hardness, good wear resistance, and strong insulation. The alumina ceramic material layer covering the surface of the base 1 can effectively improve the durability and insulation of the base 1, extend its service life, and ensure electrical safety during the processing.

[0026] The base 1 is equipped with multiple fixing mechanisms 12 arranged in a circular array. Each fixing mechanism 12 includes a bracket 13 positioned above the base 1. A pressure plate 14 is located on one side of the bracket 13, with one end of the pressure plate 14 extending into the bracket 13. Two spaced-apart crossbars 15 are fixedly installed inside the bracket 13, passing through the pressure plate 14. A screw 16 is rotatably mounted on the bracket 13, passing through the pressure plate 14 and threadedly connected to it. Two spaced-apart telescopic rods 17 are located below the bracket 13, fixedly mounted on the base 1 with their movable ends fixedly connected to the bracket 13. An elastic sheet 18 is fixedly connected between the bracket 13 and the base 1. A flexible pad is provided at the bottom of the pressure plate 14, and a handle is fixedly installed at one end of the screw 16.

[0027] The user drives the screw 16 to rotate on the bracket 13 by rotating the handle at one end of the screw 16. Since the screw 16 is threadedly connected to the pressure plate 14, and the pressure plate 14's rotational freedom is restricted by the crossbar 15, the rotation of the screw 16 causes the pressure plate 14 to move up and down along the axis of the crossbar 15. When it is necessary to fix the wafer or other workpiece, the user rotates the screw 16 to move the pressure plate 14 downwards until the flexible pad at the bottom of the pressure plate 14 presses firmly onto the wafer or workpiece, thus achieving fixation.

[0028] The flexible pad at the bottom of the pressure plate 14 provides uniform clamping force and reduces damage to the wafer or workpiece surface. At the same time, the flexible pad can adapt to a certain degree of surface unevenness, ensuring effective clamping.

[0029] Two telescopic rods 17 are provided at intervals below the support 13. The telescopic rods 17 are fixedly installed on the base 1 and their movable ends are fixedly connected to the support 13. By adjusting the length of the telescopic rods 17 (possibly by mechanical or electric means, depending on the design of the telescopic rods), the height of the support 13 and its upper pressure plate 14 can be changed, thereby accommodating wafers or workpieces of different thicknesses.

[0030] An elastic sheet 18 is fixedly connected between the bracket 13 and the base 1. During the process of the pressure plate 14 pressing the wafer or workpiece, the elastic sheet 18 can provide a certain buffering effect, reducing damage to the wafer or workpiece caused by excessive pressing force. At the same time, the elastic sheet 18 can also absorb some vibration during the pressing process, improving the stability of the fixation.

[0031] It is worth noting that the circuits, electronic components, and modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the software and methods.

[0032] It should be understood that the disclosed apparatus can be implemented in other ways, given the several embodiments provided in this application. For example, the apparatus embodiments described above are merely illustrative; the division of units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or communication connections shown or discussed may be through some interfaces; the indirect coupling or communication connections between devices or units may be telecommunications or other forms.

[0033] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.

Claims

1. A wafer electrostatic chuck base with a rapid cooling channel, characterized in that, Includes a base (1), the base (1) has a cavity (2) inside, the base (1) has multiple connecting holes (3) arranged in a circular array, the connecting holes (3) all penetrate the base (1), the cavity (2) is connected to the outside through the connecting holes (3), a support seat (4) is fixedly installed at the bottom inside the base (1), the support seat (4) is set in a groove shape, the support seat (4) has multiple vents (5) arranged in a circular array on the outside, the vents (5) penetrate the support seat (4), a servo motor (6) is fixedly installed inside the support seat (4), and multiple blades (7) arranged in a circular array are fixedly installed at the output shaft end of the servo motor (6); The base (1) has a groove (8) at the bottom, which is connected to the inner cavity of the support (4). The base (1) has a cooling channel (9) inside, which is vortex-shaped. The inner end of the cooling channel (9) is connected to the groove (8). The base (1) has an exhaust hole (10) on the outside, which is connected to the exhaust hole (10) on the outside. The base (1) has multiple electrostatic adsorption electrodes (11) embedded inside.

2. The wafer electrostatic chuck base with rapid cooling channel as described in claim 1, characterized in that, The base (1) has several mounting holes arranged in a circular array at its outer edge.

3. The wafer electrostatic chuck base with rapid cooling channel as described in claim 1, characterized in that, Multiple electrostatic adsorption electrodes (11) are arranged in a circular array, and an electrostatic adsorption electrode (11) is also provided at the top center of the base (1).

4. The wafer electrostatic chuck base with rapid cooling channel as described in claim 1, characterized in that, The base (1) is covered with a ceramic material layer, and the ceramic material layer is aluminum oxide.

5. The wafer electrostatic chuck base with rapid cooling channel as described in claim 1, characterized in that, The base (1) is provided with a plurality of fixing mechanisms (12) arranged in a circular array.

6. The wafer electrostatic chuck base with rapid cooling channel as described in claim 5, characterized in that, The fixing mechanism (12) includes a bracket (13) set above the base (1). A pressure plate (14) is provided on one side of the bracket (13). One end of the pressure plate (14) extends into the bracket (13). Two spaced crossbars (15) are fixedly installed inside the bracket (13). The crossbars (15) pass through the pressure plate (14). A screw (16) is rotatably installed on the bracket (13). The screw (16) passes through the pressure plate (14) and is threadedly connected to the pressure plate (14). Two spaced telescopic rods (17) are provided below the bracket (13). The telescopic rods (17) are fixedly installed on the base (1) and their movable ends are fixedly connected to the bracket (13). An elastic sheet (18) is fixedly connected between the bracket (13) and the base (1).

7. The wafer electrostatic chuck base with rapid cooling channel as described in claim 6, characterized in that, The bottom of the pressure plate (14) is provided with a flexible pad, and a handle is fixedly installed at one end of the screw (16).

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